KR20180111858A - 접착제 필름 및 그의 제조 방법, 접착제 테이프, 및 접착제 필름용 릴 - Google Patents
접착제 필름 및 그의 제조 방법, 접착제 테이프, 및 접착제 필름용 릴 Download PDFInfo
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- KR20180111858A KR20180111858A KR1020187024131A KR20187024131A KR20180111858A KR 20180111858 A KR20180111858 A KR 20180111858A KR 1020187024131 A KR1020187024131 A KR 1020187024131A KR 20187024131 A KR20187024131 A KR 20187024131A KR 20180111858 A KR20180111858 A KR 20180111858A
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- South Korea
- Prior art keywords
- conductive
- adhesive
- adhesive layer
- adhesive film
- thickness
- Prior art date
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-015470 | 2016-01-29 | ||
| JP2016015470 | 2016-01-29 | ||
| PCT/JP2017/001366 WO2017130789A1 (ja) | 2016-01-29 | 2017-01-17 | 接着剤フィルム及びその製造方法、接着剤テープ、並びに接着剤フィルム用リール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180111858A true KR20180111858A (ko) | 2018-10-11 |
Family
ID=59397691
Family Applications (1)
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| JPS60218628A (ja) * | 1984-04-13 | 1985-11-01 | Sharp Corp | 液晶表示素子電極接続方法 |
| JP5196703B2 (ja) * | 2004-01-15 | 2013-05-15 | デクセリアルズ株式会社 | 接着フィルム |
| WO2007123003A1 (ja) * | 2006-04-12 | 2007-11-01 | Hitachi Chemical Company, Ltd. | 回路接続用接着フィルム、回路部材の接続構造及び回路部材の接続方法 |
| JP2011003924A (ja) * | 2006-08-25 | 2011-01-06 | Hitachi Chem Co Ltd | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
| JP4862944B2 (ja) * | 2007-12-17 | 2012-01-25 | 日立化成工業株式会社 | 回路接続材料 |
| JP2009194359A (ja) * | 2008-01-16 | 2009-08-27 | Hitachi Chem Co Ltd | 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法 |
| KR20100098459A (ko) * | 2008-04-28 | 2010-09-06 | 히다치 가세고교 가부시끼가이샤 | 회로 접속 재료, 필름상 접착제, 접착제 릴 및 회로 접속 구조체 |
| WO2011111784A1 (ja) * | 2010-03-12 | 2011-09-15 | 日立化成工業株式会社 | 接着材リール |
| KR101659128B1 (ko) * | 2013-09-30 | 2016-09-22 | 제일모직주식회사 | 이방성 도전 필름 및 이를 이용한 반도체 장치 |
| KR101628440B1 (ko) * | 2013-10-31 | 2016-06-08 | 제일모직주식회사 | 이방성 도전 필름 및 이를 이용한 반도체 장치 |
| JP6297381B2 (ja) * | 2014-03-26 | 2018-03-20 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続体の製造方法 |
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- 2017-01-17 KR KR1020187024131A patent/KR20180111858A/ko not_active Application Discontinuation
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- 2017-01-23 TW TW106102287A patent/TWI750149B/zh active
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| JP6988482B2 (ja) | 2022-01-05 |
| CN114196334A (zh) | 2022-03-18 |
| CN108603078A (zh) | 2018-09-28 |
| CN114262577A (zh) | 2022-04-01 |
| JPWO2017130789A1 (ja) | 2018-11-22 |
| TWI750149B (zh) | 2021-12-21 |
| TW201739864A (zh) | 2017-11-16 |
| WO2017130789A1 (ja) | 2017-08-03 |
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