KR20180113210A - 접착 필름 및 다이싱·다이 본딩 필름 - Google Patents

접착 필름 및 다이싱·다이 본딩 필름 Download PDF

Info

Publication number
KR20180113210A
KR20180113210A KR1020187026682A KR20187026682A KR20180113210A KR 20180113210 A KR20180113210 A KR 20180113210A KR 1020187026682 A KR1020187026682 A KR 1020187026682A KR 20187026682 A KR20187026682 A KR 20187026682A KR 20180113210 A KR20180113210 A KR 20180113210A
Authority
KR
South Korea
Prior art keywords
mass
component
film
adhesive film
parts
Prior art date
Application number
KR1020187026682A
Other languages
English (en)
Korean (ko)
Inventor
하나코 요리
다카시 마스코
Original Assignee
히타치가세이가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히타치가세이가부시끼가이샤 filed Critical 히타치가세이가부시끼가이샤
Priority to KR1020237001745A priority Critical patent/KR102570822B1/ko
Publication of KR20180113210A publication Critical patent/KR20180113210A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C09J2201/622—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
KR1020187026682A 2016-02-26 2017-01-25 접착 필름 및 다이싱·다이 본딩 필름 KR20180113210A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237001745A KR102570822B1 (ko) 2016-02-26 2017-01-25 접착 필름 및 다이싱·다이 본딩 필름

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016035409 2016-02-26
JPJP-P-2016-035409 2016-02-26
PCT/JP2017/002549 WO2017145624A1 (ja) 2016-02-26 2017-01-25 接着フィルム及びダイシング・ダイボンディングフィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237001745A Division KR102570822B1 (ko) 2016-02-26 2017-01-25 접착 필름 및 다이싱·다이 본딩 필름

Publications (1)

Publication Number Publication Date
KR20180113210A true KR20180113210A (ko) 2018-10-15

Family

ID=59685363

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237001745A KR102570822B1 (ko) 2016-02-26 2017-01-25 접착 필름 및 다이싱·다이 본딩 필름
KR1020187026682A KR20180113210A (ko) 2016-02-26 2017-01-25 접착 필름 및 다이싱·다이 본딩 필름

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020237001745A KR102570822B1 (ko) 2016-02-26 2017-01-25 접착 필름 및 다이싱·다이 본딩 필름

Country Status (5)

Country Link
JP (2) JP7372737B2 (ja)
KR (2) KR102570822B1 (ja)
CN (1) CN108699402A (ja)
TW (1) TWI715721B (ja)
WO (1) WO2017145624A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220158222A (ko) * 2020-04-01 2022-11-30 쇼와덴코머티리얼즈가부시끼가이샤 반도체용 접착제, 및, 반도체 장치 및 그 제조 방법
WO2023190321A1 (ja) * 2022-03-30 2023-10-05 古河電気工業株式会社 熱伝導性フィルム状接着剤用組成物及び熱伝導性フィルム状接着剤、並びに、熱伝導性フィルム状接着剤を用いた半導体パッケージ及びその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198701A (ja) 1992-01-22 1993-08-06 Mitsubishi Electric Corp 半導体装置用パッケージ
JP3559137B2 (ja) * 1997-02-27 2004-08-25 日立化成工業株式会社 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
JP3617417B2 (ja) * 1999-06-18 2005-02-02 日立化成工業株式会社 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2001118961A (ja) * 1999-10-15 2001-04-27 Mitsubishi Electric Corp 樹脂封止型電力用半導体装置及びその製造方法
JP2009235402A (ja) 2008-03-05 2009-10-15 Hitachi Chem Co Ltd 接着フィルム
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
JP4360446B1 (ja) * 2008-10-16 2009-11-11 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
CN102575084B (zh) * 2009-09-29 2017-03-29 日立化成工业株式会社 多层树脂片及其制造方法、多层树脂片固化物的制造方法、以及高热传导树脂片层叠体及其制造方法
JP2011241245A (ja) * 2010-05-14 2011-12-01 Mitsubishi Chemicals Corp エポキシ樹脂組成物および硬化物
KR20130129185A (ko) * 2010-10-25 2013-11-27 후루카와 덴키 고교 가부시키가이샤 접착 필름 및 웨이퍼 가공용 테이프
JP2012186361A (ja) * 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP5787562B2 (ja) * 2011-03-11 2015-09-30 積水化学工業株式会社 絶縁材料及び積層構造体
US20140248504A1 (en) * 2011-09-08 2014-09-04 Hitachi Chemical Company, Ltd. Resin composition, resin sheet, cured resin sheet, resin-adhered metal foil and heat dissipation device
JP2013095782A (ja) * 2011-10-28 2013-05-20 Mitsubishi Chemicals Corp 半導体発光装置用シリコーン樹脂組成物
EP2821456A4 (en) * 2012-03-02 2015-12-16 Fuji Polymer Ind MASTIC TYPE THERMAL TRANSFER MATERIAL AND PROCESS FOR PRODUCING THE SAME
KR20150130367A (ko) * 2013-03-07 2015-11-23 스미또모 베이크라이트 가부시키가이샤 장치, 접착제용 조성물, 접착 시트
JP5749314B2 (ja) 2013-10-11 2015-07-15 日東電工株式会社 放熱性ダイボンドフィルム
EP3061786A4 (en) * 2013-10-24 2017-05-17 DIC Corporation Resin composition, heat-dissipating material, and heat-dissipating member
CN106103531A (zh) * 2014-03-20 2016-11-09 日立化成株式会社 树脂组合物、树脂片、树脂片固化物、树脂片层叠体、树脂片层叠体固化物及其制造方法、半导体装置以及led装置
JP2015193704A (ja) 2014-03-31 2015-11-05 新日鉄住金化学株式会社 高熱伝導セラミックス粉末含有樹脂組成物、その硬化物
JP2016104832A (ja) * 2014-12-01 2016-06-09 Dic株式会社 樹脂組成物、熱伝導性接着剤、熱伝導性接着シート及び積層体

Also Published As

Publication number Publication date
WO2017145624A1 (ja) 2017-08-31
TWI715721B (zh) 2021-01-11
CN108699402A (zh) 2018-10-23
JP7372737B2 (ja) 2023-11-01
KR102570822B1 (ko) 2023-08-24
KR20230013169A (ko) 2023-01-26
JPWO2017145624A1 (ja) 2018-12-27
JP2022027972A (ja) 2022-02-14
TW201741414A (zh) 2017-12-01
JP7392706B2 (ja) 2023-12-06

Similar Documents

Publication Publication Date Title
US8119737B2 (en) Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
TWI765071B (zh) 散熱性黏晶膜及切晶-黏晶膜
JP7392706B2 (ja) 接着フィルム
TWI724179B (zh) 接著膜及切晶黏晶一體型膜

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
AMND Amendment
E601 Decision to refuse application
AMND Amendment
X601 Decision of rejection after re-examination
A107 Divisional application of patent