KR20170104000A - 중첩 장치 및 중첩 방법 - Google Patents

중첩 장치 및 중첩 방법 Download PDF

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Publication number
KR20170104000A
KR20170104000A KR1020177024566A KR20177024566A KR20170104000A KR 20170104000 A KR20170104000 A KR 20170104000A KR 1020177024566 A KR1020177024566 A KR 1020177024566A KR 20177024566 A KR20177024566 A KR 20177024566A KR 20170104000 A KR20170104000 A KR 20170104000A
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KR
South Korea
Prior art keywords
substrate
support plate
support
temporary fixing
supporting
Prior art date
Application number
KR1020177024566A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 이나오
시게루 가토
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR20170104000A publication Critical patent/KR20170104000A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020177024566A 2012-05-18 2013-04-26 중첩 장치 및 중첩 방법 KR20170104000A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012115058A JP5990037B2 (ja) 2012-05-18 2012-05-18 重ね合わせ装置および重ね合わせ方法
JPJP-P-2012-115058 2012-05-18
PCT/JP2013/062381 WO2013172184A1 (ja) 2012-05-18 2013-04-26 重ね合わせ装置および重ね合わせ方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147034109A Division KR101821853B1 (ko) 2012-05-18 2013-04-26 중첩 장치 및 중첩 방법

Publications (1)

Publication Number Publication Date
KR20170104000A true KR20170104000A (ko) 2017-09-13

Family

ID=49583593

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177024566A KR20170104000A (ko) 2012-05-18 2013-04-26 중첩 장치 및 중첩 방법
KR1020147034109A KR101821853B1 (ko) 2012-05-18 2013-04-26 중첩 장치 및 중첩 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147034109A KR101821853B1 (ko) 2012-05-18 2013-04-26 중첩 장치 및 중첩 방법

Country Status (4)

Country Link
JP (1) JP5990037B2 (zh)
KR (2) KR20170104000A (zh)
TW (1) TWI567782B (zh)
WO (1) WO2013172184A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6374680B2 (ja) * 2013-12-13 2018-08-15 東京応化工業株式会社 貼付方法
DE112014006648A5 (de) * 2014-06-26 2017-01-26 Ev Group E. Thallner Gmbh Verfahren zum Bonden von Substraten mit Verteilen eines Verbindungsmaterials durch annähern der Substrate
JP6412786B2 (ja) 2014-12-03 2018-10-24 東京応化工業株式会社 搬送方法
JP6842934B2 (ja) * 2017-01-27 2021-03-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、検出位置較正方法および基板処理装置
JP2023145908A (ja) * 2022-03-29 2023-10-12 Ａｉメカテック株式会社 基板貼り合わせ装置及び基板貼り合わせ方法
JP2024000688A (ja) 2022-06-21 2024-01-09 Ａｉメカテック株式会社 アライメント装置、基板重ね合わせ装置、及びアライメント方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3900249B2 (ja) * 2001-09-28 2007-04-04 セイコーエプソン株式会社 配線基板の接続方法、電気光学装置及びその製造方法並びに電子機器
JP2004207436A (ja) 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
JP2012054416A (ja) * 2010-09-01 2012-03-15 Nikon Corp 押圧装置、貼り合わせ装置、貼り合わせ方法、及び、積層半導体装置の製造方法
JP6014302B2 (ja) * 2010-09-06 2016-10-25 東京応化工業株式会社 貼り合わせ装置および貼り合わせ方法
JP2012079807A (ja) 2010-09-30 2012-04-19 Hitachi Cable Film Device Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
TW201413777A (zh) 2014-04-01
JP5990037B2 (ja) 2016-09-07
KR101821853B1 (ko) 2018-01-24
KR20150013696A (ko) 2015-02-05
TWI567782B (zh) 2017-01-21
WO2013172184A1 (ja) 2013-11-21
JP2013243226A (ja) 2013-12-05

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