KR20170052209A - Optical plate, lighting device, and lighting module - Google Patents

Abstract

According to the present invention, a light emitting device includes: a body having a concave part; multiple lead frames arranged in the concave part of the body; a light emitting chip which is placed on one or more of the lead frames; a molding member arranged in the concave part; and an optical plate which is spaced apart from the light emitting chip while being in the concave part. The concave part includes: a first side wall which is tilted and adjacent to the lead frames; and a second side wall which is arranged between the first side wall and the upper surface of the body. The second side wall of the concave part is arranged on the exterior of the optical plate. The optical plate includes: a phosphor layer; and a transparent film arranged on at least one of the upper and lower surfaces of the phosphor layer.

Description

[0001] OPTICAL PLATE, LIGHT EMITTING DEVICE, AND LIGHT SOURCE MODULE [0002] OPTICAL PLATE, LIGHTING DEVICE, AND LIGHTING MODULE [

An embodiment relates to an optical plate.

Embodiments relate to a light emitting device having an optical plate, an illumination device, and a light source module having the same.

BACKGROUND ART Light emitting devices, for example, light emitting diodes (LEDs) are a kind of semiconductor devices that convert electrical energy into light, and have been attracting attention as a next generation light source in place of conventional fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor device, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten or a fluorescent lamp that generates ultraviolet rays generated by high-pressure discharge .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode. The light emitting diode has been increasingly used as a light source for various lamps used in indoor and outdoor, lighting devices such as a liquid crystal display, have.

The embodiment provides an optical plate for wavelength-converting light incident at a position spaced apart from a light source.

The embodiment can provide, on a light source, an optical plate having a phosphor layer and a transparent film on at least one or both of an incident surface and an emission surface of the phosphor layer.

An embodiment provides an illumination device having a light emitting element and an optical plate.

Embodiments provide an illumination device that blocks light leaking through an area between a light emitting device and an optical plate.

An embodiment provides a light emitting device having an optical plate.

Embodiments provide an optical plate for diffusing and wavelength-converting incident light onto a light-emitting element and an illumination element having the optical plate.

A light emitting device according to an embodiment includes: a body having a concave portion; A plurality of lead frames disposed in the concave portion of the body; A light emitting chip on at least one of the plurality of lead frames; A molding member disposed in the recess; And an optical plate spaced from the light emitting chip in the recess, the recess including a first sidewall adjacent the leadframe and a second sidewall disposed between an upper surface of the body and the first sidewall And a second side wall of the concave portion is disposed outside the optical plate, wherein the optical plate includes a phosphor layer and a transparent film disposed on at least one of an upper surface and a lower surface of the phosphor layer.

The light source module according to the embodiment includes the optical plate or the illumination element.

Embodiments can increase the lifetime of the phosphor in the optical plate by allowing the optical plate to be spaced from the light emitting chip.

The embodiment can wavelength-convert and diffuse the light incident by the optical plate spaced from the light emitting chip.

Embodiments can block light leaking through a region between the light emitting device and the optical plate, thereby improving light extraction efficiency through the optical plate.

In the embodiment, by arranging the optical plate so as to be spaced apart from the light source in the concave portion of the light emitting element, it is possible to miniaturize the illumination element that emits various colors.

Embodiments can prevent a hot spot by disposing a semi-transmissive mirror in a region where a light amount incident from the light emitting chip is large in a region of the optical plate.

Embodiments can improve the reliability of the light emitting device and the lighting device having the same.

The embodiment can improve the reliability of the lighting apparatus in which the lighting elements are arranged.

1 is a perspective view of a lighting device according to a first embodiment.
2 is a plan view showing an example of a light emitting device of the illumination device of FIG.
3 is a side cross-sectional view of the light emitting device of Fig.
4 is another cross-sectional side view of the light emitting device of Fig.
Fig. 5 is an exploded perspective view of the optical plate of the illumination device of Fig. 1;
Fig. 6 is a bottom view of the optical plate of the illumination device of Fig. 1;
7 is an assembled perspective view of the illumination device of Fig.
8 is a cross-sectional view of the illumination device of Fig. 7 on the AA side.
Fig. 9 is a view for explaining the illuminating element of Fig. 8;
10 is a sectional view of the illumination device of Fig. 7 on the BB side.
11 is another example of an optical plate in the illuminating element of Fig.
12 is a view showing an illumination device according to the second embodiment.
13 is another cross-sectional view of the illumination device of Fig.
14 is a view showing a lighting device according to the third embodiment.
Fig. 15 is a view showing a lighting device according to the fourth embodiment.
16 is a side sectional view showing a light emitting device having an optical plate as a fifth embodiment.
17 is another side view of the light emitting element of Fig.
Fig. 18 is a first modification of the optical plate in the light emitting device of Fig. 16;
Fig. 19 is a second modification of the optical plate in the light emitting device of Fig. 16;
20 is a third modification of the optical plate in the light emitting device of Fig.
Fig. 21 is a fourth modification of the optical plate in the light emitting device of Fig. 16;
22 is a fifth modification of the optical plate in the light emitting device of Fig.
Figs. 23A and 23B are bottom views of the optical plate of Fig. 22. Fig.
Fig. 24 is a sixth modification of the light emitting device having the optical plate of Fig. 16;
25 (A) and (B) show an example of a bottom view of the optical plate of FIG.
26 is a seventh modification of the optical plate in the light emitting device of Fig.
Fig. 27 is a eighth modification of the optical plate in the light emitting device of Fig. 26;
28 is a side sectional view of a light emitting device having an optical plate as a sixth embodiment.
29 is a side sectional view of a light emitting device having an optical plate as a seventh embodiment.
30 is a side sectional view of a light emitting device having an optical plate as an eighth embodiment.
31 is an example of an illumination device in which a semi-transmission mirror is disposed on a light-emitting device according to the embodiment.
32 is another example of an illumination device in which a transflective mirror is disposed on a light emitting device according to the embodiment.
33 is a perspective view showing a display device having an illumination device according to an embodiment.
34 is a perspective view showing a display device having an illumination device according to an embodiment.
35 is an exploded perspective view showing a lighting apparatus having a lighting device according to an embodiment.

In the description of the embodiments, each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, Quot; on "and" under "include both being formed" directly "or" indirectly " . In addition, the upper or lower reference of each component is described with reference to the drawings.

Hereinafter, an illumination device according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of a lighting device according to a first embodiment, FIG. 2 is a plan view showing an example of a light emitting device of the lighting device of FIG. 1, FIG. 3 is a side sectional view of the light emitting device of FIG. FIG. 5 is an exploded perspective view of the optical plate of the illumination device of FIG. 1, FIG. 6 is a bottom view of the optical plate of the illumination device of FIG. 1, and FIG. 9 is a cross-sectional view of the illumination device of FIG. 7, FIG. 9 is a view illustrating the illumination device of FIG. 8, and FIG. 10 is a cross-sectional view of the BB of the illumination device of FIG. 7 .

1 to 10, an illumination device 101 includes a light emitting device 100 that emits light, and an optical plate 300 that is disposed on the light emitting device 100 and diffuses and wavelength-converts the incident light to emit the light. ).

The light emitting device 100 may emit at least one of ultraviolet light, blue light, green light, and red light, and may emit light having a short wavelength such as ultraviolet light or blue light. The light emitting device 100 may emit different peak wavelengths, for example, emit blue and green light, or emit ultraviolet and visible light, but the present invention is not limited thereto.

The optical plate 300 may be disposed on the light emitting device 100 and may include a phosphor. The optical plate 300 wavelength-converts the light emitted from the light emitting device 100 and emits the light. The optical plate 300 may have a polygonal top view shape, an elliptical shape, or an elliptical shape having a straight line section. The optical plate 300 faces the upper surface of the light emitting device 100 and may be spaced apart from the light sources in the light emitting device 100, for example, the light emitting chips 171 and 172. Therefore, the phosphor in the optical plate 300 can be less affected by the heat generated from the light emitting chips 171 and 172.

2 to 4, the light emitting device 100 includes a body 110 having a concave portion 160, a plurality of lead frames 121 and 131 in the concave portion 160, And at least one light emitting chip (171, 172).

The body 110 may include an insulating material or a conductive material. The body 110 may include at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al ₂ O ₃ ), a printed circuit board Can be formed. For example, the body 110 may be made of a resin material such as polyphthalamide (PPA), epoxy, or silicone. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the epoxy or silicon material used as the body 110 to enhance the reflection efficiency. The body 110 may include a ceramic material. As another example, the body 110 may include a circuit board, and may include at least one of a resin substrate, a metal core PCB, and a ceramic substrate. The body 110 may be formed of a dark color or a black color to enhance contrast, but the present invention is not limited thereto.

The body 110 includes a recess 160 having a predetermined depth. The recess 160 may be formed in the form of a concave cup structure, a cavity structure, or a recess structure from the top surface 15 of the body 110, but the present invention is not limited thereto. The sidewalls of the recess 160 may be perpendicular or inclined relative to the bottom, and two or more of the sidewalls may be inclined at the same angle or at different angles. A reflective layer of another material may be further disposed on the surface of the concave portion 160, but the present invention is not limited thereto. The side walls of the recess 160 may have different angles from the upper sidewall adjacent to the upper surface 15 of the body 110 and the lower sidewall adjacent to the lead frames 21 and 31. However, the present invention is not limited thereto.

The shape of the body 110 may be a polygonal shape such as a triangle, a rectangle, or a pentagon, a shape having a circular shape, an elliptical shape, a curved shape, or a polygonal shape having a curved corner, Do not.

The body 110 may include a plurality of side portions, for example, four side portions 11, 12, 13, and 14 as outer side surfaces. At least one or two or more of the plurality of side portions 11, 12, 13, and 14 may be formed as a surface that is perpendicular or inclined with respect to the lower surface of the body 110. The first side surface portion 11 and the second side surface portion 12 are opposite to each other, and the third side surface portion 11, the second side surface portion 12, (13) and the fourth side surface portion (14) are opposite to each other. The length Y1 of each of the first side surface portion 11 and the second side surface portion 12 may be different from the width X1 of the third side surface portion 13 and the fourth side surface portion 14, 11 and the second side surface portion 12 may be shorter than the maximum length Y2 of the light emitting device 100 and the width X1 of the third side surface portion 13 and the fourth side surface portion 14 As shown in FIG.

The length Y1 of the first side surface portion 11 or the second side surface portion 12 may be the interval between the third side surface portion 13 and the fourth side surface portion 14, The longitudinal direction of the body 110 is orthogonal to the width direction. 2 and 3, the length Y4 of the upper surface of the body 110 is larger than the upper width Y3 of the recess 160 and the length Y1, that is, shorter than the bottom length of the body 110 .

The length Y2 of the light emitting device 100 may be two times or more, for example, three times longer than the width X1. In the light emitting device 100, a plurality of light emitting chips 171 and 172 may be arranged in the longitudinal direction.

In the light emitting device 100, a plurality of light emitting chips 171 and 172 may be arranged at predetermined intervals in the longitudinal direction. In the light emitting device 100, the light emitting chips 171 and 172 may be disposed on the respective lead frames 121 and 131 on the heat radiation side, or a plurality of light emitting chips may be disposed on one lead frame. Further, by arranging the length of the light emitting element 100 longer than the width, the heat radiation efficiency of each of the light emitting chips 171 and 172 can be improved, the size of the light emitting chips 171 and 172 can be increased, can do.

A plurality of lead frames 121 and 131 are disposed in the concave portion 160 of the body 110. The plurality of lead frames 121 and 131 include at least two or three or more metal frames, and may include first and second lead frames 121 and 131, for example. The first and second lead frames 121 and 131 may be separated by a gap portion 119.

One or a plurality of light emitting chips 171 and 172 may be disposed in the recess 160. The plurality of light emitting chips 171 and 172 may include at least two or three or more LED chips, and may include first and second light emitting chips 171 and 172, for example. One or a plurality of light emitting chips 171 and 172 may be disposed on at least one of the plurality of lead frames 121 and 131. For example, at least one light emitting chip 171 and 172 may be disposed on each of the plurality of lead frames 121 and 131 . The plurality of light emitting chips 171 and 172 may be selectively connected to the plurality of lead frames 121 and 131. Each of the light emitting chips 171 and 172 may be defined as a light source.

At least one of the plurality of lead frames 121 and 131 may include a cavity having a lower depth than the bottom of the recess 160. The first lead frame 121 includes a first cavity 125 and the first cavity 125 is recessed to a lower depth than the bottom of the cavity 160. The first cavity 125 may have a concave shape such as a cup shape or a recess shape from the bottom of the concave portion 160 in the bottom direction of the body 110. The first cavity 125 may be formed by bending or etching the first lead frame 121, but the present invention is not limited thereto.

The sidewall and bottom of the first cavity 125 are formed by the first lead frame 121 and the peripheral sidewall of the first cavity 125 may be formed to be inclined from the bottom of the first cavity 125 have. Two opposing sidewalls of the sidewalls of the first cavity 125 may be inclined at the same angle or inclined at different angles. The frame thickness of the side wall and the bottom of the first cavity 125 may be the same as the thickness of the first lead frame 121.

The second lead frame 131 includes a second cavity 135 and the second cavity 135 is recessed to a lower depth than the bottom of the cavity 160. The second cavity 135 may have a concave shape such as a cup structure or a recess in the bottom surface of the body 110 from the top surface of the second lead frame 131 or the bottom of the concave portion 160, and a recess shape. The second cavity 135 may be formed by bending or etching the second lead frame 131, but the present invention is not limited thereto. The bottom and sidewalls of the second cavity 135 may be formed by the second lead frame 131 and the sidewalls of the second cavity 135 may be formed obliquely from the bottom of the second cavity 135 . The corresponding two sidewalls of the sidewalls of the second cavity 135 may be inclined at the same angle or inclined at different angles. The frame thickness of the side wall and the bottom of the second cavity 135 may be the same as the thickness of the second lead frame 131.

The bottom shapes of the first cavity 125 and the second cavity 135 may be polygonal, polygonal having a partial curved surface, circular or elliptical, but are not limited thereto.

A lower surface of the first lead frame 121 and the second lead frame 131 may be exposed to the lower portion of the body 110 and may be disposed on the same plane as the lower surface of the body 110, have. The first lead frame 121 and the second lead frame 131 partially include the opposite sides of the bottom surfaces of the first and second cavities 125 and 135. The bottom surfaces of the first and second cavities 125 and 135 may be exposed on the lower surface of the body 110.

The first lead frame 121 may include a first lead portion 123 and the first lead portion 123 may protrude from the third side portion 13 of the body 110. The second lead frame 131 may include a second lead portion 133 and the second lead portion 133 may protrude from the fourth side portion 14 of the body 110. One or a plurality of the first lead portions 123 may protrude, and one or a plurality of the second lead portions 133 may protrude. The first and second lead portions 123 and 133 may protrude in opposite directions with respect to the concave portion 160.

The first lead frame 121 and the second lead frame 131 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, And may include at least one of tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorous (P). The thickness of the first and second lead frames 121 and 131 may be 0.15 mm or more, for example, 0.18 mm to 1.5 mm. When the thickness of the first and second lead frames 121 and 131 is less than 0.15 mm, injection molding is difficult. In addition, when the thickness of the first and second lead frames 121 and 131 exceeds 1.5 mm, the thickness (t1 in FIG. 4) of the light emitting device 100 can be increased and the size thereof can be increased, . If the thicknesses of the first and second lead frames 121 and 131 are less than 0.15 mm, the electrical characteristics and heat dissipation characteristics may be deteriorated.

The thicknesses of the first and second lead frames 121 and 131 may be the same, but the present invention is not limited thereto. The first and second lead frames 121 and 131 function as a lead frame for supplying power. In addition to the first and second lead frames 121 and 131, a metal frame for radiating heat or an intermediate frame for electrically connecting between the first and second lead frames 121 and 131 may be further disposed in the recess 160, It is not limited thereto.

A first light emitting chip 171 is disposed in the first cavity 125 of the first lead frame 121. For example, the first light emitting chip 171 is bonded to the first cavity 125 with an adhesive But it is not limited thereto. A second light emitting chip 172 is disposed in the second cavity 135 of the second lead frame 131. For example, the second light emitting chip 172 is bonded to the second cavity 135 with an adhesive But it is not limited thereto. The adhesive may be an insulating adhesive or a conductive adhesive. The insulating adhesive may include a material such as epoxy or silicone, and the conductive adhesive may include a bonding material such as solder.

The first and second light emitting chips 171 and 172 may selectively emit light in the range of the visible light band to the ultraviolet light band. For example, an ultraviolet LED chip, a red LED chip, a blue LED chip, a green LED chip, ) LED chips, and white LED chips. The first and second light emitting chips 171 and 172 include an LED chip including at least one of a compound semiconductor of group III-V elements and a compound semiconductor of group II-VII elements. The first and second light emitting chips 171 and 172 may be a horizontal chip structure in which two electrodes in the chip are disposed adjacent to each other, or may be arranged as vertical chips disposed on opposite sides, but the invention is not limited thereto. When the light emitting chips 171 and 172 are horizontal chips, the lower insulating substrate may be bonded to the lead frame with an insulating or conductive adhesive. Alternatively, when the light emitting chips 171 and 172 are vertical chips, the lower electrode of the vertical chip may be electrically connected to the lead frame by a conductive adhesive.

2, 3, and 8, the first light emitting chip 171 is connected to a first lead frame 121 disposed at the bottom of the concave portion 160 by a first wire 173, And may be connected to the second lead frame 131 by the second wire 174, but the present invention is not limited thereto. The second light emitting chip 172 may be connected to the first lead frame 121 by a third wire 175 and may be connected to the second lead 171 by a fourth wire 176, And may be connected to the frame 131, but the present invention is not limited thereto.

The light emitting device 100 may include a protection device. The protection element may be disposed on a part of the first lead frame 121 or the second lead frame 131. The protection element may be disposed within the body 110. The protection device may be implemented with a thyristor, a zener diode, or a TVS (Transient Voltage Suppression), and the zener diode protects the light emitting chips 171 and 172 from electrostatic discharge (ESD). The protection element may be connected in parallel to the connection circuit of the first light emitting chip 171 and the second light emitting chip 172.

The molding member 181 may be formed on at least one or both of the concave portion 160, the first cavity 125, and the second cavity 135. The molding member 181 includes a light-transmitting resin layer such as silicon or epoxy, and may be formed as a single layer or a multi-layer.

The surface of the molding member 181 may be formed in a flat shape, a concave shape, a convex shape, or the like, but is not limited thereto.

The molding member 181 may be a phosphor-free layer. The molding member 181 may include a diffusing agent or a scattering agent other than the phosphor. When the molding member 181 has a phosphor, the phosphor is disposed adjacent to the light emitting chips 171 and 172, thereby deteriorating the phosphor due to heat generated from the light emitting chips 171 and 172. Such deterioration of the phosphor can change the color temperature and the color coordinates, and can lower the reliability of the light emitting element 100. [ The embodiment can provide the phosphor in the optical plate 300 spaced apart from the light emitting chips 171, 172. As another example, the molding member 181 on the light emitting chips 171, 172 can be removed. When the molding member 181 is removed, an air gap may exist in the recess 160.

5 and 6, the optical plate 300 includes a support 310 having an open region 342, a phosphor layer 340, a support 310, and a phosphor layer 340 in the support 310, (320, 330) disposed on at least one of an upper surface and a lower surface of the substrate.

The thickness of the optical plate 300 may range from 0.7 mm or more, for example, 0.75 mm to 1.5 mm. When the thickness of the optical plate 300 is less than 0.7 mm, it is difficult to secure the thickness of the phosphor layer 340 and the wavelength conversion efficiency is lowered. When the thickness exceeds 1.5 mm, Increasing the thickness of the films 320 and 330 may cause optical loss. Here, the thickness of the phosphor layer 340 may be thinner than the thickness of the support 310, and may be in a range of less than 1 mm, for example, between 0.4 mm and 0.7 mm. When the thickness of the phosphor layer 340 is thinner than the above range, the wavelength conversion efficiency is lowered. If the thickness is larger than the above range, the thickness of the illumination device is increased.

The support 310 includes an open region 342 therein, and the outer shape may include a circular or polygonal frame shape. The support 310 may include a frame shape on the outer periphery of the open region 342. The open region 342 may include a circular or polygonal shape. The open region 342 may have a shape corresponding to the shape of the concave portion 160 of the light emitting device 100 as shown in FIGS. 8 to 10, but the present invention is not limited thereto.

The support 310 may be formed to surround a side surface of the phosphor layer 340. The support 310 may be formed to surround the outer periphery of the phosphor layer 340.

The lower surface area of the open area 342 may be the same as the upper surface or the light exit surface of the molding member 160, or may be a smaller or larger area. The bottom area of the open area 342 may be equal to or less than the top area, but is not limited thereto.

The support 310 may be a reflective material. The support 310 may include a glass material such as white glass or a glass material having a high reflectance. The white glass or the glass material having high reflectance can be formed by adding white particles and / or bubbles into the transparent glass. The reflectance of the support 310 may be higher than that of the transparent films 320 and 330.

As another example, the support 310 may include a resin material, and the resin material may include a resin material such as polyphthalamide (PPA), an epoxy or a silicone material. A metal oxide such as TiO ₂ , SiO ₂ or a metal oxide or a white particle filler may be added to the resin material. The support 310 may be made of a white resin. The support 310 may include a ceramic material. The support 310 may be formed of a dark color or a black color in order to improve the contrast, but the present invention is not limited thereto. When the support 310 is made of a reflective material, the incident light can be reflected. A fine irregular pattern may be formed on the inner surface of the support 310, but the present invention is not limited thereto.

As another example, the support 310 may be a light-transmitting material, for example, a transparent glass material or a transparent resin material. The support 310 may be made of a resin material such as silicon or epoxy. When the support 310 is made of a light-transmitting material, the incident light can be emitted through the side surface.

As another example, a metal reflective layer may be disposed on the inner surface or the inner surface / lower surface of the support 310, and the reflective layer may effectively reflect the incident light. At this time, the support 310 may be made of a translucent material or a reflective material.

 At least one of the inner surface and the outer surface of the support 310 may be formed as a vertical or inclined surface, but the present invention is not limited thereto. The distance W1 between the inner side surface and the outer side surface of the support body 310 in the longitudinal direction may be in a range of 0.4 mm or more, for example, 0.45 mm to 0.6 mm. When the support body 310 is smaller than this range, If it is difficult and larger than the above range, material waste can be caused. The distance W1 may be the width of the outer frame of the open area 342 of the support 310. [

The distance W2 between the inner side surface and the outer side surface of the support 310 in the width direction may be smaller than the distance W1 and may vary depending on the size of the concave portion of the light emitting device.

The inner surface of the support 310, for example, the surface that contacts the phosphor layer 340, may be disposed perpendicular or inclined with respect to the lower surface of the first transparent film 320. When the inner surface of the support 310 is inclined, the top surface width or the top surface area of the phosphor layer 340 may be larger than the bottom width or the bottom surface area.

The phosphor layer 340 may include a phosphor in a resin material such as transparent silicon or epoxy. The phosphor layer 340 converts the wavelength of light emitted from the light emitting chips 171 and 172. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors, or may include different types of phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 may include a quantum dot. The quantum dot may include an II-VI compound or a III-V compound semiconductor, and may include at least one of red, green, yellow, and red quantum dots or different types.

The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof. Since the quantum dots have a large change in the luminous efficiency depending on the temperature, the quantum dots can be separated from the light emitting chips 171 and 172 as in the embodiment, thereby reducing the change in luminous efficiency.

Transparent films 320 and 330 may be disposed on at least one or both of the phosphor layer 340 and the phosphor layer 340. The transparent films 320 and 330 may include a first transparent film 320 disposed under the phosphor layer 340 and a second transparent film 330 disposed on the phosphor layer 340. The transparent films 320 and 330 may be disposed on the incident surface and / or the emission surface of the phosphor layer 340. In this optical plate 300, either one of the first and second transparent films 320 and 330 can be removed, for example, the first or second transparent films 320 and 330 can be removed, . In manufacturing the optical plate 300, any one of the transparent films 320 and 330 may be a base film supported during the dispensing process of the phosphor layer 340.

The first and second transparent films 320 and 330 may include glass or a transparent resin film. The first and second transparent films 320 and 330 are bonded to the support 310 to protect the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 181. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 181 of 0.2 or less. The first and second transparent films 320 and 330 may have a refractive index lower than that of the molding member 181 and the phosphor layer 340.

As another example, when the molding member 181 is removed, an air gap may exist in the concave portion 160 of the light emitting device 100, and the first transparent film 320 may be disposed.

The first transparent film 320 may be attached to the lower surface of the support 310 and the lower surface of the phosphor layer 340. The second transparent film 330 may be attached to the upper surface of the support 310 and the upper surface of the phosphor layer 340. The lower surface of the optical plate 300 may be adhered on the molding member 181. The lower surface of the first transparent film 320 may be adhered to the surface of the molding member 181. The first transparent film 320 is adhered before the molding member 181 is cured so that the light loss at the interface between the first transparent film 320 and the molding member 181 can be reduced.

The thickness of the first and second transparent films 320 and 330 may be 0.3 mm or less and may be 0.05 mm or more, for example, 0.08 mm to 0.2 mm. If the thickness of the first and second transparent films 320 and 330 is less than 0.05 mm, handling may be difficult and stiffness may be caused. When the thickness exceeds 0.2 mm, the thickness of the optical plate 300 becomes thick The light transmittance may be lowered. The thickness of the first and second transparent films 320 and 330 may be the same or different from each other. If the thicknesses of the first and second transparent films 320 and 330 are different from each other, the first transparent film 320 may have a thickness greater than that of the second transparent film 330. This is because the thickness of the first transparent film 320 is thicker than the thickness of the second transparent film 330 so that it can be stably bonded to the light emitting device 100.

The thickness of the phosphor layer 340 may be greater than the thickness of the first transparent film 320 or the second transparent film 330 and may be greater than the sum of the thicknesses of the first and second transparent films 320 and 330. The thickness of the phosphor layer 340 may be 5 to 7 times the thickness of the first transparent film 320.

The phosphor layer 340 may have a thickness equal to the thickness of the support 310. In this case, the first and second transparent films 320 and 330 may be formed on the upper and lower surfaces of the support 310, Can be contacted.

As another example, the phosphor layer 340 may have a thickness smaller than the thickness of the support 310. The upper surface of the phosphor layer 340 may be flat, convex or concave. The support 310 may protrude from the outer periphery of the first and second transparent films 320 and 330, but the present invention is not limited thereto.

The optical plate 300 according to the embodiment can be provided at a thickness thinner than the thickness of the light emitting element 100 (t1 in Fig. 4), and can function as an illumination plate or a fluorescent plate on the light emitting element 100. [ The thickness of the illumination device 101 may be less than or equal to 2 mm and the thickness of the optical plate 300 and the light emitting device 100 may be less than or equal to 2 mm. There is a problem in that the thickness of the light unit having such a structure is also increased.

The optical plate is fabricated by forming a support 310 on the first transparent film 320 and then dispensing the phosphor layer 340 on the open region 342 of the support 310. The second transparent film 330 is laminated on the phosphor layer 340 and the support 320 before the phosphor layer 340 is cured and then cut to a predetermined size to form a desired optical plate 300 .

The process of attaching the optical plate 300 on the light emitting device is performed by molding the molding member 181 in the light emitting device 100 and then attaching the first transparent film 320 before curing the molding member 181 And can be mounted on the molding member 181.

The optical plate 300 may be coupled to the light emitting device 100 as shown in FIGS. The optical plate 300 may be attached to the upper surface of the body 110 of the light emitting device 100. As shown in FIG. 9, the optical plate 300 may be spaced apart from the light emitting chips 171 and 172 by a predetermined gap G1. The gap G1 may range from 0.4 mm to 1.4 mm, for example, from 0.4 mm to 0.7 mm. If the gap G1 between the light emitting chips 171 and 172 and the first transparent film 320 is less than the above range, the thickness of the body 110 may be thinned to make it difficult to secure rigidity and cause deterioration of the phosphor. The light emitting device 100 may be thickened and the light diffusion effect may be insignificant.

The length D2 of the optical plate 300 in the first axial direction may be shorter than the maximum length Y2 of the light emitting device 100 in the first axial direction and may be the same as the length Y1 of the body 110 Or otherwise formed. The length Y1 of the body 110 may be the lower length of the body 110 and the maximum length of the body 110. [ The length D2 of the optical plate 300 in the first axial direction may be equal to or less than the upper length Y4 of the body 110 as shown in FIG.

The optical plate 300 may be disposed on the upper surface 15 of the body 110 of the light emitting device 100. For example, the bottom surface area of the optical plate 300 may be equal to, greater than, or less than the top surface area of the body 110. The bottom surface length of the optical plate 300 may be the same as or different from the length of the top surface of the body 110 (Y4 in FIG. 3). The length of the phosphor layer 340 may be shorter than the length of the top surface 110 of the body 110 (Y4 in FIG. 3).

The width D3 of the optical plate 300 in the second axial direction is narrower than the width X4 in the second axial direction of the light emitting device 100, As shown in FIG. The support 310 of the optical plate 300 may overlap the upper surface 15 of the body 110 in the vertical direction. The first transparent film 320 may be disposed on the upper surface of the body 110. For example, the lower surface of the lower surface of the first transparent film 320 may be adhered to the upper surface of the body 110 with an adhesive . The outer circumference of the first transparent film 320 may be disposed outside the recess 160 or the area of the molding member 181. At least one or both of the support 310 and the first transparent film 320 may be adhered to the upper surface of the body 110 with an adhesive. A part of the support 310 may be arranged to overlap with the upper surface of the body 110 in the vertical direction.

When the area of adhesion between the lower surface of the optical plate 300 and the upper surface 15 of the body becomes larger, the horizontal flow of the optical plate 300 can be reduced. The outer surface of the optical plate 300 may be adhered to the upper surface of the body 110 as an adhesive.

8 and 9, the optical plate 300 may have the phosphor layer 340 disposed in a region corresponding to the concave portion 160 of the light emitting device 100. Accordingly, the light emitted through the concave portion 160 may enter the phosphor layer 340 through the first transparent film 320, be wavelength-converted, and be emitted to the second transparent film 330.

The molding member 181 may be disposed under the first transparent film 320. The molding member 181 may contact the lower surface of the first transparent film 320. The lower surface of the first transparent film 320 may be disposed above the upper surface of the body 110 or above the upper surface of the molding member 181. The first transparent film 320 may be disposed between the molding member 181 and the phosphor layer 340.

9 and 10, the length D1 of the phosphor layer 340 in the first axis direction may be equal to or smaller than the length Y3 of the concave portion 160 in the first axis direction. The width D4 of the phosphor layer 340 in the second axis direction may be equal to or less than the width X2 of the concave portion 160 in the second axis direction. The length D1 in the first axis direction of the phosphor layer 340 may be larger than the width D4 in the second axis direction. The phosphor layer 340 may overlap with the concave portion 160 in the vertical direction. Accordingly, the phosphor layer 340 can effectively convert the wavelength of light emitted through the concave portion 160 of the light emitting device 100.

The length E1 of the light emitting chips 171 and 172 may be equal to or longer than the width E2 of the light emitting chips 171 and 172,

11 is another example of the optical plate of Fig.

11, the optical plate 300 includes a support 310 having an open area 342 disposed on the light emitting device 100 disclosed in the embodiment, a first transparent film 320, 330 and a phosphor layer 340 in the open region 342.

The length D1 of the open region 342 of the support 310 is equal to or longer than the length Y3 of the concave portion 160 of the light emitting device 100 or the length of the top surface of the molding member 181 . The length of the phosphor layer 340 may be equal to or longer than an upper length Y3 of the concave portion 160 or an upper surface length of the molding member 181. [

The outer surface of the optical plate 300 may protrude outward from the area of the light emitting device 100. Accordingly, the optical plate 300 can be adhered to an area wider than the top surface area of the light emitting device 100, and stably attached to the light emitting device 100. The outer side of the first transparent film 320 may protrude outward from the body 110 of the light emitting device 100. The lower surface area of the first transparent film 320 may be larger than the upper surface area of the recess 160 or the upper surface area of the molding member 181 It can be wider.

The outer side of the support 310 may protrude outward from the body 110 of the light emitting device 100. The outer side of the second transparent film 330 may protrude outward from the body 110 of the light emitting device 100. The length D2 of the optical plate 300 may be greater than the length Y1 of the light emitting device 100 to increase the length or area of the phosphor layer 340. [ The optical plate 300 may be stably disposed on the light emitting device 100. The optical plate 300 can provide the incident area of the phosphor layer 340 corresponding to the upper area of the concave portion 181, thereby increasing the light incidence area and improving the light extraction efficiency.

Fig. 12 and Fig. 13 are side cross-sectional views of the light emitting element of the illumination element according to the second embodiment. In the description of the second embodiment, the same parts as those of the first embodiment will be referred to in the first embodiment, and redundant description may be omitted.

12 and 13, an illumination device includes a light emitting device 100A and an optical plate 300 on the light emitting device 100A. The above-described optical plate 300 can be applied to the above-described embodiment.

The light emitting device 100A includes a body 110A having a concave portion 162, a plurality of lead frames 122 and 132 in the concave portion 162, and a plurality of light emitting chips 171 and 172 in the concave portion 162 do.

The optical plate 300 may be spaced apart from the light emitting chips 171 and 172 of the light emitting device 100A by a predetermined gap G2. The gap G2 may range from 0.4 mm to 1.4 mm, for example, from 0.4 mm to 0.7 mm. If the distance G2 between the light emitting chips 171 and 172 and the first transparent film 320 of the optical plate 300 is less than the above range, the thickness of the body 110 becomes thin, and it is difficult to secure rigidity, If it is larger than the above range, the light emitting device 100A may be thickened and the light diffusion effect may be insignificant. The sum of the thicknesses of the light emitting device 100A and the optical plate 300 is 2 mm or less, thereby preventing the thickness of the lighting device such as the backlight unit from increasing.

At least one or both of the plurality of lead frames 122 and 132 may be formed as a horizontal surface on an upper surface. That is, it is possible to provide a lead frame having a flat top surface without forming a cavity in each of the lead frames 121 and 131 as shown in Fig.

The plurality of lead frames 122 and 132 includes a first lead frame 122 and a second lead frame 132 spaced from the first lead frame 122.

The top surface width of the first lead frame 122 may be wider than the bottom width, and the top surface area thereof may be wider than the bottom surface area. The top surface width of the second lead frame 132 may be wider than the bottom width, and the top surface area thereof may be wider than the bottom surface area. As a result, the surface area of the first and second lead frames 122 and 132 can be increased, the adhesion with the body 110A can be improved, and the heat radiation efficiency can be increased.

The first and second lead frames 122 and 132 may have stepped structures 22 and 32 in regions facing each other. The stepped structures 22 and 32 can be increased in area of adhesion with the gap portion 119 disposed between the first and second lead frames 122 and 132. The step structures 22 and 32 may be formed in a stepped shape or have inclination and are not limited thereto.

The gap portion 119 may be disposed in an area between the first and second lead frames 122 and 132 or may be disposed on an upper surface of the first and second lead frames 122 and 132 in part. The gap portion 119 may be made of the same material as the body 110A or may be made of another insulating material, but the present invention is not limited thereto.

The first and second lead frames 122 and 132 include holes 23 and 33 and a portion 116 and 117 of the body 110A may be coupled to the holes 22 and 33. [ One or a plurality of holes 23 of the first lead frame 122 may be arranged to overlap with the body 110A in the vertical direction. One or a plurality of holes 33 of the second lead frame 132 may be arranged to overlap with the body 110A in the vertical direction. The width of each of the holes 23 and 33 may be larger than the width of the upper portion, but is not limited thereto. Accordingly, the adhesive force between the body 110A and the holes 23 and 33 of the lead frames 122 and 132 can be increased, thereby preventing moisture penetration.

14 is a side cross-sectional view showing the illumination device according to the third embodiment.

Referring to FIG. 13, the illumination device includes a light emitting device 400 and an optical plate 300 described in the embodiment on the light emitting device 400. The optical plate 300 will be described with reference to the description of the embodiment (s) disclosed above.

The light emitting device 400 includes a body 410, a first lead frame 423 and a second lead frame 421 disposed on the body 410, and a second lead frame 422 disposed on the body 410, And a light emitting chip 470 electrically connected to the lead frame 423 and the second lead frame 421.

The body 410 may include an insulating material or a conductive material. The body 410 may include at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al ₂ O ₃ ), a printed circuit board Can be formed. For example, the body 410 may be made of a resin material such as polyphthalamide (PPA), epoxy, or silicone. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the epoxy or silicon material used as the body 410 to improve the reflection efficiency. The body 410 may include a ceramic material.

The body 410 may provide a recess 425 having an inclined surface around the light emitting chip 470. The molding member 440 may be disposed on the concave portion 425, but the present invention is not limited thereto. The inclined surface of the concave portion 425 may be formed with one or two or more angles, and another reflective member may be further disposed on the inclined surface.

The first lead frame 421 and the second lead frame 423 are electrically separated from each other and provide power to the light emitting chip 470. The first lead frame 421 and the second lead frame 423 may be disposed on the bottom of the concave portion 425 and may reflect light generated from the light emitting chip 470 to increase the light efficiency And may discharge the heat generated from the light emitting chip 470 to the outside.

And may be disposed on the first lead frame 421 of the light emitting chip 470 and connected to the first lead frame 423 by a wire 443. [ The first lead frame 421 may be formed as a cavity in which the light emitting chip 470 is disposed, but the present invention is not limited thereto. The light emitting chip 470 may be arranged in a flip chip manner, but the present invention is not limited thereto.

The optical plate 300 may be disposed facing the light emitting chip 470. The optical plate 300 includes a phosphor and may be disposed on the upper surface of the body 410.

The optical plate 300 includes a support 310 having an open region 342, a transparent layer 340 formed on at least one of the phosphor layer 340, the support 310, and the phosphor layer 340, Films 320 and 330.

The support 310 includes an open region 342 therein, and the outer shape may include a circular or polygonal frame shape, but the present invention is not limited thereto. The open region 342 may include a circular or polygonal shape. The open region 342 has a shape corresponding to the shape of the concave portion 425 of the light emitting device and light emitted through the concave portion 425 can be incident thereon. The support 310 may be formed to surround the side surface of the phosphor layer 340.

The support 310 may include a glass material such as white glass or a glass material having a high reflectance. The white glass or the glass material having high reflectance can be formed by adding white particles and / or bubbles into the transparent glass. The reflectance of the support 310 may be higher than that of the first and second transparent films 320 and 330.

As another example of the support 310, a resin material may be included, and the resin material may include a resin material such as polyphthalamide (PPA), an epoxy or a silicone material. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the resin material. The support 310 may be made of a white resin. The support 310 may include a ceramic material.

The phosphor layer 340 may include a phosphor in a resin material such as transparent silicon or epoxy. The phosphor layer 340 converts the wavelength of light emitted from the light emitting chip 470. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 according to an embodiment may include a quantum dot. The quantum dot may include an II-VI compound or a III-V compound semiconductor, and may emit at least one of red, green, yellow, and red quantum dots or different kinds of quantum dots.

The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof. Since the quantum dot has a large change in the luminous efficiency depending on the temperature, the quantum dot can be separated from the light emitting chip 470 as in the embodiment, and the change in the luminous efficiency can be reduced.

Transparent films 320 and 330 may be disposed on at least one or both of the phosphor layer 340 and the phosphor layer 340. The transparent films 320 and 330 may include a first transparent film 320 disposed under the fluorescent layer 340 and a second transparent film 330 disposed on the fluorescent layer 340. The transparent films 320 and 330 may be disposed on the incident surface and / or the emission surface of the phosphor layer 340. In this optical plate 300, any one of the first and second transparent films 320 and 330 may be removed, for example, the second transparent film 330 may be removed, but the present invention is not limited thereto.

The first and second transparent films 320 and 330 may include glass or a transparent resin film. The first and second transparent films 320 and 330 are bonded to the support 310 to protect the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 440 and / or the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 440 of 0.2 or less.

The first transparent film 320 may be adhered to the lower surface of the support 310 and the lower surface of the phosphor layer 340. The outer surface of the lower surface of the first transparent film 320 may be adhered to the body 410. The second transparent film 330 may be adhered to the upper surface of the support 310 and the upper surface of the phosphor layer 340.

The phosphor layer 340 may have a thickness equal to the thickness of the support 310. In this case, the first and second transparent films 320 and 330 may be formed on the upper and lower surfaces of the support 310, Can be contacted. The lower surface of the support 310 may be attached to the upper surface of the body 410 of the light emitting device 400 and may be disposed around the first transparent film 320. The lower surface of the optical plate 300 may be adhered on the molding member 440. The lower surface of the first transparent film 320 may be adhered to the surface of the molding member 440.

The optical plate 300 according to the embodiment is provided at a thickness thinner than the thickness of the light emitting element 400 and can function as an illumination plate or a fluorescent plate on the light emitting element 400. [

15 is a side cross-sectional view showing the illumination device according to the fourth embodiment.

Referring to FIG. 15, an illumination device includes a light emitting device 500 and an optical plate 300 disposed on the light emitting device 500. The optical plate 300 will be described with reference to the description of the embodiment.

The light emitting device 500 includes a body 510, a first lead frame 521 and a second lead frame 523 disposed on the body 510 and a second lead frame 523 disposed on the body 510, A light emitting chip 570 electrically connected to the frame 521 and the second lead frame 523 and a molding member 531 on the light emitting chip 570.

The body 510 may include a reflecting portion 513 having a concave portion 517 opened at an upper portion thereof and a supporting portion 511 for supporting the reflecting portion 513.

The light emitting chip 570 is disposed on the second lead frame 523 and the wire 503 is disposed on the second lead frame 523. The light emitting chip 570 is disposed in the concave portion 517 of the body 510, To the first lead frame 521, as shown in FIG. The second lead frame 523 may include a cavity in which the light emitting chip 570 is disposed, but the present invention is not limited thereto. The first lead frame 521 and the second lead frame 523 are electrically separated from each other and provide power to the light emitting chip 570.

The first lead frame 521 and the second lead frame 523 may reflect light generated from the light emitting chip 570 to increase light efficiency. For this purpose, a separate reflective layer may be formed on the first lead frame 521 and the second lead frame 523, but the present invention is not limited thereto. In addition, the first and second lead frames 521 and 523 may serve to discharge the heat generated from the light emitting chip 570 to the outside. The lid portion 522 of the first lead frame 521 and the lid portion 524 of the second lead frame 523 may be disposed on the lower surface of the body 510. [

The molding member 531 may include a resin material such as silicone or epoxy, and may surround the light emitting chip 570 to protect the light emitting chip 570. The upper surface of the molding member 531 may be flat, concave or convex. The molding member 531 may be removed so that the recessed portion 517 may be filled with the air region.

The optical plate 300 may be disposed facing the light emitting chip 570. The optical plate 300 includes a phosphor and may be disposed on the upper surface of the body 510.

The optical plate 300 includes a frame-shaped support 310 having an open region 342, a phosphor layer 340, a support 310, and a phosphor layer 340 in the support 310, A second transparent film 330 on the support 320, the support 310, and the phosphor layer 340.

The support 310 includes an open region 342 therein, and the outer shape may include a circular or polygonal frame shape. The open region 342 may include a circular or polygonal shape. The open region 342 has a shape corresponding to the shape of the concave portion 517 of the light emitting device, and light emitted through the concave portion 517 may be incident thereon. The support 310 may be formed to surround the side surface of the phosphor layer 340.

The support 310 may include a reflective material or a light-transmitting material. The support 310 may include a glass material such as white glass or a glass material having a high reflectance. The white glass or the glass material having high reflectance can be formed by adding white particles and / or bubbles into the transparent glass. The reflectance of the support 310 may be higher than that of the first and second transparent films 320 and 330.

As another example, the support 310 may include a resin material, and the resin material may include a resin material such as polyphthalamide (PPA), an epoxy or a silicone material. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the resin material. The support 310 may be made of a white resin. The support 310 may include a ceramic material.

The support 310 may be made of a transparent material such as glass or transparent silicone or epoxy.

The phosphor layer 340 may include a phosphor in a resin material such as transparent silicon or epoxy. The phosphor layer 340 converts the wavelength of the light emitted from the light emitting chip 570. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 according to an embodiment may include a quantum dot. The quantum dot may include an II-VI compound or a III-V compound semiconductor, and may emit at least one of red, green, yellow, and red quantum dots.

The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof. In the case of such a quantum dot, since the change in the luminous efficiency depending on the temperature is large, the luminous efficiency can be reduced by separating the luminous efficiency from the luminous chip 570 as in the embodiment.

The first and second transparent films 320 and 330 may include glass or a transparent resin film. The first and second transparent films 320 and 330 are bonded to the support 310 to protect the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 531 and / or the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 531 of 0.2 or less.

The first transparent film 320 may be adhered to the lower surface of the support 310 and the lower surface of the phosphor layer 340. The outer surface of the lower surface of the first transparent film 320 may be adhered to the body 510. The second transparent film 330 may be adhered to the upper surface of the support 310 and the upper surface of the phosphor layer 340.

The phosphor layer 340 may have a thickness equal to the thickness of the support 310. In this case, the first and second transparent films 320 and 330 may be formed on the upper and lower surfaces of the support 310, Can be contacted. The lower surface of the support 310 may be attached to the upper surface of the body 510 of the light emitting device 500 and may be disposed around the first transparent film 320. The lower surface of the optical plate 300 may be adhered on the molding member 440. The lower surface of the first transparent film 320 may be adhered to the surface of the molding member 440.

The optical plate 300 according to the embodiment is provided at a thickness thinner than the thickness of the light emitting element 500 and can function as an illumination plate or a fluorescent plate on the light emitting element 500. [

The optical plate 300 of the above-described embodiment is configured such that a part of the light incident on the first transparent film 320 is incident on the upper surface of the body of the light emitting device 100, 100A, 400, 500 along the first transparent film 320, As shown in Fig. That is, a light leakage problem may occur through the outer circumference of the first transparent film 320. This light leakage problem can degrade the light flux extracted through the second transparent film 330 of the optical plate 300. Hereinafter, another embodiment can provide an optical plate 300 having a structure capable of reducing the light leakage problem described above. In addition, when the molding member is disposed in the light emitting device 100, 100A, 400 or 500, a part of the molding member may move outside the passage between the optical plate 300 and the body slope, The lifting problem of the portable terminal 300 may occur.

Figs. 16 and 17 show a light emitting device having an optical plate according to the fifth embodiment, which is a modification of the light emitting device of Figs. 3 and 4. Fig. In describing the fifth embodiment, the configuration disclosed in the above embodiment will be described with reference to the description of the above embodiment.

16 and 17, the light emitting device 100B includes a body 110 having a concave portion 160, a plurality of lead frames 121 and 131 in the concave portion 160, And at least one light emitting chip (171, 172). The molding member 181 may be disposed in the recess 160.

The light emitting device 100B includes an optical plate 300 in the concave portion 160 of the body 110. The light emitting device 100B having the optical plate 300 can also be defined as an illumination device.

At least one or a plurality of lead frames 121 and 131 in the recess 160 may include cavities 125 and 135 and light emitting chips 171 and 172 may be disposed in the cavities 125 and 135.

A molding member 181 may be disposed in the concave portion 160 and the molding member 181 may be in contact with a lower surface of the optical plate 300. The upper surface of the molding member 181 may be disposed at a position lower than the upper surface 15 of the body 110.

The recess 160 includes a first sidewall 17 adjacent the lead frames 121 and 131 and a second sidewall 18 between the first sidewall 17 and the body upper surface 15. The first side wall 17 may be formed as an inclined surface with respect to the optical axis, and the inclined surface may reflect light toward the optical plate 300. The second side wall 18 may be formed as a plane parallel or inclined to the optical axis. The second side wall 18 may be disposed between the first side wall 17 and the body upper surface 15 in a vertical or inclined manner. The second side wall 18 may be in contact with the side surface of the optical plate 300 or may be bonded with an adhesive material. The second sidewall 18 may be disposed on the outer periphery of the optical plate 300 to reflect incident light. The optical axis may be a direction perpendicular to the upper surface of the light emitting chips 171 and 172.

The upper length Y3 of the recess 160 may be the same as the upper length of the molding member 160 or may be the same as the length of the optical plate 300. [ An upper length Y3 and a width X2 of the concave portion 160 may have a length and a width that allow the optical plate 300 to be inserted.

The upper end of the first sidewall 17 of the concave portion 160 may be a boundary portion with the second sidewall 18. The depth of insertion of the optical plate 300 may be limited to the height of the upper surface of the molding member 181 or adjusted to the position of the boundary portion between the first side wall 17 and the second side wall 18 of the concave portion 160 . Accordingly, the gap G1 between the optical plate 300 and the light emitting chips 171 and 172 can be matched.

The optical plate 301 includes a phosphor layer 340 and transparent films 320 and 330 disposed on at least one or both of the upper surface and the lower surface of the phosphor layer 340. The optical plate 301 may have a structure in which the support is removed from the optical plate shown in Fig.

The transparent films 320 and 33 may include a first transparent film 320 disposed between the phosphor layer 340 and the light emitting chips 171 and 172 and a second transparent film 330 disposed on the phosphor layer 340. . ≪ / RTI >

The first transparent film 320 may be disposed between the molding member 320 and the phosphor layer 340. The first transparent film 320 may be attached to the lower surface of the phosphor layer 340 and attached to the upper surface of the molding member 181.

The phosphor layer 340 converts the wavelength of light emitted from the light emitting chips 171 and 172. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors, or may include different types of phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 may include a quantum dot phosphor. The quantum dot fluorescent material may include a II-VI compound or a III-V compound semiconductor, and may include at least one of red, green, yellow, and red quantum dots or different kinds of dots.

The quantum dot phosphor is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2 , it may be a combination thereof and mixtures thereof, such as CuInSe _2. In the case of such a quantum dot, the change in the luminous efficiency depending on the temperature is increased, so that it is possible to separate the luminous efficiency from the luminous chips 171 and 172 by changing the temperature.

The first and second transparent films 320 and 330 may be made of a transparent material such as a glass material or a resin film, but the present invention is not limited thereto. The first transparent film 320 may diffuse the heat generated from the light emitting chips 171 and 172 horizontally. In this optical plate 301, any one of the first and second transparent films 320 and 330 may be removed, for example, the first or second transparent films 320 and 330 may be removed, but the present invention is not limited thereto.

The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 181. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 181 of 0.2 or less. The first and second transparent films 320 and 330 may have a refractive index lower than that of the molding member 181 and the phosphor layer 340.

The first transparent film 320 may be attached to the surface of the molding member 181. As another example, when the molding member 181 is removed, an air gap may exist in the concave portion 160 of the light emitting device 100B, and the first transparent film 320 may be disposed.

The first and second transparent films 320 and 330 and the phosphor layer 340 may be in contact with the second side wall 18 of the concave portion 160 or may be bonded with an adhesive material.

The length D1 of the phosphor layer 340 of the optical plate 300 may be equal to the length Y3 of the concave portion 160. [ Further, the phosphor layer 340 may be arranged to overlap with the light emitting chips 171 and 172 in the vertical direction, and the wavelength of the incident light may be changed.

The molding member 181 disposed between the optical plate 300 and the light emitting chips 171 and 172 can maintain the gap G1 between the optical plate 300 and the light emitting chips 171 and 172. The molding member 181 may not contain a fluorescent material therein, and may have a different fluorescent material from that of the fluorescent material formed in the fluorescent material layer 340, if necessary.

The upper surface of the optical plate 300 may be disposed on the same horizontal surface as the upper surface 15 of the body 110, or may be disposed higher or lower. The upper surface of the second transparent film 330 may be disposed on the same horizontal surface as the upper surface 15 of the body 110, or may be disposed higher or lower. Even if the upper surface of the second transparent film 330 is disposed higher than the upper surface of the body 110, light loss may be small.

The optical plate 301 may be inserted and attached before the molding member 181 is cured. The optical plate 301 is manufactured by disposing the first transparent film 320 under the support having the open region prepared in advance, forming the phosphor layer 340 in the open region, . Thereafter, the boundary between the support and the phosphor layer 340 may be cut to remove the support in the optical plate 301. The support is removed from the optical plate 301 so that the light loss can be reduced and the bottom surface area of the phosphor layer 340 can be increased to substantially the same area as the top surface area of the recess 160.

18 is a modification of the optical plate in the light emitting device of Fig.

18, the light emitting device 100B includes a body 110 having a concave portion 160, a plurality of lead frames 121 and 131 in the concave portion 160, and at least one And includes light emitting chips 171 and 172. The molding member 181 may be disposed in the recess 160.

The optical plate 300 may be disposed in the concave portion 160 of the light emitting element 100B. The optical plate 301 includes a phosphor layer 340 and transparent films 320 and 330 disposed on at least one or both of the upper surface and the lower surface of the phosphor layer 340.

The transparent films 320 and 330 include a first transparent film 320 disposed between the phosphor layer 340 and the light emitting chips 171 and 172 and a second transparent film 330 disposed on the phosphor layer 340 do. The first transparent film 320 may be disposed between the phosphor layer 340 and the molding member 181. The optical plate 301 can protect the upper and lower surfaces of the phosphor layer 340 when the transparent films 320 and 330 are disposed on both sides of the phosphor layer 340.

The optical plate 300 is disposed in the recess 160 and disposed above the first sidewall 17 of the recess 160 and disposed inside the second sidewall 18.

The light emitting device 100B may have a step structure 18A on the second side wall 18 of the body 110. [ The step structure 18A may have a lower depth than the top surface 15 of the body 110 and may be disposed on the outer circumference of the upper surface of the second side wall 18. [

The outer circumference of the second transparent film 330 may be disposed within the step structure 18A of the body 110. [ The length of the second transparent film 330 may be longer than the length of the first transparent film 320 and may be longer than the length of the phosphor layer 340 and shorter than the length of the upper portion Y4 of the body 110 . The width of the second transparent film 330 may be wider than the width of the upper portion of the concave portion 160. The second transparent film 330 can be attached to the step structure 18A of the body 110 so that the moisture permeation can be blocked and the molding member 181 can be prevented from leaking to the outside.

19 is a modification of the optical plate in the light emitting element of Fig.

Referring to FIG. 19, the optical plate 301 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 301 includes a second transparent film 330 and a phosphor layer 340. This optical plate 301 is a structure in which the first transparent film and the support are removed in the structure of FIG.

The optical plate 301 is disposed in the concave portion 160 and disposed above the first side wall 17 of the concave portion 160 and disposed inside the second side wall 18. [

The phosphor layer 340 faces the light emitting chips 171 and 172 and is disposed on the molding member 181. The lower surface of the phosphor layer 340 may be spaced apart from the light emitting chips 171 and 172 by a predetermined gap G1 by the height of the upper surface of the molding member 181.

The outer surfaces of the phosphor layer 340 and the second transparent film 330 may be disposed on the second side wall 18 of the concave portion 160. The phosphor layer 340 is attached to the inner surface of the second sidewall 18 of the recess 160 and the molding member 181 so that moisture penetration from the outside can be suppressed and the molding member 181 Can be prevented from leaking out.

The second transparent film 330 may be disposed on the inner side of the second side wall 18. The upper surface of the second transparent film 330 may be disposed on the same horizontal surface as the upper surface of the body 110, or may be disposed higher or lower.

The length of the phosphor layer 340 and the length of the second transparent film 330 may be equal to the length Y3 of the concave portion 160. The length of the second transparent film 330 may be equal to or greater than the length of the phosphor layer 340 or may be longer than the length of the phosphor layer 340. However, the present invention is not limited thereto.

20 is a modification of the light emitting device having the optical plate according to the embodiment.

Referring to FIG. 20, the optical plate 301 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 301 includes a second transparent film 330 and a phosphor layer 340. This optical plate 301 is a structure in which the first transparent film and the support are removed in the structure of FIG.

The optical plate 301 is disposed in the concave portion 160 and disposed above the first side wall 17 of the concave portion 160 and disposed inside the second side wall 18. [

The phosphor layer 340 faces the light emitting chips 171 and 172 and is disposed on the molding member 181. The lower surface of the phosphor layer 340 may be spaced apart from the light emitting chips 171 and 172 by a predetermined gap G1 by the height of the upper surface of the molding member 181.

The outer surfaces of the phosphor layer 340 and the second transparent film 330 may be disposed on the second side wall 18 of the concave portion 160. The phosphor layer 340 is attached to the inner surface of the second sidewall 18 of the recess 160 and the molding member 181 to suppress moisture penetration from the outside and the molding member 181 Can be prevented from leaking out.

The second transparent film 330 may be disposed on the inner side of the second side wall 18. The upper surface of the second transparent film 330 may be disposed on the same horizontal surface as the upper surface of the body 110, or may be disposed higher or lower.

The inner side of the first sidewall 17 of the recess 160 is inclined at a first angle? 1 relative to the optical axis and the inner side of the second sidewall 18 is inclined at a second angle? ). The second angle? 2 is arranged to be smaller than the first angle? 1 with respect to the optical axis, so that the directivity angle and the light intensity of the light can be improved.

The outer surface of the phosphor layer 340 may be in contact with the inner surface of the second side wall 18 of the recess 160 in an inclined plane. The length of the upper surface of the phosphor layer 340 may be longer than the length of the lower surface. The upper surface area of the phosphor layer 340 is arranged to be wider than the lower surface area, so that the area of the light output surface can be improved.

An adhesive member 335 may be disposed in an area between the outside of the second transparent film 330 disposed on the phosphor layer 340 and the second side wall 18 of the concave portion 160. The adhesive member 335 is disposed in a gap between the second transparent film 330 and the second side wall 18 to prevent moisture penetration. The adhesive agent 335 may protrude above the upper surface 15 of the body 110, but the adhesive agent 335 is not limited thereto.

As another example, the first transparent film or the first transparent film having an open region, which will be described later, may be further disposed under the phosphor layer 340, but the present invention is not limited thereto.

Fig. 21 is a modification of the light emitting device having the optical plate according to the embodiment, and Figs. 22A and 22B are examples of the bottom view of the optical plate in Fig.

21 and 22, the optical plate 303 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 303 includes a first transparent film 320, a second transparent film 330 and a phosphor layer 340. This optical plate 303 is a structure in which the support is removed in the structure of Fig. 5, and the first transparent film is changed. The method of manufacturing the optical plate 303 includes the steps of positioning the second transparent film 330 on the base and then forming the phosphor layer 340 on the second transparent film 330, The first transparent film 320 is adhered before curing. After the plate is cut to a predetermined size, the first transparent film 320 may be turned upside down and then placed in the concave portion 160 of the body 110.

The optical plate 303 is disposed in the recess 160 and disposed above the first sidewall 17 of the recess 160 and disposed inside the second sidewall 18.

The first transparent film 320 has an open region 326 having an open outer periphery and an outer lower portion 345 of the phosphor layer 340 may protrude through the open region 326. The open region 326 of the first transparent film 320 may be disposed along the outer side of the first transparent film 320 as shown in FIG. The lower portion 345 may be disposed along the outer circumference of the first transparent film 320. As another example, the open regions 326 of the first transparent film 320 may be disposed on both outer sides of the first transparent film 320, respectively, as shown in FIG. 22 (B) The outer lower portion 345 of the phosphor layer 340 may be disposed on both sides of the first transparent film 320. The first transparent film 320 and the outer lower portion 345 of the phosphor layer 340 may be in contact with the molding member 181 of FIG.

The first transparent film 320 may be disposed on the inner side of the phosphor layer 340 and may overlap the light emitting chips 171 and 172 in the vertical direction. The first transparent film 320 may reflect or transmit light incident from the light emitting chips 171 and 172. The outer lower portion 345 of the phosphor layer 340 may contact the molding member 181 to reduce the incident light loss.

The length Y5 of the first transparent film 320 may be shorter than an upper length Y3 of the concave portion 160 and shorter than a bottom length of the concave portion 160. [ The width of the first transparent film 320 may be shorter than the bottom width of the concave portion 160. The length Y5 of the first transparent film 320 may be larger than the distance between the plurality of light emitting chips 171 and 172 and may be set to be longer than the overlapping length of the overlapping portions of the plurality of lead frames 121 and 131, Lt; / RTI > size. The first transparent film 320 may diffuse light incident from the light emitting chips 171 and 172.

The first transparent film 320 may be spaced from the second side wall 18 of the recess 160. The outer surfaces of the phosphor layer 340 and the second transparent film 330 may be disposed on the second side wall 18 of the concave portion 160. The phosphor layer 340 is attached to the inner surface of the second sidewall 18 of the recess 160 so that moisture penetration from the outside can be suppressed and leakage of the outside of the molding member 181 .

The second transparent film 330 may be disposed on the inner side of the second side wall 18 of the concave portion 160. The upper surface of the second transparent film 330 may be disposed on the same horizontal surface as the upper surface of the body 110, or may be disposed higher or lower.

Fig. 23 is a modification of the light emitting device having the optical plate according to the embodiment, and Figs. 24A and 24B are examples of the bottom view of the optical plate of Fig. 23. Fig.

23 and 24, the optical plate 303 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 303 includes a first transparent film 320, a second transparent film 330 and a phosphor layer 340. This optical plate 303 is a modification of the first transparent film, in which the support is removed in the structure of Fig.

The optical plate 303 is disposed in the recess 160 and disposed above the first sidewall 17 of the recess 160 and disposed inside the second sidewall 18.

The first transparent film 320 has an open region 325 on the inner side and an inner lower portion 346 of the phosphor layer 340 can protrude through the open region 325. The inner open region 325 of the first transparent film 320 may have a bottom view shape in a circular or polygonal shape, but the present invention is not limited thereto.

The open region 325 of the first transparent film 320 may be disposed along the inner side of the first transparent film 320 as shown in FIG. 24A. In this case, the inner side of the phosphor layer 340 The lower portion 346 may be disposed along the inner circumference of the first transparent film 320. As another example, the first transparent film 320 may be disposed on both sides of the open region 325, as shown in FIG. 24B. In this case, the inner lower portion 346 of the phosphor layer 340 May be disposed on the center side of the first transparent film 320. The first transparent film 320 may have a structure that is connected to the outside of the open region 325 as shown in FIG. 24A or a structure that is disposed on both sides of the open region 325 as shown in FIG. As shown in FIG. The first transparent film 320 and the inner lower portion 346 of the phosphor layer 340 may be in contact with the molding member 181 of FIG.

The length or width of the inner open region 325 of the first transparent film 320 may be narrower than the distance between the light emitting chips 171 and 172. The inner open region 325 of the phosphor layer 340 may be disposed in a region that does not overlap the light emitting chips 171 and 172 in the vertical direction. The inner open region 325 of the first transparent film 320 may be disposed on the gap portion 119 between the plurality of lead frames 121 and 131 to be larger than the width of the upper surface of the gap portion 119.

The inner lower portion 346 of the phosphor layer 340 may be in contact with the upper surface of the molding member 181. When the upper surface of the molding member 181 is in contact with the lower surface of the inner lower portion 346 of the phosphor layer 340 and the material of the phosphor layer 340 and the molding member 181 are the same material, The light loss can be reduced.

The first transparent film 320 may overlap the light emitting chips 171 and 172 in the vertical direction. The first transparent film 320 may reflect or transmit light incident from the light emitting chips 171 and 172.

Here, the length of the first transparent film 320 may be equal to the length Y3 of the concave portion 160. The width of the first transparent film 320 may be equal to the bottom width of the concave portion 160.

The first transparent film 320 may be spaced from the second side wall 18 of the recess 160. The outer surfaces of the phosphor layer 340 and the second transparent film 330 may be disposed on the second side wall 18 of the concave portion 160. The phosphor layer 340 is attached to the inner surface of the second sidewall 18 of the recess 160 so that moisture penetration from the outside can be suppressed and leakage of the outside of the molding member 181 .

The second transparent film 330 may be disposed on the inner side of the second side wall 18 of the concave portion 160. The upper surface of the second transparent film 330 may be disposed on the same horizontal surface as the upper surface of the body 110, or may be disposed higher or lower.

25 is a modification of the light emitting device having the optical plate according to the embodiment.

25, the optical plate 301 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 301 includes a first transparent film 320, a second transparent film 330, and a phosphor layer 340. This optical plate 301 is a form in which the support is removed in the structure of Fig.

The recess 160 has a sloped first side wall 17, a second side wall 18 between the first side wall 17 and the top surface 15, a second side wall 17 between the first and second side walls 17, And a seat portion 17A. The mounting portion 17A is disposed in a horizontal plane, and the outer circumference of the lower surface of the optical plate 301 may be disposed. The outer surface of the lower surface of the first transparent film 320 may be in contact with the seating portion 17A or the lower surface of the phosphor layer 340 may be in contact with the seating portion 17A. This seat portion 17A can support the outer circumference of the lower surface of the optical plate 301. [

The length of at least one of the first and second transparent films 320 and 330 may be equal to or longer than the length of the phosphor layer 340, but is not limited thereto. This embodiment can be selectively applied to the optical plate of the embodiments disclosed above.

26 is a modification of the light emitting device having the optical plate according to the embodiment.

Referring to FIG. 26, the optical plate 301 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 301 includes a second transparent film 330 and a phosphor layer 340. This optical plate 301 is a structure in which the support and the first transparent film are removed in the structure of Fig.

The recess 160 has a sloped first side wall 17, a second side wall 18 between the first side wall 17 and the top surface 15, a second side wall 17 between the first and second side walls 17, And a seat portion 17A. The mounting portion 17A is disposed in a horizontal plane, and the outer circumference of the lower surface of the optical plate 301 may be disposed. The outer surface of the lower surface of the phosphor layer 340 may be in contact with the seating portion 17A. This seat portion 17A can support the outer circumference of the lower surface of the optical plate 301. [

The phosphor layer 340 is disposed on the molding member 181 and the gap G1 between the phosphor layer 340 and the light emitting chips 171 and 172 can be maintained by the height of the upper surface of the molding member 181. [

The light emitting device 100B may have a step structure 18A on the second side wall 18 of the body 110. [ The step structure 18A may have a lower depth than the top surface 15 of the body 110 and may be disposed on the outer circumference of the upper surface of the second side wall 18. [ The outer circumference of the second transparent film 330 may be disposed in the step structure 18A. The length of the second transparent film 330 may be equal to or longer than the length of the phosphor layer 340, but is not limited thereto. The second transparent film 330 may be adhered to the step structure 18A with an adhesive member to prevent moisture penetration.

27 is a modification of the light emitting device having the optical plate according to the embodiment.

27, the optical plate 303 may be disposed in the concave portion 160 of the body 110 of the light emitting device 100B.

The optical plate 303 includes a first transparent film 320, a second transparent film 330 and a phosphor layer 340. This optical plate 303 is a structure in which the support is removed in the structure of Fig. 5, and the first transparent film is deformed.

The recess 160 has a sloped first side wall 17, a second side wall 18 between the first side wall 17 and the top surface 15, a second side wall 17 between the first and second side walls 17, And a seat portion 17A. The mounting portion 17A is disposed in a horizontal plane, and the outer circumference of the lower surface of the optical plate 301 may be disposed. The outer surface of the lower surface of the phosphor layer 340 may be in contact with the seating portion 17A. This seat portion 17A can support the outer circumference of the lower surface of the optical plate 301. [

The first transparent film 320 may be disposed between the phosphor layer 340 and the molding member 181. The second transparent film 320 can maintain the gap G2 with the light emitting chips 171 and 172 by the height of the upper surface of the molding member 181. [

The first transparent film 320 has an open region 326 having an open outer periphery and an outer lower portion 345 of the phosphor layer 340 may protrude through the open region 326. The first transparent film 320 may be disposed on the inner side of the phosphor layer 340 and may overlap the light emitting chips 171 and 172 in the vertical direction. The first transparent film 320 may reflect or transmit light incident from the light emitting chips 171 and 172. The outer lower portion 345 of the phosphor layer 340 may contact the molding member 181 to reduce the incident light loss. Here, the open region 326 of the first transparent film 320 will be described with reference to FIG. As another example, the first transparent film 320 may have an open region 325 as shown in FIG. 24, but the present invention is not limited thereto.

The length Y5 of the first transparent film 320 may be greater than the distance between the plurality of light emitting chips 171 and 172. The length Y5 of the first transparent film 320 may be greater than the distance between the areas of the cavities 125 and 135 of the plurality of lead frames 121 and 131 Lt; RTI ID = 0.0 > direction. ≪ / RTI > The first transparent film 320 may diffuse light incident from the light emitting chips 171 and 172.

The first transparent film 320 may be spaced from the second side wall 18 of the recess 160. The outer surfaces of the phosphor layer 340 and the second transparent film 330 may be disposed on the second side wall 18 of the concave portion 160. The phosphor layer 340 is attached to the inner side surface and the stepped portion 17A of the second sidewall 18 of the concave portion 160 so that moisture penetration from the outside can be suppressed, Can be prevented from leaking out.

The light emitting device 100B may have a step structure 18A on the second side wall 18 of the body 110. [ The step structure 18A may have a lower depth than the top surface 15 of the body 110 and may be disposed on the outer circumference of the upper surface of the second side wall 18. [ The outer circumference of the second transparent film 330 may be disposed in the step structure 18A. The length of the second transparent film 330 may be equal to or longer than the length of the phosphor layer 340, but is not limited thereto. The second transparent film 330 may be adhered to the step structure 18A with an adhesive member to prevent moisture penetration.

28 is an example in which an optical plate is provided in the light emitting element of Fig.

Referring to FIG. 28, the light emitting device 100C has an optical plate 301 disposed in a concave portion 160 of the body 110A. The recess 160 includes a first sidewall 17 and a second sidewall 18 between the first sidewall 17 and the upper surface 15 of the body 110A. A molding member 181 is disposed on the concave portion 160 and the optical plate 300 may be adhered on the molding member 181.

The second side wall 18 may be disposed outside the optical plate 301. The optical plate 301 according to the embodiment includes a first transparent film 320, a second transparent film 330, and a phosphor layer 340, in which the support is removed in the structure of FIG.

The phosphor layer 340 may be disposed between the first and second transparent films 320 and 330. The first transparent film 320 may be disposed below the phosphor layer 340 and the second transparent film 330 may be disposed on the phosphor layer 340. The optical plate 301 may be changed to any one of the optical plates of Figs. 16 to 27, but is not limited thereto.

Fig. 29 shows a structure having an optical plate in the light emitting element of Fig.

29, the light emitting device 400A has the optical plate 301 disposed in the concave portion 425 of the body 410. [ The light emitting device 400A will be described with reference to the configuration of FIG. 13, and the optical plate 301 may be selectively applied to the optical plates of FIGS.

FIG. 30 shows a structure having an optical plate in the light emitting device of FIG.

Referring to FIG. 30, the light emitting device 500A has the optical plate 301 disposed in the concave portion 517 of the body 510. FIG. The light emitting device 500A will be described with reference to FIG. 13, and the optical plate 301 may be selectively applied to the optical plate of FIGS. 16 to 27 disclosed in the embodiment.

FIG. 31 is a view showing an optical plate having a transflective mirror and an illumination device having a light emitting device according to the embodiment, and FIG. 32 is another example of the light emitting device of FIG.

31 and 32, the optical plate 300 may include a semi-transparent mirror 351 on the bottom surface thereof. The transflective mirror 351 may be disposed to face the light emitting chips 171 and 172 of the light emitting devices 100, 100A, 100B, and 100C described in the embodiment. The semi-transmissive mirror 351 may be disposed to overlap with the light emitting chips 171 and 172 of the light emitting devices 100, 100A, 100B, and 100C described in the embodiment in the vertical direction. The semi-transparent mirror 351 may be disposed on the lower surface of the first transparent film 320 or the phosphor layer 340 of the optical plate 300. The semi-transparent mirror 351 may be in contact with the molding member 181 when the light emitting device is provided with the molding member 181. The lower surface of the semi-transmissive mirror 351 may be disposed lower than the upper surface of the molding member 181.

The transflective mirror 351 may be disposed between the light emitting chips 171 and 172 and the first transparent film 320. The transflective mirror 351 may be disposed between the light emitting chips 171 and 172 and the phosphor layer 340.

The semi-transmissive mirror 351 transmits light incident from the light emitting chips 171 and 172 and reflects some light. The semi-transmissive mirror 351 may have a higher reflectivity than the transmittance.

The bottom surface of the transflective mirror 351 may be larger than the top surface area of the light emitting chips 171 and 172. Thus, the transflective mirror 351 transmits and reflects relatively high incident light. The width E4 of the transflective mirror 351 may be wider than the width of the light emitting chips 171 and 172. [

When a plurality of light emitting chips are provided, a plurality of the semi-transmitting mirrors 351 may be disposed on the respective light emitting chips 171 and 172 so as to face each other. The semi-transmissive mirror 351 may have a circular, polygonal, or elliptical top view shape, but is not limited thereto. Since the semi-transmissive mirror 351 diffuses the incident light, the semi-transmissive mirror 351 can be incident on the phosphor layer 340 of the optical plate 300 with a uniform light distribution.

31, a part of light emitted from the light emitting chips 171 and 172 is transmitted through the transflective mirror 351 and a part of the light is reflected by the transflective mirror 351 to form the lead frames 121 and 131 Lt; / RTI > can be re-reflected at the surface.

Some light emitted from the light emitting chips 171 and 172 is transmitted through the transflective mirror 351 and part of the light is reflected by the transflective mirror 351 to form flattened lead frames 121 and 131 Can be re-reflected by the surface. The semi-transmissive mirror 351 may be applied to the optical plate disclosed in the embodiment of Figs.

An illumination device or a light emitting device (hereinafter referred to as an illumination device) according to the embodiment can be applied to an illumination system. The lighting system includes a structure in which a plurality of lighting elements are arrayed, and includes a display device shown in Figs. 33 and 34, a lighting device shown in Fig. 35, and may include a lighting lamp, a traffic light, a vehicle headlight, have.

33 is an exploded perspective view of a display device having an illumination device according to the embodiment.

33, a display device 1000 according to an embodiment includes a light guide plate 1041, a light source module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041 and the light source module 1031 and the reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material, for example, acrylic resin such as PMMA (polymethylmethacrylate), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC) and polyethylene naphtha late Resin. ≪ / RTI >

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

At least one light source module 1031 is disposed in the bottom cover 1011 and may directly or indirectly provide light from one side of the light guide plate 1041. [ The light source module 1031 includes a substrate 1033 and an illumination device 1035 according to the above-described embodiment, and the illumination devices 1035 can be arrayed at a predetermined interval on the substrate 1033. [

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like. When the illumination element 1035 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the substrate 1033 can be removed. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.

The illumination device 1035 may be mounted on the substrate 1033 such that the light exit surface is spaced apart from the light guide plate 1041 by a predetermined distance, but the present invention is not limited thereto. The illumination device 1035 can directly or indirectly provide light to the light-incident portion, which is one surface of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflection member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light source module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the invention is not limited thereto.

34 is a diagram showing a display device having an illumination device according to an embodiment.

34, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the above-described illuminating device 1124 is arrayed, an optical member 1154, and a display panel 1155.

The substrate 1120 and the illumination device 1124 may be defined as a light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto. The light source module 1160 includes a substrate 1120 and a plurality of illumination elements 1124 arranged on the substrate 1120.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a polymethyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.

The optical member 1154 is disposed on the light source module 1160 and performs surface light source, diffusion, and light condensation of light emitted from the light source module 1160.

35 is an exploded perspective view of a lighting apparatus having a lighting element according to an embodiment.

35, the lighting device according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a lighting device according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 through which the plurality of light source portions 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light source unit 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and a protrusion 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.

The protrusion 2670 has a shape protruding outward from the other side of the base 2650. The protrusion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the protrusion 2670 may be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the protrusion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800.

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

100, 100A, 100B, 100C, 400, 400A, 500, 500A:
101: Lighting element
110, 110A, 410, 510: body
121, 131, 122, 132, 421, 423, 521, 523:
125, 135: Cavity
160, 425, 517:
171, 172, 470, 570: light emitting chip
181, 440, 531:
300, 301, 303: optical plate
310: Support
320,330: Transparent film
340: phosphor layer
351: Semi-transparent mirror

Claims (17)

A body having a recess;
A plurality of lead frames disposed in the concave portion of the body;
A light emitting chip on at least one of the plurality of lead frames;
A molding member disposed in the recess; And
An optical plate spaced from the light emitting chip in the concave portion,
Wherein the recess comprises a sloped first sidewall adjacent the leadframe and a second sidewall disposed between an upper surface of the body and the first sidewall,
A second side wall of the concave portion is disposed outside the optical plate,
Wherein the optical plate includes a phosphor layer, and a transparent film disposed on at least one of an upper surface and a lower surface of the phosphor layer. The method according to claim 1,
Wherein the transparent film includes a first transparent film disposed on a lower surface of the phosphor layer. The method according to claim 1,
Wherein the transparent film includes a first transparent film disposed between the phosphor layer and the molding member, and a second transparent film disposed on the upper surface of the phosphor layer. The method according to claim 2 or 3,
And a stepped structure disposed between an upper surface of the body and a second side wall of the concave portion,
And the outer perimeter of the second transparent film is disposed in a stepped structure. The method according to claim 2 or 3,
And a horizontal stepped portion between the first side wall and the second side wall of the concave portion,
And the outside of the lower surface of the phosphor layer is disposed in the step portion. The method of claim 3,
And a stepped portion disposed between the first sidewall and the second sidewall of the concave portion,
And the outside of the lower surface of the first transparent film is disposed in the step portion. 4. The method according to any one of claims 1 to 3,
And the second sidewall contacts the outer surface of the phosphor layer. The method according to claim 2 or 3,
The inner side surface of the first sidewall being inclined at a first angle relative to the optical axis,
The inner side surface of the second sidewall being inclined at a second angle relative to the optical axis,
Wherein the second angle is smaller than the first angle. 9. The method of claim 8,
And an adhesive member between the second transparent film and the second sidewall. 4. The method according to any one of claims 1 to 3,
Wherein an upper surface of the body is equal to or lower than an upper surface of the optical plate. 3. The method of claim 2,
Wherein the first transparent film has an open region on the outer side of which an outer lower portion of the phosphor layer protrudes. 12. The method of claim 11,
And the outer bottom of the first transparent film and the phosphor layer contacts the molding member. 3. The method of claim 2,
Wherein the first transparent film has an open region in which an inner lower portion of the phosphor layer protrudes inside. 14. The method of claim 13,
And the inner lower portion of the first transparent film and the phosphor layer is in contact with the molding member. 4. The method according to any one of claims 1 to 3,
And a semi-transmissive mirror that reflects and transmits light incident on a region facing the light emitting chip, out of a region between the optical plate and the molding member,
Wherein the semi-transparent mirror has a bottom area smaller than a bottom area of the phosphor layer. 4. The method according to any one of claims 1 to 3,
Wherein the transparent film comprises a glass material. Board; And
A plurality of light emitting devices on the substrate,
The light source module according to any one of claims 1 to 3,

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