KR20190085703A - Heater core, heater and heating system including thereof - Google Patents

Abstract

According to an embodiment, disclosed is a heater core comprising: a first substrate; a first ceramic disposed on the first substrate; a heating element disposed on the first ceramic; a second ceramic disposed on the heating element; and a second substrate disposed on the second ceramic. The thickness of the first substrate is greater than the thickness of the second substrate, and the thickness of the second substrate is greater than the first ceramic or the second ceramic. Therefore, provided is the heater core which is structurally stable and has an improved reliability.

Description

HEATER CORE, HEATER, AND HEATING SYSTEM CONTAINING THE SAME (HEATER CORE, HEATER AND HEATING SYSTEM INCLUDING THEREOF)

Embodiments relate to a heater core, a heater, and a heating system including the same.

The automobile includes an air conditioner for providing thermal comfort in the room, for example, a heating device for performing heating through a heater, and a cooling device for performing cooling through the refrigerant circulation.

In the case of a general internal combustion engine vehicle, since a large amount of waste heat is generated from the engine, it is easy to secure heat required for heating from the engine. On the other hand, in the case of an electric vehicle, there is less heat generated than in an internal combustion engine vehicle, and there is also a problem that heating for a battery is also required.

Accordingly, the electric vehicle requires a separate heating device, and it is important to increase the energy efficiency of the heating device.

However, there is a limitation that the heat efficiency is lowered by bonding the heater core to the base substrate through adhesion.

Embodiments provide a heater core, a heater, and a heating system including the same.

In addition, a heater core that is structurally stable and improved in reliability is provided.

In addition, it provides a heater core with improved durability and improved thermal efficiency.

Further, it provides a heater core having improved resistance to thermal shock.

The problems to be solved in the embodiments are not limited to these, and the objects and effects that can be grasped from the solution means and the embodiments of the problems described below are also included.

According to an aspect of the present invention, there is provided a heater core comprising: a first substrate; A first ceramic disposed on the first substrate; A heating element disposed on the first ceramic; A second ceramic disposed on the heating element; And a second substrate disposed on the second ceramic, wherein a thickness of the first substrate is larger than a thickness of the second substrate, and a thickness of the second substrate is larger than that of the first ceramic or the second ceramic .

The thickness of the first substrate may be greater than the total thickness of the first ceramic, the heating element, the second ceramic, and the second substrate.

The area of the surface of the first substrate perpendicular to the thickness direction may be different from the area of the first ceramic, the heating element, the second ceramic, and the second substrate.

The area of the surface of the first substrate perpendicular to the thickness direction may be larger than the area of each of the first ceramic, the heating element, the second ceramic, and the second substrate.

The thickness ratio of the thickness of the second substrate to the thickness of the first substrate may be 1: 4 to 1:30.

A first electrode terminal formed on one end of the heating element; And

And a second electrode terminal formed at the other end of the heating element.

The area of the first ceramic perpendicular to the thickness direction may be smaller than the area of the first substrate and larger than the area of the second ceramic.

The area of the second substrate perpendicular to the thickness direction may be smaller than the area of the second ceramic and larger than the area of the heating element.

A heater according to an embodiment includes a power module; And a heat generating module electrically connected to the power module to generate heat, wherein the heat generating module includes a plurality of heat radiating fins and a plurality of heater cores disposed in an alternating manner, the heater core comprising: a first substrate; A first ceramic disposed on the first substrate; A heating element disposed on the first ceramic; A second ceramic disposed on the heating element; And a second substrate disposed on the second ceramic, wherein a thickness of the first substrate is greater than a thickness of the second substrate, and a thickness of the second substrate is larger than that of the first ceramic or the second ceramic .

A heating system according to an embodiment includes: a passage through which air flows; A supply portion for introducing air; An exhaust unit for exhausting air to the room of the moving means; And a heater disposed between the air supply unit and the exhaust unit in the flow path to heat air, the heater comprising: a power module; And a heat generating module electrically connected to the power module to generate heat, wherein the heat generating module includes a plurality of heat radiating fins and a plurality of heater cores disposed in an alternating manner, the heater core comprising: a first substrate; A first ceramic disposed on the first substrate; A heating element disposed on the first ceramic; A second ceramic disposed on the heating element; And a second substrate disposed on the second ceramic, wherein a thickness of the first substrate is greater than a thickness of the second substrate, and a thickness of the second substrate is larger than that of the first ceramic or the second ceramic .

According to the embodiment, a heater core that is structurally stable and improved in reliability can be realized. Embodiments provide a heater core, a heater, and a heating system including the same.

In addition, a heater core having improved durability and improved heat efficiency can be manufactured.

Further, it is possible to manufacture a heater core having improved resistance to thermal shock.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1 is a perspective view of a heater according to an embodiment,
2 is a plan view of the heat generating module according to the embodiment,
3 is an exploded perspective view of the heater core of the heat generating module according to the embodiment,
4 is an exploded perspective view of the heater according to the embodiment,
5 is a sectional view of the heater core in the direction of II in Fig. 3,
Fig. 6 is a top view in the A direction in Fig. 5,
Fig. 7 is a modification of Fig. 5,
8 is a plan view of a heater core according to another embodiment,
9 is a view showing various shapes of a heating element,
10A is a perspective view of a heat generating module according to another embodiment,
Fig. 10B is a modification of Fig. 10A,
11 is a conceptual diagram showing a heating system according to an embodiment.

The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated and described in the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms including ordinal, such as second, first, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

FIG. 1 is a perspective view of a heater according to an embodiment, FIG. 2 is a plan view of a heat generating module according to an embodiment, and FIG. 3 is an exploded perspective view of a heater core of a heat generating module according to an embodiment.

Referring to FIG. 1, a heater 1000 according to an embodiment includes a case 100, a heat generating module 200, and a power module 300.

The case 100 may be disposed outside the heater 1000. The case 100 may be configured to enclose the heat generating module 200 accommodated in the case 100 as an external member of the heater 1000. The power module 300 may be disposed on one side of the case 100. The case 100 may be coupled to the power module 300.

A lower portion of the case 100 may include a receiving portion for coupling with the power module 300. For example, the case 100 and the power module 300 may be coupled to each other through a pincer coupling. However, the present invention is not limited to this method, and various coupling schemes can be applied.

Further, the case 100 may have a receptacle portion in the form of a hollow block, but the present invention is not limited thereto. Illustratively, the case 100 may include a first side 110 and a second side 120. Here, the plurality of inlets may be disposed on the first surface 110. Accordingly, the fluid can flow into the first surface 110. Here, the fluid is a medium for transferring heat, for example, air. However, it is not limited to this kind.

In addition, the plurality of inlets may be arranged to align a predetermined row on the first surface 110. [ The thickness of the plurality of inlets in the first direction (X-axis direction) may vary, but is not limited to this shape.

The plurality of outlets may be disposed on the second surface 120. Fluid introduced through the first surface 110 may be heated from the heating module within the case 100 and may move through the outlet of the second surface 120. The outlet may also be arranged in alignment with a predetermined row on the second surface. It can also be arranged to correspond to a plurality of inlets. Thereby, the fluid introduced through the inlet port can be smoothly discharged through the outlet port.

And the fluid (b ₁ ) flowing into the inlet port may be lower in temperature than the fluid (b- ₂ ) discharged through the outlet port. In addition, the thickness of the plurality of outlets in the first direction (X-axis direction) may vary, but is not limited to this shape.

The heat generating module 200 may be disposed inside the case 100. The heat generating module 200 may be electrically connected to the power module 300 disposed at one side of the case 100. The heat generating module 200 may generate heat by using the power supplied from the power module 300.

The power module 300 may be disposed on one side of the case 100. For example, the power module 300 may be disposed under the case 100 to support the case 100 and the heat generating module 200. The power module 300 may be coupled to the case 100. The power module 300 may be electrically connected to the heat generating module 200 to supply power to the heat generating module 200. One side of the power module 300 may be connected to an external power supply. The mass air flow (MAF) of the heater 1000 according to the embodiment may be 300 kg / h, but it may have various values depending on the volume of the heater 1000.

2, the heat generating module 200 may include a plurality of heater cores 220, heat dissipation fins 210, a first gasket 230, and a second gasket 240.

The heater core 220 may be disposed inside the case 100 as a heat generating portion. The heater core 220 may receive power from the power module and perform heat generation. The number of heater core 220 may be plural, but is not limited to this number.

The heater core 220 may have a thickness T1 ranging from 1 mm to 6 mm in the first direction (X-axis direction). However, the present invention is not limited to such a thickness, and the thickness of the heater core 220 can be increased in the first direction (X axis direction) as the size of the heater increases. Here, the first direction (X-axis direction) is the direction in which the heater core 220 and the radiating fin 210 are alternately arranged, and is the same as the thickness direction of the heater core. Hereinafter, the first direction (X-axis direction) will be described.

The heater according to the embodiment of the present invention can reduce the maximum thickness T2 in the first direction (X-axis direction) of the heater by decreasing the thickness T1 of the heater core 220 in the first direction have. With such a configuration, the other heaters in the embodiment are lighter, and include more heater cores 220 per heater of the same size to provide improved thermal efficiency.

Preferably, the thickness T1 in the first direction (X-axis direction) of the heater core 220 can be 1 mm or more and 5 mm or less, and more preferably 1.5 mm or more and 3 mm or less.

The plurality of heater cores 220 may be spaced apart by a predetermined distance. The radiating fins 210 may be disposed between the plurality of heater cores 220.

The heater core 220 and the radiating fins 210 may be arranged alternately in the first direction (X-axis direction).

That is, the heat generating module 200 may include a heat radiating fin 210 and a heater core 220 disposed alternately in the first direction (X axis direction). The minimum thickness T2 of the heat generating module 200 may be 160 mm to 200 mm. The heater core 220 and the heat dissipation fin 210 are connected to each other so that heat generated in the heater core 220 can move to the heat dissipation fin 210. Accordingly, the fluid passing through the heater core 220 and the heat dissipation fin 210 can be heated to increase the temperature. For example, the fluid passing through the heater core 220 and the radiating fin 210 can be supplied to the interior of the vehicle to control the temperature inside the vehicle.

For this heat transfer, a thermally conductive member (not shown) may be disposed between the heater core 220 and the radiating fin 210. The thermally conductive member (not shown) may include conductive silicon, but is not limited to such a material.

The radiating fins 210 may be disposed inside the case 100. The radiating fins 210 may be disposed between the heater cores 220, and may be plural. The plurality of radiating fins 210 may be spaced apart in the first direction (X-axis direction).

The radiating fin 210 may be in the form of extending in the second direction (Z-axis direction) like the heater core 220. Here, the second direction (Z-axis direction) means a direction perpendicular to the first direction (X-axis direction) and is applied as follows. The radiating fin 210 may be a louver fin, but is not limited thereto. The radiating fin 210 may have a shape in which the inclined plate is laminated in the second direction (Z-axis direction). Accordingly, the heat dissipation fin 210 may include a plurality of gaps through which the fluid can pass. The fluid can be supplied with heat while passing through the gap. By this heat dissipation fin 210, the heat transfer area through which the heat generated in the heater core 220 is transferred to the fluid is increased, and the heat transfer efficiency can be improved.

The heat dissipation fins 210 may be combined with the heater core 220 by an adhesive member such as a silver bonding layer 224 or an aluminum (Al) brazing paste. However, the present invention is not limited to these methods.

An adhesive member (not shown) may be disposed between the heater core 220 and the radiating fin 210 to couple the heater core 220 and the radiating fin 210 together. The bonding member (not shown) prevents detachment of the heater core 220 and the heat dissipation fin 210 at a high temperature generated when the heater is driven, thereby improving the durability and reliability of the heater.

The thickness T3 of the radiating fin 210 in the first direction (X-axis direction) may be 8 mm to 32 mm, but may be variously applied depending on the size of the heater.

There is a problem that the mass air flow of the heater is reduced when the thickness T3 of the radiating fin 210 in the first direction (X-axis direction) is smaller than 8 mm, Axial direction) is greater than 32 mm, there is a limit to lowering the rate of temperature rise of the fluid because heat is not properly transferred to the passing fluid.

In addition, the minimum height L1 of the radiating fin 210 may be 180 to 220 mm in a second direction (Z-axis direction) perpendicular to the first direction (X-axis direction).

A support (not shown) may be disposed between the radiating fins 210. The support portion (not shown) may be randomly disposed between the plurality of radiating fins 210. For example, at least one support portion (not shown) may be disposed between the adjacent heater cores 220. [

The support portion (not shown) supports the heater core 220 and the heat dissipation fin 210 to prevent the heater core 220 and the heat dissipation fin 210 from being bent from external force. The thickness of the support portion (not shown) in the first direction (X-axis direction) may be 0.4 mm to 0.6 mm. When the thickness of the support portion (not shown) in the first direction (X-axis direction) is smaller than 0.4 mm, there is a limit that the amount of fluid discharged through the heater is reduced. There is a problem that when the thickness of the supporting portion (not shown) in the first direction (X-axis direction) is larger than 0.6 mm, the space of the radiating fin 210 decreases and the heat transmitted to the fluid decreases.

The support (not shown) may be disposed in the center of the adjacent heater core 220 between the heater cores 220. With such a configuration, damage of the heater can be minimized by distributing the force from the external force in a balanced manner.

In addition, the support (not shown) may have a thickness (T1) that decreases as the thickness T1 of the heater core 220 decreases without changing the minimum thickness T2 of the heat generating module 200 in the first direction Can be the same. That is, the support portion (not shown) can be inserted into the heater while maintaining the thickness T3 of the radiating fin 210 in the first direction (X-axis direction). According to this structure, when the heater applied to the existing vehicle is replaced with the heater according to the embodiment of the present invention, the design (size, etc.) of the heater does not need to be changed, And can be reused. For example, the heat radiating fins of existing heaters can be equally applied to the heaters according to the embodiments. Therefore, the conventional heater manufacturing process can be used, so that the heater according to the present embodiment does not change the existing manufacturing process and compatibility can be improved.

The first gasket 230 may be positioned inside the case 100. The second gasket 240 may be located at a lower portion inside the case 100. The first gasket 230 and the second gasket 240 can be engaged with the case 100 by being pinched, glued, or the like.

The first gasket 230 and the second gasket 240 may be provided with a plurality of first accommodating portions 231 and second accommodating portions 241 spaced apart in the first direction (X axis direction). The first gasket 230 may include a plurality of protruded first receiving portions 231. The second gasket 240 may include a plurality of protruding second receiving portions 241.

Referring to FIG. 3, the heater core 220 may include a first substrate 221, a second substrate 223, and a heating element 222.

The first substrate 221 and the second substrate 223 can receive the heating element 222 therein.

The first substrate 221 may be disposed on one side of the heater core 220 and the second substrate 223 may be disposed on the other side of the heater core 220.

The first substrate 221 and the second substrate 223 may include a metal having high thermal conductivity. For example, the first substrate 221 and the second substrate 223 may include Al, Cu, Ag, Au, Mg, SUS, stainless steel, or the like. However, the present invention is not limited to these materials.

Unlike the first substrate 221, the second substrate 223 may be formed by thermal spraying on the second ceramic 223a. This will be described later in detail with reference to FIG.

In addition, the second substrate 223 may be formed of a metal material capable of protecting the ceramic and the heating element, but is not limited thereto.

The first ceramics 221a and the second ceramics 223a may be positioned to face each other with respect to the heating element 222. The first ceramics 221a and the second ceramics 223a may be formed by anodizing, thermal spraying, screen printing, patterning, or the like.

The first ceramics 221a and the second ceramics 223a may be formed of at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), magnesium (Mg) ) And nitrogen (N). In addition, the first ceramic 221a and the second ceramic 223a may include Ti. The explanation on the weight ratio of Ti will be explained below.

For example, the first ceramics 221a and the second ceramics 223a may include aluminum oxide, aluminum nitride, magnesium oxide, and magnesium nitride. With this configuration, the first ceramic 221a and the second ceramic 223a can easily dissipate the heat generated from the heating element 222 of the heater core 220 to the outside. The first ceramics 221a and the second ceramics 223a may perform insulation to prevent electrical signals provided to the heating element 222 from being transmitted to the radiating fins and the case.

In addition, the first ceramic 221a and the second ceramic 223a may be formed to be as thin as 50 占 퐉 to 500 占 퐉 in the first direction (X-axis direction). With this configuration, the first and second ceramics 221a and 223a easily dissipate the heat generated by the heating element 222 disposed between the first ceramic 221a and the second ceramic 223a, It is possible to prevent a phenomenon such as a crack caused in the first ceramic member 221a and the second ceramic member 223a.

The first ceramic 221a and the second ceramic 223a may be formed on the first substrate 221 through spraying at a high temperature nozzle of about 10,000 ° C. At this time, since the temperature formed between the first ceramic 221a and the second ceramic 223a and the first substrate 221 is about 200 ° C, the first substrate 221, the first ceramic 221a, The first ceramic 221a and the second ceramic 223a can be prevented from being separated from the first substrate 221 during the operation of the heater. In addition, the first ceramic 221a and the second ceramic 223a can be improved in thermal reliability of the heat-resistant heater core 220 formed through thermal spraying in the high-temperature nozzle as described above.

In addition, the same can be applied to the case where the second ceramic 223a is formed on the second substrate 223 by spraying.

The thermal expansion coefficients of the first and second substrates 221 and 223 may be determined according to predetermined conditions by reflecting the thermal expansion coefficients of the first and second ceramics 221a and 223a. That is, the thermal expansion coefficients of the first and second substrates 221 and 223 may have values similar to those of the first and second ceramics 221a and 223a.

The thermal expansion coefficient of the first and second substrates 221 and 223 may have the same value as the thermal expansion coefficient of the first and second ceramics 221a and 223a. As a result, since the thermal conductivity is good but it is brittle and easily damaged by thermal shock, the thickness of the first and second ceramics 221a and 223a can be adjusted and reinforced.

The difference between the thermal expansion coefficient of the first substrate 221 and the second substrate 223 and the thermal expansion coefficient of the first and second ceramics 221a and 223a is 0 or equal to or the ratio of the thermal expansion coefficient is 1: : ≪ / RTI > Preferably, the coefficient ratio of the thermal expansion coefficient of the first substrate 221 and the second substrate 223 to the thermal expansion coefficient of the first and second ceramics 221a and 223a ranges from 2: 1 to 4: 1. When the coefficient ratio of the thermal expansion coefficient between the first substrate 221 and the second substrate 223 and the first and second ceramics 221a and 223a exceeds 6: 1, the first and second ceramics 221a and 223a It can be broken.

The first substrate 221 and the second substrate 223 may be disposed on both sides of the heating element 222, the first ceramic 221a, and the second ceramic 223a. Accordingly, the first substrate 221 and the second substrate 223 can protect the heating element 222, the first ceramic 221a, and the second ceramic 223a. The first substrate 221 and the second substrate 223 are made of a material having high thermal conductivity such as aluminum (Al) so that heat generated in the heat generating element 22 can be easily conducted to the outside through the heat dissipating fin 210 . The heating element 222 may be disposed between the first substrate 221 and the second substrate 223. For example, the heating element 222 may be disposed on one surface of the first substrate 221 by printing, patterning, spraying, vapor deposition, or the like.

The heat generating element 222 may be disposed inside the heat generating module 200. The heating element 222 may be disposed on the first substrate 221 by printing, patterning, vapor deposition, or the like. The heating element 222 may be disposed on a surface of the first substrate 221 where the first substrate 221 and the second substrate 223 are in contact with each other.

The heating element 222 may be a resistor line. The heating element 222 may include at least one of Ni-Cr, Mo, W, Ru, Ag, Cu, BiTiO, But it is not limited thereto. The heat generating element 222 may generate heat when electricity flows.

The heating element 222 may be formed on the first ceramic 221a of the first substrate 221 through silk screen printing or thermal spraying.

As mentioned above, the heating element 222 may be formed on the first substrate 221 through thermal spray at a high temperature nozzle of about 10,000 ° C. Since the temperature formed between the first substrate 221 and the first ceramic 221a is about 200 ° C, the degree of adhesion between the first substrate 221 and the first ceramic 221a is improved, It is possible to prevent the first ceramic 221a from being separated from the first ceramic 221.

The heating element 222 extends in various directions of the first substrate 221 and can be turned up (curved or bent) at a portion of the first substrate 221. Illustratively, the heating element 222 may be repeatedly extended in the second direction (Z-axis direction) of the first substrate 221. The heating element 222 may be in the form of being laminated in a third direction (Y-axis direction) in which the fluid passes by repeating this extension.

With this configuration, the fluid passes through the portion where heat is generated in the heater core 220 while passing through the heat generating module 200, and can receive heat. That is, the area of contact between the fluid and the heat generated in the heater core 220 can be increased by the arrangement of the heat generating elements 222.

In the case of the heater including the conventional ceramic, the heating element 222 according to the embodiment is formed by the first substrate 221 and the second substrate 223, The area of the heat generating element 222 may be variously different from the area of the first substrate 221 and the second substrate 223. For example, the surface area of the heat generating element 222 can be secured at 10% or more, 50% or more, or 70% or more of the surface area of the first substrate 221 to improve the heat efficiency, There is also.

Both ends of the heat generating element 222 may be electrically connected to any one of the first electrode terminal 225a and the second electrode terminal 225b. However, the present invention is not limited to these connection forms.

The heating element 222 can receive power from the power module through the first electrode terminal 225a and the second electrode terminal 225b. The heating element 222 can convert the electrical energy of the power module into thermal energy. For example, a current flows through the heating element 222, and heat generation may occur. And the heat generation element 222 can be controlled in heat generation under the control of the power supply provided by the power module.

In addition, a heat diffusion plate (not shown) may be disposed on both sides of the heater core 220. The heat dissipation plate may have a plurality of layer structures to facilitate thermal diffusion. However, the present invention is not limited to such a structure.

Further, a cover portion (not shown) for covering the heater core 220 may be disposed. The heat dissipation plate may be disposed on one side of the first substrate 221 and the second substrate 223 to transmit heat to the cover portion. For example, the heat diffusion plate can be coupled to the side surfaces of the first substrate 221 and the second substrate 223, respectively.

The electrode unit 225 may be disposed at one end of the heater core 220. The electrode unit 225 may include a first electrode terminal 225a and a second electrode terminal 225b. For example, the first electrode terminal 225a and the second electrode terminal 225b may be disposed outside the first substrate 221 and the second substrate 223.

The first electrode terminal 225a and the second electrode terminal 225b may be electrically connected to the heating element 222 in the first substrate 221 as described above. Accordingly, the first electrode terminal 225a and the second electrode terminal 225b may be partially disposed between the first substrate 221 and the second substrate 223, respectively. The first electrode terminal 225a and the second electrode terminal 225b may have different electrical polarities. The first electrode terminal 225a, the heating element 222, and the second electrode terminal 225a may form an electrically closed loop in the heater core 220. [ A separate connection part for electrically connecting the first electrode terminal 225a and the second electrode terminal 225b to the heating element 222 may be disposed. In addition, the first electrode terminal 225a and the second electrode terminal 225b may be electrically connected to the power module. Thus, the power of the power module can be provided to the heat generating module 200.

The cover portion (not shown) may surround the first substrate 221 and the second substrate 223. And the cover portion (not shown) may include a receiving hole.

The material of the cover portion (not shown) may include aluminum (Al). The cover portion (not shown) may be a hollow bar or a rod in the form of an external member of the heater core 220, but is not limited thereto.

The cover part (not shown) can house the first substrate 221, the second substrate 223, the heating element 222, and a heat dissipation plate (not shown) therein. In this case, the inner surface of the cover portion (not shown) may contact at least one of the first substrate 221, the second substrate 223, and a heat diffusion plate (not shown).

A thermally conductive silicone may be disposed between the cover (not shown) and the first substrate 221 and the second substrate 223, and a heat spreader (not shown). The cover portion (not shown) can be bonded to the first substrate 221, the second substrate 223, and the heat diffusion plate (not shown) by the thermally conductive silicone. In addition, the cover portion (not shown) may be structurally coupled to the first substrate, the second substrate 223, and the heat dissipation plate (not shown), but is not limited thereto.

Since the cover portion (not shown) surrounds the first substrate 221, the second substrate 223 and the heat diffusion plate (not shown), the first substrate 221 and the second substrate 223, (Not shown). With this structure, the cover portion (not shown) can improve the reliability of the heater core 220. [

The cover part (not shown) has a high thermal conductivity, and conveys heat generated in the heating body 222 of the first substrate 221 and the second substrate 223 to the radiating fin 210 contacting the heater core 220 .

In addition, a cover portion (not shown) may be inserted into the first gasket 230 and the second gasket 240. The cover portion may be inserted into the first gasket 230 and the second gasket 240 to support the heat generating module 200 of the embodiment.

However, the cover part (not shown) may be modified by design request and may have various forms, and is not limited to this form. In addition, the cover portion (not shown) may be an additional configuration that can be changed by design request. In the heater core 220, the cover portion may be omitted. In addition, a heat diffusion plate (not shown) may be omitted as well as a cover portion (not shown).

The first gasket 230 may include a plurality of first receiving portions. Also, the second gasket 240 may include a plurality of second accommodating portions.

The plurality of first receiving portions 231 and the second receiving portions 231 may be arranged so as to correspond one-to-one with the plurality of heater cores 220. With this structure, one side of the heater core 220 can be inserted into the first accommodating portion 231. [ Further, the other side of the heater core 220 can be inserted into the second accommodating portion 241.

The first substrate 221 and the second substrate 223 may be inserted into the first gasket 230 and the second gasket 240. With this configuration, the heater core according to the embodiment can provide a heater that is lighter in weight due to reduced volume and reduced volume.

However, the electrode portion 225 of the heater core 220 may extend downward through the second accommodating portion 241. Accordingly, the first electrode terminal 225a and the second electrode terminal 225b are exposed downward and can be electrically connected to the power module.

4 is an exploded perspective view of a heater according to an embodiment.

Referring to FIG. 4, the power module 300 may be disposed below the case 100. The power module 300 may be coupled to the case 100. The power module 300 may be electrically connected to the heat generating module. The power module 300 can control intensity, direction, wavelength, etc. of the current supplied to the heat generating module. The power module 300 may be connected to an external power supply unit through a conductive line (not shown) to be charged or supplied with power.

The power module 300 may include a case guide part 310, a connection terminal part 320, a first connection terminal 330, and a second connection terminal 340 in a block form.

The case guide 310 may be formed at the center of the upper surface of the power module 300. The case guide part 310 may have a square groove or a hole shape, and a connection terminal part 320 may be formed therein. In this case, a groove or a hole corresponding to the lower portion of the case 100 may be formed by a rectangular groove or hole of the case guide portion 310 and a side wall of the connection terminal portion 320. Therefore, the case 100 can be guided in a state of being inserted into the case guide portion 310. As a result, the power module 300 can be arranged on the lower portion of the case 100. [ In this case, the lower part of the case 100 and the power module 300 can be combined. Various methods such as mechanical (screw and the like), structural (such as pinching), and adhesion (adhesive layer) can be used for the coupling of the case 100 and the power module 300.

The connection terminal portion 320 may be a support formed at an inner center portion of the case guide portion 310. A connection terminal groove 321 may be formed at the center of the connection terminal portion 320. A plurality of first and second connection terminals 330 and 340 may be arranged on the bottom surface of the connection terminal groove 321.

The first and second connection terminals 330 and 340 may be plural. The first and second connection terminals 330 and 340 may be spaced apart from each other in the front-rear direction. In this case, the first connection terminal 330 may be disposed at the front side. Further, the second connection terminal 340 may be disposed at the rear side. The first and second connection terminals 330 and 340 may be in the form of a plate having front and rear surfaces. The plurality of first and second connection terminals 330 and 340 may correspond one-to-one with the plurality of heater cores 220. The plurality of first and second connection terminals 330 and 340 may be disposed facing each other with a plurality of first and second electrode terminals 225a and 225b. Therefore, when the case 100 is coupled to the power module 300, the first connection terminal 330 can be coupled to the corresponding first electrode terminal 225a. In addition, the second connection terminal 340 can be coupled to the corresponding second electrode terminal 225b. The first connection terminal 330 and the first electrode terminal 225a may be pinched or assembled and electrically connected. Similarly, the second connection terminal 340 and the second electrode terminal 225b may be pinched or assembled and electrically connected.

5 is a cross-sectional view of the heater core in the direction II in Fig. 3, Fig. 6 is a top view in the direction A in Fig. 5, and Fig. 7 is a modification of Fig.

First, referring to Figure 5, the first substrate 221 may be the width (W ₂₎ is 10㎜ 20㎜ to a third direction (Y axis direction). The width W ₁ of the second substrate 223 in the third direction (Y axis direction) may be equal to or smaller than the width W ₂ of the first substrate 221 in the third direction (Y axis direction) . For example, the width W _{1 of} the second substrate 223 in the third direction (Y-axis direction) may be 10 mm to 20 mm.

In addition, any one of the first substrate 221 and the second substrate 223 may have a larger width in the third direction (Y-axis direction) than the other. Illustratively, the first substrate 221 may be greater than the third direction (Y axis direction) in the width (W2), the width of the second substrate 223, a third direction (Y axis direction) (W _1).

As described above, the second substrate 223 may be formed on the first ceramic 221a, the heating body 222, and the second ceramic 223a by a thermal spraying method.

However, spraying is a technique of melting or half-melting the material on the surface of the object using the desired material. Specifically, the thermal spray can be divided into a gas type and an electric type. For example, the thermal spray material is continuously supplied and melted in a flame to form a film by spraying molten material with compressed air, A method in which the generated combustion gas is injected at a high speed through a nozzle, and a raw material powder is sprayed to a high-speed injection gas at a high-speed injection / heating / melting speed to form a film. At this time, the first ceramic 221a, the second ceramic 223a, and the heating element 222 are formed by feeding, heating, and melting the raw material powder so that the structure is finer, the insulating / thermal conductivity is improved, .

Alternatively, the second substrate 223 may be formed of a sake wire so that the manufacturing speed can be improved and a large thickness can be easily manufactured, the film strength is high, the cost is low, the insulating property is poor, Lt; / RTI >

That is, the first ceramic 221a, the heating element 222, the second ceramic 223a, and the second substrate 223 may all be formed on the first substrate 221 by thermal spraying.

Thus, the heater core according to the embodiment can improve the bonding force between the first ceramic 221a, the heating body 222, the second ceramic 223a, and the second substrate 223 disposed on the first substrate 221 .

Further, when the heating element 222 generates heat, the phenomenon that the heating element 222 is separated from the first and second substrates 221 and 223 due to the high temperature can be prevented. Further, the second substrate 223 can protect the ceramic and heat generating element 222 from moisture and external force.

In addition, the second substrate 223 can directly contact the second ceramic 223a on the second ceramic 223a. Accordingly, the inflow of air, foreign matter, or the like between the second substrate 223 and the second ceramic 223a is blocked, thereby improving the heat generating efficiency.

The width W _{2 of} the first substrate 221 in the third direction (Y-axis direction) may be 10 mm to 20 mm. The second substrate 223 may have a width W ₁ of 11 mm to 23 mm in a third direction (Y-axis direction).

The first ceramic 221a, the heating body 222, and the second ceramic 223a may be formed on the first substrate 221 as described above. The second ceramic 223a may be formed on the first ceramic 221a and the heating body 222 by thermal spraying.

At this time, the second ceramics 223a may be formed on the first ceramic 221a even if they are formed by thermal spraying at high temperature and high pressure. The second ceramic 223a is formed on the first ceramic 221a before the second ceramic 223a is formed so that the high temperature and high pressure applied when the second ceramic 223a is formed are transferred to the second substrate 223, The first substrate 221 may be affected by the high temperature when the first ceramic 221a and the second ceramic 223a are formed on the first substrate 221 The thickness T ₄ can be increased in the first direction (X-axis direction) in order to prevent warping.

The heater core according to the embodiment includes the first substrate 221, the first ceramic 221a, the second ceramic 223a, the heating element 222, the second substrate 223a, May be different from each other.

First, the thickness T _{4 of} the first substrate 221 in the first direction (X-axis direction) is divided into a first ceramic 221a, a second ceramic 223a, a heating element 222 And the second substrate 223, respectively.

For example, the thickness T ₄ - in the first direction (X-axis direction) of the first substrate 221 may be 0.4 mm to 3 mm. Preferably, the thickness (T ₄ -) in the first direction (X-axis direction) of the first substrate may be 1 mm to 2.5 mm, and more preferably 1.5 mm to 2.2 mm. The first substrate 221 according to the embodiment is formed by spraying the first ceramic 221a, the second ceramic 223a, the heating element 222 and the second substrate 223 on the first substrate 221 It is possible to prevent a warping phenomenon caused by heat.

The first ceramic 221a may be formed on the first substrate 221 and may have a thickness T ₅ smaller than that of the first substrate 221 and the second substrate 223 in the first direction .

For example, the first ceramic 221a may have a thickness (T ₅ ) of 50 μm to 500 μm in the first direction (X-axis direction). Preferably, the first ceramic (221a) may be any of the thickness (T ₅₎ is 100㎛ 400㎛ to the first direction (X axis direction), more preferably to 150㎛ 300㎛.

In this case, when the thickness T _{5 of} the first ceramic 221a in the first direction (X-axis direction) is smaller than 50 占 퐉, the withstand voltage phenomenon may be lowered. That is, the first ceramic 221a can not withstand the voltage applied to the heating element 222 between the heating element 222 and the first substrate 221, so that it may be difficult to maintain electrical disconnection. First ceramic (221a) has a thickness (T ₅₎ is greater than the 500㎛, heating the first substrate (221 columns on a first ceramic (221a) originating from (222) a first direction (X axis direction) ) Is reduced, and there is a limit in which cracks are generated.

The heating element 222 may be disposed on the first ceramic 221a as mentioned above. For example, the heating element 222 may be disposed on a patterning by a laser. The heating element 222 may have a thickness T ₆ of 10 μm to 100 μm in the first direction (X-axis direction). Preferably, the heating element 222 may be in the 30㎛ 70㎛ to the thickness in the first direction (X axis direction) (T _6), may be more preferably, 40㎛ to 60㎛.

Further, when the thickness T ₆ in the first direction (X-axis direction) is smaller than 10 탆, the heat generating element 222 has a limit to lower the generated heat. If the thickness T ₆ of the heating element 222 in the first direction (X-axis direction) is larger than 100 μm, there is a limit to increase the risk of electrical disconnection between the heating elements 222.

Second ceramic (223a) may be a first ceramic (221a) and may be formed on the heat generating element 222, the first to 50㎛ 500㎛ thickness in a first direction (X axis direction) (T _7). Preferably, the second ceramic (223a) may be any of the thickness (T ₇₎ is 100㎛ 400㎛ to the first direction (X axis direction), more preferably to 150㎛ 300㎛.

In this case, when the thickness T ₇ is smaller than 50 탆 in the first direction (X-axis direction), the second ceramic 223 a has a limit to lower the electrical disconnection between the heating element 222 and the second substrate 223 is present and the second ceramic (223a) is on a first direction (X axis direction) in the thickness (T ₇₎ is a second ceramic (223a), the heat generated from the large case, the heating element 222 than the 500㎛ 2 substrate 2213. In other words,

The second substrate 223 may be formed on the second ceramic 223a as mentioned above. The second substrate 223 is a first direction (T ₈ -) to the thickness (X-axis direction) than the thickness of the first ceramic (221a) and the second ceramic (223a), the first substrate 221 is larger than the thickness of Can be small. Thus, the second substrate 223 is disposed on the outer side of the heater core, so that the first ceramic 221a and the second ceramic 223a inside can be protected from external force.

The second substrate 223 may have a thickness (T ₈ -) of 100 μm to 500 μm in the first direction (X-axis direction). When the thickness T ₈ - in the first direction (X-axis direction) of the second substrate 223 is smaller than 100 탆, there may be a problem that the second substrate 223 is bent at a high temperature. Further, when the thickness T ₈ - of the second substrate 223 in the first direction (X-axis direction) is larger than 500 μm, there is a limit that the heat transfer efficiency of the second substrate 223 is lowered. That is, the thickness T ₈ in the first direction (X-axis direction) of the second substrate 223 according to the embodiment is greater than the thickness T ₄ in the first direction (X-axis direction) Can be small. Preferably, the second substrate 223 has a thickness (T ₈ -) of 125 μm to 400 μm in the first direction (X axis direction), more preferably, the second substrate 223 has a thickness Direction) and the thickness (T ₈ -) may be 200 탆 to 300 탆.

The thickness ratio of the thickness of the second substrate 223 to the thickness of the first substrate 221 in the first direction (X-axis direction) may be 1: 2 to 1:10. Preferably, the thickness ratio is 1: 5 to 1: 8, more preferably the thickness ratio is 1: 3 to 1: 5.

When the thickness ratio of the thickness of the second substrate 223 to the thickness of the first substrate 221 is less than 1: 4 in the first direction (X-axis direction), the first substrate 221 is curled, There is a limitation that heat can not be easily transferred to the first substrate 221 and the second substrate 223. [

When the thickness ratio of the thickness of the second substrate 223 to the thickness of the first substrate 221 is greater than 1:30 in the first direction (X-axis direction), the heat dissipating fins 210 attached to the second substrate 223 are supported And there is a limit that the second ceramic 223a from the outside is influenced by the external force.

With this structure, the volume and weight of the heater core 220 can be reduced while preventing the second substrate 223 from expanding and bending due to the high temperature. In addition, it is possible to provide a reduction in manufacturing cost.

The thickness of the first substrate 221 in the first direction (X axis direction) may be greater than the total thickness of the first ceramic 221, the heating element 222, the second ceramic 223a, and the second substrate 223. The first substrate 221 can be formed by a high temperature process even if the first ceramic 221, the heating element 222, the second ceramic 223a, and the second substrate 223 are formed on the first substrate 221 by thermal spraying. It may not be warped.

In addition, the second substrate 223 has a thickness in a first direction (X axis direction) (T ₈ -) is the first ceramic (221a) or the second ceramic (223a), each of the first direction (X axis direction) in the thickness And may be smaller than the thickness in the entire first direction (X-axis direction) of the first ceramics 221a and the second ceramics 223a.

6, a heater core according to an embodiment includes a first ceramic 221a, a heating body 222, a second ceramic 223a, and a second substrate 223 formed on a first substrate 221 in a first direction (X-axis direction) in this order.

The height of the first substrate 221 in the second direction (Z-axis direction) is greater than the height of the first ceramic 221a, the heating body 222, the second ceramic 223a and the second substrate 223 in the second direction Z Axis direction). For example, the first substrate 221, the first ceramic 221a, the heating element 222, the second ceramic 223a, and the second substrate 223 may have the same height in the second direction (Z-axis direction) .

The width of the first substrate 221 in the third direction (Y-axis direction) is the width of the first ceramic 221a, the heating element 222, the second ceramic 223a, and the second substrate 223 in the third direction Y axis direction). For example, the widths of the first substrate 221, the first ceramic 221a, the heating element 222, the second ceramic 223a, and the second substrate 223 may be the same in the third direction (Y axis direction) .

The area S1 on the YZ plane of the first substrate 221 is larger than the areas S2, S3 and S4 on the YZ plane of the first ceramic 221a, the second ceramic 223a and the second substrate 223, .

For example, the area (S1) on the YZ plane of the first substrate 221 may be a 36cm ² to about 44 cm ^2.

The area S2 on the YZ plane of the first ceramic 221a is smaller than the area S1 on the YZ plane of the first substrate 221 and larger than the area S3 on the YZ plane of the second ceramic 223a . Accordingly, the first substrate 221 may include a region where the first ceramic 221a is not disposed along the edge of the first substrate 221, and the first substrate 221 may be positioned at a high temperature The second ceramic 223a can have the area S3 on the YZ plane smaller than the area S2 on the YZ plane of the first ceramic 221a have. The area on the YZ plane of the heating element 222 may be smaller than the area S3 on the YZ plane of the second ceramic 223a and the area S2 on the YZ plane of the first ceramic 221a. The area of the second substrate 223 on the YZ plane may be larger than the area on the YZ plane of the heating element 222 and smaller than the area S3 on the YZ plane of the second ceramic 223a. With such a configuration, the electrical connection between the first substrate 221 and the second substrate 223 can be cut off.

That is, the heating element 222 may overlap the first substrate 221, the first ceramic 221a, the second ceramic 223A, and the second substrate 223 in the first direction (x-axis direction). Thus, the heating element 222 can be insulated from the first substrate 221 and the second substrate 223, except for the electrical connection with the electrode terminal described above.

The second substrate 223 may be overlapped with the first substrate 221, the first ceramic 221a, and the second ceramic 223A in a first direction (x-axis direction). The area of the second substrate 223 on the yz plane is larger than the area of the heating element 222 and the heat generated from the heating element 22 is easily transferred to the second substrate 223 through the second ceramic 223a Heat loss can be reduced.

In addition, the second ceramic 223a may overlap with the first substrate 221 and the first ceramic 221a in the first direction (x-axis direction). Accordingly, even if the second ceramic 223a is formed on the first ceramic 221a by spraying or the second substrate 223 is formed on the second ceramic 223a by thermal spraying, So that the second ceramic 223a or the first substrate 221 can be prevented from being warped.

Also, the first ceramic 221a may overlap the first substrate 221 in the first direction (x-axis direction). Accordingly, even if the first ceramic 221a is formed on the first substrate 221 through thermal spraying, the first ceramic 221a is superimposed on the first substrate 221 and the first ceramic 221a is warped due to thermal expansion .

Referring to FIG. 7, the heating element 222 may have various shapes as described above. For example, the surface area of the heat generating element 222 can be secured at 10% or more, 50% or more, or 70% or more of the surface area of the first substrate 221 to improve the heat efficiency, FIG. 8 is a plan view of a heater core according to another embodiment.

Referring to FIG. 8, the adhesive layer 224 may be disposed between one surface of the first substrate 221 and the first ceramic 221a. The adhesive layer 224 can transfer the heat provided from the heating element 222 to the first substrate 221 by the first ceramic 221a.

That is, in the heater core, the first substrate 221, the adhesive layer 224, the first ceramic 221a, the heating element 222, the second ceramic 223a, and the second substrate 223 can be arranged in order have.

Accordingly, the first substrate 221 can be combined with the adhesive layer 224 disposed on one side, and the supporting force against the radiating fins (not shown) connected to the other side can be improved. Further, the adhesive layer 224 can protect the first ceramic 221a from external force.

The adhesive layer 224 may be made of a material having a thermal expansion coefficient similar to that of the first ceramics 221a and may easily transmit the heat of the heating element 222 to the first ceramic 223a.

9 is a view showing various shapes of a heating element.

Referring to FIG. 9, the first substrate 221 may be formed by printing, patterning, coating, or spraying. For example, as shown in FIG. 5, the heating element 222 may be formed so as to extend in a predetermined direction, then turn up and extend again in a direction opposite to the extended direction, and repeat it. In addition, the heating element 222 may be formed in a zigzag shape, or may be formed in a spiral shape as shown in FIG. As described above, the heating elements 222 may include a plurality of heating patterns 222-1 and 222-2 that are connected to each other in a predetermined pattern and are spaced apart from each other. Also, the heating element 222 can easily form a desired pattern using a mask on the substrate 221 on which the first ceramic 221a is formed. For example, a mask including the same open region as that in which the heating element 222 is to be sprayed can be disposed on the substrate on which the first ceramic 221a is formed. Thus, when thermal spraying is performed on the mask, the heating element 222 is sprayed on the open region of the mask, and a heating element may not be formed on the region other than the open region.

The plurality of heating patterns 222-1 and 222-2 are spaced apart from each other, and a thermal conductor (not shown) may be disposed in the spacing region between the plurality of heating patterns 222-1 and 222-2. As the printed area of the heating element 222 is wider, the amount of heat transferred to the first substrate 221 and the second substrate 223 through the first ceramic and the second ceramic can be increased. In the present specification, the heating element 222 may be used in combination with a resistor, a heating pattern, or the like.

In addition, the surface area of the heating element 222 can be variously set to 10% or more, 50% or more, or 70% or more of the upper surface area of the first substrate 221. Accordingly, the heat generating region can be enlarged on the first substrate 221 to improve the heat generating efficiency.

Since the heating element 222 is formed using a mask including an open area, the heating element 222 may be formed on the first ceramic 221a by a desired area. For example, the open area of the mask can be controlled to increase or decrease the surface area of the heating element. In addition, it can be manufactured in accordance with the heating efficiency, and it is possible to provide process efficiency, product productivity, and appropriate heat generating efficiency.

The heat conductor (not shown) may be disposed between the heating patterns 222-1 and 222-2 disposed on the first substrate 221. [ In addition, the heat conductor (not shown) may be disposed further on the outside of the heating element 222. At this time, the area of the heat conductor (not shown) disposed on the first substrate 221 may be 0.5 times or more the area of the heat generating element 222. When the area of the heat conductor (not shown) is less than 0.5 times the area of the heat generating element 222, the heat conductivity of heat generated from the heat generating element 222 may be low. 10A is a perspective view of a heat generating module according to another embodiment, and FIG. 10B is a modification of FIG. 10A.

Referring to FIG. 10A, a sensor 290 may be disposed on the heater core. The sensor 290 may comprise a temperature sensor. The temperature sensor may also include an NTC thermistor. For example, the NTC thermistor may be a device whose resistance decreases with temperature. Accordingly, the control unit disposed in the power module can sense the temperature of the heater core using the resistance value of the NTC thermistor. The controller may control the power supplied to the heater core by providing a column corresponding to the temperature of the heater core calculated in the PTC thermistor.

Such a sensor 290 may be disposed on one side of the heater core. However, the present invention is not limited to this position, and the sensor may be disposed on a support (not shown) formed in the middle of the heater core.

For example, for accurate temperature measurement of the heater core, the sensor 290 may be disposed on the side from which the fluid is to be ejected. Also, the temperature sensor may include at least one of a thermostat and a thermocouple. However, it is not limited to this kind.

With this configuration, the sensor 290 can sense the temperature of the region where the fluid is discharged. Accordingly, by accurately measuring the temperature of the fluid discharged through the discharge port, the user can more promptly control the heater 1000.

Referring to FIG. 10B, the sensor may be disposed in the heater core. As a result, the sensor can be protected from an external impact. However, the present invention is not limited to such a position and may be disposed on one side of the heater.

11 is a conceptual diagram showing a heating system according to an embodiment.

Referring to Fig. 11, the heating system 2000 of the present embodiment can be used for various moving means. Here, the moving means is not limited to vehicles that run on land, such as automobiles, but may also include boats, airplanes, and the like. Hereinafter, a case in which the heating system 2000 of the present embodiment is used in an automobile will be described as an example.

The heating system 2000 can be accommodated in an engine room of an automobile. The heating system 2000 may include an air supply unit 400, a flow path 500, an exhaust unit 600, and a heater 1000.

As the supply unit 400, various supply devices such as a blower fan and a pump may be used. The supply unit 400 moves the fluid outside the heating system 2000 to the inside of the flow path 500 described later and can move the fluid along the flow path 500.

The flow path 500 may be a passage through which the fluid flows. The supply unit 400 may be disposed at one side of the flow path 500 and the exhaust unit 600 may be disposed at the other side of the flow path 500. The oil line 500 can cooperatively connect the engine room and the interior of the vehicle.

As the exhaust part 600, a blade capable of opening and closing can be used. The exhaust part 600 may be disposed on the other side of the flow path 500. The exhaust part 600 can communicate with the interior of the automobile. Therefore, the fluid that has traveled along the flow path 500 can be introduced into the interior of the vehicle through the exhaust part 600.

The heater 1000 of the present embodiment described above can be used as the heater 1000 of the heating system 2000. Hereinafter, the description of the same technical idea will be omitted. The heater 1000 may be disposed in the form of a partition wall in the middle of the flow path 500. In this case, the front and rear sides of the heater 1000 may be the same or similar to the front and rear sides of the automobile. The cool fluid in the engine room that is supplied to the oil line 500 through the air supply unit 400 is heated while being transmitted through the heater 1000 from the front to the rear and then flows along the oil line 500 again and flows through the exhaust unit 600 It can be supplied indoors.

In addition, the heater 1000 of the present embodiment can cause heat transfer by the heating element disposed between the first ceramic and the second ceramic. And the heat efficiency can be increased by utilizing the high calorific value of the heating element. In addition, a high calorific value of the heating element can be covered with the first and second ceramics having a high heat transfer rate, thereby achieving thermal stability, and improving the thermal efficiency and reliability. Further, the switching unit may be provided between the electrode terminal, between the heat generating module and the power module, or within the power module, so that overheating and overcurrent can be prevented in advance.

Furthermore, the heater 1000 of the present embodiment is free from heavy metal materials such as lead (Pb) and can be environment-friendly and lightweight.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (10)

A first substrate;
A first ceramic disposed on the first substrate;
A heating element disposed on the first ceramic;
A second ceramic disposed on the heating element; And
And a second substrate disposed on the second ceramic,
Wherein the thickness of the first substrate is greater than the thickness of the second substrate,
Wherein the thickness of the second substrate is larger than that of the first ceramic or the second ceramic.
The method according to claim 1,
Wherein the thickness of the first substrate is greater than the total thickness of the first ceramic, the heating element, the second ceramic, and the second substrate.
The method according to claim 1,
Wherein an area of a surface of the first substrate perpendicular to the thickness direction is different from an area of the first ceramic, the heating element, the second ceramic, and the second substrate.
3. The method of claim 2,
Wherein an area of a surface of the first substrate perpendicular to the thickness direction is larger than an area of each of the first ceramic, the heating element, the second ceramic, and the second substrate.
The method according to claim 1,
Wherein the thickness ratio of the thickness of the second substrate to the thickness of the first substrate is 1: 4 to 1:30.
The method according to claim 1,
A first electrode terminal formed on one end of the heating element; And
And a second electrode terminal formed on the other end of the heating element.
The method according to claim 1,
Wherein the area of the first ceramic perpendicular to the thickness direction is smaller than the area of the first substrate and larger than the area of the second ceramic.
The method according to claim 1,
Wherein the second substrate has an area of a surface perpendicular to the thickness direction smaller than that of the second ceramic and larger than an area of the heating element.
Power module; And
And a heat generating module electrically connected to the power module to generate heat,
The heat-
A plurality of heat radiating fins and a plurality of heater cores disposed alternately,
The heater core includes:
A first substrate;
A first ceramic disposed on the first substrate;
A heating element disposed on the first ceramic;
A second ceramic disposed on the heating element; And
And a second substrate disposed on the second ceramic,
Wherein the thickness of the first substrate is greater than the thickness of the second substrate,
Wherein the thickness of the second substrate is larger than that of the first ceramic or the second ceramic.
A passage through which air flows;
A supply portion for introducing air;
An exhaust unit for exhausting air to the room of the moving means; And
And a heater disposed between the air supply unit and the exhaust unit in the flow path for heating air,
The heater
Power module; And
And a heat generating module electrically connected to the power module to generate heat,
The heat-
A plurality of heat radiating fins and a plurality of heater cores disposed alternately,
The heater core includes:
A first substrate;
A first ceramic disposed on the first substrate;
A heating element disposed on the first ceramic;
A second ceramic disposed on the heating element; And
And a second substrate disposed on the second ceramic,
Wherein the thickness of the first substrate is greater than the thickness of the second substrate,
Wherein the thickness of the second substrate is larger than that of the first ceramic or the second ceramic.

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