KR20190040578A - Led package comprising heat sink plate and method for producing thereof - Google Patents

Abstract

According to an embodiment of the present invention, the present invention provides an LED package having a heat sink plate. The LED package comprises: a first heat sink plate disposed on a lower part of a substrate and having a plurality of heat dissipating protrusions protruding to a lower part on a lower surface thereof; and a second heat sink plate disposed on an upper part of the substrate to be coupled to the first heat sink plate in order to surround the substrate and including at least one through hole for an LED mounted on the substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to an LED package having a heat sink and a method of manufacturing the LED package.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED package having a heat sink and a manufacturing method thereof, and more particularly, to an LED package having a heat sink capable of improving heat dissipation efficiency and moistureproof / dustproof effect and a method of manufacturing the same.

A light emitting diode (LED) refers to a light emitting diode that is a semiconductor device that emits light when a voltage is applied in a forward direction. The LED is smaller than a conventional light source, has a long life span, And a high-speed response characteristic with high energy efficiency and high intensity, and various lighting apparatuses using such an LED as a light source are being developed.

However, a lighting apparatus using an LED as a light source has various advantages as described above. On the other hand, when the LED chip emits a considerable amount of heat, the temperature of the LED chip becomes too high, Resulting in deterioration in luminous efficiency and shortening of the number of LED chips.

On the other hand, a conventional SMT (Surface Mounting Technology) type LED package has a problem that the electrodes are exposed to the outside, which is not suitable for realizing waterproofing. In order to solve this problem, there is a method of realizing waterproof by packing the LED by rubber packing using a separate device. With this method, it is possible to obtain the waterproofness of life, but it is difficult to expect moistureproofing. That is, when the LED is operated, heat is generated, the temperature inside the device is increased, the internal air expands, and the expanded air escapes into the gap of the rubber packing. When the operation of the LED is turned off, the heat is cooled. At this time, the air inside is contrarily contracted. In order to fill the contracted space, external air is again introduced into the interior of the structure through the rubber packing gap. As such, the rubber packing may provide a waterproof function, but it is difficult to prevent the shrinking / expanding air from entering and leaving the rubber packing gap of the device as the temperature of the LED increases or decreases. That is, there is a problem that it is difficult to realize a complete moisture-proof / dust-proof structure by the structure of the structure.

Therefore, a technique for solving such a problem is required.

An object of the present invention is to provide an LED package and a method of manufacturing the same, which can improve the heat radiation efficiency and the moisture-proof / dustproof effect through the heat sink coupling.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems which are not mentioned can be understood by those skilled in the art from the following description.

According to an embodiment of the present invention, there is provided an LED package including a heat sink. Wherein the LED package comprises: a first heat sink disposed at a lower portion of the substrate and having a plurality of heat dissipating protrusions protruding downward from a lower surface thereof; And a second heat sink coupled to the first heat sink to surround the substrate and disposed on the substrate, the second heat sink including at least one aperture for the LED to be mounted on the substrate.

Preferably, a filler may be applied to the inside of the at least one through-hole.

Also, preferably, the second heat radiating plate may have a flat plate shape with the through holes formed therein.

Also, preferably, the first heat sink and the second heat sink may be formed of a conductive material.

In addition, preferably, the first heat sink and the second heat sink may be coupled to each other using a screw coupling method or an adhesive coupling method.

Further, preferably, the at least one aperture may be formed at a position corresponding to the LED.

Also preferably, the substrate may comprise a metal core PCB.

A method of manufacturing an LED package having a heat sink according to an embodiment of the present invention is provided. The method comprising: disposing a substrate on top of the first heat sink; And bonding the second heat radiating plate to the first heat radiating plate so as to surround the substrate, wherein a plurality of heat radiating protrusions protruding downward are formed on a lower surface of the first heat radiating plate, and the second heat radiating plate has a flat plate shape And at least one aperture for the LED to be mounted on the substrate.

Preferably, the method further comprises the step of applying the filler inside the at least one through-hole.

Also, preferably, the first heat sink and the second heat sink may be formed of a conductive material.

According to the present invention, the heat generated from the LED and the substrate can be efficiently discharged to the outside by enclosing the substrate on which the LED is mounted through the heat sink. In particular, the heat sink is disposed not only at the bottom of the substrate but also at the top, that is, the side where the LED is mounted, thereby providing more improved heat emission performance.

In addition, according to the present invention, by forming a through hole at a position corresponding to the LED in the second heat sink, the illumination effect of the LED can be prevented from being lowered by the second heat sink.

Further, according to the present invention, it is possible to apply a stretchable transparent material filler to the through hole to protect the LED from external stimuli without lowering the lighting effect.

BRIEF DESCRIPTION OF THE DRAWINGS A brief description of each drawing is provided to more fully understand the drawings recited in the description of the invention.
1 is a perspective view of an LED package having a heat sink according to an embodiment of the present invention.
Fig. 2 shows a cross-sectional view taken along line I-I 'of Fig.
Fig. 3 shows an exploded view of the LED package of Fig.
4 illustrates a method of manufacturing an LED package having a heat sink in accordance with an embodiment of the present invention.
FIG. 5 illustrates a manufacturing process of an LED package having a heat sink according to an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the difference that the embodiments of the present invention are not conclusive. In addition, embodiments of the present invention will be described below, but the technical idea of the present invention is not limited thereto and can be variously modified by those skilled in the art.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Throughout the specification, when an element is referred to as " comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise. In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements.

FIG. 1 is a perspective view of an LED package having a heat sink according to an embodiment of the present invention. FIG. 2 is a sectional view taken along line I-I 'of FIG. 1, Fig.

1 to 3, an LED package 100 including a heat sink according to an exemplary embodiment of the present invention includes a first heat sink 110, a second heat sink 120, a substrate 130, and LEDs 140, . ≪ / RTI >

The first heat sink 110 is disposed under the substrate 130 and receives heat generated from the substrate 130 and / or the LED 140 and can dissipate the heat to the outside. For this, the first heat sink 110 may be formed of a conductive material having a high heat dissipation efficiency and may have a large surface area to increase the contact surface with the external air. As shown in the figure, a plurality of heat dissipating protrusions protruding downward may be formed on the lower surface of the first heat dissipating plate 110. However, the present invention is not limited thereto. For example, according to an embodiment of the present invention, Various types of first heat sinks 110 may be applied.

The second heat sink 120 is disposed on the upper side of the substrate 130 to receive heat generated from the substrate 130 and / or the LED 140 and to dissipate the heat to the outside. For this, the second heat sink 120 may be formed of a conductive material having a high heat dissipation efficiency. However, unlike the first heat sink 110, the second heat sink 120 may be formed as a flat plate including at least one through hole 150 or the like. This is to prevent the second heat sink 120 from interrupting the light emitted from the LED 140 in consideration of the fact that the second heat sink 120 is disposed on the LED 140 side.

The second heat sink 120 may be combined with the first heat sink 110 to surround the substrate 130 to further improve heat dissipation efficiency. Specifically, the first heat sink 110 and the second heat sink 120 respectively conduct heat directly from the substrate 130 and / or the LED 140 to emit the heat to the outside, and the first heat sink 110 and / The second heat sinks 120 may emit heat to the outside after the heat conduction between them. For example, the second heat sink 120 disposed on the side of the LED 140 (i.e., the upper side of the substrate 130) receives heat from the LED 140 or the like and transmits the heat to the first heat sink 110 And the first heat sink 110 can more efficiently discharge heat received from the second heat sink 120 through the protrusion structure for heat dissipation. Similarly, the heat of the first heat sink 110 may be transmitted to the second heat sink 120, and the second heat sink 120 may discharge the transmitted heat to the outside. Particularly, when the substrate 130 is embodied as a metal core PCB, significant heat conduction occurs in the first heat sink 110 contacting the metal layer, so that the heat dissipation load of the first heat sink 110 is reduced by the second heat sink 120 The total heat emission efficiency can be improved.

The first heat sink 110 and the second heat sink 120 may be directly coupled to each other using a screw or an adhesive so as to efficiently conduct heat from the second heat sink 120 to the first heat sink 110, Or a combination thereof can be applied.

In one example, the first heat sink 110 and the second heat sink 120 may be coupled through a threaded connection. In this case, the first heat sink 110 and the second heat sink 120 may be directly coupled through a screw At least one of the first heat sink 110 and the second heat sink 120 may be screwed onto the substrate 130.

In one example, the first heat sink 110 and the second heat sink 120 may be coupled using an adhesive bonding scheme. In this case, the adhesive may be applied to the first heat sink 110 and the second heat sink 120 so that the first heat sink 110 and the second heat sink 120 are firmly coupled. At this time, it is preferable to use an adhesive excellent in heat resistance and conductivity. According to the embodiment, the adhesive bonding method may be used independently or in combination with the above-mentioned screw bonding method to further improve the thermal conductivity and bonding firmness between the heat sinks 110 and 120. [

Meanwhile, the second heat sink 120 may include at least one through hole 150. For example, at least one aperture 150 may be formed at a location corresponding to the LED 140 disposed on the substrate 130. Accordingly, when the second heat sink 120 is disposed on the substrate 130 and is coupled to the first heat sink 110, the LED 140 mounted on the substrate 130 is electrically connected through the at least one through hole 150 It can be exposed to the outside, and can emit light to the outside.

The substrate 130 may be disposed between the first heat sink 110 and the second heat sink 120. The substrate 130 may be a substrate on which wiring or soldering for electrical connection is not exposed or minimized to the outside, such as, for example, a metal core printed circuit board (PCB). In this case, the first heat sink 110 may conduct heat directly from the lower metal layer of the substrate 130 and discharge it to the outside.

The LEDs 140 may be mounted on the substrate 130. For example, the LED 140 may be mounted on the substrate 130 in the form of a package including an LED chip, a metal electrode, an insulating layer, and the like. For example, the heat generated from the LED 140 may be directly transferred to the second heat sink 120 or transferred to the first heat sink 110 and / or the second heat sink 120 via the substrate 130 Can be released.

Although not shown in FIGS. 1 to 3, a filler (see 160 in FIG. 4) may be applied to at least one through hole 150 formed in the second heat sink 120. The filler 160 is for protecting the LED 140 from external stimuli such as heat, moisture, impact and the like, and is formed of a transparent material having elasticity, such as transparent silicone, transparent epoxy, The generated light can be diverted to the outside and can correspond to the expansion / contraction of the air caused by the heat generated by the LED 140.

The height W of the through hole of the second heat sink 120 may be determined by considering the height of the LED 140 protruding from the substrate 130 and the height of the filler 160 applied to the substrate 130 ≪ / RTI > That is, the second heat sink 120 allows a sufficient amount of the filler 160 to be applied without interrupting the light emitted from the LED 140, so that the glass or the silicon lens is bonded to the LED, 160 can have durable durability and adhesive strength.

According to an additional embodiment, a cushioning material may be additionally applied to the interior of the through-hole 150. Particularly, between the second heat sink 120 and the filler 160. [ The cushioning material may have a thermal expansion coefficient between the thermal expansion coefficient of the filler material 160 and the thermal expansion coefficient of the second heat sink plate 120, and may be formed of a transparent material having elasticity, As a result, cracks or leakage due to the difference in thermal expansion coefficient between the filler 160 and the second heat sink 120 can be prevented.

FIG. 4 illustrates a method of manufacturing an LED package having a heat sink according to an embodiment of the present invention, and FIG. 5 illustrates a manufacturing process according to the method of FIG.

Referring to FIG. 4, a method 400 includes a step S110 of placing a first heat sink 110 on a lower portion of a substrate 130, a second heat sink 120 on a first heat sink 110 to surround the substrate, (S120) of applying a filler to the through hole of the second heat sink 120, and applying a filler (S130) into the through hole of the second heat sink 120. [ Hereinafter, steps S110 to S130 will be described in more detail with reference to Figs. 5 (a) to 5 (c).

Referring to FIG. 5A, the first heat sink 110 may be disposed below the substrate 130 in step S110. For example, the substrate 130 may be a substrate on which the surface mount (SMT) of the LED 140 is completed. At this time, a plurality of heat dissipating protrusions protruding downward may be formed on the lower surface of the first heat sink 110.

With this structure, the first heat sink 110 may have a wide cross-sectional area to increase the heat emission efficiency of the heat transmitted from the substrate 130 and / or the LED 140. The first heat sink 110 may be formed of a conductive material. Therefore, the heat dissipation efficiency of the first heat sink 110 can be further improved.

Referring to FIG. 5B, the second heat sink 120 may be coupled to the first heat sink 110 to surround the substrate 130 in step S120. The second heat sink 120 may be formed of a conductive material. In this case, the substrate 130 may be a printed circuit board (PCB). If the substrate 130 is a metal core PCB, the heat generated from the LED 140 may be transmitted through the first heat sink 110 and the second heat sink 110, The heat transfer efficiency can be improved.

The second heat sink 120 may include at least one through hole 150 and at least one through hole 150 may be formed at a location corresponding to the LED 140 disposed on the substrate 130 have. Accordingly, when the second heat sink 120 is coupled to the first heat sink 110, the LED 140 disposed on the substrate 130 may be exposed to the outside through the at least one through hole 150. [

Referring to FIG. 5C, the filler 160 may be applied to at least one through hole 150 formed in the second heat sink 120 in step S130. For example, the filler material 160 may be formed of a transparent material having elasticity such as transparent silicone, transparent epoxy, etc., so that light emitted from the LED 140 may diverge to the outside, It is possible to cope with expansion / contraction of air by heat.

The thickness W of the through hole of the second heat sink 120 may be determined by considering the height of the LED 140 protruded from the substrate 130 and the coating height of the filler 160 mounted on the substrate 130 ≪ / RTI > That is, the second heat sink 120 allows a sufficient amount of the filler 160 to be applied without interrupting the light emitted from the LED 140, so that the glass or the silicon lens is bonded to the LED, 160 can have durable durability and adhesive strength.

As described above, an optimal embodiment has been disclosed in the drawings and specification. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: LED package 110: first heat sink
120: second heat sink 130: substrate
140: LED 150: aperture
160: Filler

Claims (10)

A first heat sink disposed at a lower portion of the substrate and having a plurality of heat dissipating protrusions protruding downward from a lower surface thereof; And
And a second heat sink disposed on the top of the substrate and coupled to the first heat sink to surround the substrate and including at least one through hole for the LED to be mounted on the substrate. The method according to claim 1,
Wherein a filler is applied to the inside of the at least one through hole. The method according to claim 1,
And the second heat sink is a flat plate having the through holes formed therein. The method according to claim 1,
Wherein the first heat sink and the second heat sink are formed of a conductive material. The method according to claim 1,
Wherein the first heat sink and the second heat sink are coupled to each other using a screw connection method or an adhesive bonding method. The method according to claim 1,
Wherein the at least one aperture is formed at a position corresponding to the LED. The method according to claim 1,
Wherein the substrate comprises a metal core PCB. ≪ RTI ID = 0.0 > 15. < / RTI > Disposing a substrate on top of the first heat sink; And
And coupling a second heat sink to the first heat sink to surround the substrate,
A plurality of heat dissipating protrusions protruding downward are formed on a lower surface of the first heat dissipating plate,
Wherein the second heat sink comprises at least one aperture for a LED mounted in the substrate as a flat plate shape. 9. The method of claim 8,
Further comprising the step of applying a filler to the inside of the at least one through-hole. 9. The method of claim 8,
Wherein the first heat sink and the second heat sink are formed of a conductive material.

Images