KR20190090177A - Stick mask, producing method of stick mask and producing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a stick mask, a method of manufacturing a stick mask, and a method of manufacturing a frame-integrated mask. A stick mask (150) according to the present invention includes: a mask part (110) including one mask cell (C) on which a plurality of mask patterns (P) are formed, and a dummy around the mask cell (C); and a pair of tension parts (130) connected to at least both sides of the mask part (110). It is possible to prevent the warpage or distortion of the mask.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a mask, a stick mask,

The present invention relates to a stick mask, a method of manufacturing a stick mask, and a method of manufacturing a frame-integrated mask. More specifically, it is possible to improve the quality of the mask and to improve the yield of the mask by separately manufacturing and connecting the mask part and the tension part, and the frame and the mask are integrated to form an alignment between the masks A stick mask, a method of manufacturing a stick mask, and a method of manufacturing a frame-integrated mask.

Recently, electroforming methods have been studied in the manufacture of thin plates. In the electroplating method, an anode body and a cathode body are immersed in an electrolytic solution, and a power source is applied to electrodeposit a metal thin plate on the surface of the cathode body, so that an ultra thin plate can be manufactured and mass production can be expected.

On the other hand, FMM (Fine Metal Mask) method for depositing an organic material at a desired position by bringing a thin film metal mask (Shadow Mask) into close contact with a substrate is mainly used as a technique of forming a pixel in an OLED manufacturing process.

In a conventional OLED manufacturing process, a mask is formed in a stick shape or a plate shape, and then a mask is welded and fixed to an OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, several masks can be fixed to the OLED pixel deposition frame for the manufacture of a large area OLED. In the process of fixing to the frame, each mask is stretched so as to be flat. Adjusting the tensile force so that the entire portion of the mask is flat is a very difficult task. Particularly, in order to align a mask pattern having a size of several to several tens of micrometers while flattening each of the cells, it is necessary to perform a high level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask do.

Nevertheless, there has been a problem in that, in fixing the plurality of masks to one frame, alignment between the masks and between the mask cells is not good. Further, in the process of welding and fixing the mask to the frame, there is a problem that the thickness of the mask film is too thin and the mask is warped due to the load.

In the case of ultra-high quality OLED, QHD image quality is 500 ~ 600 PPI (pixel per inch), pixel size is about 30 ~ 50㎛, 4K UHD and 8K UHD high image quality are higher ~ 860 PPI, ~ 1600 PPI Resolution. Considering the pixel size of the ultra-high-resolution OLED, the alignment error between each cell must be reduced to about several micrometers, and the deviation from the OLED can lead to a product failure, resulting in a very low yield. Therefore, it is necessary to develop techniques for preventing deformation such as masking and twisting, clarifying alignment, fixing the mask to the frame, and the like.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a frame-integrated mask in which a mask and a frame have an integrated structure.

It is another object of the present invention to provide a method of manufacturing a frame-integrated mask capable of preventing deformation such as warping or twisting of the mask and clarifying alignment.

Another object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the production time is significantly reduced and the yield is remarkably increased.

It is another object of the present invention to provide a stick mask and a stick mask manufacturing method which can improve the quality of a mask used in a frame-integrated mask and improve the yield.

It is another object of the present invention to provide a stick mask and a method of manufacturing a stick mask, which can reduce costs and improve productivity by manufacturing a standard semiconductor device or a semiconductor process.

The above object of the present invention can be achieved by a mask comprising: a mask portion including a mask cell having a plurality of mask patterns formed therein and a dummy around the mask cell; And a pair of tension portions connected to at least both sides of the mask portion.

In the vertical direction, the mask portion and the tensile portion can occupy different regions.

In the horizontal direction, the mask portion and the tension portion may include overlapped portions overlapping each other.

The mask portion may have a rectangular shape and one side of the tensile portion may have the same length or width as one side of the connected mask portion.

The tensioning portion may include at least one protrusion for clamping the clamper.

At least the mask portion among the stick masks may be formed by electroforming on a single crystal silicon wafer.

The tensile portion may be formed by electroplating on a conductive substrate.

The mask portion can be used as an OLED pixel deposition mask.

At least a part of the rim of the mask part may be adhered to the frame having a plurality of mask cell areas along at least one of a first direction and a second direction perpendicular to the first direction.

The tension portion can be separated and removed from the mask portion.

The mask portion and the tensile portion may be invar or super invar materials.

According to another aspect of the present invention, there is provided a method of manufacturing a stick mask, including the steps of: (a) providing a mask portion including a mask cell having a plurality of mask patterns and a dummy around the mask cell; (b) providing a pair of tension members; And (c) connecting the tensile portions to at least both sides of the mask portion.

In the step (a), the mask part may be formed by electroforming on a single crystal silicon wafer.

In the step (b), the tensile portion may be formed by electroplating on a conductive substrate.

After step (c), in the vertical plane, the mask part and the tension part occupy different spaces, and in the horizontal direction, the mask part and the tension part can at least partially overlap one another.

The mask portion and the tension portion may be connected using an adhesive containing at least two metal alloys.

When at least one of a predetermined temperature and a predetermined pressure is applied to the adhesive, at least a part of the adhering portion changes from a solid phase to a liquid phase, and the liquid phase of the adhering portion changes into a solid phase again, You can connect.

The mask part and the tensile part can be connected by using an organic / inorganic adhesive.

The mask portion and the tension portion can be welded to each other.

The above object of the present invention can be also achieved by a method of manufacturing a frame-integrated mask in which a mask and a frame for supporting a mask are integrally formed, comprising: (a) a mask cell having a plurality of mask patterns formed therein; Preparing a mask portion for forming a mask; (b) preparing a pair of tension members; (c) connecting the tensile portions to at least both sides of the mask portion to manufacture a stick mask; (d) providing a frame having a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction; (e) corresponding a mask cell of the stick mask to one mask cell region of the frame; And (f) adhering at least a part of the dummy of the mask part to the frame.

The frame includes a frame frame part; At least one first grid frame portion extending in a first direction and having opposite ends connected to the frame portion; And at least one second grid frame portion extending in a second direction perpendicular to the first direction and intersecting the first grid frame portion and having both ends connected to the frame frame portion.

The frame frame portion may have a rectangular shape.

The cross-sectional shape perpendicular to the longitudinal direction of the first grid frame portion and the second grid frame portion may be a triangular, rectangular, or at least one of a side and an edge rounded triangular or rectangular.

(f) comprises the steps of: (d1) forming a bonding portion on at least a part of the upper portion of the frame, and bonding at least a part of the dummy of the mask portion to the bonding portion; (d2) laser welding at least a portion of the mask in the inner region to the upper portion of the frame in a region where the bonding portion is formed; (d4) irradiating a laser to the boundary of the peeling film of the mask portion corresponding to the adhering portion, and cleaning the adhering portion; And (d5) removing the peeling film and the tensile portion of the mask portion.

the plurality of stick masks may be successively adhered to the subsequent frame corresponding to the mask cell area by repeating steps (e) to (f).

According to the present invention configured as described above, there is an effect that the mask and the frame form an integral structure.

Further, according to the present invention, it is possible to prevent deformation such as warping or twisting of the mask and to make alignment clear.

Further, according to the present invention, the production time can be remarkably reduced and the yield can be remarkably increased.

Further, according to the present invention, it is possible to improve the quality of a mask used in a frame-integrated mask and improve the yield.

In addition, according to the present invention, manufacturing cost can be reduced and productivity can be improved by using a standardized semiconductor device or a semiconductor process. For example, if you use 8-inch or 12-inch wafers, you can take advantage of existing well-established semiconductor process / equipment component infrastructures such as wafer cassettes, jigs, , It is easy to handle a conductive substrate for electroplating, and the manufacturing cost and process cost are greatly reduced.

1 is a schematic view showing a conventional OLED pixel deposition mask.
2 is a schematic view showing a process of bonding a conventional mask to a frame.
FIG. 3 is a schematic view showing an alignment error between cells in a process of stretching a conventional mask. FIG.
4 is a front view and a side sectional view showing a frame according to an embodiment of the present invention.
5 is a front view and a side sectional view showing a frame-integrated mask according to an embodiment of the present invention, and is a schematic view of a stick mask.
6 is a schematic view showing a process of sticking a stick mask according to an embodiment of the present invention in correspondence with a cell region of a frame.
7 is a schematic view showing various embodiments for manufacturing a stick mask.
FIG. 8 is a schematic view showing a mask part and a tensile part, and a manufacturing method of a mask part according to an embodiment of the present invention.
9 is a schematic view showing a stick mask according to an embodiment of the present invention.
10 is a schematic view showing a process of manufacturing a frame-integrated mask using a stick mask according to an embodiment of the present invention.
11 is a schematic view showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views, and length and area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

1 is a schematic view showing a conventional OLED pixel deposition mask 10;

Referring to FIG. 1, the conventional mask 10 may be made of a stick-type or a plate-type. The mask 10 shown in Fig. 1 (a) is a stick-shaped mask, and both sides of the stick can be welded and fixed to the OLED pixel deposition frame. The mask 100 shown in FIG. 1 (b) is a plate-type mask and can be used in a pixel forming process with a large area.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smart phone. In the cell C, a pixel pattern P is formed so as to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. For example, a pixel pattern P is formed in the cell C so as to have a resolution of 70 X 140. That is, a large number of pixel patterns P constitute one cell C in a cluster, and a plurality of cells C can be formed in the mask 10. [

2 is a schematic view showing a process of bonding a conventional mask 10 to a frame 20. Fig. FIG. 3 is a schematic view showing that an alignment error occurs between cells in a process of stretching (F1 to F2) a conventional mask 10. The stick mask 10 having the five cells (C: C1 to C5) shown in FIG. 1 (a) will be described as an example.

Referring to Fig. 2 (a), first, the mask 10 should be flattened. Tensile force F1 to F2 is applied in the longitudinal direction of the mask 10, and the mask 10 is stretched according to the pulling. In this state, the mask 10 is loaded on the frame 20 in a rectangular frame shape. The cells C 1 to C 5 of the mask 10 are located in the hollow space portion of the frame 20. The frame 20 may be of a size such that the cells C1 to C5 of one mask 10 are located in the hollow space inside the frame and the cells C1 to C5 of the plurality of masks 10 Area. ≪ / RTI >

Referring to FIG. 2B, the mask 10 is aligned while finely adjusting the tensile force F1 to F2 applied to each side of the mask 10, and then a portion of the side of the mask 10 is welded (W) (10) and the frame (20). Fig. 2 (c) shows a cross-sectional side view of the frame 10 and the interconnected mask 10.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to the respective sides of the mask 10 are finely adjusted, there arises a problem that alignment between the mask cells C1 to C3 is not performed well. For example, the distances D1 to D1 ", D2 to D2 "between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The mask 10 is large in size including a plurality (for example, five) of cells C1 to C5, and has a very thin thickness on the order of several tens of micrometers, so that it is easily struck or warped by a load. In addition, it is very difficult to check the alignment state in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten each cell.

Therefore, a minute error of the tensile forces F1 to F4 can cause an error in the extent to which each cell C1 to C3 of the mask 10 stretches or spreads, D1 ", D2 to D2 ") are different from each other. Of course, it is difficult to arrange the mask pattern P so that the error is completely zero. However, in order to prevent the mask pattern P having a size of several to several tens of micrometers from adversely affecting the pixel process of the ultra high definition OLED, . The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition to this, a plurality of masks 10 of about 6 to 20 are connected to each of the frames 20, and a plurality of cells C to C5 of the mask 10, It is also a very difficult task to clarify the alignment state between the substrates, and the process time due to alignment is inevitably increased, which is a significant reason for reducing the productivity.

Accordingly, the present invention proposes a frame-integrated mask capable of preventing deformation such as warping or twisting of the mask 100, clarifying alignment in the frame 200, significantly reducing the manufacturing time, and significantly increasing the yield do.

Fig. 4 is a front view (Fig. 4 (a)) and a side sectional view (Fig. 4 (b)) showing a frame 200 according to an embodiment of the present invention. FIG. 5 is a front view (FIG. 5A) and a side sectional view (FIG. 5B) showing a frame-integrated mask according to an embodiment of the present invention and a schematic view of the stick mask 150 c). 4B is a side sectional view taken along the line A-A 'in FIG. 4A, and FIG. 5B is a side sectional view taken along the line B-B' in FIG. 5A.

Referring to FIGS. 4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200 one by one. 5, the mask 100 is assumed to be adhered to the frame 200, but the present invention is not limited thereto. The mask 100 may vary depending on the sizes of the mask 100 and the frame 200. The mask 100 refers to a portion that actually adheres to the frame 200 in the stick mask 150 and functions as a mask in the OLED deposition process. In this regard, it is understood that the mask portion 110 of the stick mask 150 to be described later is substantially the same as the mask 100.

A plurality of mask patterns P are formed in each of the masks 100, and one cell C may be formed in one of the masks 100. The mask 100 (the stick mask 150) may be formed by electroforming so as to be formed into a thin thickness. The mask 100 may be a super invar material having a thermal expansion coefficient of about 1.0 X 10 < ^-6 > / DEG C and an invar, about 1.0 X 10 < ^-7 > / DEG C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by heat energy, and thus it can be used as FMM (Fine Metal Mask) and shadow mask in the manufacture of high resolution OLED. In consideration of the development of techniques for performing the pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 may be formed of nickel (Ni), nickel-cobalt ) Or the like.

The frame 200 may include a frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The frame 200 may be made of a metal such as invar, super invar, aluminum, titanium, or the like, and may be made of a material such as Invar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as that of the mask .

In addition, the frame 200 may include at least one first grid frame portion 220 extending in a first direction (transverse direction). The first grid frame part 220 may be formed in a straight line shape so that both ends of the first grid frame part 220 may be connected to the frame part 210. When the frame 200 includes a plurality of first grid frame portions 220, it is preferable that each of the first grid frame portions 220 is equally spaced.

In addition, in addition, the frame 200 may include at least one second grid frame portion 230 extending in a second direction (longitudinal direction). The second grid frame part 230 may be formed in a straight line shape and both ends may be connected to the frame part 210. Since the first grid frame unit 220 and the second grid frame unit 230 are perpendicular to each other, there may exist crossing points that intersect with each other. When the frame 200 includes a plurality of second grid frame portions 230, it is preferable that the respective second grid frame portions 230 are equally spaced.

The shape of the cross section perpendicular to the longitudinal direction of the first and second grid frame portions 220 and 230 may be a rectangular shape such as a triangle or a parallelogram, and the sides and edges may be partially rounded.

The thickness of the frame part 210 may be greater than the thickness of the first and second grid frame parts 220 and 230. The frame part 210 may be formed to have a thickness ranging from several millimeters to several centimeters because it is responsible for the overall rigidity of the frame 200. In the case of the first and second grid frame portions 220 and 230, if the thickness is too thick, it may cause a problem that the source of the organic material passes through the mask 100 in the OLED pixel deposition process. On the contrary, if the thickness is too small, it may be difficult to secure the rigidity enough to support the mask 100. Accordingly, the widths and thicknesses of the first and second grid frame units 220 and 230 may be about 1 to 5 mm.

The frame unit 200 may include a plurality of mask cells C regions by combining the frame unit 210 and the first and second grid frame units 220 and 230. The mask cell C area means a blank hollow area except for the area occupied by the frame frame part 210 and the first and second grid frame parts 220 and 230 in the frame part 200 . As the cell C of the mask 100 is associated with the mask cell C region, it can be used as a passageway through which the pixels of the OLED are substantially deposited through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smart phone. In one mask 100, mask patterns P constituting one cell C may be formed. Alternatively, although one mask 100 may have a plurality of cells C, it is necessary to avoid the large-area mask 100 for the clear alignment of the mask 100, The small-area mask 100 is preferable.

The frame 200 has a plurality of mask cell C regions, and each of the masks 100 can be adhered to correspond to one mask cell C, respectively. Each of the masks 100 (or the mask unit 110, see FIG. 5C) is formed by a mask cell C in which a plurality of mask patterns P are formed and a dummy cell C corresponding to the portion of the mask 110). The dummy may include only a mask film, or may include a mask film having a predetermined dummy pattern formed in a shape similar to the mask pattern (P). The mask cell C corresponds to the mask cell region of the frame 200, and part or all of the dummy may be adhered to the frame 200. As a result, the mask 100 and the frame 200 can have an integrated structure. The stick mask 150 is first manufactured and the mask portion 110 is formed on the frame 200 after the stick mask 150 is corresponding to the frame 200. In order to adhere the mask 100 so as to correspond to the frame 200, 200). ≪ / RTI >

Referring to FIG. 5C, the stick mask 150 includes a mask unit 110 and a tension unit 130. The mask unit 110 may include a mask cell C having a plurality of mask patterns P and a dummy around the mask cell C. [ The tension portion 130 is connected to at least both sides of the mask portion 110, and at least one protrusion 131 for clamping the clamper is formed.

The mask 110 may have a rectangular shape, but is not limited thereto. The tension portion 130 may have the same length and width as one side of the mask portion 110 connected to one side of the tension portion 130 so that the side of the mask portion 110 can be uniformly tensioned.

FIG. 6 is a schematic view showing a process of sticking the stick mask 150 according to an embodiment of the present invention, corresponding to a cell C region of the frame 200. 6, the stick mask 150 corresponds to the upper left cell C region of the frame 200, but the mask 100 may be attached to all the mask cells by the same bonding method It is preferable to adhere.

Referring to FIG. 6A, the mask 110 of the stick mask 150 may correspond to one mask cell C region of the frame 200. 6, a clamper (not shown) is clamped on the tensile portion 130 of the stick mask 150, and tensile (F1 to F2) is applied to both sides (two sides) 100 may be flattened and correspond to the mask cell C region. It is possible to grasp the mask 100 at one point and hold it at several points (e.g., 1 to 3 points in Fig. 6). On the other hand, all sides of the mask may be stretched (F1 to F4) along all the axial directions, not the uniaxial direction.

For example, the tensile force applied to each side of the stick mask 150 may not exceed 4N. The tensile force applied depending on the size of the stick mask 150 may be the same or different. In other words, since the stick mask 150 of the present invention includes one mask cell C, the tensile force required by the conventional mask 10 (see Fig. 1), which includes the plurality of cells C1 to C5, This is likely to be the same or at least diminished. The mask 100 is attached to the frame 200 even after the stick mask 150 is attached to the frame 200 after the stick mask 150 is stretched since 9. N means a gravity force of 1 kg. The tension applied to the mask 100 by the frame 200 is very small. Thus, the deformation of the mask 100 and / or the frame 200 by the tension can be minimized, and the misalignment of the mask 100 (or the mask pattern P) can be minimized.

The conventional mask 10 of FIG. 1 has a long length because it includes five cells (C1 to C5), whereas the mask 100 of the present invention includes a single cell (C) So that the degree to which the pixel position accuracy (PPA) is distorted can be reduced. For example, assuming that the length of a mask 10 including a plurality of cells (C1 to C5, ...) is 1 m and a PPA error of 10 m is generated in all 1 m, Can be 1 / n of the upper error range according to the reduction of the relative length (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, the length of the conventional mask 10 is reduced from 1 m to 1/10, so that a PPA error of 1 탆 is generated in the entire length of 100 mm , The alignment error is remarkably reduced.

On the other hand, if the stick mask 150 has a plurality of cells C and the misalignment is minimized even if the cells C of the frame 200 correspond to the regions, May correspond to a plurality of mask cell (C) regions of the frame (200). Also in this case, it is preferable that the stick mask 150 has as few cells C as possible in consideration of the process time and productivity in the alignment.

The alignment state can be confirmed in real time through the camera unit (not shown) while adjusting the tensile force so that the stick mask 150 corresponds to the area of the mask cell C in a flat state. In the case of the present invention, since only one cell C of the stick mask 150 needs to be matched and the alignment state is confirmed, a plurality of cells C: The manufacturing time can be remarkably reduced as compared with the conventional method (see FIGS. 1 and 2).

That is, according to the method of manufacturing a frame-integrated mask of the present invention, N pieces of cells C 1 to C 5 are formed through N processes in which N stick masks 150 are associated with one cell C, And simultaneously confirm all the alignment states of the N cells (C1 to C5) at the same time.

The method of producing a frame-integrated mask according to the present invention is characterized in that the product yield in the process 25 in which 25 stick masks 150 are respectively associated with and aligned on 25 cell (C) (See FIG. 2 (a)) including the respective cells C 1 to C 5 in the five cells (C) . The conventional method of aligning five cells (C1 to C5) in five cell regions (C) at a time is a much more cumbersome and difficult task, resulting in a lower product yield.

6 (b), a part or all of the rim of the mask part 110 of the stick mask 150 can be attached to the frame 200. Attachment may be performed with a weld (W), and preferably with a laser weld (W). The welded portion may be integrally connected with the same material as the mask 100 / frame 200.

A portion of the mask 110 may be melted and welded (W) to the frame 200 by irradiating the laser onto the rim portion (or the dummy) of the mask portion 110. The welding W must be performed as close as possible to the edge of the frame 200 to minimize the hysterical space between the mask 100 and the frame 200 and increase the adhesion. The welded portion W may be formed in the form of a line or a spot and may be a medium for integrally connecting the mask 100 and the frame 200 with the same material as the mask 100 .

The width and thickness of the first grid frame part 220 (or the second grid frame part 230) may be about 1 to 5 mm. In order to improve the productivity of the first grid frame part 220, Or the second grid frame portion 230) and the edge of the mask 100 should be reduced to about 0.1 to 2.5 mm as much as possible.

7 is a schematic view showing various embodiments for manufacturing the stick mask 150. Fig.

The stick mask 150 may be manufactured by electroplating on a conductive substrate 30, 40 (or a mother plate 30, 40). A photoresist pattern capable of forming a mask pattern P is formed on the conductive substrates 30 and 40 and then electroplating is performed to form materials such as invar and super invar on the conductive substrates 30 and 40 The stick mask 150 can be electrodeposited.

In the case of a metal, metal oxide may be generated on the surface, impurities may be introduced in the course of metal production, and in the case of a polycrystalline silicon substrate, an inclusion or a grain boundary may exist. In the case of the substrate, there is a high possibility that impurities are contained, and strength. Acid resistance may be weak. An element that interferes with the formation of an electric field uniformly on the surface of the base plate such as metal oxide, impurities, inclusions, grain boundaries, etc. is referred to as "Defect ". Due to the defect, a uniform electric field is not applied to the negative electrode of the above-mentioned material, so that a part of the plating film (stick mask 150) can be formed non-uniformly.

Unevenness of the plated film and the plated film pattern [mask pattern (P)] in the realization of UHD class or higher ultra high image quality may adversely affect pixel formation. Since the pattern width of the FMM and the shadow mask can be formed to a size of several to several tens of micrometers, preferably less than 30 micrometers, even a defect of a few micrometers in size occupies a large proportion in the pattern size of the mask.

Further, in order to remove defects in the cathode body made of the above-mentioned material, an additional process for removing metal oxide, impurities and the like may be performed. In this process, another defect such as etching of the cathode body material may be caused have.

Therefore, the present invention can use a conductive base material 30, 40 made of a single crystal silicon material. The substrate 30, 40 may be doped with a high concentration of 10 < ¹⁹ > or more so as to have conductivity. Doping may be performed on the entire substrate 30, 40, or may be performed only on the surface portion.

Since there is no defect in the case of doped single crystal silicon, there is an advantage that a uniform plating film (stick mask 150) due to the formation of a uniform electric field on the entire surface at the time of electroplating can be produced. Frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the image quality level of OLED pixels. Further, since there is no need to carry out an additional process for removing and eliminating defects, there is an advantage that the process cost is reduced and the productivity is improved.

It is also possible to form an insulating part instead of PR by oxidizing and nitriding the surfaces of the substrates 30 and 40 according to necessity by using the silicon substrates 30 and 40 There is an advantage. PR, and the insulating portion serve to prevent electrodeposition of the plating film (mask 100), and a pattern (mask pattern P) can be formed on the plating film.

On the other hand, when electroplating is performed on the wide-plate-like base material 30 shown in FIG. 7A, a large amount of the stick mask 150 can be manufactured. However, in order to manufacture a wide plate type substrate 30 having a single crystal silicon material, the manufacturing cost is too high, and a problem arises that a device for performing the PR process, electroplating process, etc., must be separately formed on the wide plate- do.

Accordingly, it is possible to consider using the single crystal silicon wafer 40 as the conductive substrate 40 shown in Figs. 7 (b) and 7 (c). The monocrystalline silicon wafer 40 has already been standardized by the semiconductor industry, and a process capable of transferring and processing semiconductor wafers, a device capable of performing the process, and a peripheral infrastructure have already been developed and commercialized. For example, when an 8-inch or 12-inch wafer is used as the conductive substrate 40 (monocrystalline silicon wafer 40), a well-prepared semiconductor process such as a wafer cassette, a jig, / It has the advantage that it can utilize the equipment part infrastructure as it is and apply it to the process. Thus, it is easy to handle the conductive substrate 40, and the manufacturing cost and the process cost are significantly reduced.

Although the use of the single crystal silicon wafer 40 as the conductive substrate 40 provides many advantages, the single crystal silicon wafer 40 has a circular shape as a whole, whereas the stick mask 150 has a rectangular shape as a whole Therefore, productivity may be limited due to shape difference.

For example, as shown in FIG. 7 (b), six stick masks 150 corresponding to the display size on the 12-inch single crystal silicon wafer 40 can be electrodeposited. However, it is difficult to secure a space for electrodeposition of the rectangular stick mask 150 near the rim of the circular single crystal silicon wafer 40, thus wasting space. In addition, for example, only about two stick masks 150 corresponding to the display size can be electrodeposited on an 8-inch single crystal silicon wafer 40 'smaller than that shown in FIG. 7 (b). As shown in FIG. 7 (c), there arises a problem that there is a limitation in the space of the single crystal silicon wafer 40 'for electrodepositing the stick mask 150 thereon.

Accordingly, the present invention can be applied to the case where the single crystal silicon wafer 40 is used as the conductive base material 40 to secure various advantages as described above, and to provide a stick mask 150 capable of maximizing the productivity even on the single crystal silicon wafer 40 A manufacturing method and a stick mask 150 are provided.

8A is a schematic view showing a mask part 110 (FIG. 8A) and a mask part 110 and a tensile part 130 (FIG. 8B) according to an embodiment of the present invention. to be.

8A, electroplating on the single crystal silicon wafer 40 is the same as producing the stick mask 150 of FIG. 7 by electroplating. However, in the present invention, all of the stick masks 150 are not formed by electroplating, and only the mask part 110 of the stick mask 150 is formed by electroplating on the conductive substrate 40 (monocrystalline silicon wafer 40) . Only the masking portion 110 excluding the tensioning portion 130 is electroplated on the conductive base material 40 so that a greater number of electroplating can be performed on the single crystal silicon wafer 40 of the same size. For example, in the past, six stick masks 150 can be electroplated on a 12-inch single crystal silicon wafer 40, as shown in FIG. 7 (b) , 9 pieces of mask portions 110 corresponding to the display size can be electroplated on the 12-inch single crystal silicon wafer 40 as shown in Fig.

The tension unit 130 may be manufactured by electroplating using a separate conductive substrate. The stretching portion 130 is not formed with the mask pattern P and is substantially not attached to the frame 200 but is separated from the stick mask 150 and removed. Therefore, the tensile portion 130 does not require a complete level of electroplated film quality as compared with the mask portion 110. [ Even if a predetermined defect exists in the tensile portion 130, the OLED pixel deposition process does not adversely affect the OLED pixel. Of course, the tensile portion 130 may also be manufactured by electroplating on a single crystal silicon wafer 40. [

As shown in FIG. 8 (b), the mask portion 110 and the tensile portion 130 constituting the stick mask 150 can be separately manufactured. One mask cell C in which a plurality of mask patterns P are formed and a mask 110 including a dummy in the vicinity of the mask cell C are formed on a single crystal silicon wafer 40 As shown in FIG. The pair of tensile portions 130 to be connected to at least both sides of the mask portion 110 may be formed of a separate conductive substrate.

9 is a schematic diagram showing a stick mask 150 according to an embodiment of the present invention.

Referring to FIG. 9, separately manufactured mask part 110 and a pair of tension parts 130 may be bonded as shown in FIG. 8 (b). Since the mask portion 110 and the tensile portion 130 are plated films having a thickness of about several tens of micrometers, it is very difficult to attach and attach the side surfaces on the same horizontal plane. Therefore, it is preferable that the mask portion 110 and the stretching portion 130 occupy different regions in the vertical direction. Occupation of other regions in the vertical direction can be understood to mean that the mask portion 110 and the tensile portion 130 are not located in the same height space when constructing the stick mask 150. In another aspect, the mask portion 110 and the stretching portion 130 may include a superposition portion OR that overlaps with each other in a horizontal plane. That is, the mask portion 110 and the tension portion 130 are integrally bonded to each other via the overlap portion (OR) portion, thereby forming the stick mask 150.

The width of the overlap portion (OR) portion may be less than 2 mm. The mask part 110 and the stretching part 130 may be bonded to each other with an organic / inorganic adhesive interposed therebetween.

Alternatively, the mask portion 110 and the tensile portion 130 may be bonded to each other by performing welding on the overlapped portion (OR) portion

Alternatively, the mask part 110 and the stretching part 130 may be bonded to each other with an adhesive of an eutectic material interposed therebetween. The eutectic adhesive is an adhesive containing at least one metal selected from the group consisting of In, Sn, Bi and Au and Sn, Bi, Ag, Zn, Cu, Sb and Ge. And may have a thin thickness of about 10 to 30 mu m. The eutectic adhesive includes at least two metal solid phases, and at a certain temperature / pressure eutectic point, both metal phases can be in a liquid phase. And if you leave the elliptic point, you can again become two metal halves. Accordingly, it can act as an adhesive through phase change from solid phase to liquid phase to solid phase.

A predetermined temperature / pressure may be applied after interposing the eutectic adhesive on the overlapped portion (OR) portion of the mask portion 110 and the tensile portion 130. A predetermined pressure may be applied to prevent voids from occurring and a separate device (not shown) may be provided to flow an antioxidant gas (vacuum) to prevent eutectic oxidation. The eutectic adhesive which is solid at a predetermined temperature / pressure can be changed into a liquid while melting. Next, after the predetermined temperature / pressure (HP) is released, the mask part 110 and the tension part 130 can be bonded together while the eutectic adhesive is solidified again.

The eutectic adhesive does not contain volatile organics at all. Therefore, the volatile organic material of the adhesive reacts with the process gas to adversely affect the pixels of the OLED, or the outgas such as the organic material contained in the adhesive itself may not adversely affect the pixel processing chamber or be deposited on the OLED pixel as impurities. . In addition, since the eutectic adhesive is a solid, it is not cleaned by the OLED organic cleaning liquid and can have corrosion resistance. In addition, since the organic adhesive includes two or more metals, it can be connected to the mask part 110 and the tension part 130, which are the same metal material, with high adhesiveness.

One surface (upper surface) of the mask part 110 of the stick mask 150 manufactured by connecting the mask part 110 and the tension part 130 is adhered on the frame 200, And the tensile portion 130 can be separated and removed after the tensile and frame 200 adhering process is completed.

10 is a schematic view showing a process of manufacturing a frame-integrated mask using the stick mask 150 according to an embodiment of the present invention. In one embodiment, the mask portion 110 may be welded (W) to perform adhesion with the frame 200. The mask portion 110 of the stick mask 150 is formed on the surface of the mask 200 in the direction of the surface of the mask 200. As described above, since the mask 100 is actually attached to the frame 200 in the stick mask 150 and functions as a mask in the OLED deposition process, 100). ≪ / RTI >

10 (a), the stick mask 150 is placed on top of the frame 200 (which may be the first and second grid frame portions 220 and 230, or the frame frame portion 210) do. The clamper clamps the projection 131 of the tension portion 130 of the stick mask 150 and the tensile force F1-F4 is applied to the stick mask 150, .

The configuration of the frame 200 (the frame frame part 210, the first and second grid frame parts 220 and 230) of the mask cell C area has a shape that surrounds the mask part 110 .

A bonding portion TA may be formed on the upper portion of the frame 200 where the mask portion 110 contacts. As the adhesive for the adhesive portion TA, an epoxy resin adhesive or the like can be used. At least a part of the rim 110b of the mask 110 can be adhered and fixed to the upper portion of the frame 200 by the adhesive portion TA.

The adhesion portion TA has an effect of temporarily fixing the stick mask 150. However, since the thermal expansion coefficient of the adhesive and the inv mask 100 are different from each other, A problem may be caused. In addition, contaminants generated by the reaction of the adhesive with the process gas may adversely affect the pixels of the OLED, and outgas such as organic solvents contained in the adhesive itself may contaminate the pixel processing chamber or may be deposited on the OLED pixels as impurities Adverse effects can be caused. Further, as the adhesive is gradually removed, a problem that the mask 100 is detached from the frame 200 may occur. It is therefore necessary to clean the adhering portion TA. However, since the adhering portion TA and the stick mask 150 are adhered to each other, it is difficult to clean the adhering portion TA from the outside. During the cleaning of the adhering portion TA, There is also a possibility that deformation may occur in the mask 150. In addition, when the bonding portion TA is cleaned and removed, another method for bonding the mask 100 and the frame 200 together is proposed.

Therefore, the present invention can be carried out by performing the same process as shown in FIGS. 10 (b) to 10 (d) so as to completely remove only the adhering portion TA without affecting the mask 100 (or the stick mask 150) have. The mask 100 and the frame 200 can be integrally adhered to each other by interposing the welding portion 110c between the mask portion 110 and the frame 200 instead of the bonding portion TA.

Referring to FIG. 10 (b), laser welding W can be performed between the mask part 110b and the frame 200 by using the mask part 110b at the rim part. When the laser beam is irradiated on the upper portion of the mask portion 110b (or the pile of the mask portion 110), a part of the mask portion 110b may be melted and the weld portion 110c may be generated. Specifically, the laser needs to be irradiated on the inner region of the region where the bonding portion TA is formed. The welding portion 110c must be formed on the inner side of the bonding portion TA since the cleaning portion is required to penetrate the cleaning liquid from the outside of the frame 200 (or the outer surface of the mask portion 110). In addition, since the welding portion 110c is formed close to the corner of the frame 200, it is possible to minimize the space that is wedged between the mask portion 110 and the frame 200 and to improve the adhesion. The welding portion 110c may be formed in the form of a line or a spot and may be a medium for integrally connecting the mask portion 110b and the frame 200 with the same material as the mask portion 110b. have.

Next, referring to FIG. 10C, a laser L is irradiated to the region boundary of the mask portion 110 corresponding to the adhering portion TA to separate (separate) from the mask portion 110b and the peeling film 110d A line can be formed. That is, the laser L is irradiated to the boundary of the peeling film 110d in the mask part 110b, and the peeling film 110d can be separated from the mask part 110 by laser trimming. However, the peeling film 110d is not directly peeled off but remains adhered to the bonding portion TA.

Next, referring to (d) of FIG. 10, the bonding portion TA can be cleaned (C). A known cleaning material can be used without limitation according to the adhesive, and the cleaning liquid can penetrate from the side surface of the mask part 110 to clean (C) the adhering part TA. Thus, the adhering portion TA can be completely removed.

Then, the peeling film 110d and the tensile part 130 separated from the mask part 110 are peel off (PO). The peeling film 110d can be immediately peeled off because the peeling film 110d is separated from the mask part 110 and not in a state in which the adhering part TA is removed and adhered to the frame 200. [ Since the peeling film 110d and the tension unit 130 are integrally connected to each other, when the peeling film 110d is peeled off, the tension unit 130 can be also detached and removed.

11 (e), a frame-integrated mask in which the mask section 110 (or the mask 100) and the frame 200 are integrally formed is completed. It is possible to repeat the process of bonding one stick mask 150 onto the frame 200 and successively sticking the remaining stick mask 150 to the mask cell C and attaching the remaining stick masks 150 to the frame 200. Since the mask 100 already attached to the frame 200 can present the reference position, the time in the process of sequentially matching the remaining masks 100 to the cell C and confirming the alignment state is remarkably reduced There is an advantage to be able to. Then, the pixel position accuracy (PPA) between the mask 100 bonded to one mask cell region and the mask 100 bonded to the adjacent mask cell region does not exceed 3 mu m, There is an advantage that a mask for forming an OLED pixel can be provided.

11 is a schematic view showing an OLED pixel deposition apparatus 1000 using a frame-integrated mask 100, 200 according to an embodiment of the present invention.

11, an OLED pixel evaporation apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 (Not shown).

A target substrate 900 such as a glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source evaporator 500. Integrated masks 100, 200 [or FMM] for depositing the organic source 600 on a pixel-by-pixel basis may be closely attached to the target substrate 900 or may be disposed in close proximity to each other. The magnet 310 generates a magnetic field and can be brought into close contact with the target substrate 900 by a magnetic field.

The deposition source supply part 500 can supply the organic material source 600 through the left and right paths and the organic material sources 600 supplied from the deposition source supply part 500 can supply the pattern P And may be deposited on one side of the target substrate 900. The deposited organic material source 600 that has passed through the pattern P of the frame-integrated mask 100, 200 can act as the pixel 700 of the OLED.

The patterns of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S) in order to prevent uneven deposition of the pixel 700 by a shadow effect . Organic materials 600 passing through the pattern in a diagonal direction along the sloped surface can also contribute to the formation of the pixel 700, so that the pixel 700 can be uniformly deposited in thickness as a whole.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such variations and modifications are to be considered as falling within the scope of the invention and the appended claims.

40:
100: mask
110: mask part
130:
131: protrusion
150: Stick mask
200: frame
210:
220: first grid frame section
230: second grid frame section
1000: OLED pixel deposition apparatus
C: cell, mask cell
P: mask pattern
TA: Adhesive
W: Welding

Claims (25)

A mask portion including a mask cell having a plurality of mask patterns formed therein and a dummy around the mask cell; And
A pair of tension parts connected to at least both sides of the mask part
. The method according to claim 1,
Wherein the mask portion and the retention portion occupy different areas. The method according to claim 1,
Wherein the mask portion and the tensile portion overlap each other in a horizontal plane. The method according to claim 1,
Wherein the mask portion has a rectangular shape and one side of the tensile portion has the same length or width as one side of the connected mask portion. The method according to claim 1,
Wherein the tensioning portion includes at least one protrusion for clamping the clamper. The method according to claim 1,
Wherein at least a mask portion of the stick mask is formed by electroforming on a single crystal silicon wafer. The method according to claim 6,
Wherein the tensile portion is formed by electroplating on a conductive substrate. The method according to claim 1,
The mask portion is used as an OLED pixel deposition mask. The method according to claim 1,
Wherein at least a part of the rim of the mask part is glued on a frame having a plurality of mask cell areas along at least one of a first direction and a second direction perpendicular to the first direction. 10. The method of claim 9,
Wherein the pulling portion is separated and removed from the mask portion. The method according to claim 1,
Wherein the mask portion and the tensile portion are invar or super invar materials. A method of manufacturing a stick mask,
(a) providing a mask portion including a mask cell having a plurality of mask patterns and a dummy around the mask cell;
(b) providing a pair of tension members; And
(c) connecting the tensile portions to at least both sides of the mask portion
Wherein the step of forming the stick mask comprises the steps of: 13. The method of claim 12,
wherein in the step (a), the mask part is formed by electroforming on a single crystal silicon wafer. 14. The method of claim 13,
(b), the tensile portion is formed by electroplating on a conductive substrate. 13. The method of claim 12,
After step (c)
In the vertical direction, the mask portion and the tensile portion occupy another space,
Wherein the mask portion and the tension portion are at least partially overlapped with each other in the horizontal direction. 13. The method of claim 12,
Wherein the mask portion and the tension portion are connected by using an adhesive containing at least an alloy of two metals. 17. The method of claim 16,
When at least one of a predetermined temperature and a predetermined pressure is applied to the adhesive, at least a part of the adhering portion changes from a solid phase to a liquid phase, and the liquid phase of the adhering portion changes into a solid phase again, Wherein said method comprises the steps of: 13. The method of claim 12,
Wherein the mask portion and the tensile portion are connected by using an organic / inorganic adhesive. 13. The method of claim 12,
And the mask portion and the tension portion are welded to each other to connect the mask portion and the tension portion. A method of manufacturing a frame-integrated mask in which a mask and a frame for supporting the mask are integrally formed,
(a) preparing a mask portion including a mask cell having a plurality of mask patterns and a dummy around the mask cell;
(b) preparing a pair of tension members;
(c) connecting the tensile portions to at least both sides of the mask portion to manufacture a stick mask;
(d) providing a frame having a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction;
(e) corresponding a mask cell of the stick mask to one mask cell region of the frame; And
(f) bonding at least a part of the pile of the mask part to the frame
Wherein the frame-integrated mask comprises a plurality of mask patterns. 21. The method of claim 20,
The frame,
A frame frame part;
At least one first grid frame portion extending in a first direction and having opposite ends connected to the frame portion; And
At least one second grid frame portion extending in a second direction perpendicular to the first direction and intersecting the first grid frame portion and having opposite ends connected to the frame portion,
Wherein the frame-integrated mask comprises a plurality of mask patterns. 21. The method of claim 20,
And the rim frame portion has a rectangular shape. 21. The method of claim 20,
Wherein the cross-sectional shape perpendicular to the longitudinal direction of the first grid frame portion and the second grid frame portion is triangular, rectangular, or at least one of sides and edges is rounded triangular or rectangular. 21. The method of claim 20,
(f)
(d1) forming an adhesive portion on at least a part of an upper portion of the frame, and bonding at least a part of the dummy of the mask portion to the adhesive portion;
(d2) laser welding at least a portion of the mask in the inner region to the upper portion of the frame in a region where the bonding portion is formed;
(d4) irradiating a laser to the boundary of the peeling film of the mask portion corresponding to the adhering portion, and cleaning the adhering portion; And
(d5) removing the peeling film and the tensile portion of the mask portion
Wherein the frame-integrated mask comprises a plurality of mask patterns. 21. The method of claim 20,
(e) to (f) are repeated to adhere a plurality of stick masks sequentially to a rear frame corresponding to a mask cell area.

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