KR20180024340A - Flat lapping apparatus - Google Patents

Abstract

A flat polishing apparatus comprises: a bed; a processing table; a polishing unit; a contact blade dressing unit; and an automatic measurement unit. The processing table is installed on the bed, a carrier is installed to fixate a substrate to be polished, and the carrier can be moved in the Y-axis direction. The polishing unit comprises: a Z-direction moving base sheet; a main axis motor; and a polishing wheel. The main axis motor is installed on the Z-direction moving base sheet. The polishing wheel is connected with the main axis motor. The Z-direction moving base sheet can move in the X-axis and Z-axis directions. The contact blade dressing unit comprises a dressing tool installed within a moving range of the polishing wheel, and the dressing tool trues the polishing wheel by coming in contact with the same. The automatic measurement unit is installed on the polishing unit and comprises a driving apparatus and a sensor. The driving apparatus can move the sensor in the Z-axis direction to measure the height of the carrier and the substrate. Accordingly, polishing measurements with high precision can be obtained as the flat polishing apparatus is provided with a contact blade dressing function and an automatic measuring function.

Description

[0001] FLAT LAPPING APPARATUS [0002]

The present invention relates to a planar polishing apparatus, and more particularly to a planar polishing apparatus for polishing a carrier plate or a workpiece.

Conventional planar polishing apparatuses perform a polishing operation of a substrate or a workpiece by using a polishing wheel (for example, a ceramic brush wheel), but the movement removing ability is comparatively weak and the precision is poor. Further, the conventional planar polishing apparatus has no automatic measuring function, and it is not easy to control the polishing precision, and the dimension can not be precisely controlled, so that a high precision polishing dimension can not be obtained. In addition, the conventional planar polishing table easily suffers from the situation that the polishing residue is sucked and clogged.

The inventors of the present invention felt that the defects could be improved, and the inventors of the present invention combined the haemorrhagic application with the dedication to the research, finally, the present invention which can rationally improve the defects and effectively improve the defects .

A technical problem to be solved by the present invention is to provide a planar polishing apparatus which is excellent in movement removing ability and has a contact-type dressing and an automatic measuring function to obtain high-precision polishing dimensions.

The technical problem to be solved by the present invention is also to provide a planar polishing apparatus capable of reducing the situation where the polishing residue is sucked into the processing table and clogged.

In order to solve the above technical problem, the present invention provides a planar polishing apparatus comprising: a bed; A processing table installed on the bed, the processing table being movable along the Y-axis direction and having a carrier for fixing a substrate to be polished; A main spindle motor and a grinding wheel, the main spindle motor being installed on the Z-direction moving base sheet, the grinding wheel being power-connected to the spindle motor, The Z-direction moving base sheet is movable along the X-axis direction and the Z-axis direction, and the polishing wheel is moved in a direction perpendicular to the polishing direction of the polishing table unit; A contact-type dressing unit installed in a moving range of the polishing wheel and including a dressing tool for modifying the polishing wheel by being in contact with the polishing wheel; And at least one sensor attached to the polishing unit, the at least one sensor being connected to the at least one driving device, the at least one driving device being connected to the carrier and the substrate And moving the at least one sensor along the Z-axis direction to measure the height of the at least one sensor.

Preferably, the carrier includes a base sheet and a ceramic adsorption unit, wherein the base sheet is installed on the bed, the ceramic adsorption unit is installed on the base sheet, and the upper part of the base sheet is located outside the ceramic adsorption unit Wherein at least one vacuum groove is formed at a position close to the ceramic adsorption unit and at least one of the vacuum grooves is recessed to the outside of the ceramic adsorption unit so as to discharge the cutting liquid and the polishing residue, Lt; / RTI >

The present invention has at least the following advantages.

The carrier of the present invention moves along the Y axis direction and the Z direction moving base sheet can move along the X axis and Z axis directions so that the polishing wheel can polish the substrate on the carrier of the machining table. The planar polishing apparatus of the present invention can control the movement in both the X-axis, the Y-axis, and the Z-axis direction, and is excellent in moving ability and has good processing accuracy.

Further, the present invention has a contact-type dressing function, so that the post-polishing grinding wheel can be dressed using a direct dressing tool, thereby reducing an error in precision. The present invention also has an automatic surveying function, so that the sensor can be elevated and lowered by a driving device. The system can set the preliminary processing amount in advance. When the workpiece is polished to a preset amount, the automatic surveying function is activated, The accuracy of the polishing precision can be obtained by performing the final precision correcting operation after confirming the zero point by measuring the position of the substrate, measuring the height position of the substrate, checking the error of the actual height.

The carrier of the present invention can be provided with a vacuum groove, and the vacuum groove is installed to surround the outside of the ceramic adsorption unit, thereby discharging the cutting fluid and the polishing residue, thereby reducing the situation in which the polishing residue is sucked into the ceramic adsorption unit, .

BRIEF DESCRIPTION OF THE DRAWINGS For a better understanding of the features and techniques of the present invention, reference should now be made to the following detailed description and drawings, which are provided for purposes of illustration only and are not intended to be limiting, It is not.

1 is a perspective view of a planar polishing apparatus according to the present invention.
1A is a detailed view of a portion A in Fig.
2 is a front view of the planar polishing apparatus of the present invention.
3 is a side view of the planar polishing apparatus of the present invention.
4 is a plan view of the planar polishing apparatus of the present invention.
5 is a perspective view of the contact-type dressing unit of the present invention.
6 is a perspective view of the automatic surveying unit of the present invention.
7 is a three-dimensional view of the carrier of the present invention.
7A is a detailed view of a portion B in Fig.
8 is a plan view of the carrier of the present invention.

Hereinafter, embodiments of the planar polishing apparatus according to the present invention will be described with reference to specific specific embodiments. Those skilled in the art will readily appreciate other advantages and effects of the present invention in accordance with the teachings of the present invention. The present invention may also be practiced or embodied in other, different and more specific embodiments, and each detail in this specification may be based on a different point of view and application, and various modifications and changes may be made thereto without departing from the spirit of the invention . It should also be noted that the drawings of the present invention are by no means drawn to scale, but are merely brief descriptions and do not reflect the actual dimensions of the arrangement. The following examples illustrate the present invention in more detail, but do not limit the scope of the invention in any way.

[First Embodiment]

1 to 4, the present invention provides a planar polishing apparatus for polishing a substrate or other workpiece, the planar polishing apparatus comprising a bed 1, a processing table 2, a polishing unit 3, A dressing unit 4 and an automatic measuring unit 5 (see Fig. 6).

The bed 1 can be installed on the ground to support and connect the apparatus such as the machining table 2, the polishing unit 3, the contact-type dressing unit 4 and the automatic surveying unit 5 in a stable structure.

The processing table 2 is provided on the bed 1 and a carrier 21 for fixing the substrate 6 to be polished is provided on the processing table 2. [ The substrate 6 may be a glass substrate, a thin substrate such as an IC substrate, or other workpiece. The carrier 21 includes a ceramic adsorption unit. The carrier 21 includes a permanent magnet plate and the like. The structure of the carrier 21 is not limited. After the substrate is transferred to the processing table 2, It can be fixed to the carrier 21 by, for example, vacuum adsorption or self-adsorption.

The carrier 21 is movable along the Y-axis direction, that is, the carrier 21 can move along the forward and backward directions shown in FIG. More specifically, the carrier 21 is driven by a first motor 22, the first motor 22 is connected to the carrier 21 using a transmission mechanism such as a screw, And is slidably engaged with the rail 23. Therefore, the carrier 21 can be moved in the Y-axis direction by using the first motor 22. When the substrate 6 on the machining table 2 is polished, the carrier 21 reciprocates along the Y- can do. However, the structure of the transmission mechanism and the guide rail of the carrier 21 is not limited and can be replaced with various conventional power transmission and guide structures.

The polishing unit 3 is provided above the processing table 2 and the polishing unit 3 includes a Z-direction moving base sheet 31, a spindle motor 32 and a polishing wheel 33. The spindle motor 32 is mounted on the Z-direction moving base sheet 31, the grinding wheel 33 is connected to the spindle motor 32 and the grinding wheel 33 is connected to the pulley assembly 38 And may be connected to the spindle motor 32. The center axis of the grinding wheel 33 is parallel to the X axis direction and the grinding wheel 33 can move along the Z direction moving base sheet 31 and the spindle motor 32 can rotate the grinding wheel 33 . The outside of the spindle motor 32 and the pulley assembly 38 may be covered with a housing (not shown) for protecting the components such as the spindle motor 32 and the pulley assembly 38.

The Z-direction moving base sheet 31 is movable along the X-axis direction, that is, the Z-direction moving base sheet 31 can move along the left and right directions shown in FIG. Specifically, the polishing unit 3 further includes an X-direction base sheet 39, and the Z-direction moving base sheet 31 can be driven by a second motor 34. [ The second motor 34 is coupled to the X-direction base seat 39 using a transmission mechanism such as a screw and the X-direction base seat 39 is slidably coupled to the second guide rail 35 Reference). Therefore, the second motor 34 can be used to drive the X-direction base sheet 39 to move along the X-axis direction. When the substrate 6 on the machining table 2 is polished, the X-direction base sheet 39 is moved in the Z-direction moving base sheet 31, the spindle motor 32 and the polishing wheel 33 in the X- So that the polishing wheel 33 is fed to the substrate 6 along the X-axis direction to perform polishing. However, the structure of the transmission mechanism and the guide rail of the X-direction base sheet 39 is not limited and can be replaced with various conventional power transmission and guide structures.

The spindle motor 32 is movable along the up and down directions shown in Fig. Specifically, the Z-direction moving base sheet 31 is slidably engaged with the X-direction base sheet 39, and the Z-direction moving base sheet 31 is slidably moved along the Z-axis direction in the X- . Therefore, the Z-direction moving base sheet 31 can be driven to move along the Z-axis direction by using a third motor (not shown), and the third motor can be driven by the Z-direction moving base sheet 31 And the Z-direction moving base sheet 31 is slidably engaged with the X-direction base sheet 39. The X- Therefore, the Z-direction moving base sheet 31 and the spindle motor 32 can be driven to move along the Z-axis direction by using the third motor. The main shaft motor 32 and the polishing wheel 33 are reciprocated along the Z axis direction when the substrate 6 on the machining table 2 is polished so that the polishing wheel 33 is moved along the Z axis direction to the substrate 6, To perform polishing. However, the structure of the transmission mechanism and the guide rail of the Z-direction base seat 31 is not limited and can be replaced with various conventional power transmission and guide structures.

The substrate 6 can be carried to the carrier 21 of the machining table 2 by using a transportation device such as a robot arm or the like after the substrate 6 is fixed, The grinding unit 3 is moved downward (along the Z-axis direction) so that the grinding wheel 33 reaches the preset height and then the grinding on the surface of the substrate 6 is started, The substrate 6 is polished in the longitudinal direction (along the Y-axis direction) while moving (along the Y-axis direction). Further, the Z-direction moving base sheet 31 moves the polishing wheel 33 along the X-axis direction to polish the substrate 6 in the lateral direction (along the X-axis direction). After the polishing of the substrate 6 is completed, the polishing wheel 33 can be lifted by using a third motor, and the substrate 6, which has been polished by using a carrying device such as a robot arm, And after the next substrate 6 to be polished is moved and positioned, the polishing operation is repeated.

5, the contact-type dressing unit 4 of the present invention may include a dressing tool 41 and a position sensor 42. The dressing tool 41 is preferably a diamond pencil, It does not. The dressing tool 41 is installed within the moving range of the polishing wheel 33 and the dressing tool 41 can contact the polishing wheel 33 to tune the polishing wheel 33. [ The position sensor 42 is a contact type sensor and the position sensor 42 is disposed on the side of the dressing tool 41 and in the moving range of the polishing wheel 33, The grinding wheel 33 senses the position of the wheel surface of the grinding wheel 33 before dressing the grinding wheel 33 and senses the diameter of the grinding wheel 33 and transmits the sensed value to a control unit And calculates the dressing amount of the polishing wheel 33 through the control unit. The position sensor 42 can be covered with a protective cover 43 when not in use.

6, the automatic surveying unit 5 of the present invention is installed in the polishing unit 3, and can be installed in a housing which is coated on the outside of the spindle motor 32, for example. The automatic measuring unit 5 may include at least one driving device 51 and at least one sensor 52. The driving device 51 may be an apparatus such as an air cylinder or a motor, And can be fixed to the outside of the polishing unit 3. The sensor 52 may be a device such as a feeler gauge, and the sensor 52 is connected to the drive device 51. The driving device 51 can move the sensor 52 along the Z-axis direction so as to measure the height of the carrier 21 and the substrate 6. [ Before polishing each substrate 6, the height of the processing table 2 can be measured and confirmed. After polishing the substrate 6 by a predetermined amount, the height of the substrate 6 is measured again, and then the final precision of polishing is controlled . The automatic measuring unit 5 is provided outside the polishing unit 3 and when the automatic measuring unit 5 performs the measurement, the driving unit 51 is operated and elongated, The sensor 52 can be brought into contact with the object to be measured before the polishing wheel 33 when the polishing unit 3 moves downward in the Z-axis direction. The object to be measured may be a substrate on the carrier 21 or an outer frame portion 214 of the carrier 21. [

A guide member 53 is provided between the polishing unit 3 and the sensor 52 of the corresponding automatic measuring unit 5 in the present embodiment and the guide member 53 is fixed to the fixed sheet 531 And an elevating sheet 532. The fixed sheet 531 is fixed to one side of the polishing unit 3 and the elevating sheet 532 is slidably mounted to the fixed sheet 531 and the sensor 52 is fixed to the elevating sheet 532. [ The lift-up sheet 532 can move along the Z-axis direction in the fixed sheet 531 so that the sensor 52 can move up and down stably along the Z-axis direction.

[Second Embodiment]

7 and 8, in this embodiment, the carrier 21 includes a base sheet 211 and a ceramic adsorption unit 212. The base sheet 211 is installed in the bed 1, The ceramic adsorption unit 212 may be installed on the base sheet 211, and the ceramic adsorption unit 212 may be an integrally formed porous ceramic. The ceramic adsorption unit 212 has a vacuum adsorption surface 213. The upper portion of the base sheet 211 has an outer frame 214 on the outer side of the ceramic adsorption unit 212 and a vacuum adsorption surface 213, And the outer frame portion 214 of the base sheet 211 may be located on the same horizontal plane. At least one vacuum groove 215 is provided in the outer frame portion 214 at a position close to the ceramic adsorption unit 212 (see FIG. 7A). In this embodiment, two vacuum grooves 215 are provided " The two vacuum grooves 215 surround the outer side of the ceramic adsorption unit 212 at intervals. The vacuum groove 215 may be connected to a suitable vacuum device (air extraction device), and the ceramic adsorption panel 212 and the vacuum groove 215 may each have a vacuum circuit that is independently controlled. The vacuum groove 215 is provided so as to surround the outer side of the ceramic adsorption unit 212 to discharge the cutting fluid and the polishing residue, thereby reducing the situation where the polishing residue is sucked into the ceramic adsorption unit 212 and the porous material is clogged.

The carrier of the present invention moves along the Y axis direction and the Z moving base sheet moves along the X axis and Z axis directions so that the polishing wheel can polish the substrate on the carrier of the machining table. The planar polishing apparatus of the present invention can control the movement in both the X-axis, the Y-axis, and the Z-axis direction, and is excellent in moving ability and has good processing accuracy.

Further, the present invention has a contact-type dressing function, so that the polished grinding wheel is dressed using a direct dressing tool, and after the dressing, the grinding wheel contacts the position sensor to confirm the precise position of the Z axis, So that the error of precision can be reduced.

The present invention also has an automatic surveying function, so that the sensor can be elevated and lowered by a driving device. The system can set the preliminary processing amount in advance. When the workpiece is polished to a preset amount, the automatic surveying function is activated, The accuracy of the polishing precision can be obtained by performing the final precision correcting operation after confirming the zero point by measuring the position of the substrate, measuring the height position of the substrate, checking the error of the actual height.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Are covered by the protection scope.

1: Bed 2: Processed table
3: Polishing unit 4: Contact tooth dressing unit
5: Automatic measuring unit 6: Substrate
21: carrier 22: first motor
23: first guide rail 31: Z-direction moving base sheet
32: spindle motor 33: grinding wheel
34: second motor 35: second guide rail
38: pulley assembly 39: X-direction base sheet
41: dressing tool 42: position sensor
43: protective cover 51: driving device
52: sensor 53: guide mechanism
211: base sheet 212: ceramic adsorption layer
213: Vacuum suction surface 214: Outer frame part
215: vacuum groove 531: fixed sheet
532:

Claims (9)

Bed;
A processing table installed on the bed, the processing table being movable along the Y-axis direction and having a carrier for fixing a substrate to be polished;
A main shaft motor provided on the Z-direction moving base sheet, the polishing wheel being disposed above the processing table and including a Z-direction moving base seat, a main shaft motor and a grinding wheel, And the Z-direction moving base sheet is movable along the X-axis direction and the Z-axis direction so that the polishing wheel is moved on a carrier of the processing table A polishing unit capable of polishing the substrate;
A contact blade dressing unit including a dressing tool installed within a range of movement of the polishing wheel and adapted to contact the polishing wheel to modify the polishing wheel; And
Wherein the at least one sensor is connected to the at least one drive device and the at least one drive device is mounted on the carrier and the substrate, And an automatic metering unit for moving the at least one sensor along the Z-axis direction to measure the height. The method according to claim 1,
Wherein the carrier includes a base sheet and a ceramic adsorption unit, the base sheet is installed on the bed, the ceramic adsorption unit is installed on the base sheet, and the upper part of the base sheet is provided on the outer side of the ceramic frame, Wherein at least one vacuum groove is formed in the outer frame portion at a position close to the ceramic adsorption unit and at least one vacuum groove is formed on the outer side of the ceramic adsorption unit so as to discharge the cutting fluid and the polishing residue Of the polishing pad. 3. The method of claim 2,
Wherein at least one of the at least one vacuum groove is provided and the two vacuum grooves enclose the outside of the ceramic adsorption unit at intervals. 3. The method of claim 2,
Wherein the ceramic adsorption unit is a porous ceramic unit integrally formed with a vacuum adsorption surface and the outer frame portion of the base sheet is located on the same horizontal plane. 3. The method of claim 2,
Wherein the ceramic adsorber and the at least one vacuum groove each have independently controlled vacuum circuits. The method according to claim 1,
Wherein the carrier comprises a permanent magnet plate (magnet board). The method according to claim 1,
Wherein the dressing unit includes a position sensor, the position sensor is disposed on a side of the dressing tool and is located within a range of movement of the polishing wheel, And detecting the position of the wheel face of the polishing wheel to detect the diameter and the polishing amount of the polishing wheel. The method according to claim 1,
A guide mechanism is provided between the polishing unit and the sensor of the automatic surveying unit, the guide mechanism includes a fixed seat and an elevated sheet, the fixed seat is fixed to one side of the polishing unit, Wherein the sensor is fixed to the elevating sheet, and the elevating sheet is movable along the Z-axis direction in the fixing sheet. The method according to claim 1,
The polishing unit further includes an X-direction base sheet, and the carrier is driven by a first motor, the carrier is slidably engaged with the first guide rail, and is movable along the Y-axis direction; Direction base sheet is connected to a second motor, the X-direction base sheet is slidably engaged with a second guide rail, the Z-direction moving base sheet is slidably engaged with the X-direction base sheet, And the Z-direction moving base sheet is allowed to move along the X-axis direction and the Z-axis direction.

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