KR20180020972A - 증착 마스크의 제조 방법, 증착 마스크 준비체, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 및 증착 마스크 - Google Patents

증착 마스크의 제조 방법, 증착 마스크 준비체, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 및 증착 마스크 Download PDF

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Publication number
KR20180020972A
KR20180020972A KR1020177035727A KR20177035727A KR20180020972A KR 20180020972 A KR20180020972 A KR 20180020972A KR 1020177035727 A KR1020177035727 A KR 1020177035727A KR 20177035727 A KR20177035727 A KR 20177035727A KR 20180020972 A KR20180020972 A KR 20180020972A
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KR
South Korea
Prior art keywords
mask
resin
deposition
protective sheet
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020177035727A
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English (en)
Korean (ko)
Inventor
도시히코 다케다
구미코 호카리
야스코 소네
가츠나리 오바타
Original Assignee
다이니폰 인사츠 가부시키가이샤
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Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Priority claimed from PCT/JP2016/069250 external-priority patent/WO2017006821A1/ja
Publication of KR20180020972A publication Critical patent/KR20180020972A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H01L51/0011—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H01L27/32—
    • H01L51/10—
    • H01L51/5253—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020177035727A 2015-07-03 2016-06-29 증착 마스크의 제조 방법, 증착 마스크 준비체, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 및 증착 마스크 Ceased KR20180020972A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2015-134806 2015-07-03
JP2015134805 2015-07-03
JPJP-P-2015-134805 2015-07-03
JP2015134806 2015-07-03
JPJP-P-2016-128114 2016-06-28
JP2016128114A JP6160747B2 (ja) 2015-07-03 2016-06-28 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク
PCT/JP2016/069250 WO2017006821A1 (ja) 2015-07-03 2016-06-29 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法、及び蒸着マスク

Publications (1)

Publication Number Publication Date
KR20180020972A true KR20180020972A (ko) 2018-02-28

Family

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Family Applications (1)

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KR1020177035727A Ceased KR20180020972A (ko) 2015-07-03 2016-06-29 증착 마스크의 제조 방법, 증착 마스크 준비체, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 및 증착 마스크

Country Status (5)

Country Link
US (4) US10396283B2 (OSRAM)
JP (3) JP6160747B2 (OSRAM)
KR (1) KR20180020972A (OSRAM)
CN (1) CN107709602B (OSRAM)
TW (2) TWI701352B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20220170208A (ko) * 2021-06-22 2022-12-29 (주)휴넷플러스 대면적 다중 박막 초고해상도 증착용 마스크

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JP6160747B2 (ja) * 2015-07-03 2017-07-12 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク
CN110512172A (zh) * 2018-05-21 2019-11-29 鸿富锦精密工业（深圳）有限公司 蒸镀遮罩的制造方法及有机发光材料的蒸镀方法
JP7059839B2 (ja) * 2018-07-11 2022-04-26 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク製造装置、蒸着パターン形成方法、および有機半導体素子の製造方法
JP7187883B2 (ja) * 2018-08-09 2022-12-13 大日本印刷株式会社 蒸着マスクの製造方法
CN110875356B (zh) * 2018-08-30 2024-09-20 上海和辉光电股份有限公司 一种柔性显示母板、柔性amoled显示面板及柔性显示器件
US20220181594A1 (en) * 2019-03-27 2022-06-09 Sakai Display Products Corporation Method for manufacturing resin film having fine pattern, method for manufacturing organic el display device, base material film for use in formation of fine pattern, and resin film having support member attached thereto
CN112296534B (zh) * 2019-10-09 2024-10-01 宁德时代新能源科技股份有限公司 极片切割装置及方法
JP7120262B2 (ja) * 2020-02-06 2022-08-17 大日本印刷株式会社 蒸着マスク準備体の製造方法、フレーム付き蒸着マスク準備体の製造方法、及びフレーム付き蒸着マスク準備体
JP7579510B2 (ja) * 2020-04-02 2024-11-08 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌ表示装置の製造方法及び蒸着方法
JP7645138B2 (ja) * 2021-06-17 2025-03-13 株式会社アルバック ハードマスクの製造方法及び太陽電池の製造方法
KR20230020035A (ko) * 2021-08-02 2023-02-10 삼성디스플레이 주식회사 증착용 마스크
CN217238987U (zh) * 2022-01-18 2022-08-19 荣耀终端有限公司 显示组件及电子设备
CN118048100A (zh) * 2022-11-17 2024-05-17 重庆康佳光电技术研究院有限公司 一种保护胶及蒸镀设备使用方法
KR20250122025A (ko) * 2024-02-05 2025-08-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조 방법

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JP5517308B2 (ja) 2011-11-22 2014-06-11 株式会社ブイ・テクノロジー マスクの製造方法、マスク及びマスクの製造装置
TWI572729B (zh) * 2012-01-12 2017-03-01 Dainippon Printing Co Ltd A method of manufacturing a vapor deposition mask, and a method of manufacturing an organic semiconductor device
KR101972920B1 (ko) * 2012-01-12 2019-08-23 다이니폰 인사츠 가부시키가이샤 수지판을 구비한 금속 마스크, 증착 마스크, 증착 마스크 장치의 제조 방법, 및 유기 반도체 소자의 제조 방법
JP5288037B2 (ja) 2012-10-03 2013-09-11 株式会社デンソー 車両用表示装置
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JP6160747B2 (ja) * 2015-07-03 2017-07-12 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220170208A (ko) * 2021-06-22 2022-12-29 (주)휴넷플러스 대면적 다중 박막 초고해상도 증착용 마스크

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US10396283B2 (en) 2019-08-27
US20180190906A1 (en) 2018-07-05
US20190363256A1 (en) 2019-11-28
TW201716601A (zh) 2017-05-16
TW202041695A (zh) 2020-11-16
TWI740578B (zh) 2021-09-21
US20210098702A1 (en) 2021-04-01
JP6769396B2 (ja) 2020-10-14
US10651386B2 (en) 2020-05-12
JP7024837B2 (ja) 2022-02-24
US10873029B2 (en) 2020-12-22
JP6160747B2 (ja) 2017-07-12
US20200235299A1 (en) 2020-07-23
CN107709602B (zh) 2020-10-13
TWI701352B (zh) 2020-08-11
JP2017014620A (ja) 2017-01-19
JP2021004416A (ja) 2021-01-14
JP2017206774A (ja) 2017-11-24
CN107709602A (zh) 2018-02-16

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