KR20170071610A - 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 - Google Patents

금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 Download PDF

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KR20170071610A
KR20170071610A KR1020177016027A KR20177016027A KR20170071610A KR 20170071610 A KR20170071610 A KR 20170071610A KR 1020177016027 A KR1020177016027 A KR 1020177016027A KR 20177016027 A KR20177016027 A KR 20177016027A KR 20170071610 A KR20170071610 A KR 20170071610A
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South Korea
Prior art keywords
metal plate
deposition mask
elongation percentage
width direction
manufacturing
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KR1020177016027A
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English (en)
Korean (ko)
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치카오 이케나가
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다이니폰 인사츠 가부시키가이샤
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Publication of KR20170071610A publication Critical patent/KR20170071610A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26—Methods of annealing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C23F1/04—Chemical milling
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020177016027A 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 KR20170071610A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2013-002923 2013-01-10
JP2013002923 2013-01-10
JPJP-P-2013-162712 2013-08-05
JP2013162712A JP5382259B1 (ja) 2013-01-10 2013-08-05 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
PCT/JP2014/050345 WO2014109393A1 (ja) 2013-01-10 2014-01-10 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法

Related Parent Applications (1)

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KR1020157009819A Division KR101749435B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197029100A Division KR20190116559A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Publications (1)

Publication Number Publication Date
KR20170071610A true KR20170071610A (ko) 2017-06-23

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ID=50036550

Family Applications (6)

Application Number Title Priority Date Filing Date
KR1020157009819A KR101749435B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020177016027A KR20170071610A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020217028724A KR20210112419A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020197029100A KR20190116559A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020217028725A KR20210112420A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020227044685A KR20230007527A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Family Applications Before (1)

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KR1020157009819A KR101749435B1 (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Family Applications After (4)

Application Number Title Priority Date Filing Date
KR1020217028724A KR20210112419A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020197029100A KR20190116559A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020217028725A KR20210112420A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법
KR1020227044685A KR20230007527A (ko) 2013-01-10 2014-01-10 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법

Country Status (4)

Country Link
JP (1) JP5382259B1 (ja)
KR (6) KR101749435B1 (ja)
CN (4) CN110306155B (ja)
WO (1) WO2014109393A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190041982A (ko) * 2017-10-13 2019-04-23 도판 인사츠 가부시키가이샤 증착 마스크용 기재, 증착 마스크용 기재의 제조 방법, 증착 마스크의 제조 방법, 및 표시 장치의 제조 방법
KR20210123293A (ko) * 2019-01-31 2021-10-13 다이니폰 인사츠 가부시키가이샤 증착 마스크군, 전자 디바이스의 제조 방법 및 전자 디바이스

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JP5516816B1 (ja) 2013-10-15 2014-06-11 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP6698265B2 (ja) * 2014-02-14 2020-05-27 大日本印刷株式会社 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体
JP5641462B1 (ja) * 2014-05-13 2014-12-17 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法
DE202016008840U1 (de) 2015-02-10 2020-02-11 Dai Nippon Printing Co., Ltd. Metallblech
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JP6701543B2 (ja) * 2015-07-10 2020-05-27 大日本印刷株式会社 蒸着マスクおよび蒸着マスクの製造方法
DE112016003224T5 (de) 2015-07-17 2018-04-19 Toppan Printing Co., Ltd. Metallmaskensubstrat für dampfabscheidung, metallmaske für dampfabscheidung, herstellungsverfahren für metallmaskensubstrat für dampfabscheidung und herstellungsverfahren für metallmaske für dampfabscheidung
CN113403574A (zh) 2015-07-17 2021-09-17 凸版印刷株式会社 金属掩模用基材及其制造方法、蒸镀用金属掩模及其制造方法
CN107849681A (zh) 2015-07-17 2018-03-27 凸版印刷株式会社 金属掩模基材、金属掩模、以及金属掩模的制造方法
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KR102477941B1 (ko) 2015-09-30 2022-12-16 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크의 제조 방법 및 금속판
US10541387B2 (en) 2015-09-30 2020-01-21 Dai Nippon Printing Co., Ltd. Deposition mask, method of manufacturing deposition mask and metal plate
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CN110144547B (zh) * 2016-04-14 2021-06-01 凸版印刷株式会社 蒸镀掩模用基材、蒸镀掩模用基材的制造方法及蒸镀掩模的制造方法
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KR102333411B1 (ko) * 2017-01-10 2021-12-02 다이니폰 인사츠 가부시키가이샤 증착 마스크, 증착 마스크 장치의 제조 방법 및 증착 마스크의 제조 방법
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