KR20170052199A - Optical plate, lighting device, and lighting module - Google Patents

Abstract

A lighting device according to an embodiment of the present invention includes: a light emitting device which has a light emitting chip; and an optical plate which has a transflective mirror facing the light emitting chip on the light emitting device. The optical plate includes: a phosphor layer; a first transparent film under the phosphor layer; and a reflector surrounding a lateral side of the phosphor layer. The transflective mirror is arranged on a partial region of the first transparent film to face the light emitting chip and reflects and transmits incident light. The transflective mirror has a lower side area which is larger than an upper side area of the light emitting chip. Accordingly, the present invention can increase the lifetime of a phosphor by separating the optical plate from the light emitting chip.

Description

[0001] OPTICAL PLATE, LIGHTING DEVICE, AND LIGHTING MODULE [0002]

An embodiment relates to an optical plate.

Embodiments relate to an illumination device having an optical plate and a light source module having the same.

BACKGROUND ART Light emitting devices, for example, light emitting diodes (LEDs) are a kind of semiconductor devices that convert electrical energy into light, and have been attracting attention as a next generation light source in place of conventional fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor device, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten or a fluorescent lamp that generates ultraviolet rays generated by high-pressure discharge .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode. The light emitting diode has been increasingly used as a light source for various lamps used in indoor and outdoor, lighting devices such as a liquid crystal display, have.

An embodiment provides an optical plate having a semi-transmissive mirror that reflects and transmits incident light.

An embodiment provides an illumination element having an optical plate having a semi-transmissive mirror on a light-emitting element.

An embodiment provides an illumination device having an optical plate having a translucent mirror on a light emitting element and a support plate for supporting the optical plate.

Embodiments provide an optical plate for diffusing and wavelength-converting incident light onto a light-emitting element and an illumination element having the optical plate.

An optical plate according to an embodiment includes: a phosphor layer; A first transparent film below the phosphor layer; A second transparent film on the phosphor layer; A reflector disposed between the first and second transparent films to surround a side surface of the phosphor layer; And a semi-transmissive mirror disposed in a partial area of the first transparent film and reflecting and transmitting incident light, wherein the semi-transmissive mirror is disposed facing the light source, and the semi-transmissive mirror has a lower surface area Has a smaller bottom area.

An illumination device according to an embodiment includes: a light emitting element having a light emitting chip; And an optical plate having a transflective mirror facing the light emitting chip on the light emitting element, the optical plate comprising: a phosphor layer; A first transparent film below the phosphor layer; And a reflector surrounding a side surface of the phosphor layer, wherein the transflective mirror is disposed in a part of the first transparent film so as to face the light emitting chip, and reflects and transmits the incident light, And a bottom surface area larger than the top surface area of the light emitting chip.

The light source module according to the embodiment includes the optical plate or the illumination element.

The embodiment can increase the lifetime of the phosphor by allowing the optical plate to be spaced from the light emitting chip.

Embodiments can prevent a hot spot by disposing a semi-transmissive mirror in a region where a light amount incident from the light emitting chip is large in a region of the optical plate.

The embodiment can wavelength-convert and diffuse the light incident by the optical plate.

Embodiments can improve the reliability of the light emitting device and the lighting device having the same.

The embodiment can improve the reliability of the lighting apparatus in which the lighting elements are arranged.

1 is a perspective view of a lighting device according to a first embodiment.
2 is a plan view showing an example of a light emitting device of the illumination device of FIG.
3 is a side cross-sectional view of the light emitting device of Fig.
4 is another cross-sectional side view of the light emitting device of Fig.
Fig. 5 is an exploded perspective view of the optical plate of the illumination device of Fig. 1;
Fig. 6 is a bottom view of the optical plate of the illumination device of Fig. 1;
7 is an assembled perspective view of the illumination device of Fig.
8 is a cross-sectional view of the illumination device of Fig. 7 on the AA side.
Fig. 9 is a view for explaining the illuminating element of Fig. 8;
10 is a sectional view of the illumination device of Fig. 7 on the BB side.
11 is a view for explaining a light extraction path in the illumination device of Fig.
12 is another example of an optical plate in the illuminating element of Fig.
13 is another example of an optical plate in the illuminating element of Fig.
14 is a side cross-sectional view to which another light emitting element is applied to the illumination element of Fig.
15 is another cross-sectional side view of the illumination device of Fig.
FIG. 16 is a view for explaining the light extraction path of the illumination device of FIG. 14; FIG.
17 is a perspective view showing the illumination device according to the second embodiment.
FIG. 18 is a plan view showing the optical and support plates in the illumination device of FIG. 17; FIG.
Fig. 19 is a cross-sectional side view of the optical and plate cover of Fig. 18; Fig.
Fig. 20 is a cross-sectional side view of the optical and plate cover of Fig. 18; Fig.
21 is an assembled perspective view of the illumination device of Fig.
22 is a CC side sectional view of the illumination device of Fig.
23 is a DD side sectional view of the illumination device of Fig.
24 is a view showing an example of a first shape of a semi-transmissive mirror of an optical plate according to an embodiment.
25 is a graph showing the optical energy density according to the reflectance of the semi-transmission mirror in the optical plate of FIG.
26 (a) - (e) are diagrams showing the light energy distribution according to the reflectance of the semi-transmission mirror in the optical plate of Fig.
27 is a view showing an example of a second shape of a semi-transmission mirror of an optical plate according to the embodiment.
28 is a graph showing the optical energy density according to the reflectance of the transflective mirror in the optical plate of FIG.
Fig. 29 (a) - (e) are diagrams showing light energy distributions according to reflectance of a semi-transmissive mirror in the optical plate of Fig.
30 is a view showing an example of a third shape of the semi-transmissive mirror of the optical plate according to the embodiment.
31 is a graph showing the optical energy density according to the reflectance of the transflective mirror in the optical plate of FIG.
32 (a) - (e) are diagrams showing the light energy distribution according to the reflectance of the transflective mirror in the optical plate of Fig. 30.
FIGS. 33 (a) to 33 (c) are diagrams showing the light energy distribution according to the size of the transflective mirror in the optical plate according to the embodiment.
Fig. 34 is a diagram showing a light energy distribution in an optical plate to which the light emitting device of Fig. 8 is applied.
Fig. 35 is a diagram showing light energy distribution in an optical plate to which the light emitting device of Fig. 14 is applied.
Figs. 36 (a) to 36 (d) are diagrams for explaining light energy distribution in an optical plate having no semi-transmissive mirror in a comparative example.
37 is a side sectional view showing a lighting device according to the third embodiment.
38 is a side sectional view showing the illumination device according to the fourth embodiment.
39 is a perspective view showing a display device having an illumination device according to the embodiment.
40 is a perspective view showing a display device having an illumination device according to an embodiment.
41 is an exploded perspective view showing a lighting device having a lighting device according to the embodiment.

In the description of the embodiments, each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, Quot; on "and" under "include both being formed" directly "or" indirectly " . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied. BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG.

Hereinafter, an illumination device according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of a lighting device according to a first embodiment, FIG. 2 is a plan view showing an example of a light emitting device of the lighting device of FIG. 1, FIG. 3 is a side sectional view of the light emitting device of FIG. FIG. 5 is an exploded perspective view of the optical plate of the illumination device of FIG. 1, FIG. 6 is a bottom view of the optical plate of the illumination device of FIG. 1, and FIG. 9 is a cross-sectional view of the illumination device of FIG. 7, FIG. 9 is a view illustrating the illumination device of FIG. 8, and FIG. 10 is a cross-sectional view of the BB of the illumination device of FIG. 7 .

1 to 10, an illumination device 101 includes a light emitting device 100 that emits light, and an optical plate 300 that is disposed on the light emitting device 100 and diffuses and wavelength-converts the incident light to emit the light. ).

The light emitting device 100 may emit at least one of ultraviolet light, blue light, green light, and red light, and may emit light having a short wavelength such as ultraviolet light or blue light.

2 to 4, the light emitting device 100 includes a body 110 having a concave portion 160, a plurality of lead frames 121 and 131 in the concave portion 160, And at least one light emitting chip (171, 172).

The body 110 may include an insulating material or a conductive material. The body 110 may include at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al ₂ O ₃ ), a printed circuit board Can be formed. For example, the body 110 may be made of a resin material such as polyphthalamide (PPA), epoxy, or silicone. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the epoxy or silicon material used as the body 110 to enhance the reflection efficiency. The body 110 may include a ceramic material.

The body 110 includes a recess 160 having a predetermined depth. The recess 160 may be formed in the shape of a concave cup structure, a cavity structure, or a recess structure from the top surface 15 of the body 10, but the present invention is not limited thereto. The side walls of the recess 160 may be perpendicular or inclined with respect to the bottom, and two or more side walls may be formed with an inclination.

The shape of the body 110 may be a polygonal structure such as a triangle, a rectangle, or a pentagon, or may have a circular or curved shape. The shape of the concave portion 160 viewed from the top may be a circular shape, an elliptical shape, a polygonal shape (e.g., a square shape), and a polygonal shape with a curved corner.

The body 110 may include a plurality of side portions, for example, four side portions 11, 12, 13 and 14. At least one of the plurality of side portions 11, 12, 13, and 14 may be disposed perpendicular or inclined with respect to the lower surface of the body 110. The first side surface portion 11 and the second side surface portion 12 are opposite to each other, and the third side surface portion 11, the second side surface portion 12, (13) and the fourth side surface portion (14) are opposite to each other. The length Y1 of each of the first side surface portion 11 and the second side surface portion 12 may be different from the width X1 of the third side surface portion 13 and the fourth side surface portion 14, 11 and the second side surface portion 12 may be shorter than the maximum length Y2 of the light emitting device 100 and the width X1 of the third side surface portion 13 and the fourth side surface portion 14 As shown in FIG.

The length Y1 of the first side surface portion 11 or the second side surface portion 12 may be the interval between the third side surface portion 13 and the fourth side surface portion 14, The longitudinal direction of the body 110 is orthogonal to the width direction.

The light emitting device 100 may be arranged such that the maximum length Y2 is longer than the width X1 by two or more times, for example, three times or more, and the plurality of light emitting chips 171 and 172 may be arranged in the longitudinal direction.

A plurality of lead frames 121 and 131 are disposed in the concave portion 160 of the body 110. The plurality of lead frames 121 and 131 include at least two or three or more metal frames, and may include first and second lead frames 121 and 131, for example. The first and second lead frames 121 and 131 may be separated by a gap portion 119.

One or a plurality of light emitting chips 171 and 172 may be disposed in the recess 160. The plurality of light emitting chips 171 and 172 may include at least two or three or more LED chips, and may include first and second light emitting chips 171 and 172, for example. The plurality of light emitting chips 171 and 172 may be selectively connected to the plurality of lead frames 121 and 131. Each of the light emitting chips 171 and 172 may be defined as a light source.

The first lead frame 121 may include a first cavity 125 having a lower depth than the bottom 16 of the recess 160. The first cavity 125 may have a concave shape such as a cup shape or a recess shape from the bottom 16 of the concave portion 160 to the bottom direction of the body 110.

The sidewall and bottom of the first cavity 125 are formed by the first lead frame 121 and the peripheral sidewall of the first cavity 125 may be formed to be inclined from the bottom of the first cavity 125 have. Two opposed sidewalls of the sidewalls of the first cavity 125 may be inclined at the same angle or may be inclined at different angles.

The second lead frame 131 is formed with a concave second cavity 135 having a lower depth than the bottom 16 of the cavity 160. The second cavity 135 may have a concave shape in the bottom surface of the body 110 from the bottom surface 16 of the concave portion 160 or the upper surface of the second lead frame 131, Or a recess shape. The bottom and sidewalls of the second cavity 135 may be formed by the second lead frame 131 and the sidewalls of the second cavity 135 may be formed obliquely from the bottom of the second cavity 135 . The corresponding two sidewalls of the sidewalls of the second cavity 135 may be inclined at the same angle or inclined at different angles.

The bottom shapes of the first cavity 125 and the second cavity 135 may be polygonal, polygonal having a partial curved surface, circular or elliptical, but are not limited thereto.

A lower surface of the first lead frame 121 and the second lead frame 131 may be exposed to the lower portion of the body 110 and may be disposed on the same plane as the lower surface of the body 110, have. The first lead frame 121 and the second lead frame 131 partially include the opposite sides of the bottom surfaces of the first and second cavities 125 and 135.

The first lead frame 121 may include a first lead portion 123 and the first lead portion 123 may protrude from the third side portion 13 of the body 110. The second lead frame 131 may include a second lead portion 133 and the second lead portion 133 may protrude from the fourth side portion 14 of the body 110. One or a plurality of the first lead portions 123 may protrude, and one or a plurality of the second lead portions 133 may protrude. The first and second lead portions 123 and 133 may protrude in opposite directions with respect to the concave portion 162).

The first lead frame 121 and the second lead frame 131 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, And may include at least one of tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorous (P). The thickness of the first and second lead frames 121 and 131 may be 0.15 mm or more, for example, 0.18 mm to 1.5 mm. When the thickness of the first and second lead frames 121 and 131 is less than 0.15 mm, injection molding is difficult. In addition, when the thickness of the first and second lead frames 121 and 131 exceeds 1.5 mm, the thickness (t1 in FIG. 4) of the light emitting device 100 can be increased and the size thereof can be increased, . If the thicknesses of the first and second lead frames 121 and 131 are less than 1.5 mm, the electrical characteristics and heat dissipation characteristics may be deteriorated.

The thicknesses of the first and second lead frames 121 and 131 may be the same, but the present invention is not limited thereto. The first and second lead frames 121 and 131 function as a lead frame for supplying power. In addition to the first and second lead frames 121 and 131, a metal frame for radiating heat or an intermediate frame for electrically connecting between the first and second lead frames 121 and 131 may be further disposed in the recess 160, It is not limited thereto.

A first light emitting chip 171 is disposed in the first cavity 125 of the first lead frame 121. For example, the first light emitting chip 171 is bonded to the first cavity 125 with an adhesive But it is not limited thereto. A second light emitting chip 172 is disposed in the second cavity 135 of the second lead frame 131. For example, the second light emitting chip 72 is bonded to the second cavity 35 with an adhesive But it is not limited thereto. The adhesive may be an insulating adhesive or a conductive adhesive. The insulating adhesive may include a material such as epoxy or silicone, and the conductive adhesive may include a bonding material such as solder.

The first and second light emitting chips 171 and 172 may selectively emit light in the range of the visible light band to the ultraviolet light band. For example, an ultraviolet LED chip, a red LED chip, a blue LED chip, a green LED chip, ) LED chips, and white LED chips. The first and second light emitting chips 171 and 172 include an LED chip including at least one of a compound semiconductor of group III-V elements and a compound semiconductor of group II-VII elements. The first and second light emitting chips 171 and 172 may be a horizontal chip structure in which two electrodes in the chip are disposed adjacent to each other, or may be arranged as vertical chips disposed on opposite sides, but the invention is not limited thereto.

2, 3, and 8, the first light emitting chip 171 includes a first lead frame 121 disposed on the bottom 16 of the concave portion 160 with a first wire 173, And may be connected to the second lead frame 131 by the second wire 174, but the present invention is not limited thereto. The second light emitting chip 172 may be connected to the first lead frame 121 by a third wire 175 and may be connected to the second light emitting chip 172 by a fourth wire 176 disposed on the bottom 16 of the recess 160 And may be connected to the second lead frame 131, but the present invention is not limited thereto.

The light emitting device 100 may include a protection device. The protection element may be disposed on a part of the first lead frame 121 or the second lead frame 131. The protection device may be implemented with a thyristor, a zener diode, or a TVS (Transient Voltage Suppression), and the zener diode protects the light emitting chips 171 and 172 from electrostatic discharge (ESD). The protection element may be connected in parallel to the connection circuit of the first light emitting chip 171 and the second light emitting chip 172. The protection element may be disposed inside the body 110, but is not limited thereto.

The molding member 181 may be formed in the concave portion 160, the first cavity 125, and the second cavity 135. The molding member 181 includes a light-transmitting resin layer such as silicon or epoxy, and may be formed as a single layer or a multi-layer.

The surface of the molding member 181 may be formed in a flat shape, a concave shape, a convex shape, or the like, but is not limited thereto.

The molding member 181 may be a phosphor-free layer. The molding member 181 may include a diffusing agent or a scattering agent other than the phosphor. When the molding member 181 has a phosphor, the phosphor is disposed adjacent to the light emitting chips 171 and 172, thereby deteriorating the phosphor due to heat generated from the light emitting chips 171 and 172. Such deterioration of the phosphor can change the color temperature and the color coordinates, and can lower the reliability of the light emitting element 100. [ The embodiment can provide the phosphor in the optical plate 300 spaced apart from the light emitting chips 171, 172. As another example, the molding member 181 on the light emitting chips 171, 172 can be removed.

5 to 10, the optical plate 300 includes a frame-shaped reflector 310 having an open area 342, a phosphor layer 340, a reflector 310, Transparent films 320 and 330 disposed on at least one of the upper surface and the lower surface of the phosphor layer 340 and a transflective mirror 351 and 353 facing the light source under the phosphor layer 340.

The thickness of the optical plate 300 may range from 0.7 mm or more, for example, 0.7 mm to 1.5 mm. When the thickness of the optical plate 300 is less than 0.7 mm, it is difficult to secure the thickness of the phosphor layer 340 and the wavelength conversion efficiency is lowered. When the thickness exceeds 1.5 mm, Increasing the thickness of the films 320 and 330 may cause optical loss.

The reflector 310 includes an open region 342 therein, and the outer shape of the reflector 310 may include a circular frame or a polygonal frame. The open region 342 may include a circular or polygonal shape. 8 to 10, the open region 342 has a shape corresponding to the shape of the concave portion 160 of the light emitting device 100, and the light emitted through the concave portion 160 is incident . The reflector 310 may be formed to surround the side surface of the phosphor layer 340. The lower surface area of the open area 342 may be equal to or smaller than the upper surface or the light exit surface of the molding member 160.

The reflector 310 may include a glass material such as a white glass or a glass material having a high reflectance. The white glass or the glass material having high reflectance can be formed by adding white particles and / or bubbles into the transparent glass. The reflectance of the reflector 310 may be higher than that of the transparent films 320 and 330.

As another example, the reflector 310 may include a resin material, and the resin material may include a resin material such as polyphthalamide (PPA), an epoxy or a silicone material. A metal oxide such as TiO ₂ , SiO ₂ or a metal oxide or a white particle filler may be added to the resin material. The reflector 310 may be made of a white resin. The reflector 310 may include a ceramic material.

As another example, the support 310 may be a light-transmitting material, for example, a transparent glass material or a transparent resin material. The support 310 may be made of a resin material such as silicon or epoxy. When the support 310 is made of a light-transmitting material, the incident light can be emitted through the side surface, thereby providing wide light directivity.

As another example, a metal reflective layer may be disposed on the inner surface or the inner surface / lower surface of the support 310, and the reflective layer may effectively reflect the incident light. At this time, the support 310 may be made of a translucent material or a reflective material.

 At least one of the inner surface and the outer surface of the support 310 may be formed as a vertical or inclined surface, but the present invention is not limited thereto. The distance W1 between the inner side surface and the outer side surface of the support body 310 in the longitudinal direction may be in a range of 0.4 mm or more, for example, 0.45 mm to 0.6 mm. When the support body 310 is smaller than this range, If it is difficult and larger than the above range, material waste can be caused. The distance W1 may be the width of the outer frame of the open area 342 of the support 310. [

The distance W2 between the inner side surface and the outer side surface of the support 310 in the width direction may be equal to or smaller than the gap W1, but is not limited thereto. The intervals W2 and W1 may vary depending on the recess size of the light emitting device, but are not limited thereto.

The inner surface of the support 310, for example, the surface that contacts the phosphor layer 340, may be disposed perpendicular or inclined with respect to the lower surface of the first transparent film 320. When the inner surface of the support 310 is inclined, the top surface width or the top surface area of the phosphor layer 340 may be larger than the bottom width or the bottom surface area.

The phosphor layer 340 may include a phosphor in a resin material such as transparent silicon or epoxy. The phosphor layer 340 converts the wavelength of light emitted from the light emitting chips 171 and 172. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors, or may include different types of phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 may include a quantum dot. The quantum dot may include an II-VI compound or a III-V compound semiconductor, and may include at least one of red, green, yellow, and red quantum dots or different types.

The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof. Since the quantum dots have a large change in the luminous efficiency depending on the temperature, the quantum dots can be separated from the light emitting chips 171 and 172 as in the embodiment, thereby reducing the change in luminous efficiency.

Transparent films 320 and 330 may be disposed on at least one or both of the phosphor layer 340 and the phosphor layer 340. The transparent films 320 and 330 may include a first transparent film 320 disposed under the fluorescent layer 340 and a second transparent film 330 disposed on the fluorescent layer 340. The transparent films 320 and 330 may be disposed on the incident surface and / or the emission surface of the phosphor layer 340. In this optical plate 300, any one of the first and second transparent films 320 and 330 may be removed, for example, the second transparent film 330 may be removed, but the present invention is not limited thereto.

The first and second transparent films 320 and 330 may include glass or a transparent resin film. The first and second transparent films 320 and 330 are bonded on the reflector 310 to protect the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 181. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 181 of 0.2 or less. The first and second transparent films 320 and 330 may have a refractive index lower than that of the molding member 181 and the phosphor layer 340.

The first transparent film 320 may be adhered to the lower surface of the reflector 310 and the lower surface of the phosphor layer 340. The second transparent film 330 may be adhered to the upper surface of the reflector 310 and the upper surface of the phosphor layer 340.

The thickness of the first and second transparent films 320 and 330 may be 0.05 mm or more, for example, 0.08 mm to 0.2 mm. If the thickness of the first and second transparent films 310 and 330 is less than 0.05 mm, handling may be difficult and stiffness may be caused. When the thickness exceeds 0.2 mm, the thickness of the optical plate 300 becomes thick The light transmittance may be lowered. The thickness of the first and second transparent films 320 and 330 may be the same or different from each other. If the thicknesses of the first and second transparent films 320 and 330 are different from each other, the first transparent film 320 may have a thickness greater than that of the second transparent film 330. This is because the thickness of the first transparent film 320 is thicker than the thickness of the second transparent film 330 so that it can be stably bonded to the light emitting device 100.

The first and second transparent films 320 and 330 may be formed on the upper surface and the lower surface of the reflector 310. In this case, Can be contacted.

The phosphor layer 340 may be thinner than the reflector 310. The reflector 310 may protrude from the outer periphery of the first and second transparent films 320 and 330, but the present invention is not limited thereto.

The transflective mirrors 351 and 353 may include a metal material such as aluminum (Al) or silver (Ag) material capable of performing a semi-transmissive function. The transflective mirrors 351 and 353 may be formed of a material having a reflectance higher than that of the transmissivity. Here, when the sum of transmittance and reflectance is 100%, the reflectance of the transflective mirrors 351 and 353 may exceed 50%.

The semi-transmission mirrors 351 and 353 may include a diffusion sheet. An undulation pattern may be formed on the lower surface of the transflective mirrors 351 and 353, that is, on the light incident surface, but the present invention is not limited thereto. These semi-transmissive mirrors 351 and 353 may be defined as a half mirror sheet, a semi-transparent mirror, a polarizing sheet, or a translucent diffusion sheet. The transflective mirrors 351 and 353 may be formed by screen printing under the first transparent film 320, but the present invention is not limited thereto.

The transflective mirrors 351 and 353 may be disposed under the first transparent film 320, for example, below the phosphor layer 340. One or a plurality of the transflective mirrors 351 and 353 may be disposed under the first transparent film 320. For example, the number of the transflective mirrors 351 and 353 may be the same as the number of the light emitting chips 171 and 172. The transflective mirrors 351 and 353 may be disposed to face the light source, for example, facing the light emitting chips 171 and 172, respectively.

The semi-transmission mirrors 351 and 353 reflect and transmit the light incident from the light emitting device 100. The semi-transmissive mirrors 351 and 353 may be disposed in a region where the light amount of the light source incident on the optical plate 300 is a maximum, so that a part of the incident light is transmitted and the remaining light is reflected.

By disposing the transflective mirrors 351 and 353 in the regions where the light amounts of the light emitting chips 171 and 172 are the highest, such an optical plate 300 can reduce the problem of deterioration of the fluorescent substance and quantum dots by light generated from the light emitting chips 171 and 172 And can reduce the optical loss. Further, the color conversion by the fluorescent substance and the quantum dot can prevent the lowering of the light efficiency and the lowering of the color correction index. As another example, the transflective mirrors 351 and 353 may be disposed on the upper surface of the molding member 181 so as to face the light emitting chips 171 and 172, but the present invention is not limited thereto.

As shown in FIG. 6, the transflective mirrors 351 and 353 are arranged in a first direction (or a longitudinal direction) when a plurality of the transflective mirrors 351 and 353 are arranged, and each of the transflective mirrors 351 and 353 has a length E4 in the first direction, Width (E5). The linear distance G3 between the centers of the plurality of transflective mirrors 351 and 353 may be set to be not more than twice the length E4 and the linear distance G3 is set to be equal to or less than the center of the light emitting chips 171 and 172 May be the same as the straight line distance between them.

The optical plate 300 according to the embodiment can be provided at a thickness thinner than the thickness of the light emitting element 100 (t1 in Fig. 4), and can function as an illumination plate or a fluorescent plate on the light emitting element 100. [

The optical plate 300 may be coupled to the light emitting device 100 as shown in FIGS. The optical plate 300 may be attached to the upper surface of the body 110 of the light emitting device 100. 9, the length D2 of the optical plate 300 in the first direction may be shorter than the maximum length Y2 of the light emitting device 100 in the first direction, and the length Y1 of the body 110 ) May be formed. The length Y1 of the body 110 may be a length of a lower portion of the body 110 and may be a maximum length. The optical plate 300 may be disposed on the upper surface 15 of the body of the light emitting device 100. For example, the bottom surface area of the optical plate 300 may be the same as or different from the top surface area of the body 110. The length of the bottom surface of the optical plate 300 may be the same as or different from the length of the top surface of the body 110. The length of the phosphor layer 310 may be shorter than the length of the top surface of the body 110.

The width D3 of the optical plate 300 in the second direction is narrower than the width X4 of the light emitting element 100 in the second direction, And can be seated on the upper surface 15. The reflector 310 of the optical plate 300 may overlap the upper surface 15 of the body 110 in the vertical direction. The first transparent film 320 may be disposed on the upper surface of the body 110. For example, the lower surface of the lower surface of the first transparent film 320 may be adhered to the upper surface of the body 110 with an adhesive . At least one of the reflector 310 and the first transparent film 320 may be adhered to the upper surface of the body 110 with an adhesive.

The area of adhesion between the lower surface of the optical plate 300 and the upper surface 15 of the body may be maximized to reduce the flow of the optical plate 300. The outer surface of the optical plate 300 may be adhered to the upper surface of the body 110 as an adhesive.

8 and 9, the optical plate 300 includes the phosphor layer 340 disposed in a region corresponding to the concave portion 160 of the light emitting device 100, and the light emitting chip 171, The semitransparent mirrors 351 and 353 may be disposed in a region where the semi-

The transflective mirrors 351 and 353 may be disposed between the light emitting chips 171 and 172 and the first transparent film 320. The semi-transparent mirrors 351 and 353 may be disposed between the molding member 181 and the first transparent film 320. The molding member 181 may be disposed under the first transparent film 320.

The semi-transparent mirrors 351 and 353 may be in contact with the molding member 181 of the light emitting device 100. The lower surfaces of the semi-transparent mirrors 351 and 353 may be disposed lower than the upper surface of the molding member 181. The lower surfaces of the transflective mirrors 351 and 353 may be disposed closer to the light emitting chips 171 and 172 than the upper surface of the molding member 181.

The molding member 181 may be in contact with the lower surfaces of the transflective mirrors 351 and 353 and the first transparent film 320.

9 and 10, the length D1 of the phosphor layer 340 in the first direction may be equal to or less than the length Y3 of the recess 160 in the first direction. The width D4 of the phosphor layer 340 in the second direction may be equal to or less than the width X2 of the recess 160 in the second direction. The length D1 of the phosphor layer 340 in the first direction may be greater than the width D4 of the second direction. The phosphor layer 340 may overlap with the concave portion 160 in the vertical direction. Accordingly, the phosphor layer 340 can effectively convert the wavelength of light emitted through the concave portion 160 of the light emitting device 100.

The length E4 of the transflective mirrors 351 and 353 may be longer than the length E1 of the light emitting chips 171 and 172 and narrower than the bottom width B1 of the cavities 125 and 135. [ The length E4 is in a range of 1 time or more, for example, 1 time to 2 times the length B1. When the length E4 is smaller than the above range, the light diffusion effect by the transflective mirrors 351 and 353 is insignificant, If it is larger than the above range, interference may occur between the light emitted from the adjacent light emitting chips 171 and 172.

The width E5 of the transflective mirrors 351 and 353 may be greater than the width E2 of the light emitting chips 171 and 172 and narrower than the bottom width B2 of the cavities 125 and 135. [ The width E5 is in a range of 1 times or more, for example, 1 to 2 times the width B2. When the width E5 is smaller than the range, the light diffusion effect by the transflective mirrors 351 and 353 is insignificant. If the width is larger than the above range, there is a problem that the distribution of diffused light is not uniform and the difference in width from the width E4 of the concave portion 160 is not large.

The width E5 of the transflective mirrors 351 and 353 may be 0.65 or less, for example, 0.34 to 0.62 times the width X2 of the recess 160. If the width E5 is smaller than the above range, the light diffusion effect is insignificant. If the width E5 is larger than the above range, there is a problem that the light diffusion distribution is not uniform.

The length E4 of the transflective mirrors 351 and 353 is longer than the width E5 and the ratio of the length E4 to the width E5 of the transflective mirrors 351 and 353 is in the range of 1: 0.5 to 2: 1.4 . The ratio of the length E4 and the width E5 may be the same as the ratio of the length B1 and the width B2 of the light emitting chips 171 and 172. [

The semi-transmissive mirrors 351 and 353 can be disposed on the light emitting chips 171 and 172 so that the lower surface area thereof is larger than the upper surface area of the light emitting chips 171 and 172. The light emitted from the light emitting chips 171 and 172 is transmitted or reflected And the reflected light may be reflected by the lead frames 121 and 131 and re-incident on the optical plate 300. [ Since the length E4 of the transflective mirrors 351 and 353 is narrower than the bottom width B1 of the cavities 125 and 135, the light reflected from the transflective mirrors 351 and 353 passes through the lead frame The light incident on the surfaces of the cavities 125 and 135 may be reflected in the other direction by the bottom surface and the inclined side surface of the cavities 125 and 135.

The bottom surface area of the transflective mirrors 351 and 353 may be larger than the top surface area of the light emitting chips 171 and 172. That is, the first transflective mirrors 351 and 353 may be disposed on the first light emitting chip 171 in an area larger than the area of the first light emitting chip 171, and the second transflective mirrors 351 and 353 may be disposed on the first light emitting chip 171, And may be disposed on the second light emitting chip 172 in an area larger than the area of the second light emitting chip 172.

The distance G1 between the transflective mirrors 351 and 353 and the light emitting chips 171 and 172 may be in a range of 1 mm or less, for example, 0.2 mm to 1 mm. If the gap G1 between the light emitting chips 171 and 172 and the semi-transmissive mirrors 351 and 353 is smaller than the above range, the thickness of the body 110 may be thinned to make it hard to secure rigidity and cause a problem of phosphor deterioration. There may be a problem that the thickness t1 of the light emitting element 100 becomes thick and the light diffusion effect by the transflective mirrors 351 and 353 may be insignificant.

The transflective mirrors 351 and 353 according to the embodiment are disposed on the respective light emitting chips 171 and 172 in such a manner that the light emitted from the light emitting chips 171 and 172 is dispersed to be dispersed through the first transparent film 320, So that light can be incident on the phosphor layer 340. Accordingly, the light irradiated onto the illumination element 101 can have a uniform distribution.

The optical plate 300 according to the embodiment transmits and reflects the light emitted from the light emitting chips 171 and 172 by the transflective mirrors 351 and 353 and the reflected light is reflected in the light emitting device 100, Can be transmitted to the peripheral area of the semi-transmission mirrors 351 and 353.

12 is another example of a semi-transmission mirror of the optical plate.

12, the transflective mirrors 351 and 353 may be disposed between the first transparent film 320 and the phosphor layer 340, not on the lower surface of the optical plate 300. The transflective mirrors 351 and 353 may transmit a part of light incident through the first transparent film 320 and partially reflect the light. Accordingly, the light energy distribution that is condensed on the light emitting chips 171 and 172 can be dispersed.

13 is another example of the semi-transmission mirror of the optical plate.

As shown in Fig. 13, the semi-transmissive mirrors 352 and 354 may include curved surfaces on the lower surface. The lower surfaces of the transflective mirrors 352 and 354 may be formed into a convex curved surface in the direction of the light emitting chips 171 and 172. Accordingly, the transflective mirrors 351 and 354 transmit part of the light incident on the center region out of the light incident from the light emitting chips 171 and 172 and increase the reflection of the light incident on the periphery of the center region. The energy density distribution on the light emitting chips 171 and 172 can be dispersed by the semi-transmission mirrors 352 and 354.

14 and 15 show an example in which the light emitting element of the illumination element according to the embodiment is modified.

14 and 15, an illumination device includes a light emitting device 100A and an optical plate 300 on the light emitting device 100A.

The light emitting device 100A includes a body 110A having a concave portion 160, a plurality of lead frames 122 and 132 in the concave portion 160, and a plurality of light emitting chips 171 and 172 in the concave portion 160 do.

At least one or both of the plurality of lead frames 122 and 132 may be formed as a horizontal surface on an upper surface. That is, it is possible to provide a flat lead frame without forming a cavity in each of the lead frames 121 and 131 as shown in FIG.

The plurality of lead frames 122 and 132 includes a first lead frame 122 and a second lead frame 132 spaced from the first lead frame 122.

The top surface width of the first lead frame 122 may be wider than the bottom width, and the top surface area thereof may be wider than the bottom surface area. The top surface width of the second lead frame 132 may be wider than the bottom width, and the top surface area thereof may be wider than the bottom surface area. As a result, the surface area of the first and second lead frames 122 and 132 can be increased, the adhesion with the body 110a can be improved, and the heat radiation efficiency can be increased.

The first and second lead frames 122 and 132 may have stepped structures 22 and 32 in regions facing each other. The stepped structures 22 and 32 can be increased in area of adhesion with the gap portion 119 disposed between the first and second lead frames 122 and 132.

The gap portion 119 may be disposed in an area between the first and second lead frames 122 and 132 or may be disposed on an upper surface of the first and second lead frames 122 and 132 in part. The gap portion 119 may be made of the same material as the body 110A or may be made of another insulating material, but the present invention is not limited thereto.

The first and second lead frames 122 and 132 include holes 23 and 33 and a portion 116 and 117 of the body 110A may be coupled to the holes 22 and 33. [ One or a plurality of holes 23 of the first lead frame 122 may be arranged to overlap with the body 110A in the vertical direction. One or a plurality of holes 33 of the second lead frame 132 may be arranged to overlap with the body 110A in the vertical direction. The width of each of the holes 23 and 33 may be larger than the width of the upper portion, but is not limited thereto. Accordingly, the adhesive force between the body 110A and the holes 23 and 33 of the lead frames 122 and 132 can be increased, thereby preventing moisture penetration.

As shown in FIG. 16, the transflective mirrors 351 and 353 of the optical plate 300 reflect or transmit light incident from the light emitting chips 171 and 172, and the reflected light is reflected on the flat lead frames 122 and 132 And may be re-incident on the optical plate 300.

FIG. 17 is a view showing a lighting device according to a second embodiment, FIG. 18 is an assembled plan view of the optical and plate cover in the illumination device of FIG. 17, FIG. 19 is an assembled side view of the optical and plate cover of FIG. 18, 21 is an assembled perspective view of the illumination device of Fig. 17, Fig. 22 is a side cross-sectional view of the illumination device of Fig. 21, and Fig. 23 is a cross- Fig.

17 to 23, the illumination device includes a light emitting device 100, an optical plate 300 on the light emitting device 100, and a plate cover 360 on the optical plate 300. The light emitting device 100 and the optical plate 300 will be described with reference to the above description, and redundant description of the same configuration will be omitted.

The plate cover 360 has an opening 365 and includes a side cover portion 361 and a top cover 362. The side cover portion 361 may be disposed outside the side surface of the optical plate 300 and the top cover 363 may be disposed around the upper surface of the optical plate 300.

The plate cover 360 may be made of a metal or a non-metal material. When the plate cover 360 is made of metal, it may be a metal material such as iron (Fe), copper (Cu), aluminum (Al), silver (Ag) The plate cover 360 may be made of a plastic material in the case of a base metal. The plate cover 360 may be made of a material having a high reflectance.

As shown in FIGS. 18 and 19, the length D5 of the plate cover 360 may be at least two times the width D6, for example, three times or more. The ratio between the length D5 and the width D6 of the plate cover 360 may vary depending on the ratio of the length Y1 and the width X4 of the body 110 shown in Figs.

19, the height of the plate cover 360 may be greater than the thickness of the optical plate 300, and may extend from the upper surface of the optical plate 300 to the upper outer periphery of the light emitting device 100 . The plate cover 360 may prevent leakage of light traveling through the side surfaces of at least one or both of the first and second transparent films 320 and 330 of the optical plate 300.

The maximum distance D7 between the both side cover portions 361 of the plate cover 360 may be longer than the length D2 of the optical plate 300 and the minimum distance may be the width of the optical plate 300 D3. ≪ / RTI >

The plate cover 360 may be coupled to the light emitting device 100 and the optical plate 300 of FIGS. 14 and 15, but is not limited thereto. The optical plate 300 can be inserted into the plate cover 360.

The side cover portion 361 of the plate cover 360 may protrude from the lower surface of the optical plate 300 by a predetermined length P1. This is because the side cover portion 361 of the plate cover 360 extends from the outer side of the optical plate 300 to the outer upper side of the light emitting device 100 and leaks through the side surface of the first transparent film 320 The light can be blocked.

17, the plate cover 360 may be disposed on the side surfaces 11, 12, 13, and 14 of the body 110 of the light emitting device 100. Referring to FIG. The body 110 provides a step structure in which the side cover portion 361 of the plate cover 360 is inserted into at least one, two, or four side portions of the side portions 11, 12, 13, . For example, the step structure 42, 43 may include a step structure 42, 43 outside the first and second side parts 11, 12 of the body 110, And the second side surfaces 11 and 12 from the upper surface 15. The side cover portion 361 of the plate cover 360 may be extended to the stepped structures 42 and 43 as shown in FIG. The side cover portion 361 extends to both side portions 11-14 of the body 110 and can be in close contact with the step structures 42 and 43. [ The depth P2 of the step structures 42 and 43 is formed deeper than the length P1 of the side cover portion 361 of the plate cover 360 protruding from the lower surface of the optical plate 300, The side cover portion 361 can be stably inserted. In addition, the side cover portion 361 of the plate cover 360 may block leakage of light traveling through the first transparent film 32.

The plate cover 360 may adhere the optical plate 300 to the light emitting device 100 and prevent the optical plate 300 from flowing. Further, the plate cover 360 may be formed of a metal material to dissipate heat generated from the light emitting device 100 and the optical plate 300.

Since the opening 365 of the plate cover 360 is arranged in an area larger than the area of the upper surface of the phosphor layer 340, the phosphor layer 340 may not interfere with the light emitted from the phosphor layer 340. The opening 365 of the plate cover 360 may face the concave portion 160 of the light emitting device 100.

The top cover portion 362 of the plate cover 360 may be disposed on both sides of the opening 365 in the longitudinal direction. The top cover portion 362 of the plate cover 360 may face the top surface of the body 110 of the light emitting device 100. As another example, the top cover portion 362 of the plate cover 360 may be disposed on both sides in the width direction of the opening portion 365, or may be disposed around the opening portion 365, but is not limited thereto The top cover portion 362 may have a plurality of recesses 363 at the inner corners and the recesses 363 may enhance the rigidity of the top cover portion 362 of the plate cover 360 .

24 is a diagram showing an example of a first shape of a semi-transmissive mirror of an optical plate according to an embodiment, FIG. 25 is a graph showing a light energy density according to a reflectance of a semi-transmissive mirror in the optical plate of FIG. 24, (A) to (e) show the light energy distribution according to the reflectance of the semi-transmission mirror in the optical plate of Fig.

Referring to FIGS. 24 to 26, when the shape of the transflective mirrors 351 and 353 is elliptical, the length E4 may be longer than the width E5. That is, the maximum length E4 may be longer than the maximum width E5. The ratio of the length E4 to the width E5 may be 1.5: 1, for example, the length E4 may be 1.5 mm ± 0.3 mm and the width E5 may be 1 mm ± 0.2 mm. The linear distance G3 between the centers of the transflective mirrors 351 and 353 may be less than twice the length E4 and more than twice the width E5.

25, when the reflectance of the transflective mirrors 351 and 353 is in the range of 60% to 80%, the optical energy density of the first transparent film 320 is 50% Which is higher than that of the others. When the reflectance of the transflective mirrors 351 and 353 is 65%, the optical energy density can be minimized.

26 shows the optical energy density according to the reflectance of the transflective mirrors 351 and 353 in the first transparent film 320. The reflectance of the transflective mirrors 351 and 353 is 50% (C) is a case where the reflectance is 60%, (c) is the case where the reflectance is 65%, (d) is the case where the reflectance is 70%, and (e) is the case where the reflectance is 80%. The light energy density of (a) - (e) can be increased when the reflectance of the semi-transmissive mirrors 351 and 353 is in the range of 60% to 80%. As shown in FIG. 26C, when the reflectance of the semi-transmissive mirrors 351 and 353 is 65%, it can be seen that the light energy densities of the central region of the semi-transmissive mirror and the peripheral region of the semi-transmissive mirror are uniformly distributed.

27 is a diagram showing an example of a second shape of a semi-transmissive mirror of the optical plate according to the embodiment, FIG. 28 is a graph showing a light energy density according to the reflectance of the semi-transmissive mirror in the optical plate of FIG. 27, (A) to (e) are diagrams showing the light energy distribution according to the reflectance of the transflective mirror in the optical plate of FIG.

27 to 29, the shape of the transflective mirrors 351 and 353 may be a circular shape having a predetermined diameter. The linear distance G3 between the centers of the transflective mirrors 351 and 353 is in the range of the diameter, that is, the horizontal or vertical lengths E4 and E5, May be at least two times the length (E4, E5), e.g., greater than 2 mm.

As shown in FIG. 28, the optical energy density in the first transparent film is low when the reflectance of the transflective mirrors 351 and 353 is in the range of 68% ± 5%. When the reflectance of the transflective mirrors 351 and 353 is 68%, the optical energy density can be minimized.

FIG. 29 shows the light energy density according to the reflectance of the transflective mirrors 351 and 353 in the first transparent film. In FIG. 29, the reflectance of the transflective mirrors 351 and 353 is 50% Is 60%, (c) is 65%, (d) is 70%, and (e) is 80%. As the reflectance of the semi-transmissive mirrors 351 and 353 increases, the amount of light dispersed to the periphery of the semi-transmissive mirrors 351 and 353 may be increased. Thus, when the reflectance of the semi-transmissive mirrors 351 and 353 is 68% ± 5%, it can be seen that the light energy density is equal to the density and the light intensity of the region of the semi-transmissive mirrors 351 and 353 and the region of the transparent film.

FIG. 30 is a diagram showing an example of a third shape of a semi-transmissive mirror of the optical plate according to the embodiment, FIG. 31 is a graph showing a light energy density according to the reflectance of the semi-transmissive mirror in the optical plate of FIG. 30, (A) to (e) show the light energy distribution according to the reflectance of the semi-transmission mirror in the optical plate of FIG.

Referring to FIG. 30, the transflective mirrors 351 and 353 may have a polygonal shape, and the length E4 may be longer than the width E5. The ratio of the length E4 to the width E5 may be 1.5: 1, for example, the length E4 may be 1.5 mm ± 0.3 mm and the width E5 may be 1 mm ± 0.2 mm. The linear distance G3 between the centers of the transflective mirrors 351 and 353 may be less than twice the length E4 and more than twice the width E5.

As shown in FIG. 31, the light energy density in the first transparent film is low when the reflectance of the transflective mirrors 351 and 353 is in the range of 65% ± 5%. When the reflectance of the transflective mirrors 351 and 353 is 65%, the optical energy density can be minimized.

32 shows the optical energy density according to the reflectance of the transflective mirrors 351 and 353 in the first transparent film. In the case where the reflectance of the transflective mirrors 351 and 353 is 50%, (b) Is 60%, (c) is 65%, (d) is 70%, and (e) is 80%. As the reflectance of the semi-transmissive mirrors 351 and 353 increases, the amount of light dispersed to the periphery of the semi-transmissive mirrors 351 and 353 may be increased. Thus, when the reflectance of the transflective mirrors 351 and 353 is 65% ± 5%, it can be seen that the light energy density is equal to the density and the light intensity of the regions of the transflective mirrors 351 and 353 and the region of the transparent film.

The shape of the transflective mirrors 351 and 353 may be circular, elliptical or polygonal. When the reflectance of the transflective mirrors 351 and 353 is 60% to 70%, the transflective mirrors 351 and 353 and the The light energy densities of the peripheral regions are similar to each other, so that the light can be dispersed.

33A to 33C are diagrams showing the light energy distribution according to the length E4 and the width E5 of the transflective mirrors 351 and 353 in the optical plate according to the embodiment. This light energy distribution is a case where the semi-transmission mirrors 351 and 353 are elliptical and the distance from the light emitting chips 171 and 172 is 0.5 mm.

33A shows the case where the size of the transflective mirrors 351 and 353 is equal to the length E4 and the width E5 of the light emitting chips 171 and 172 and the reflectance of the transflective mirrors 351 and 353 is 45% It can be seen that the diffusion effect by the semi-transmission mirrors 351 and 353 is insignificant.

33B shows a case where the size of the transflective mirrors 351 and 353 is larger than the lengths E4 and E5 of the light emitting chips 171 and 172 and the reflectance of the transflective mirrors 351 and 353 is 65% It can be seen that the diffusion effect by the transflective mirrors 351 and 353 is improved to a uniform distribution. Here, the length E4 is in the range of 1.5 mm ± 0.3 mm, and the width E5 is in the range of 1 mm ± 0.2 mm.

33C shows a case where the sizes of the transflective mirrors 351 and 353 are larger than the light emitting chips 171 and 172 and the reflectance of the transflective mirrors 351 and 353 is 65% There is a diffusion effect due to the transflective mirrors 351 and 353, but there is a problem that it is partially concentrated.

Here, the length E4 is in the range of 2.2 mm ± 0.44 mm, the width E5 is in the range of 1.4 mm ± 0.28 mm, and the width and length of the opening may vary depending on the size of the package.

FIG. 34 is a view showing a light energy distribution in an optical plate to which the light emitting element of FIG. 8 is applied, and FIG. 35 is a diagram showing a light energy distribution in the optical plate to which the light emitting element of FIG. 14 is applied.

34 and 35, the light emitting chips 171 and 172 are disposed in the cavities of the lead frames 121 and 131 disposed below the recess 160 in the light emitting device 100 as shown in FIG. 8, or the light emitting chips 171 and 172 are disposed in the lead frames 121 and 131, Even if the cavity is not formed in the cavity, the difference in optical energy density distribution caused by the semi-transmission mirrors 351 and 353 is generated, but the uniform light distribution is provided as a whole.

Figs. 36 (a) to 36 (d) are diagrams for explaining light energy distribution in an optical plate having no semi-transmissive mirror in a comparative example.

In FIG. 36 (a), when the distance between the light emitting chip and the first transparent film is 0.5 mm, the light energy distribution shows a high light intensity in the region of the light emitting chip.

36 (b) to 36 (d) show a case where the distance between the light emitting chip and the first transparent film 320 is increased to 1.0 mm, 1.5 mm and 2.0 mm, and the light emitted from the light emitting chip is gradually diffused have. However, the spacing between the light emitting chip and the optical plate may be increased to cause a problem of thickening the light emitting element, and the thickness of the light emitting element may also be increased. Accordingly, the embodiment can provide the thickness of the light emitting device (t1 in Fig. 4) at a maximum thickness of 1.8 mm or less.

37 is a side sectional view showing a lighting device according to the third embodiment.

Referring to FIG. 37, an illumination device includes a light emitting device 400 and an optical plate 300 according to an embodiment on the light emitting device 400.

The light emitting device 400 includes a body 410, a first lead frame 423 and a second lead frame 421 disposed on the body 410, and a second lead frame 422 disposed on the body 410, And a light emitting chip 470 electrically connected to the lead frame 423 and the second lead frame 421.

The body 410 may include an insulating material or a conductive material. The body 110 may include at least one of a resin material such as polyphthalamide (PPA), a silicon (Si), a metal material, a photo sensitive glass (PSG), a sapphire (Al ₂ O ₃ ), a printed circuit board Can be formed. For example, the body 410 may be made of a resin material such as polyphthalamide (PPA), epoxy, or silicone. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the epoxy or silicon material used as the body 410 to improve the reflection efficiency. The body 110 may include a ceramic material.

The body 410 may provide a recess 425 having an inclined surface around the light emitting chip 470. The molding member 440 may be disposed on the concave portion 425, but the present invention is not limited thereto.

The first lead frame 421 and the second lead frame 423 are electrically separated from each other and provide power to the light emitting chip 470. The first lead frame 421 and the second lead frame 423 may be disposed on the bottom of the concave portion 425 and may reflect light generated from the light emitting chip 470 to increase the light efficiency And may discharge the heat generated from the light emitting chip 470 to the outside.

And may be disposed on the first lead frame 421 of the light emitting chip 470 and connected to the first lead frame 423 by a wire 443. [ The first lead frame 421 may be formed as a cavity in which the light emitting chip 470 is disposed, but the present invention is not limited thereto. The light emitting chip 470 may be arranged in a flip chip manner, but is not limited thereto.

The optical plate 300 may be disposed facing the light emitting chip 470. The optical plate 300 includes a phosphor and may be disposed on the upper surface of the body 410.

The optical plate 300 includes a frame-shaped reflector 310 having an open region 342, at least one of a phosphor layer 340, a reflector 310, a phosphor layer 340, And a transflective mirror 350 facing the light emitting chip 470, which is a light source, under the phosphor layer 340. The transparent film 320,

The reflector 310 includes an open region 342 therein, and the outer shape of the reflector 310 may include a circular frame or a polygonal frame. The open region 342 may include a circular or polygonal shape. The open region 342 has a shape corresponding to the shape of the concave portion 425 of the light emitting device and light emitted through the concave portion 425 can be incident thereon. The reflector 310 may be formed to surround the side surface of the phosphor layer 340.

The reflector 310 may include a glass material such as a white glass or a glass material having a high reflectance. The white glass or the glass material having high reflectance can be formed by adding white particles and / or bubbles into the transparent glass. The reflectance of the reflector 310 may be higher than that of the first and second transparent films 320 and 330.

As another example, the reflector 310 may include a resin material, and the resin material may include a resin material such as polyphthalamide (PPA), an epoxy or a silicone material. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the resin material. The reflector 310 may be made of a white resin. The reflector 310 may include a ceramic material.

The phosphor layer 340 may include a phosphor in a resin material such as transparent silicon or epoxy. The phosphor layer 340 converts the wavelength of light emitted from the light emitting chip 470. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 according to an embodiment may include a quantum dot. The quantum dot may include an II-VI compound or a III-V compound semiconductor, and may emit at least one of red, green, yellow, and red quantum dots or different kinds of quantum dots.

The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof. Since the quantum dot has a large change in the luminous efficiency depending on the temperature, the quantum dot can be separated from the light emitting chip 470 as in the embodiment, and the change in the luminous efficiency can be reduced.

Transparent films 320 and 330 may be disposed on at least one or both of the phosphor layer 340 and the phosphor layer 340. The transparent films 320 and 330 may include a first transparent film 320 disposed under the fluorescent layer 340 and a second transparent film 330 disposed on the fluorescent layer 340. The transparent films 320 and 330 may be disposed on the incident surface and / or the emission surface of the phosphor layer 340. In this optical plate 300, any one of the first and second transparent films 320 and 330 may be removed, for example, the second transparent film 330 may be removed, but the present invention is not limited thereto.

The first and second transparent films 320 and 330 may include glass or a transparent resin film. The first and second transparent films 320 and 330 are bonded on the reflector 310 to protect the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 181 and / or the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 181 of 0.2 or less.

The first transparent film 320 may be adhered to the lower surface of the reflector 310 and the lower surface of the phosphor layer 340. The outer surface of the lower surface of the first transparent film 320 may be adhered to the body 410. The second transparent film 330 may be adhered to the upper surface of the reflector 310 and the upper surface of the phosphor layer 340.

The first and second transparent films 320 and 330 may be formed on the upper surface and the lower surface of the reflector 310. In this case, Can be contacted.

The transflective mirror 350 may include a metal material such as aluminum (Al) or silver (Ag) material capable of performing a semipermeable function. The transflective mirror 350 may be formed of a material having a reflectance higher than that of the transmissivity. Here, the sum of the transmittance and the reflectance may be 100%.

The semi-transparent mirror 350 may include a diffusion sheet. An uneven pattern may be formed on the lower surface of the semi-transmissive mirror 350, that is, on the light incident surface, but the present invention is not limited thereto. The semi-transparent mirror 350 may be defined as a half mirror sheet, a semi-transparent mirror, a polarizing sheet, or a translucent diffusion sheet. The transflective mirror 350 may be formed by screen printing under the first transparent film 320, but is not limited thereto.

The semi-transparent mirror 350 may be disposed below the phosphor layer 340, for example, under the first transparent film 320. One or more of the transflective mirrors 350 may be disposed under the first transparent film 320. For example, the number of the transflective mirrors 350 may be the same as the number of the light emitting chips 470. The transflective mirror 350 may be disposed facing the light emitting chip 470, for example.

The description of the transflective mirror 350 and the light emitting chip 470 will be given with reference to the description given in the above embodiment. The length E4 of the transflective mirror 350 in the first direction is longer than the length E1 of the light emitting chip 470 in the first direction and the width of the light emitting chip 470 in the second direction And may be arranged wider than the width of the second direction. The top or bottom surface area of the transflective mirror 350 may be larger than the top surface area of the light emitting chip 470.

The distance G1 between the semi-transmissive mirror 350 and the light emitting chip 470 may be in a range of 1 mm or less, for example, 0.2 mm to 1 mm. When the gap G1 between the light emitting chip 470 and the transflective mirror 350 is less than the above range, the thickness of the body 410 becomes thin and it is difficult to secure rigidity and a problem of deterioration of the phosphor may occur. There may be a problem that the thickness of the light emitting device is increased, and the effect of light diffusion by the transflective mirror 350 may be insignificant.

The semi-transparent mirror 350 reflects and transmits the light incident from the light emitting device. The semi-transmissive mirror 350 may be disposed in a region having a maximum amount of light incident on the optical plate 300, and may be diffused into the peripheral region. The reflectance of the transflective mirror 350 may be higher than the transmittance as described in the embodiment.

This optical plate 300 can reduce the problem of deterioration of the phosphor due to light generated from the light emitting chip 470 by disposing the transflective mirror 350 in the region where the light amount of the light emitting chip 470 is the highest, The light loss can be reduced. Further, the color conversion by the quantum dot can prevent the deterioration of the light efficiency and prevent the color correction index from being lowered.

The optical plate 300 according to the embodiment is provided at a thickness smaller than the thickness of the light emitting device 100 and can function as an illumination plate or a fluorescent plate on the light emitting device 100. [

The plate cover shown in FIG. 17 may be coupled to the upper surface and the periphery of the illumination device, but the present invention is not limited thereto.

38 is a side cross-sectional view showing the illumination device according to the embodiment.

Referring to FIG. 38, an illumination device includes a light emitting device 500 and an optical plate 300 disposed on the light emitting device 500.

The light emitting device 500 includes a body 510, a first lead frame 521 and a second lead frame 523 disposed on the body 510 and a second lead frame 523 disposed on the body 510, A light emitting chip 570 electrically connected to the frame 521 and the second lead frame 523 and a molding member 531 on the light emitting chip 570.

The body 510 may include a reflecting portion 513 having a concave portion 517 opened at an upper portion thereof and a supporting portion 511 for supporting the reflecting portion 513.

The light emitting chip 570 is disposed on the second lead frame 523 and the wire 503 is disposed on the second lead frame 523. The light emitting chip 570 is disposed in the concave portion 517 of the body 510, To the first lead frame 521, as shown in FIG. The second lead frame 523 may include a cavity in which the light emitting chip 570 is disposed, but the present invention is not limited thereto. The first lead frame 521 and the second lead frame 523 are electrically separated from each other and provide power to the light emitting chip 570.

The first lead frame 521 and the second lead frame 523 may reflect light generated from the light emitting chip 570 to increase light efficiency. For this purpose, a separate reflective layer may be formed on the first lead frame 521 and the second lead frame 523, but the present invention is not limited thereto. In addition, the first and second lead frames 521 and 523 may serve to discharge the heat generated from the light emitting chip 570 to the outside. The lid portion 522 of the first lead frame 521 and the lid portion 524 of the second lead frame 523 may be disposed on the lower surface of the body 510. [

The molding member 531 may include a resin material such as silicone or epoxy, and may surround the light emitting chip 570 to protect the light emitting chip 570. The upper surface of the molding member 531 may be flat, concave or convex. The molding member 531 may be removed so that the recessed portion 517 may be filled with the air region.

The optical plate 300 may be disposed facing the light emitting chip 570. The optical plate 300 includes a phosphor and may be disposed on the upper surface of the body 510.

The optical plate 300 includes a frame-shaped reflector 310 having an open region 342, a phosphor layer 340 in the reflector 310, a reflector 310, and a phosphor layer 340, A second transparent film 340 is disposed on the film 320, the reflector 310 and the phosphor layer 340, and a semi-transmissive mirror 340 facing the light emitting chip 570, which is a light source, (350).

The reflector 310 includes an open region 342 therein, and the outer shape of the reflector 310 may include a circular frame or a polygonal frame. The open region 342 may include a circular or polygonal shape. The open region 342 has a shape corresponding to the shape of the concave portion 517 of the light emitting device, and light emitted through the concave portion 517 may be incident thereon. The reflector 310 may be formed to surround the side surface of the phosphor layer 340.

The reflector 310 may include a glass material such as a white glass or a glass material having a high reflectance. The white glass or the glass material having high reflectance can be formed by adding white particles and / or bubbles into the transparent glass. The reflectance of the reflector 310 may be higher than that of the first and second transparent films 320 and 330.

As another example, the reflector 310 may include a resin material, and the resin material may include a resin material such as polyphthalamide (PPA), an epoxy or a silicone material. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the resin material. The reflector 310 may be made of a white resin. The reflector 310 may include a ceramic material.

The phosphor layer 340 may include a phosphor in a resin material such as transparent silicon or epoxy. The phosphor layer 340 converts the wavelength of the light emitted from the light emitting chip 570. The phosphor layer 340 may include at least one of red, green, yellow, and blue phosphors. The phosphor excites a part of the emitted light and emits it as light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor.

The phosphor layer 340 according to an embodiment may include a quantum dot. The quantum dot may include an II-VI compound or a III-V compound semiconductor, and may emit at least one of red, green, yellow, and red quantum dots.

The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, CuInSe _2, and the like, and combinations thereof. In the case of such a quantum dot, since the change in the luminous efficiency depending on the temperature is large, the luminous efficiency can be reduced by separating the luminous efficiency from the luminous chip 570 as in the embodiment.

The first and second transparent films 320 and 330 may include glass or a transparent resin film. The first and second transparent films 320 and 330 are bonded on the reflector 310 to protect the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a refractive index equal to or lower than that of the molding member 181 and / or the phosphor layer 340. The first and second transparent films 320 and 330 may be formed of a material having a difference in refractive index of the molding member 181 of 0.2 or less.

The first transparent film 320 may be adhered to the lower surface of the reflector 310 and the lower surface of the phosphor layer 340. The outer surface of the lower surface of the first transparent film 320 may be adhered to the body 510. The second transparent film 330 may be adhered to the upper surface of the reflector 310 and the upper surface of the phosphor layer 340.

The first and second transparent films 320 and 330 may be formed on the upper surface and the lower surface of the reflector 310. In this case, Can be contacted.

The transflective mirror 350 may include a metal material such as aluminum (Al) or silver (Ag) material capable of performing a semipermeable function. The transflective mirror 350 may be formed of a material having a reflectance higher than that of the transmissivity. Here, the sum of the transmittance and the reflectance may be 100%.

The semi-transparent mirror 350 may include a diffusion sheet. An uneven pattern may be formed on the lower surface of the semi-transmissive mirror 350, that is, on the light incident surface, but the present invention is not limited thereto. The semi-transparent mirror 350 may be defined as a half mirror sheet, a semi-transparent mirror, a polarizing sheet, or a translucent diffusion sheet. The transflective mirror 350 may be formed by screen printing under the first transparent film 320, but is not limited thereto.

The semi-transparent mirror 350 may be disposed below the phosphor layer 340, for example, under the first transparent film 320. One or a plurality of the transflective mirrors 350 may be disposed under the first transparent film 320. For example, the number of the transflective mirrors 350 may be the same as the number of the light emitting chips 570. The transflective mirror 350 may be disposed facing the light emitting chip 470, for example.

The description of the transflective mirror 350 and the light emitting chip 570 will be given with reference to the description given in the above embodiments. For example, the length E4 of the transflective mirror 350 in the first direction is longer than the length E1 of the light emitting chip 570 in the first direction, and the width of the light emitting chip 570 in the second direction And may be arranged wider than the width of the second direction. The top or bottom surface area of the transflective mirror 350 may be larger than the top surface area of the light emitting chip 570.

The gap G1 between the semi-transmissive mirror 350 and the light emitting chip 570 may be in a range of 0.5 mm or more, for example, 0.5 mm to 1.5 mm. When the gap G1 between the light emitting chip 570 and the semi-transmissive mirror 350 is smaller than the above range, the thickness of the body 510 becomes thin and it is difficult to secure rigidity and a problem of phosphor deterioration may occur. There may be a problem that the thickness of the light emitting device is increased, and the effect of light diffusion by the transflective mirror 350 may be insignificant.

The semi-transparent mirror 350 reflects and transmits the light incident from the light emitting device. The semi-transmissive mirror 350 may be disposed in a region having a maximum amount of light incident on the optical plate 300, and may be diffused into the peripheral region. The reflectance of the transflective mirror 350 may be higher than the transmittance as described in the embodiment.

This optical plate 300 can reduce the problem of degradation of the phosphor due to the light generated from the light emitting chip 570 by disposing the transflective mirror 350 in the region where the light amount of the light emitting chip 570 is the highest, The light loss can be reduced. Further, the color conversion by the quantum dot can prevent the deterioration of the light efficiency and prevent the color correction index from being lowered.

The optical plate 300 according to the embodiment is provided at a thickness smaller than the thickness of the light emitting device 100 and can function as an illumination plate or a fluorescent plate on the light emitting device 100. [

The plate cover shown in FIG. 17 may be coupled to the upper surface and the periphery of the illumination device, but the present invention is not limited thereto.

The illumination device according to the embodiment can be applied to the illumination system. The lighting system includes a structure in which a plurality of light emitting elements are arrayed, and includes a display apparatus shown in Figs. 39 and 40, a lighting apparatus shown in Fig. 41, and may include an illumination lamp, a traffic light, a vehicle headlight, have.

39 is an exploded perspective view of a display device having an illumination device according to an embodiment.

Referring to Figure 39, a display device 1000 according to an embodiment includes a light guide plate 1041, a light source module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041 and the light source module 1031 and the reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material, for example, acrylic resin such as PMMA (polymethylmethacrylate), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC) and polyethylene naphtha late Resin. ≪ / RTI >

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

At least one light source module 1031 is disposed in the bottom cover 1011 and may directly or indirectly provide light from one side of the light guide plate 1041. [ The light source module 1031 includes a substrate 1033 and an illumination device 1035 according to the above-described embodiment, and the illumination devices 1035 can be arrayed at a predetermined interval on the substrate 1033. [

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like. When the illumination element 1035 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the substrate 1033 can be removed. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.

The illumination device 1035 may be mounted on the substrate 1033 such that the light exit surface is spaced apart from the light guide plate 1041 by a predetermined distance, but the present invention is not limited thereto. The illumination device 1035 can directly or indirectly provide light to the light-incident portion, which is one surface of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflection member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light source module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the invention is not limited thereto.

40 is a diagram showing a display device having an illumination device according to the embodiment.

40, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the above-described illumination device 1124 is arrayed, an optical member 1154, and a display panel 1155.

The substrate 1120 and the illumination device 1124 may be defined as a light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto. The light source module 1160 includes a substrate 1120 and a plurality of illumination elements 1124 arranged on the substrate 1120.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a polymethyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.

The optical member 1154 is disposed on the light source module 1160 and performs surface light source, diffusion, and light condensation of light emitted from the light source module 1160.

41 is an exploded perspective view of a lighting device having a lighting device according to an embodiment.

41, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a lighting device according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 through which the plurality of light source portions 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light source unit 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and a protrusion 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.

The protrusion 2670 has a shape protruding outward from the other side of the base 2650. The protrusion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the protrusion 2670 may be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the protrusion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800.

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

100, 100A, 400, 500:
110, 110A, 410, 510: body
121, 131, 122, 132, 421, 423, 521, 523:
125, 135: Cavity
160, 425,
171, 172, 470, 570:
181, 440, 531:
300: optical plate
310: reflector
320,330: Transparent film
340: phosphor layer
351,353: Semi-transparent mirror
460: Plate cover

Claims (20)

A phosphor layer;
A first transparent film below the phosphor layer;
A second transparent film on the phosphor layer;
A reflector disposed between the first and second transparent films to surround a side surface of the phosphor layer; And
And a transflective mirror disposed in a part of the first transparent film and reflecting and transmitting the incident light,
Wherein the transflective mirror is disposed facing the light source,
Wherein the semi-transmissive mirror has a bottom area smaller than a bottom area of the phosphor layer. The method according to claim 1,
Wherein the transflective mirror comprises an elliptical, circular or polygonal shape. The method according to claim 1,
Wherein the phosphor layer has a quantum dot. 4. The method according to any one of claims 1 to 3,
Wherein the transflective mirror is formed of a material having a reflectance higher than that of the transmissivity. 4. The method according to any one of claims 1 to 3,
Wherein a plurality of the transflective mirrors are arranged on a lower surface of the first transparent film. A light emitting element having a light emitting chip; And
And an optical plate having a transflective mirror facing the light emitting chip on the light emitting element,
Wherein the optical plate comprises:
A phosphor layer;
A first transparent film below the phosphor layer; And
And a reflector surrounding a side surface of the phosphor layer,
The semi-transmissive mirror is disposed in a part of the first transparent film so as to face the light emitting chip, and reflects and transmits the incident light,
Wherein the transflective mirror has a bottom area larger than the top surface area of the light emitting chip. The method according to claim 6,
And a second transparent film on the phosphor layer. 9. The method of claim 8,
Wherein the first and second transparent films comprise a glass material,
And the reflector is disposed between the first and second transparent films. The method according to claim 6,
Wherein the transflective mirror has a length in a first direction longer than a width in a second direction,
Wherein the light emitting chip has a length in a first direction longer than a width in a second direction. 10. The method according to any one of claims 6 to 9,
The light-
A body having a recess; And
And a plurality of lead frames disposed in the recess,
Wherein at least one of the light emitting chips is disposed in the recess and is electrically connected to the plurality of lead frames,
The optical plate is attached on the body,
And the concave portion overlaps with the phosphor layer in the vertical direction. 11. The method of claim 10,
Wherein the plurality of lead frames include first and second lead frames,
Wherein a plurality of the light emitting chips are arranged in a first direction,
Wherein a plurality of said plurality of semi-transmission mirrors are disposed facing each of said light emitting chips. 11. The method of claim 10,
Wherein at least one of the plurality of lead frames includes a cavity recessed downwardly of the body below the recess,
And the light emitting chip is disposed in the cavity. 11. The method of claim 10,
Wherein a lower surface of the semi-transparent mirror is disposed below a horizontal straight line on an upper surface of the body. 11. The method of claim 10,
Wherein the concave portion includes a molding member,
Wherein the molding member is in contact with the first transparent film and the transflective mirror. 10. The method according to any one of claims 6 to 9,
Wherein the transflective mirror comprises an elliptical, circular or polygonal shape. 10. The method according to any one of claims 6 to 9,
Wherein the phosphor layer has a quantum dot. 11. The method of claim 10,
Wherein the body is bonded to the lower surface of the first transparent film with an adhesive. 10. The method according to any one of claims 6 to 9,
The semi-transmissive mirror has a reflectance higher than that of the transmissive element. 10. The method according to any one of claims 6 to 9,
And a plate cover having an opening on the optical plate,
And the plate cover includes a side cover portion surrounding the top surface of the optical plate and a side surface of the light emitting device. Board; And
A plurality of illumination elements on the substrate,
The light source module has the illumination device according to any one of claims 6 to 9.

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