KR20170130517A - Copper alloy plate and heat dissipation parts for heat dissipation parts - Google Patents

Abstract

A copper alloy plate for heat dissipation parts having high strength, excellent bending workability, and heat radiation property is provided. 0.1 to 1.0 mass% of Ni, 0.01 to 0.3 mass% of Fe, and 0.03 to 0.2 mass% of P, and the balance of Cu and inevitable impurities. A tensile strength in the rolling direction of 580 MPa or more, a proof stress of 560 MPa or more, an elongation of 6% or more, a tensile strength of 600 MPa or more in the direction perpendicular to the rolling direction, a proof stress of 580 MPa or more, an elongation of 3% When the ratio R / t of the bending radius R to the plate thickness t is 0.5 and the 90 degree bending is performed in which the direction of the bending line is the rolling vertical direction, the bending limit width is 70 mm or more and the direction of the bending line is the rolling vertical direction The bending limit width when performing close bending is 20 mm or more.

Description

Copper alloy plate and heat dissipation parts for heat dissipation parts

The present invention relates to a copper alloy plate for a heat dissipation part and a heat dissipation part.

BACKGROUND ART [0002] Heat dissipation parts for dissipating heat generated from electronic components such as a CPU, a liquid crystal, and an image pickup element mounted on electronic equipment such as a personal computer, a tablet terminal, a smart phone, a cellular phone, a digital camera, and a digital video camera are used. The heat dissipation component prevents an excessive increase in the temperature of the electronic component, thereby preventing thermal runaway of the electronic component and functioning normally. As heat dissipating parts, those made of pure copper with high thermal conductivity, stainless steel excellent in strength and corrosion resistance, or lightweight aluminum alloy have been used. These heat dissipation parts are not only a heat dissipation function but also a structural member for protecting electronic components mounted from external force applied to electronic equipment.

BACKGROUND ART [0002] Electronic components mounted on electronic devices are required to have higher speed and higher functionality, and the densification of electronic components is continuously being advanced. Therefore, the amount of heat generated by the electronic components is rapidly increasing. In addition, with the demand for downsizing, thinning, and weight reduction of electronic devices, heat dissipation parts are required to be thin. However, even when the heat dissipation parts are thinned, it is required to maintain the heat dissipation performance and the structural strength.

The plate material, which is the material of the heat dissipation part, is formed into a heat dissipation part through plastic working such as hem bending (close bending), 90 ° bending or drawing. In the bending process, the width of the bent portion (the length of the bent line) in the lead frame and the terminal is about several millimeters or less. However, in the heat dissipation component, the width of the bent portion is about 20 mm or more. It is known that the bending workability of the plate material sharply decreases as the bending width increases, and rigid bending workability is required in the plate material for a heat dissipation component as compared with a terminal or lead frame plate material.

As a material for heat dissipation parts, pure copper has excellent thermal conductivity, but its strength is low and heat dissipation parts can not be made thin. Stainless steel has low thermal conductivity (2 to 3% IACS) and can not be used as a heat dissipation component for electronic components with large heat dissipation. Aluminum alloys are both insufficient in strength and thermal conductivity. On the other hand, copper alloys are excellent in strength and conductivity (see, for example, Patent Documents 1 to 3), but a wide range of bending can not be achieved.

Japanese Patent Application Laid-Open No. 2001-335864 Japanese Patent Application Laid-Open No. 2013-204083 Japanese Patent Application Laid-Open No. 20-207261

An object of the present invention is to provide a copper alloy plate for heat dissipation parts having high strength, excellent bending workability, and heat radiation.

The copper alloy sheet for a heat dissipation component according to the present invention contains 0.1 to 1.0 mass% of Ni, 0.01 to 0.3 mass% of Fe and 0.03 to 0.2 mass% of P, the balance being Cu and inevitable impurities, Tensile strength in parallel direction of 580 MPa or more, proof stress of 560 MPa or more, elongation of 6% or more, tensile strength of 600 MPa or more in the direction perpendicular to the rolling direction, strength of 580 MPa or more, elongation of more than 3%, electrical conductivity of 50% When the bending line width is set to 70 mm or more when the ratio R / t between the radius R and the plate thickness t is set to 0.5 and the direction of the line of bending is 90 degrees bending in a direction perpendicular to the rolling direction (i.e., And a bending working width when the bending line is subjected to close contact bending in a direction perpendicular to the rolling direction is 20 mm or more.

The copper alloy preferably contains 0.3 mass% or less (0 mass% or less) of one or more of Si, Zn, Sn, Co, Al, Cr, Mg, Mn, Ca, Pb, Ti and Zr in total ).

The surface coating layer may be formed on the surface of the copper alloy plate by plating or the like as needed, thereby improving the corrosion resistance. As the surface coating layer, one layer or a plurality of layers of a Sn layer, a Cu-Sn alloy layer, a Ni layer, or a Ni-Co layer is conceivable.

According to the present invention, it is possible to provide a copper alloy plate for a heat-dissipating component which has strength as a structural member, particularly strength against endurance against deformation and drop impact, bending workability for enduring a complicated shape, and high heat- . Further, when the surface coating layer is formed on the copper alloy plate, the corrosion resistance is improved, and the performance as a heat radiation member can be prevented from deteriorating even in a severe environment.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining a test method of a 90-degree bend test of the embodiment. Fig.

Hereinafter, the copper alloy for a heat dissipation component according to the present invention will be described in detail.

<Composition of copper alloy plate>

The composition of the copper alloy includes 0.1 to 1.0% by mass of Ni, 0.01 to 0.3% by mass of Fe and 0.03 to 0.2% by mass of P, and the balance of Cu and inevitable impurities. The copper alloy may contain, as necessary, one or more of Si, Zn, Sn, Co, Al, Cr, Mg, Mn, Ca, Pb, Ti and Zr in an amount of 0.3 mass% Mass%). This composition is consistent with the main part of the copper alloy composition described in Patent Document 1.

Ni precipitates an intermetallic compound with P, which will be described later, thereby increasing the strength of the copper alloy. If the Ni content is less than 0.1% by mass, desired strength can not be obtained because Ni-P compound is small. On the other hand, when the Ni content exceeds 1.0 mass%, a large amount of precipitated Ni-P compound is formed at the time of casting to deteriorate hot workability. Therefore, the Ni content is set to 0.1 to 1.0 mass%. The lower limit of the Ni content is preferably 0.3 mass%, more preferably 0.4 mass%, and the upper limit is preferably 0.9 mass%, more preferably 0.8 mass%.

Fe forms an intermetallic compound with Ni and P, thereby increasing the strength of the copper alloy. Further, the production of the crystallized product of the Ni-P compound is suppressed, and the hot workability is improved. If the Fe content is less than 0.01% by mass, the above effects are insufficient. On the other hand, if the Fe content exceeds 0.3% by mass, the precipitation of the Fe-P compound takes precedence, and the conductivity is lowered due to the influence of the solid Ni and Fe not forming a compound with P. Therefore, the Fe content is set to 0.01 to 0.3 mass%. The lower limit of the Fe content is preferably 0.05 mass%, more preferably 0.07 mass%, and the upper limit is preferably 0.2 mass%, more preferably 0.15 mass%.

P forms an intermetallic compound with Ni and Fe and precipitates on the parent phase of Cu to improve the strength. When the P content is less than 0.03 mass%, precipitation of the Ni-Fe-P compound is not sufficient, and desired strength can not be obtained. On the other hand, when the P content exceeds 0.2 mass%, a large amount of the Ni-P compound is crystallized and the hot workability deteriorates. Therefore, the P content is set to 0.03 to 0.2 mass%. The lower limit of the P content is preferably 0.06% by mass, more preferably 0.08% by mass, and the upper limit is preferably 0.17% by mass, and more preferably 0.15% by mass.

Si, Zn, Sn, Co, Al, Cr, Mg, Mn, Ca, Pb, Ti and Zr which are added as necessary as a subcomponent improve the strength of the copper alloy and improve the hot- There is also. However, when the total content of one or more subcomponents is more than 0.3% by mass, the strength of the copper alloy is improved but the conductivity and the thermal conductivity are lowered. Therefore, the total content of the subcomponent is 0.3 mass% or less (does not include 0 mass%).

<Properties of copper alloy plate>

The heat dissipating member is required to have strength as a structural member, particularly strength against deformation and falling impact. If the tensile strength of the copper alloy sheet in the rolling parallel direction is 580 MPa or more, the proof stress is 560 MPa or more, the tensile strength in the direction perpendicular to the rolling direction is 600 MPa or more, and the proof stress is 580 MPa or more, have. If the elongation in the rolling parallel direction of the copper alloy sheet is 6% or more and the elongation in the direction perpendicular to the rolling direction is 3% or more, there is a problem particularly in the molding workability in the case of forming the heat dissipating member from the copper alloy sheet by drawing or bending .

When a heat dissipating member is molded using a copper alloy sheet as a base material, generally, a copper alloy sheet requires excellent bending workability. The bending limit width of the copper alloy plate is 70 mm or more when the ratio R / t of the bending radius R to the plate thickness t is 0.5 and the direction of the bending line is the vertical direction of the bending, If the bending limit width in the case of performing close contact bending in the direction perpendicular to the rolling direction is 20 mm or more, there is no hindrance to the manufacture of the heat dissipation component. If the bending limit width of the copper alloy sheet does not reach the above value, cracking or fracture occurs in the bending portion in the process of manufacturing the heat-radiating component, making it difficult to form into a complicated shape.

In order to absorb heat generated from a semiconductor element or the like and dissipate it to the outside, it is preferable that the copper alloy plate for a heat radiation member has a conductivity of 50% IACS or more and a thermal conductivity of 220 W / mK or more. On the other hand, the thermal conductivity can be converted from the conductivity by the Wiedemann-Franz rule, and if the conductivity is 50% IACS or more, the thermal conductivity becomes 220 W / m · K or more.

&Lt; Production process of copper alloy plate >

The copper alloy sheet according to the present invention can be produced by a process of melt casting, homogenizing treatment, hot rolling, cold rolling, recrystallization annealing, cold rolling, aging annealing for a plurality of times, and cold rolling. On the other hand, this step is the same as the conventional manufacturing method (see Patent Document 1), except that aging annealing is repeated plural times.

In the homogenizing treatment, the ingot is heated at 900 to 1000 占 폚 for 0.5 to 5 hours, and hot rolling is started at that temperature. After the hot rolling, the ingot is quenched (preferably water-cooled) at a cooling rate of 20 占 폚 / Therefore, after both surfaces are ground, cold rolling is carried out at an appropriate processing rate.

Subsequently, the recrystallization annealing is performed in a temperature range of 650 to 775 캜 for 10 to 100 seconds. This recrystallization annealing is performed in order to improve elongation and bending workability of the copper alloy plate (product). If the temperature of the recrystallization annealing is less than 650 ° C or the holding time is less than 10 seconds, recrystallization becomes insufficient and the bending workability of the copper alloy plate (product) deteriorates. On the other hand, when the temperature of the recrystallization annealing exceeds 775 DEG C or the holding time exceeds 100 seconds, the recrystallized grains become coarser (coarsening with an average crystal grain size of 10 mu m or more) Is not obtained.

After the recrystallization annealing, cold rolling is carried out if necessary. When this cold rolling is carried out, the processing rate may be suitably set within a range of 75% or less so as to obtain a predetermined processing rate and a product plate thickness in a finish cold rolling to be described later.

Successively, the aging annealing is repeated a plurality of times. The conditions of the aging annealing are all preferably in the range of 350 to 450 DEG C for 1 to 10 hours. If the temperature of the aging treatment is less than 350 占 폚 or the holding time is less than 1 hour, the precipitation is insufficient and the conductivity of the copper alloy sheet (product) is not improved. On the other hand, if the temperature of the aging treatment exceeds 450 DEG C or the holding time exceeds 10 hours, the precipitate becomes coarse, and sufficient strength can not be obtained in the copper alloy plate (product). After each aging annealing, the copper alloy sheet material is cooled to room temperature. By repeating the aging annealing a plurality of times as a part of the manufacturing process, the structure (grain size and orientation, etc.) is made uniform and the bending workability is improved, and the bending working width limit of 90 degree bending and the working limit width of close bending are large The copper alloy sheet according to the present invention can be produced. On the other hand, conventionally, aging annealing has been performed only once (see Patent Document 1).

After the aging annealing, finish cold rolling is performed to the target plate thickness. The processing rate is set according to the target product strength.

After finishing cold rolling, short-time annealing is carried out if necessary. The conditions of this short-time annealing are set at 250 to 450 DEG C for 20 to 40 seconds. By performing the short-time annealing under this condition, the deformation introduced by the finishing cold rolling is removed. Further, under this condition, there is no softening of the material, so that the decrease in strength is small.

<Surface coating layer of copper alloy plate>

By forming the surface coating layer on the copper alloy plate by plating or the like, the corrosion resistance of the heat radiation member can be improved and the performance as a heat radiation member can be prevented from deteriorating even in a severe environment.

As the surface coating layer formed on the surface of the copper alloy sheet, a Sn layer is preferable. If the thickness of the Sn layer is less than 0.2 占 퐉, the improvement of the corrosion resistance is not sufficient, and if it exceeds 5 占 퐉, the productivity is lowered and the cost is increased. Therefore, the thickness of the Sn layer is set to 0.2 to 5 mu m. The Sn layer includes a Sn metal and a Sn alloy.

A Cu-Sn alloy layer can be formed below the Sn layer having a thickness of 0.2 to 5 m. If the thickness of the Cu-Sn alloy layer exceeds 3 탆, the bending workability is lowered, so that the thickness of the Cu-Sn alloy layer is 3 탆 or less. In this case, a Ni layer or a Ni-Co alloy layer can be further formed as a base layer below the Cu-Sn alloy layer. When the thickness of the Ni layer or the Ni-Co alloy layer exceeds 3 m, the bending workability is lowered, so that the thickness of the Ni layer or the Ni-Co alloy layer is 3 m or less.

As the surface coating layer, a Ni layer, a Ni-Co alloy layer, and a Cu-Sn alloy layer can be formed in this order. The thicknesses of the Ni layer, the Ni-Co alloy layer, and the Cu-Sn alloy layer are all 3 μm or less from the viewpoint of preventing the deterioration of the bending workability.

As the surface coating layer, any one layer of a Ni layer or a Ni-Co alloy layer can be formed. From the viewpoint of preventing the deterioration of the bending workability, these coating layers are all set to 3 μm or less.

Each of the coating layers may be formed by electroplating, reflow plating, electroless plating, sputtering or the like. The Cu-Sn alloy layer can be formed by performing Sn plating on a copper alloy base material or by performing copper plating and Sn plating on a copper alloy base material, followed by reflow treatment, etc., and reacting Cu with Sn (for example, Japanese Patent Laid-Open No. 2004-68026). The heating conditions for the reflow treatment are 230 to 600 ° C for 5 to 30 seconds.

Example

No. of Table 1 1 to 21 were melted and dissolved in an ingot with a thickness of 50 mm, a length of 80 mm and a width of 200 mm in the atmosphere by an electric furnace. Thereafter, the ingot was heated at 950 占 폚 for 1 hour, then hot-rolled to a thickness of 15 mm, immediately immersed in water and quenched. Next, the surface of the rolled material was ground to remove the oxide film, followed by cold rolling to a thickness of 1.0 mm. Subsequently, recrystallization annealing at 750 占 폚 for 60 seconds was performed. On the other hand, the average crystal grain size (measured by the cutting method defined by JIS H 0501) measured on the surface of the plate after the recrystallization annealing was less than 10 μm.

Subsequently, cold rolling was carried out at a machining rate of 40%. For 1 to 18, aging annealing was repeated twice. For ages 19 to 21, aging annealing was performed only once. No. 1 to 18, the first aging annealing was carried out under the conditions of 375 占 폚 for 5 hours, and after cooling to room temperature once, the second aging annealing was performed under the conditions of 425 占 폚 占 2 hours. No. The aging annealing of 19 to 21 was performed under conditions of 400 DEG C x 5 hours. Subsequently, the surface oxide was removed with a dilute sulfuric acid solution, and then subjected to finish cold rolling to a target plate thickness of 0.2 mm at a working rate of 67%.

After completion of the cold rolling, short-time annealing at 350 캜 for 30 seconds was carried out.

The mechanical properties, the electric conductivity and the bending limit width of the copper alloy tank (product plate) obtained in the above process, the commercially available stainless steel plate (SUS304) and the aluminum alloy (5052 (H38)) were measured with the following procedure. Further, the thermal conductivity was calculated from the conductivity by the Wiedemann-Franz rule. The results are shown in Table 2.

<Mechanical Properties>

From each disclosure material, a longitudinal direction is taken to JIS 5 test specimen parallel to and perpendicular to the rolling direction and, JIS Z subjected to a tensile test based on the regulations of 2241, a parallel direction (∥) in the rolling direction and the perpendicular direction (⊥ ) Were measured for tensile strength, proof stress and elongation.

<Conductivity>

The conductivity was measured based on the provisions of JIS H 0505.

&Lt; Bending limit width of 90 degree bending >

Four test pieces (three pieces for each width) having different lengths of 30 mm in length and 10 to 100 mm in width (widths of 10 mm, 15 mm, 20 mm, and 25 mm at intervals of 5 mm to 100 mm in width) were prepared. The direction of the side of the test piece 30 mm in length was parallel to the rolling direction of the specimen. Using this test piece, the V-shaped block 1 and the press fitting 2 shown in Fig. 1 were set in a hydraulic press, the ratio R / t of the bending radius R to the plate thickness t was set to 0.5, 1) in the direction of the width of the test piece 3 (Good Way bending) and bending at 90 degrees. The width of the V-shaped block 1 and the pressing metal 2 (thickness in the direction perpendicular to the paper surface of Fig. 1) was 120 mm. The load of the hydraulic press was set to 1000 kgf (9800 N) per 10 mm width of the test piece.

After the bending test, the entire length of the outer side of the bending portion of the test piece was observed with an optical microscope of 100 times, and the case where no crack was observed in one of the three test pieces was judged to be rejected. The maximum width of the passed test specimen was defined as the bending limit width of the specimen.

&Lt; Bending limit width of contact bending >

A test piece of a quadrangle shape having different widths of 30 mm in length and 5 to 50 mm in width (5 mm wide, 5 mm wide, 10 mm wide, 15 mm wide and 20 mm wide at intervals of 5 mm) was prepared from the specimen in the same manner as in the 90- Three per each). And the direction of the side of the test piece 30 mm in length was parallel to the rolling direction. Using this test piece, the ratio R / t of the bending radius R to the plate thickness t was set to 2.0, and the direction of the bent line was set in the width direction of the test piece (Good Way), to about 170 degrees in accordance with JIS Z 2248 After bending, close bending was performed.

After the bending test, the presence or absence of cracks in the bent portion was observed with an optical microscope of 100 times, and in the case where no cracks were observed at one portion in all three test pieces, the test was judged to be rejected. The maximum width of the passed test specimen was defined as the bending limit width of the specimen.

As shown in Tables 1 and 2, the alloy composition having the alloy composition defined in the present invention and having the composition obtained by repeatedly performing the aging annealing twice as a part of the manufacturing process was evaluated. The tensile strength, the proof stress, the elongation, the conductivity, the bending limit widths of 90 degree bending and the close bending satisfy the requirements of the present invention.

On the other hand, the alloy having no alloy composition specified in the present invention, No. 10 to 18, and No. 1 subjected to the aging annealing only once as a part of the manufacturing process. 19 to 21 do not satisfy at least one of the tensile strength, the proof stress, the elongation, the conductivity, the 90 degree bending, and the bending limit width of the close bending.

No. 10 had insufficient Ni content and had low strength.

No. 11 had excessive Ni content, and a large amount of Ni-P compound was formed, and cracking occurred during hot rolling, and subsequent steps could not be carried out.

No. 12 contained an insufficient amount of Fe, so that a large amount of Ni-P compound was formed, cracking occurred during hot rolling, and subsequent steps could not be carried out.

No. 13 has an excessive Fe content, and therefore has low conductivity and low thermal conductivity.

No. 14 contained excessive amounts of P, so that a large amount of Ni-P compounds were formed, cracking occurred during hot rolling, and subsequent steps could not be carried out.

No. 15 has insufficient P content and low strength.

No. 16 to 18 all have an excessive content of the subcomponent, so that the electric conductivity and the thermal conductivity are low, and the bending limit width is small.

No. 19 to 21 are conventional processes that have been subjected to aging annealing only once, so that the bending limit width is insufficient.

In addition, the commercially available stainless steel sheet No. 22 has a low electric conductivity and a low thermal conductivity, and is a commercially available aluminum alloy plate. 23 is low in strength and low in conductivity and thermal conductivity.

Next, as shown in Fig. Cu plating, Cu plating, Cu-Sn plating and Ni-Co alloy plating are applied to the surface of the copper alloy plate (product board) did. Table 3 shows the plating bath composition and plating condition of each plating, and Table 4 shows the thickness of each plating layer. On the other hand, in Table 4, No. 24 to 26, 29, 30 and 32 to 35 are those obtained by performing a reflow treatment after electroplating, and the thicknesses of the respective plating layers are those after the reflow treatment. No. The Cu-Sn layers 24 to 26, 29, 30 and 32 to 35 are formed by the reaction of Cu of Cu plating and Sn of Sn plating by a reflow treatment. On the other hand, this Cu plating was destroyed by the reflow treatment.

The thickness of each plating layer was measured in the following manner.

<Sn layer>

First, the total thickness of the Sn layer (the total thickness of the Sn layer including the Cu-Sn alloy layer) is measured using a fluorescent X-ray film thickness meter (Seiko Electronics Industry Co., Ltd., type SFT3200). Thereafter, the substrate was immersed in a peeling solution containing p-nitrophenol and caustic soda as a main component for 10 minutes, and the Sn layer was peeled off, and then the amount of Sn in the Cu-Sn alloy layer was measured using a fluorescent X-ray film thickness meter . The Sn layer thickness was calculated by subtracting the amount of Sn in the Cu-Sn alloy layer from the total thickness of the Sn layer thus obtained.

<Cu-Sn alloy layer>

p-nitrophenol, and caustic soda for 10 minutes. After peeling off the Sn layer, the amount of Sn in the Cu-Sn alloy layer is measured using a fluorescent X-ray film thickness meter. The thickness of the Cu-Sn alloy layer is the Sn-converted thickness.

<Ni layer, Co layer, Ni-Co alloy layer>

The thicknesses of the Ni layer, the Co layer and the Ni-Co alloy layer were measured using a fluorescent X-ray film thickness meter.

No. Test specimens were prepared from the respective specimens 24 to 36, and the corrosion resistance and the bending workability were measured in the following manner.

<Corrosion resistance>

The corrosion resistance was evaluated by a salt spray test. (Manufactured by Wako Pure Chemical Industries, Ltd.) containing 5% by mass of NaCl was used, and the test conditions were as follows: test temperature: 35 占 폚 占 1 占 폚, spray solution pH: 6.5 to 7.2 and spray pressure: 0.07 to 0.17 MPa (0.098 占 .01 MPa), sprayed for 72 hours, and then washed with water and dried. Subsequently, the surface of the test piece was observed with a stereoscopic microscope to observe whether or not there was corrosion (base material corrosion and spot corrosion on the surface of the plating).

&Lt; Evaluation of bending workability of plating &

Four test pieces (three pieces for each width) having a length of 30 mm and a width of 20 mm were prepared from the blank. The direction of the side of the test piece 30 mm in length was parallel to the rolling direction of the blank (base material). Using this test piece, the V-shaped block 1 and the press fitting 2 shown in Fig. 1 were set in a hydraulic press, and the ratio R / t of the bending radius R to the plate thickness t was set to 2.0, and the direction of the bent line 90 degrees bending was performed in a direction perpendicular to the rolling direction of the base material. The load of the hydraulic press was set to 1000 kgf (9800 N) per 10 mm width of the test piece.

After the bending test, the entire length of the outer side of the bending portion of the test piece was observed with an optical microscope at a magnification of 100, and no crack was observed in any one of the three test pieces, and no crack was observed in any of the three test pieces. .

As shown in Table 4, the plating composition and the thickness of each plating layer specified in the present invention were measured. 24 to 33, no corrosion of the base material was observed in the salt spray test, and cracking did not occur in the bending workability test. On the other hand, the Ni layer or the Ni-Co alloy layer is not formed. 26, and No. 5, in which the Sn layer was not remained and the Cu-Sn alloy layer was exposed on the surface. 30 showed no erosion of the base material, but spot erosion (phenomenon that the surface of the coating layer was corroded) was observed.

On the other hand, when the thickness of the plating layer is outside the range of the present invention, 34 to 36 showed corrosion of the base material in the salt spray test or cracking in the plating in the bending workability test.

No. 34, the thickness of the Sn layer was thin, and corrosion of the base material occurred.

No. 35, and 36, the thickness of the Cu-Sn alloy layer or the Ni layer was thick, and cracking occurred in the plating in the bending test.

The disclosure of the present specification includes the following aspects.

Sun 1:

And a balance of Cu and inevitable impurities, wherein the tensile strength in the rolling parallel direction is at least 580 MPa, the proof stress is at least 560 MPa , The elongation is 6% or more, the tensile strength in the direction perpendicular to the rolling direction is 600 MPa or more, the proof strength is 580 MPa or more, the elongation is 3% or more, the conductivity is 50% IACS or more and the ratio R / t of the bending radius R to the plate thickness t 0.5, and the bending limit width when the 90 degree bend was performed in which the direction of the line of bending was set to the vertical direction of rolling was 70 mm or more, and the bending limit width when the bending line direction was the rolling vertical direction was 20 mm Or more of the copper alloy sheet for heat dissipation parts.

Sun 2:

(Including 0 mass% or less) of one or more of Si, Zn, Sn, Co, Al, Cr, Mg, Mn, Ca, Pb, Ti and Zr in total The copper alloy sheet for a heat-dissipating component according to the first aspect of the present invention.

Sun 3:

A copper alloy plate for a heat dissipation component according to one of claims 1 to 3, characterized in that the aging annealing is repeated a plurality of times as a part of the manufacturing process.

Sun 4:

A copper alloy plate for a heat-dissipating component according to any one of claims 1 to 3, wherein a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface.

Sun 5:

A copper alloy plate for a heat dissipation component according to any one of the first to third aspects, wherein a Cu-Sn alloy layer having a thickness of 3 μm or less and a Sn layer having a thickness of 0.2 to 5 μm are formed on the surface in this order.

Sun 6:

Wherein a Ni layer or a Ni-Co alloy layer of 3 mu m or less in thickness, a Cu-Sn alloy layer of 3 mu m or less in thickness, and a Sn layer of 0.2 to 5 mu m in thickness are formed on the surface in this order The copper alloy plate for a heat dissipating component described in one of

Sun 7:

A copper alloy for a heat dissipation component according to any one of the first to third aspects, wherein a Ni layer or a Ni-Co alloy layer with a thickness of 3 탆 or less and a Cu-Sn alloy layer with a thickness of 3 탆 or less are formed on the surface in this order plate.

Sun 8:

The copper alloy plate for a heat-dissipating component according to any one of the first to third aspects, wherein a single layer of a Ni layer or a Ni-Co alloy layer having a thickness of 3 탆 or less is formed on the surface.

Sun 9:

A heat-dissipating component produced by processing a copper alloy plate for a heat-dissipating component according to any one of the first to eighth aspects.

The present application is accompanied by a priority claim based on Japanese Patent Application No. 2015-068589 filed on March 30, 2015 as the filing date. Mentionee &lt; RTI ID = 0.0 &gt; 2015-068589 &lt; / RTI &gt;

1: V-shaped block
2:

Claims (25)

And a balance of Cu and inevitable impurities, wherein the tensile strength in the rolling parallel direction is at least 580 MPa, the proof stress is at least 560 MPa , The elongation is 6% or more, the tensile strength in the direction perpendicular to the rolling direction is 600 MPa or more, the proof strength is 580 MPa or more, the elongation is 3% or more, the conductivity is 50% IACS or more and the ratio R / t of the bending radius R to the plate thickness t 0.5, and the bending limit width when the 90 degree bend was performed in which the direction of the line of bending was set to the vertical direction of rolling was 70 mm or more, and the bending limit width when the bending line direction was the rolling vertical direction was 20 mm Or more of the copper alloy sheet for heat dissipation parts. The method according to claim 1,
(Including 0 mass% or less) of one or more of Si, Zn, Sn, Co, Al, Cr, Mg, Mn, Ca, Pb, Ti and Zr in total Wherein the copper alloy plate for a heat dissipation component is a copper alloy plate for a heat dissipation component. The method according to claim 1,
Characterized in that the aging annealing is repeated a plurality of times as a part of the manufacturing process. 3. The method of claim 2,
Characterized in that the aging annealing is repeated a plurality of times as a part of the manufacturing process. The method according to claim 1,
And a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface of the copper alloy plate. 3. The method of claim 2,
And a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface of the copper alloy plate. The method of claim 3,
And a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface of the copper alloy plate. 5. The method of claim 4,
And a Sn layer having a thickness of 0.2 to 5 占 퐉 is formed on the surface of the copper alloy plate. The method according to claim 1,
Wherein a copper-Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0.2 to 5 占 퐉 are formed on the surface in this order. 3. The method of claim 2,
Wherein a copper-Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0.2 to 5 占 퐉 are formed on the surface in this order. The method of claim 3,
Wherein a copper-Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0.2 to 5 占 퐉 are formed on the surface in this order. 5. The method of claim 4,
Wherein a copper-Sn alloy layer having a thickness of 3 占 퐉 or less and a Sn layer having a thickness of 0.2 to 5 占 퐉 are formed on the surface in this order. The method according to claim 1,
A Ni alloy layer, a Ni-Co alloy layer, a Cu-Sn alloy layer with a thickness of 3 탆 or less, and a Sn layer with a thickness of 0.2 to 5 탆 in a thickness of 3 탆 or less are formed on the surface in this order. . 3. The method of claim 2,
A Ni alloy layer, a Ni-Co alloy layer, a Cu-Sn alloy layer with a thickness of 3 탆 or less, and a Sn layer with a thickness of 0.2 to 5 탆 in a thickness of 3 탆 or less are formed on the surface in this order. . The method of claim 3,
A Ni alloy layer, a Ni-Co alloy layer, a Cu-Sn alloy layer with a thickness of 3 탆 or less, and a Sn layer with a thickness of 0.2 to 5 탆 in a thickness of 3 탆 or less are formed on the surface in this order. . 5. The method of claim 4,
A Ni alloy layer, a Ni-Co alloy layer, a Cu-Sn alloy layer with a thickness of 3 탆 or less, and a Sn layer with a thickness of 0.2 to 5 탆 in a thickness of 3 탆 or less are formed on the surface in this order. . The method according to claim 1,
Wherein a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less and a Cu-Sn alloy layer having a thickness of 3 占 퐉 or less are formed on the surface in this order. 3. The method of claim 2,
Wherein a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less and a Cu-Sn alloy layer having a thickness of 3 占 퐉 or less are formed on the surface in this order. The method of claim 3,
Wherein a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less and a Cu-Sn alloy layer having a thickness of 3 占 퐉 or less are formed on the surface in this order. 5. The method of claim 4,
Wherein a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less and a Cu-Sn alloy layer having a thickness of 3 占 퐉 or less are formed on the surface in this order. The method according to claim 1,
Wherein one layer of a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less is formed on the surface of the copper alloy plate. 3. The method of claim 2,
Wherein one layer of a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less is formed on the surface of the copper alloy plate. The method of claim 3,
Wherein one layer of a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less is formed on the surface of the copper alloy plate. 5. The method of claim 4,
Wherein one layer of a Ni layer or a Ni-Co alloy layer having a thickness of 3 占 퐉 or less is formed on the surface of the copper alloy plate. A heat-dissipating component produced by processing the copper alloy plate for a heat-dissipating component according to any one of claims 1 to 24.

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