KR20170095594A - 레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치 - Google Patents

레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치 Download PDF

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Publication number
KR20170095594A
KR20170095594A KR1020160017193A KR20160017193A KR20170095594A KR 20170095594 A KR20170095594 A KR 20170095594A KR 1020160017193 A KR1020160017193 A KR 1020160017193A KR 20160017193 A KR20160017193 A KR 20160017193A KR 20170095594 A KR20170095594 A KR 20170095594A
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KR
South Korea
Prior art keywords
laser beam
metal material
laser
cutting
oil
Prior art date
Application number
KR1020160017193A
Other languages
English (en)
Korean (ko)
Inventor
정대호
신준엽
Original Assignee
주식회사 이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020160017193A priority Critical patent/KR20170095594A/ko
Priority to PCT/KR2016/009770 priority patent/WO2017142149A1/ko
Priority to TW105130092A priority patent/TWI598173B/zh
Publication of KR20170095594A publication Critical patent/KR20170095594A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020160017193A 2016-02-15 2016-02-15 레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치 KR20170095594A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160017193A KR20170095594A (ko) 2016-02-15 2016-02-15 레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치
PCT/KR2016/009770 WO2017142149A1 (ko) 2016-02-15 2016-09-01 레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치
TW105130092A TWI598173B (zh) 2016-02-15 2016-09-19 雷射去毛刺方法、雷射加工方法及雷射加工裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160017193A KR20170095594A (ko) 2016-02-15 2016-02-15 레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치

Publications (1)

Publication Number Publication Date
KR20170095594A true KR20170095594A (ko) 2017-08-23

Family

ID=59625281

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160017193A KR20170095594A (ko) 2016-02-15 2016-02-15 레이저 디플래쉬 방법과, 이를 이용한 레이저 가공 방법 및 장치

Country Status (3)

Country Link
KR (1) KR20170095594A (zh)
TW (1) TWI598173B (zh)
WO (1) WO2017142149A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112404745A (zh) * 2020-11-02 2021-02-26 中国航空工业集团公司北京长城航空测控技术研究所 一种薄片晶体器件切割面的超快激光平整方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11151590A (ja) * 1997-11-17 1999-06-08 Tanaka Seisakusho Kk レーザ切断装置
JP4162772B2 (ja) * 1998-09-09 2008-10-08 日酸Ｔａｎａｋａ株式会社 レーザピアシング方法およびレーザ切断装置
US6806441B2 (en) * 2001-09-24 2004-10-19 Polyneer, Inc. Process for laser-cutting parts and removing flashing
JP4562995B2 (ja) * 2003-04-22 2010-10-13 三菱電機株式会社 レーザピアシング加工方法、レーザ切断加工物の生産方法及びレーザ加工機
US7977602B2 (en) * 2007-03-21 2011-07-12 Photon Dynamics, Inc. Laser ablation using multiple wavelengths

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112404745A (zh) * 2020-11-02 2021-02-26 中国航空工业集团公司北京长城航空测控技术研究所 一种薄片晶体器件切割面的超快激光平整方法

Also Published As

Publication number Publication date
TW201729934A (zh) 2017-09-01
TWI598173B (zh) 2017-09-11
WO2017142149A1 (ko) 2017-08-24

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