TWI701352B - 蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、有機半導體元件之製造方法、有機電致發光顯示器之製造方法及蒸鍍遮罩 - Google Patents

蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、有機半導體元件之製造方法、有機電致發光顯示器之製造方法及蒸鍍遮罩 Download PDF

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Publication number
TWI701352B
TWI701352B TW105120982A TW105120982A TWI701352B TW I701352 B TWI701352 B TW I701352B TW 105120982 A TW105120982 A TW 105120982A TW 105120982 A TW105120982 A TW 105120982A TW I701352 B TWI701352 B TW I701352B
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TW
Taiwan
Prior art keywords
mask
vapor deposition
resin
protective sheet
deposition mask
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TW105120982A
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English (en)
Chinese (zh)
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TW201716601A (zh
Inventor
武田利彦
穂刈久実子
曽根康子
小幡勝也
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日商大日本印刷股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW105120982A 2015-07-03 2016-07-01 蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、有機半導體元件之製造方法、有機電致發光顯示器之製造方法及蒸鍍遮罩 TWI701352B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2015-134805 2015-07-03
JP2015134805 2015-07-03
JP2015134806 2015-07-03
JP2015-134806 2015-07-03
JP2016128114A JP6160747B2 (ja) 2015-07-03 2016-06-28 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク
JP2016-128114 2016-06-28

Publications (2)

Publication Number Publication Date
TW201716601A TW201716601A (zh) 2017-05-16
TWI701352B true TWI701352B (zh) 2020-08-11

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TW109124111A TWI740578B (zh) 2015-07-03 2016-07-01 蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、有機半導體元件之製造方法、有機電致發光顯示器之製造方法及蒸鍍遮罩
TW105120982A TWI701352B (zh) 2015-07-03 2016-07-01 蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、有機半導體元件之製造方法、有機電致發光顯示器之製造方法及蒸鍍遮罩

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TW109124111A TWI740578B (zh) 2015-07-03 2016-07-01 蒸鍍遮罩之製造方法、蒸鍍遮罩準備體、有機半導體元件之製造方法、有機電致發光顯示器之製造方法及蒸鍍遮罩

Country Status (5)

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US (4) US10396283B2 (OSRAM)
JP (3) JP6160747B2 (OSRAM)
KR (1) KR20180020972A (OSRAM)
CN (1) CN107709602B (OSRAM)
TW (2) TWI740578B (OSRAM)

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JP6160747B2 (ja) 2015-07-03 2017-07-12 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク準備体、有機半導体素子の製造方法、及び蒸着マスク
CN110512172A (zh) * 2018-05-21 2019-11-29 鸿富锦精密工业（深圳）有限公司 蒸镀遮罩的制造方法及有机发光材料的蒸镀方法
JP7059839B2 (ja) * 2018-07-11 2022-04-26 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク製造装置、蒸着パターン形成方法、および有機半導体素子の製造方法
JP7187883B2 (ja) * 2018-08-09 2022-12-13 大日本印刷株式会社 蒸着マスクの製造方法
CN110875356B (zh) * 2018-08-30 2024-09-20 上海和辉光电股份有限公司 一种柔性显示母板、柔性amoled显示面板及柔性显示器件
CN113874539A (zh) * 2019-03-27 2021-12-31 堺显示器制品株式会社 具有微细图案的树脂薄膜的制造方法和有机el显示装置的制造方法以及微细图案形成用基材膜及带有支撑构件的树脂薄膜
CN112296534B (zh) * 2019-10-09 2024-10-01 宁德时代新能源科技股份有限公司 极片切割装置及方法
JP7120262B2 (ja) * 2020-02-06 2022-08-17 大日本印刷株式会社 蒸着マスク準備体の製造方法、フレーム付き蒸着マスク準備体の製造方法、及びフレーム付き蒸着マスク準備体
JP7579510B2 (ja) * 2020-04-02 2024-11-08 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、有機半導体素子の製造方法、有機ｅｌ表示装置の製造方法及び蒸着方法
JP7645138B2 (ja) * 2021-06-17 2025-03-13 株式会社アルバック ハードマスクの製造方法及び太陽電池の製造方法
KR102615023B1 (ko) * 2021-06-22 2023-12-19 (주)휴넷플러스 대면적 다중 박막 초고해상도 증착용 마스크
KR20230020035A (ko) * 2021-08-02 2023-02-10 삼성디스플레이 주식회사 증착용 마스크
CN217238987U (zh) * 2022-01-18 2022-08-19 荣耀终端有限公司 显示组件及电子设备
CN118048100A (zh) * 2022-11-17 2024-05-17 重庆康佳光电技术研究院有限公司 一种保护胶及蒸镀设备使用方法
KR20250122025A (ko) * 2024-02-05 2025-08-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조 방법

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JP2014133938A (ja) * 2013-01-11 2014-07-24 Dainippon Printing Co Ltd 蒸着マスクの製造方法、金属マスク付き樹脂層、及び有機半導体素子の製造方法

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US20200235299A1 (en) 2020-07-23
US10396283B2 (en) 2019-08-27
US10873029B2 (en) 2020-12-22
JP2017206774A (ja) 2017-11-24
US20190363256A1 (en) 2019-11-28
JP6769396B2 (ja) 2020-10-14
US10651386B2 (en) 2020-05-12
JP2017014620A (ja) 2017-01-19
US20210098702A1 (en) 2021-04-01
KR20180020972A (ko) 2018-02-28
JP2021004416A (ja) 2021-01-14
TW201716601A (zh) 2017-05-16
CN107709602B (zh) 2020-10-13
TW202041695A (zh) 2020-11-16
CN107709602A (zh) 2018-02-16
US20180190906A1 (en) 2018-07-05
TWI740578B (zh) 2021-09-21
JP6160747B2 (ja) 2017-07-12
JP7024837B2 (ja) 2022-02-24

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