TWI599449B - Flat lapping apparatus - Google Patents

Description

Surface grinding equipment

The present invention relates to a planar grinding apparatus, and more particularly to a planar grinding apparatus for grinding a carrier or a workpiece.

The existing surface grinding equipment utilizes a grinding wheel (such as a ceramic brush wheel) to perform a grinding operation of a carrier or a workpiece, which has poor removal ability and poor precision. Furthermore, the existing flat grinding equipment does not provide an automatic measuring function, the grinding precision control is not easy, and precise dimensional control cannot be achieved, so that high-precision grinding size cannot be achieved. Furthermore, the conventional machined surface for flat grinding is likely to be clogged by inhalation of wear debris.

In summary, the present inventors have felt that the above-mentioned defects can be improved, and the present invention has been put forward with great interest in designing and coordinating the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a planar grinding device with better removal capability, a function of sharpening and automatic measurement of the knife, and high precision grinding size.

The technical problem to be solved by the present invention is also to provide a plane grinding device which can reduce the occurrence of clogging when the abrasive chips are sucked into the processing table.

In order to solve the above technical problems, the present invention provides a planar grinding apparatus, The utility model comprises: a bed; a processing table disposed on the bed, the processing table is provided with a carrying platform for fixing the carrier to be ground, the carrier can move along a Y-axis direction; a unit disposed above the processing table, the grinding unit includes a Z-direction moving base, a spindle motor and a grinding wheel, the spindle motor is disposed on the Z-direction moving base, and the grinding wheel is dynamically connected to the spindle motor The spindle motor can be used to drive the grinding wheel to rotate. The Z-direction moving base can move along an X-axis direction and a Z-axis direction, and the grinding wheel can be used for grinding the carrier on the processing table. a touch sharpening unit comprising a sharpening tool disposed within a range of motion of the grinding wheel, the sharpening tool being capable of contacting the grinding wheel to trim the grinding wheel; and an automatic amount The measuring unit is disposed on the polishing unit, and includes at least one driving device and at least one sensor, wherein the at least one sensor is connected to the at least one driving device, and the at least one driving device can drive the at least one sensor The movement of the Z-axis direction, for measuring the height of the carrier platform and the carrier plate.

Preferably, the carrying platform comprises a base and a ceramic suction cup, the base is disposed on the bed, the ceramic suction cup is disposed on the base, and the top of the base forms an outer frame portion on the outer side of the ceramic suction cup, At least one vacuum groove is recessed in a position of the outer frame portion adjacent to the ceramic chuck, and the at least one vacuum groove surrounds the outer side of the ceramic chuck for discharging cutting fluid and wear debris.

The invention has at least the following advantages:

The carrier of the present invention can be moved along the Y-axis direction, and the Z-direction moving base can be moved along the X-axis and the Z-axis direction, so that the grinding wheel can grind the carrier on the stage of the processing table. The planar grinding apparatus of the present invention can control movement in the X-axis, Y-axis and Z-axis directions, has better removal ability, and has better processing precision.

The invention has the function of sharpening the knife, and the grinding wheel is directly sharpened by the sharpening tool after grinding to reduce the error of precision. The invention further has the function of automatic measuring, the driving device can be used to drive the sensor to lift and lower, the system can preset the reserved processing amount, and when the grinding to the preset amount, the automatic measuring function is enabled, and the processing table position is measured first. Make a zero confirmation, then measure the height position of the carrier and confirm the actual height error. The final finishing motion is achieved, so that high-precision grinding sizes can be achieved.

The carrying platform of the present invention can be provided with a vacuum groove which surrounds the outer side of the ceramic suction cup and can be used for discharging cutting fluid and grinding debris to reduce the occurrence of clogging of the porous material by the suction of the grinding abrasive by the ceramic suction cup.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

1‧‧‧ bed

2‧‧‧Processing countertops

21‧‧‧Loading station

211‧‧‧Base

212‧‧‧Ceramic suction cups

213‧‧‧ Vacuum adsorption surface

214‧‧‧Outer frame

215‧‧‧vacuum trench

22‧‧‧First motor

23‧‧‧First rail

3‧‧‧grinding unit

31‧‧‧Z-direction mobile base

32‧‧‧Spindle motor

33‧‧‧ grinding wheel

34‧‧‧second motor

35‧‧‧Second rail

38‧‧‧ Pulley set

39‧‧‧X to base

4‧‧‧Bearing sharpening unit

41‧‧‧ sharpening tools

42‧‧‧ position sensor

43‧‧‧ protective cover

5‧‧‧Automatic measurement unit

51‧‧‧ drive

52‧‧‧ sensor

53‧‧‧Guiding agency

531‧‧‧ Fixed seat

532‧‧‧ Lifting seat

6‧‧‧ Carrier Board

Figure 1 is a perspective view of a planar grinding apparatus of the present invention.

1A is a detailed view of a portion A of FIG. 1.

Figure 2 is a front elevational view of the planar grinding apparatus of the present invention.

Figure 3 is a side elevational view of the planar grinding apparatus of the present invention.

4 is a top plan view of a planar grinding apparatus of the present invention.

Figure 5 is a perspective view of the sharpening unit of the blade of the present invention.

Figure 6 is a perspective view of the automatic measuring unit of the present invention.

Figure 7 is a perspective view of the carrier of the present invention.

Fig. 7A is a detailed view of a portion B of Fig. 7.

Figure 8 is a plan view of the carrier of the present invention.

The embodiments of the planar polishing apparatus of the present invention are described below by way of specific specific examples, and those skilled in the art can readily appreciate other advantages and effects of the present invention from the disclosure of the present specification. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. Further, the drawings of the present invention are merely illustrative, and are not depicted in actual dimensions, that is, the actual dimensions of the related structures are not reflected, which will be described first. The following embodiments further explain the present invention in detail. The present invention is not intended to limit the scope of the invention in any way.

[First Embodiment]

Referring to FIG. 1 to FIG. 4, the present invention provides a planar grinding apparatus for grinding a carrier or other workpiece. The planar polishing apparatus includes a bed 1, a processing table 2, a grinding unit 3, and a collision tool. Unit 4 and an automatic measuring unit 5 (shown in Figure 6).

The bed 1 is a stable structure and can be placed on the ground for supporting and connecting the processing table 2, the grinding unit 3, the sharpening unit 4 and the automatic measuring unit 5.

The processing table 2 is disposed on the bed 1. The processing table 2 is provided with a carrying platform 21 for fixing the carrier 6 to be polished. The carrier 6 can be a thin carrier or other workpiece such as a glass substrate or an IC carrier. . The carrier 21 includes a ceramic chuck, and the carrier 21 includes a permanent magnet disk or the like, and the configuration thereof is not limited. After the carrier 6 is transported to the processing table 2, the carrier 6 can be fixed on the carrier 21, for example, Vacuum adsorption or magnetic fixation.

The stage 21 is movable in a Y-axis direction, that is, the stage 21 can be moved in the front and rear directions as shown in FIG. Specifically, the carrier 21 can be driven by a first motor 22, and the first motor 22 can be connected to the carrier 21 by a transmission mechanism such as a screw, and the carrier 21 is slidably engaged with the first rail 23, so that the first motor can be utilized. A motor 22 drives the stage 21 to be movable in the Y-axis direction. When the carrier 6 on the processing table 2 is ground, the stage 21 can reciprocate in the Y-axis direction. However, the configuration of the transmission mechanism and the guide rail of the loading platform 21 is not limited, and various transmission and guiding structures can be replaced.

The grinding unit 3 is disposed above the processing table 2, the grinding unit 3 includes a Z-direction moving base 31, a spindle motor 32 and a grinding wheel 33. The spindle motor 32 is disposed on the Z-direction moving base 31, and the grinding wheel 33 is The spindle motor 32 is connected. Alternatively, the grinding wheel 33 can be coupled to the spindle motor 32 via a transmission mechanism such as a pulley set 38. The center axis of the grinding wheel 33 is parallel to the X-axis direction, and the grinding wheel 33 can be moved along the Z-direction moving base 31 The spindle motor 32 can be used to drive the grinding wheel 33 to rotate. The outer side of the spindle motor 32 and the pulley set 38 may also be covered with a housing (not shown) for protecting the spindle motor 32 and the pulley set 38 and the like.

The Z-direction moving base 31 is movable in an X-axis direction, that is, the Z-direction moving base 31 is movable in the left and right directions as shown in FIG. Specifically, the grinding unit 3 further includes an X-direction base 39. The Z-direction moving base 31 can be driven by a second motor 34. The second motor 34 can be connected to the X-direction base 39 by a transmission mechanism such as a screw. X is slidably engaged with the base 39 on the second guide rail 35 (as shown in FIG. 1A), so that the second motor 34 can be used to drive the X toward the base 39 to be movable in the X-axis direction. When the carrier 6 on the processing table 2 is polished, the X-direction base 39 can drive the Z-moving base 31, the spindle motor 32, and the grinding wheel 33 to reciprocate along the X-axis direction, so that the grinding wheel 33 can follow the X. The carrier 6 is fed in the axial direction and polished. However, the configuration of the transmission mechanism and the guide rail of the X-direction base 39 is not limited, and various transmission and guidance structures can be replaced.

The spindle motor 32 is movable in the up and down directions as shown in FIG. Specifically, the Z-moving base 31 is slidably fitted to the X-direction base 39, and the Z-direction moving base 31 is slidable in the Z-axis direction on the X-direction base 39, so that the third motor can be utilized (Fig. The Z-moving base 31 can be moved in the Z-axis direction, and the third motor can be coupled to the Z-moving base 31 by a transmission mechanism such as a screw, and the Z-sliding base 31 is slidably coupled to the X-direction base 39. Therefore, the Z-moving base 31 and the spindle motor 32 can be moved in the Z-axis direction by the third motor. When the carrier 6 on the processing table 2 is polished, the spindle motor 32 and the grinding wheel 33 can reciprocate in the Z-axis direction, and the grinding wheel 33 can be fed to the carrier 6 in the Z-axis direction. However, the configuration of the transmission mechanism and the guide rail of the Z-direction moving base 31 is not limited, and various transmission and guiding structures can be replaced.

In the polishing operation, the carrier 6 can be transported to the stage 21 of the processing table 2 by a transfer device such as a robot arm, and after the carrier 6 is fixed, the polishing unit 3 can be moved downward by the third motor. (along the Z-axis direction), the grinding wheel 33 At a predetermined height, polishing of the surface of the carrier 6 is started, and the stage 21 can be reciprocated (along the Y-axis direction) to perform longitudinal polishing (along the Y-axis direction) of the carrier 6. Further, the Z-moving base 31 drives the grinding wheel 33 to move in the X-axis direction to perform the grinding of the carrier plate 6 in the lateral direction (along the X-axis direction). After the polishing of the carrier 6 is completed, the grinding wheel 33 can be lifted by the third motor, and the finished carrier 6 can be moved away from the processing table 2 by a transfer device such as a robot arm, and the next carrier 6 to be polished is moved to the next. After the positioning, the above grinding operation is repeated.

Referring to FIG. 5, the blade sharpening unit 4 of the present invention may include a sharpening tool 41 and a position sensor 42. The sharpening tool 41 is preferably but not limited to a diamond pen, and the sharpening tool 41 is disposed on the grinding wheel. Within the range of motion 33, the sharpening tool 41 can be used to contact the grinding wheel 33 to trim the grinding wheel 33. The position sensor 42 is a contact sensor. The position sensor 42 is disposed on the side of the sharpening tool 41 and is located within the movable range of the grinding wheel 33. The position sensor 42 can be used in the grinding wheel 33. Before and after the sharpening, the position of the wheel surface of the grinding wheel 33 is sensed, thereby sensing the diameter of the grinding wheel 33, and then transmitting the sensed value to a control unit (not shown), and the control unit calculates the The sharpening amount of the grinding wheel 33. The position sensor 42 can be covered with a protective cover 43 when not in use.

Referring to FIG. 6 , the automatic measuring unit 5 of the present invention is disposed on the polishing unit 3 , for example, may be disposed on a casing covered by the outside of the spindle motor 32 . The automatic measuring unit 5 includes at least one driving device 51 and at least one sense. The driving device 51 can be a device such as a cylinder or a motor. The driving device 51 can be fixed to the outside of the polishing unit 3, the sensor 52 can be a device such as a probe, and the sensor 52 is connected to the driving device 51. The 51 can drive the sensor 52 to move in the Z-axis direction for measuring the height of the carrier 21 and the carrier 6. Before each of the carrier plates 6 is polished, the height measurement of the processing table 2 can be performed first, and after grinding to a reserve amount, the height measurement of the carrier plate 6 is performed, followed by final precision control polishing. The automatic measuring unit 5 is disposed outside the grinding unit 3. When the automatic measuring unit 5 performs the measurement, the driving device 51 is actuated to elongate, thereby changing the position of the sensor 52 in the Z-axis direction, so that the grinding unit 3 is in the Z-axis. When moving down, The sensor 52 may first contact the object to be tested than the grinding wheel 33, and the object to be tested may be a carrier on the carrier 21 or an outer frame portion 214 of the carrier 21.

In the present embodiment, a guiding mechanism 53 is disposed between the grinding unit 3 and the sensor 52 of the corresponding automatic measuring unit 5, and the guiding mechanism 53 includes a fixing base 531 and a lifting base 532. The seat 531 is fixed to one side of the grinding unit 3, the lifting base 532 is slidably disposed on the fixing base 531, and the sensor 52 is fixed on the lifting base 532. The lifting base 532 can be moved along the Z-axis direction on the fixing base 531. In order to drive the sensor 52 to move stably along the Z-axis direction.

[Second embodiment]

Referring to FIG. 7 and FIG. 8 , in the embodiment, the loading platform 21 includes a base 211 and a ceramic suction cup 212 . The base 211 is disposed on the bed 1 , and the ceramic suction cup 212 is disposed on the base 211 . The ceramic suction cup 212 can be The ceramic chuck 212 has a vacuum suction surface 213. The top of the base 211 forms an outer frame portion 214 on the outer side of the ceramic chuck 212. The vacuum suction surface 213 and the outer frame portion 214 of the base 211 can be located in the same level. The outer frame portion 214 is recessed with a vacuum groove 215 (as shown in FIG. 7A) near the position of the ceramic chuck 212. This embodiment discloses that the vacuum groove 215 is provided with two, and the two vacuum grooves 215 are spaced around. On the outside of the ceramic chuck 212. The vacuum groove 215 can be connected to a suitable vacuuming device (suction device), and the ceramic chuck 212 and the vacuum channel 215 each have an independently controlled vacuum circuit. The vacuum groove 215 surrounds the outer side of the ceramic chuck 212 and can be used to discharge the cutting fluid and the grinding debris to reduce the occurrence of clogging of the porous material by the suction of the ceramic chuck 212.

The carrier of the present invention can be moved along the Y-axis direction, and the Z-direction moving base can be moved along the X-axis and the Z-axis direction, so that the grinding wheel can grind the carrier on the stage of the processing table. The planar grinding apparatus of the present invention can control movement in the X-axis, Y-axis and Z-axis directions, has better removal ability, and has better processing precision.

Furthermore, the invention has the function of sharpening the knife, and the grinding wheel is directly sharpened by the sharpening tool after grinding, and the grinding wheel can touch the position sensor to confirm the correct position of the Z axis after the sharpening. The machining operation can be directly performed to reduce the accuracy error.

The invention further has the function of automatic measuring, the driving device can be used to drive the sensor to lift and lower, the system can preset the reserved processing amount, and when the grinding to the preset amount, the automatic measuring function is enabled, and the processing table position is measured first. After confirming the zero point, the height position of the carrier is measured, and the final finishing operation is performed after confirming the actual height error, so that the high-precision grinding size can be achieved.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and the equivalent changes of the present invention and the contents of the drawings are all included in the scope of protection of the present invention. Within, combined with Chen Ming.

1‧‧‧ bed

2‧‧‧Processing countertops

21‧‧‧Loading station

211‧‧‧Base

212‧‧‧Ceramic suction cups

22‧‧‧First motor

23‧‧‧First rail

3‧‧‧grinding unit

31‧‧‧Z-direction mobile base

32‧‧‧Spindle motor

33‧‧‧ grinding wheel

34‧‧‧second motor

35‧‧‧Second rail

38‧‧‧ Pulley set

4‧‧‧Bearing sharpening unit

6‧‧‧ Carrier Board

Claims (7)

A plane grinding apparatus comprises: a bed; a processing table disposed on the bed, the processing table is provided with a carrying platform for fixing a carrier to be ground, the carrier can be along a Y axis Moving in the direction, the carrying platform comprises a base and a ceramic suction cup, the base is disposed on the bed, the ceramic suction cup is disposed on the base, and the top of the base forms an outer frame portion on the outer side of the ceramic suction cup, the outer At least one vacuum groove is recessed in a position of the frame portion adjacent to the ceramic chuck, and the at least one vacuum groove surrounds the outer side of the ceramic chuck for discharging cutting fluid and grinding debris; and a grinding unit disposed on the processing table The grinding unit includes a Z-direction moving base, a spindle motor and a grinding wheel. The spindle motor is disposed on the Z-direction moving base. The grinding wheel is dynamically connected to the spindle motor, and the spindle motor can be driven The grinding wheel rotates, the Z-direction moving base can move along an X-axis direction and a Z-axis direction, and the grinding wheel can be used for grinding the carrier on the processing table of the processing table; The utility model comprises a sharpening tool, the sharpening tool is arranged within the movable range of the grinding wheel, the sharpening tool can be used for contacting the grinding wheel to trim the grinding wheel, and an automatic measuring unit is arranged for the grinding The unit includes at least one driving device and at least one sensor, the at least one sensor is coupled to the at least one driving device, and the at least one driving device can drive the at least one sensor to move along the Z-axis direction, It is used to measure the height of the carrying platform and the carrier. The planar grinding apparatus of claim 1, wherein the at least one vacuum groove is provided with two, the two vacuum grooves being spaced around the outer side of the ceramic chuck. The planar grinding apparatus of claim 1, wherein the ceramic chuck is an integrally formed porous ceramic, the ceramic chuck having a vacuum suction surface that is at the same level as the outer frame portion of the base. The planar grinding apparatus of claim 1, wherein the ceramic chuck and the at least one vacuum groove each have an independently controlled vacuum circuit. The surface grinding apparatus of claim 1, wherein the blade sharpening unit further comprises a position sensor disposed on a side of the sharpening tool and located within the movable range of the grinding wheel, The position sensor can be used to sense the position of the wheel surface of the grinding wheel before and after the grinding wheel is sharpened, thereby sensing the diameter and the wear amount of the grinding wheel. The plane grinding apparatus of claim 1, wherein a guiding mechanism is disposed between the grinding unit and the sensor of the automatic measuring unit, the guiding mechanism comprises a fixing base and a lifting seat, and the fixing seat is fixed On one side of the grinding unit, the lifting seat is slidably disposed on the fixing seat, and the sensor is fixed on the lifting seat, and the lifting seat can move along the Z-axis direction on the fixing seat. The plane grinding apparatus of claim 1, wherein the grinding unit further comprises an X-direction base, and the stage is driven by a first motor, and the stage is slidably engaged with the first rail, along which Moving in the Y-axis direction; the X-direction base is coupled to a second motor, the X-slider is slidably coupled to a second rail, and the Z-moving base is slidably coupled to the X-direction base to enable the Z The moving base can move in the X-axis direction and the Z-axis direction.