KR20160140084A - Face up mounting bonded led package - Google Patents

Face up mounting bonded led package Download PDF

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Publication number
KR20160140084A
KR20160140084A KR1020150076218A KR20150076218A KR20160140084A KR 20160140084 A KR20160140084 A KR 20160140084A KR 1020150076218 A KR1020150076218 A KR 1020150076218A KR 20150076218 A KR20150076218 A KR 20150076218A KR 20160140084 A KR20160140084 A KR 20160140084A
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KR
South Korea
Prior art keywords
substrate
glass
led
optical device
directly
Prior art date
Application number
KR1020150076218A
Other languages
Korean (ko)
Inventor
최연식
Original Assignee
(주)지엔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)지엔 filed Critical (주)지엔
Priority to KR1020150076218A priority Critical patent/KR20160140084A/en
Publication of KR20160140084A publication Critical patent/KR20160140084A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

[0001] The present invention relates to an LED package, and more particularly, to a method of packaging an LED package by forming a solder bump on an LED-mounted substrate for an optical device and attaching the solder bump directly to a metal pattern formed on a glass bottom surface, It is possible to package without the printed circuit board which is demanded for, and to directly improve the thermal efficiency by connecting the optical element directly to the heat sink. In addition, since the optical element is attached directly to the bottom surface of the glass, To a face-up mounting LED package capable of minimizing the expansion of air due to temperature change as well as the inflow of air during contraction.

Description

FACE UP MOUNTING BONDED LED PACKAGE [0001]

[0001] The present invention relates to an LED package, and more particularly, to a method of packaging an LED package by forming a solder bump on an LED-mounted substrate for an optical device and attaching the solder bump directly to a metal pattern formed on a glass bottom surface, It is possible to package without the printed circuit board which is demanded for, and to directly improve the thermal efficiency by connecting the optical element directly to the heat sink. In addition, since the optical element is attached directly to the bottom surface of the glass, To a face-up mounting LED package capable of minimizing the expansion and contraction of air due to temperature change as well as waterproofing.

In recent years, light emitting diodes (LEDs), which are optical devices that are increasingly used in various fields beyond their role as lighting fixtures, are attracting attention as eco-friendly light sources that do not cause pollution. As the use range of semiconductor light emitting diodes (LEDs) has expanded to various fields, high efficiency and excellent heat emission characteristics of LEDs have been required.

LEDs used in various fields are formed on a surface of a substrate 10 for an optical device made of aluminum (Al) such as an SMD (Surface Mount Device) shown in FIG. 1 (A) In order to package the LED as described above, a plurality of substrates 10 for optical devices, in which LEDs are mounted on a printed circuit board (PCB) 30, as shown in FIG. 1 (B) A heat sink 50 is attached to the lower portion of the printed circuit board 30 so that the heat generated by the LED is discharged through the heat sink. In addition, the LED is prevented from being exposed to water or foreign matter And a glass (40) is bonded to the upper part thereof to be packaged.

For this purpose, as shown in FIG. 2, a plurality of substrates 10 for optical devices to be packaged are installed on a printed circuit board (PCB) 30, and then a heat sink 50, and a glass 40 is provided on the upper portion of the printed circuit board 30. And. A metal pattern (Copper Pattern) 32 is formed on a printed circuit board to mount a plurality of substrates 10 for optical devices on a printed circuit board (PCB) 30, and a substrate 10 for an optical device, A soldering pad that can be bonded to the metal pattern of the printed circuit board is formed on the bottom surface of the printed circuit board, and then the package is formed by bonding the soldering pad and the metal pattern.

However, in the conventional LED package having such a structure, the heat generated from the LEDs must be transferred to the heat sink through the printed circuit board, thus reducing the heat radiation efficiency.

In addition, in order to prevent water and foreign matter from entering the LEDs mounted on the printed circuit board, it has been common to use a rubber packing or the like to mechanically secure the connection. In this case, However, due to the temperature change of the ambient environment where the LED package is installed or the temperature change of the space inside the LED package due to the heat generated by the LED itself, the inflow of air and the salt contained in the air Therefore, there is a problem that a large amount of salt exists in the glass of the LED package after a certain period of use.

Korean Patent Registration No. 10-1353392 Korean Patent Publication No. 10-1086014

The solder bump is formed on the substrate for the optical device on which the LED is mounted and then the solder bump is directly attached to the metal pattern formed on the bottom surface of the glass so that the package can be packaged without the printed circuit board required for packaging at least one optical device , The optical element is directly connected to the heat sink to improve the heat radiation efficiency and the optical element is attached directly to the bottom of the glass, thereby minimizing the space inside the glass in the LED package, And a face-up mounting LED package capable of minimizing the entry and exit of air at the time of contraction.

A face-up mounting LED package for solving the above-

A metal substrate for an optical device, the electrode being electrically separated by a vertical insulation layer, and a cavity in which a LED can be mounted, the recess being formed at the center; An LED connected to the electrode in a state of being seated in a cavity on the substrate for the optical device; At least one solder bump formed on an upper surface of the substrate for an optical device; And a transparent glass in which a metal pattern to which the solder bump can be attached is formed on a bottom surface and an upper surface of the substrate for an optical device on which the LED is mounted is directly attached.

At this time, the solder bump is formed of at least one solder ball formed on the upper surface of the substrate for optical device for direct attachment to the glass, so that the solder bump can be mounted on the substrate for an optical device.

In addition, an electrical signal for driving a plurality of LEDs forming the LED package is applied to a bottom surface of the glass, and a metal pattern made of a conductive metal for facilitating attachment of the solder bump is formed do.

The light source may further include a heat sink directly connected to a bottom surface of the substrate for an optical device directly attached to the glass and directly conducting heat generated when the LED is driven.

It is further preferable that the optical device further includes a sealing portion for completely sealing the periphery of the substrate for the optical device in which the glass is directly bonded to the upper surface and the heat sink is directly bonded to the bottom surface.

Since the substrate for the optical device is directly attached to the bottom surface of the glass and there is almost no space between the glass and the substrate for the optical device, the volume of the LED package can be remarkably reduced and the expansion and contraction of the air It is possible to minimize entry and exit of air due to shrinkage.

In addition, since the heat generated from the LED is directly transferred to the heat sink, the present invention has an advantage that the heat dissipation effect can be realized faster and more remarkably than that transmitted to the heat sink through the printed circuit board (PCB).

1 is a perspective view and a cross-sectional view showing an example of a conventional LED package;
2 is a schematic view showing mounting of an LED on a printed circuit board in a conventional LED package;
3 is a perspective view of a substrate for an optical device, in which a solder bump is formed for a face-up mounting LED package according to the present invention;
4 is a schematic view showing that a substrate for an optical device on which solder bumps are formed according to the present invention is bonded to a metal pattern formed directly on a glass.
5 is a cross-sectional view showing that a plurality of substrates for optical devices are attached to a glass having a metal pattern formed according to the present invention.
6 is a sectional view showing that a heat sink is directly coupled to a substrate for a plurality of optical devices according to the present invention.
7 is a cross-sectional view of an LED package showing complete sealing in a state in which a space between a glass substrate and an optical device substrate is minimized according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a perspective view of a substrate for an optical device in which a solder bump is formed for a face-up mounting LED package according to the present invention, FIG. 4 is a cross-sectional view of a substrate for an optical device in which a solder bump is formed, Fig.

3 and 4, the face-up mounting LED package according to the present invention includes an electrode electrically isolated by a vertical insulating layer, a metal material having a recessed cavity in which a LED can be mounted, An LED 200 connected to the electrode in a state of being seated in a cavity on the substrate for the optical device; at least one solder bump 300 formed on the upper surface of the substrate for the optical device; A transparent glass 400 on which a metal pattern to which the solder bumps can be attached is formed, the upper surface of which is directly attached to the substrate for optical devices on which the LEDs are mounted, and at least one substrate bottom surface directly attached to the glass And a heat sink 500 directly connected to the heat sink 500.

3, a cavity 110 is formed at the center of the substrate 100, and a metal material such as aluminum is electrically separated by a vertical insulation layer 120 So as to form an electrode for applying a voltage to the LED.

After the LED 200 is mounted on the cavity 110 of the substrate for optical devices, the electrodes are electrically connected to the respective electrodes separated by the vertical insulating layer by wires or the like to form an optical device.

The solder bump 300 is composed of at least one solder ball formed on the upper surface of the optical device substrate 100 for direct attachment to the glass 400, As shown in FIG. 4, is formed on the substrate 100 for the optical device near the cavity 110 so that the mounting can be performed above the substrate for the optical device without affecting the LED.

That is, since the solder bump 300 is formed on the metal portion of the substrate for the optical device in the vicinity of the cavity, it is possible to prevent the LED from being in contact with the glass or metal pattern even if the top surface of the substrate for optical device is directly contacted with the glass.

In FIG. 3, four solder bumps 300 are formed at four corners of the top surface of the quadrangular optical device substrate. However, the positions and number of the solder bumps are not limited thereto, It is of course possible to freely form over the entire upper surface.

As described above, the solder bump 300 is formed on the upper surface of the substrate for an optical device. Thus, in the present invention, mounting for realizing an LED package is performed above the substrate for an optical device 100. Accordingly, a soldering pad is formed on the bottom surface of a substrate for an optical device and bonded to a printed circuit board (PCB) to correspond to a face down which is mounted on a lower surface of the substrate for an optical device In the present invention, a face up mounting is used to express that the glass is bonded to the upper surface of the substrate for optical devices.

The glass 400 is made of transparent glass having excellent transparency so that light emitted from the LED can be exposed to the outside as is used in a typical LED package. However, in the present invention, since the substrate 100 for the optical device is directly attached to the glass 400 by excluding the printed circuit board (PCB), not only the substrate for the optical device is fixed but also signals are applied to the LEDs forming the LED package Electrical connection should be made so that

4, a metal pattern 410 is formed on the bottom surface of the glass 400 to drive a plurality of LEDs forming the LED package in a state of being adhered to the glass 400 So that an electrical signal can be transmitted.

By forming the metal pattern 410 as a conductive metal on the bottom surface of the glass as described above, an electrical signal for driving a plurality of LEDs can be applied, and a solder bump 300 made of a conductive material So that it can be attached to the glass better.

By attaching the solder bumps 300 formed on the substrate for the optical device to the bottom surface of the patterning glass 400 having the metal pattern formed thereon, the upper surface of the substrate for optical devices is directly bonded to the glass The LED package is implemented.

Therefore, the volume can be remarkably reduced as compared with a case where a substrate for an optical device is mounted on a conventional printed circuit board and then the glass is mechanically coupled to the upper portion. In particular, since there is almost no space between the glass and the substrate for the optical device, air can be minimized by the expansion and contraction of the air caused by the increase or decrease of the temperature.

6, the heat sink 500 is directly connected to the bottom surface of the substrate 100 for an optical device, which is directly bonded to a metal pattern formed on a glass substrate without a printed circuit board, So that the heat can be directly transferred to the heat sink.

Since the heat generated by the LED 200 is directly transferred to the heat sink 500, the heat generated by the LED is transferred to the heat sink through the printed circuit board (PCB). As a result, . ≪ / RTI >

7, the glass substrate 400 is directly bonded to the upper surface of the optical device substrate 100 and the heat sink 500 is directly bonded to the bottom surface of the substrate. The sealing portion 600 may be formed of a metal.

That is, in the present invention, since the glass and the heat sink are directly coupled to the substrate for the optical device on which the LED is mounted, it is possible to seal the periphery by using a sealing material such as epoxy, State can be implemented.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

100 - substrate for optical device 110 - cavity
120 - vertical insulating layer
200 - LED 300 - Solder bump
400 - Glass 410 - Metal pattern
500 - Heat sink 600 - Sealing part

Claims (5)

A metal substrate for an optical device, the electrode being electrically separated by a vertical insulation layer, and a cavity in which a LED can be mounted, the recess being formed at the center;
An LED connected to the electrode in a state of being seated in a cavity on the substrate for the optical device;
At least one solder bump formed on an upper surface of the substrate for an optical device; And
And a transparent glass on which a metal pattern to which the solder bump can be attached is formed on the bottom surface and on which an upper surface of the substrate for optical devices on which the LED is mounted is directly attached. The method according to claim 1,
Wherein the solder bump comprises at least one or more solder balls formed on an upper surface of the substrate for optical devices for direct attachment to the glass so that the solder bumps can be mounted above the substrate for optical devices. package. 3. The method of claim 2,
Wherein a metal pattern made of a conductive metal is formed on the bottom surface of the glass to apply an electrical signal for driving the plurality of LEDs forming the LED package and facilitate the attachment of the solder bumps. Up mounting LED package. The method of claim 3,
And a heat sink directly connected to a bottom surface of the substrate for optical devices directly attached to the glass and directly transmitting heat generated during driving the LED. 5. The method of claim 4,
And a sealing part for completely sealing the periphery of the substrate for optical devices in which the glass is directly bonded to the upper surface and the heat sink is directly bonded to the bottom surface.
KR1020150076218A 2015-05-29 2015-05-29 Face up mounting bonded led package KR20160140084A (en)

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KR1020150076218A KR20160140084A (en) 2015-05-29 2015-05-29 Face up mounting bonded led package

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Application Number Priority Date Filing Date Title
KR1020150076218A KR20160140084A (en) 2015-05-29 2015-05-29 Face up mounting bonded led package

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110112091A (en) * 2019-04-26 2019-08-09 清华大学深圳研究生院 A kind of device of batch transferring plates bare die
KR20200064821A (en) * 2018-11-29 2020-06-08 유운용 LED light case module and illumination system having the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086014B1 (en) 2011-06-27 2011-11-22 (주)포인트엔지니어링 Highly heat sink substrate for optical element device and fabricating method thereof
KR101353392B1 (en) 2013-02-07 2014-01-21 (주)포인트엔지니어링 Method for manufacturing light emitting device and the device thereby

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086014B1 (en) 2011-06-27 2011-11-22 (주)포인트엔지니어링 Highly heat sink substrate for optical element device and fabricating method thereof
KR101353392B1 (en) 2013-02-07 2014-01-21 (주)포인트엔지니어링 Method for manufacturing light emitting device and the device thereby

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200064821A (en) * 2018-11-29 2020-06-08 유운용 LED light case module and illumination system having the same
CN110112091A (en) * 2019-04-26 2019-08-09 清华大学深圳研究生院 A kind of device of batch transferring plates bare die

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