KR20170038634A - Substrate assembly system, substrate assembly device using that system and substrate assembly method using that system - Google Patents

Abstract

A substrate assembly system, a substrate assembly apparatus used therefor, and a substrate assembly method using the system are provided. Simplification of a parallel adjustment of an upper substrate with respect to a lower substrate is achieved. The substrate assembly system (1000) has a substrate assembly apparatus (1) and a control device. The substrate assembly apparatus includes: a lower table (4) having a lower substrate surface (4a) for maintaining a lower substrate (K2); an upper table (3) having an upper substrate surface (3a); a plurality of adhesive pins (8a) for maintaining the adhesion of an upper substrate (K1) at the adhesive portion downwardly protruding from the upper substrate surface; a first drive mechanism (20) for vertically moving the adhesive pin and the upper table; at least one base unit (8b) mounted thereon with at least one adhesive pin; and a plurality of second driving mechanisms (80) for independently moving up and down each portion of the base unit. The control device includes: a height control unit for defining the height of each portion of the base unit by controlling operations of each second driving mechanism; and an adjustment data calculation unit for calculating data for adjusting the operation amount of each second driving mechanism on the basis of the timing of the variation of the load of each second driving mechanism according to a descending amount of the first driving mechanism.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate assembly system, a substrate assembly apparatus for use in the system, and a substrate assembly method using the system,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate assembly system, a substrate assembly apparatus used in the system, and a substrate assembly method using the system.

Conventionally, there has been a substrate assembling system in which an upper substrate (glass substrate) and a lower substrate (glass substrate) are bonded in vacuum to assemble a substrate such as a liquid crystal panel (see, for example, Patent Document 1). The substrate assembling system includes a substrate assembling device for assembling the upper substrate and the lower substrate in a vacuum chamber to assemble the substrate, a control device for controlling the operation of the substrate assembling device, and an upper substrate and a lower substrate, And a transfer device for carrying the substrate assembled by the substrate assembling device out of the vacuum chamber.

The substrate assembling apparatus has a lower table and an upper table in a vacuum chamber. The substrate assembling apparatus holds the lower substrate on which the liquid crystal is dropped on the lower table and holds the upper substrate on the upper table so as to face the lower substrate. Further, an adhesive is applied to one of the lower substrate and the upper substrate. In the substrate assembling apparatus, the inside of the vacuum chamber is evacuated, and the upper substrate and the lower substrate are pressed by the upper table, thereby joining the upper substrate and the lower substrate with the adhesive applied to either one of the substrates. Thus, the substrate assembling system assembles a substrate such as a liquid crystal panel. In such a substrate assembling system, it is necessary to arrange the upper substrate and the lower substrate substantially in parallel in the vacuum chamber in order to reduce errors occurring when the upper substrate and the lower substrate are bonded and to improve the positional accuracy of the bonding.

Japanese Patent No. 4379435

However, the conventional substrate assembling system has a problem in that the upper substrate is adjusted in parallel with the lower substrate.

For example, the parallel adjustment in the conventional substrate assembly system is carried out in such a manner that the adjustment amount is unclear, so that the inclination of the upper substrate with the human hand until the state becomes good (the parallelism is included in the threshold value) Is repeatedly performed. Because of this, the parallel adjustment had begun.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a substrate assembling system capable of simplifying parallel adjustment of an upper substrate relative to a lower substrate, a substrate assembling apparatus used in the system, And to provide a method of the present invention.

In order to achieve the above object, a first aspect of the present invention is a substrate assembling system comprising: a substrate assembling device for assembling a substrate by joining an upper substrate and a lower substrate; and a control device for controlling operations of the substrate assembling device, The assembly apparatus includes an upper table having a lower table having a lower substrate surface for holding the lower substrate, an upper table having an upper substrate surface opposed to the lower substrate surface, and an adhesive portion vertically operating on the upper substrate surface, A plurality of adhesive fins for adhering and holding the upper substrate in the adhesive portion protruding downward from the upper substrate surface; and a vacuum chamber capable of storing the lower table, the upper table, and the adhesive pins in a vacuum environment, A first driving mechanism for vertically moving the adhesive pin and the upper table, and at least one adhesive And a plurality of second driving units arranged at four corners of at least each of the base units for independently moving up and down respective portions of the respective base portions with respect to the upper substrate surface, Wherein the control device controls a motion of each of the second driving mechanisms to define a height of each of the portions of the base portion with respect to the upper surface of the upper substrate, And an adjustment data calculation unit for calculating the adjustment data of the operation amount of each of the second drive mechanisms based on the timing of the variation of the load of each of the second drive mechanisms measured according to the fall amount.

The adjustment data calculation unit of the substrate assembly system calculates the adjustment data of the operation amount of each second drive mechanism on the basis of the timing of the variation of the load of each second drive mechanism measured according to the fall amount of the first drive mechanism . The engineer on the provider side of the substrate assembling system or the operator on the user side can check the calculated adjustment data to easily perform an appropriate parallel adjustment. Therefore, this substrate assembling system can simplify the parallel adjustment of the upper substrate relative to the lower substrate.

According to a second aspect of the present invention, there is provided a substrate assembling apparatus comprising: a lower table having a lower substrate surface for holding a lower substrate; an upper table having an upper substrate surface opposed to the lower substrate surface; A plurality of adhesive pins provided at the front end for vertically operating adhesive portions and adhering and holding the upper substrate in the adhesive portion protruding downward from the upper substrate surface; A first driving mechanism for moving the adhesive pin and the upper table up and down; one or more base portions to which at least one adhesive pin is mounted; And each of the portions of each of the base portions is independently moved up and down relative to the upper substrate surface Each of the second driving mechanisms is constituted by a servomotor or a step motor which is capable of being performed by a control device in which the variation of the amount of current depending on the load is measured externally .

According to a third aspect of the present invention, there is provided a substrate assembly method comprising: a lower table having a lower substrate surface for holding a lower substrate; an upper table having an upper substrate surface opposed to the lower substrate surface; A plurality of adhesive pins provided at the front end for vertically operating adhesive portions and adhering and holding the upper substrate in the adhesive portion protruding downward from the upper substrate surface; A first driving mechanism for moving the adhesive pin and the upper table up and down; one or more base portions to which at least one adhesive pin is mounted; And each of the portions of each of the base portions with respect to the upper substrate surface is independently moved up and down A substrate carrying step of carrying a substrate between the lower table and the upper table for a substrate assembling apparatus having a plurality of second driving mechanisms and adhering the substrate by the adhering section of the adhesive pin; A vacuum evacuation step of evacuating air in the vacuum chamber to a vacuum environment in the vacuum chamber by controlling the operation of each of the second driving mechanisms, In which the adhesive pin and the upper table are lowered by the first driving mechanism so that the substrate is pressed toward the lower table and the load of the second driving mechanism is measured, Based on the timing of the variation of the load of each of the second driving mechanisms measured according to the amount of descent of the first driving mechanism, And an adjusting data calculating step of calculating adjusting data of an operation amount of each of the second driving mechanisms.

The other means are the latter.

According to the present invention, it is possible to simplify the parallel adjustment of the upper substrate relative to the lower substrate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration of a substrate assembly system related to the embodiment; Fig.
2 is a diagram showing a configuration of a suspension mechanism of the substrate assembling apparatus used in the embodiment.
Fig. 3 is a diagram showing the structure of a suction (suction) mechanism of a substrate assembling device used in the embodiment. Fig.
4 is a view showing a configuration of an adhesive holding mechanism of the substrate assembling apparatus used in the embodiment.
5 is a view showing the configuration of the upper substrate surface of the upper table.
6 is a diagram schematically showing the operation of the upper table.
7 is a diagram schematically showing the structure of a vertical movement mechanism.
8 is a diagram showing a configuration of a control apparatus used in the embodiment.
9 is a graph showing the relationship between the Z-axis height and the current value of the electric motor of the up-and-down moving mechanism.
10 is a view showing the operating state of the electric motor of the up-and-down moving mechanism.
11A is a flow chart 1 showing operation during setup of a substrate assembly system.
11B is a flow chart (2) illustrating operation during setup of the substrate assembly system.
11C is a flowchart 3 showing operation during setup of the substrate assembly system.
11D is a flowchart (4) showing operation during setup of the substrate assembly system.
12 is a flow chart showing the operation during the stop of the substrate assembly system.
Figure 13 is a flow chart illustrating operation during production of a substrate assembly system.
14A is a flowchart (1) showing an operation in pressurization and current measurement of the substrate assembling system.
14B is a flowchart (2) showing the operation in pressurization and current measurement of the substrate assembling system.
15 is a diagram showing an example of a display screen.

Hereinafter, an embodiment of the present invention (hereinafter referred to as " present embodiment ") will be described in detail with reference to the drawings. In addition, each drawing is only schematically shown to the extent that the present invention can be fully understood. Therefore, the present invention is not limited to the illustrated example. In the drawings, the same reference numerals are given to common components and the same constituent elements, and a repetitive description thereof will be omitted.

[Embodiment Mode]

≪ Configuration of Substrate Assembly System >

Hereinafter, the configuration of the substrate assembly system 1000 related to the present embodiment will be described with reference to FIG. 1 is a diagram showing a configuration of a substrate assembling system 1000. FIG.

1, the substrate assembly system 1000 related to the present embodiment has a substrate assembly apparatus 1, a control apparatus 100, and a transport apparatus 200. As shown in FIG.

The substrate assembling apparatus 1 is an apparatus for assembling a substrate such as a liquid crystal panel by bonding an upper substrate K1 (glass substrate) and a lower substrate K2 (glass substrate) in vacuum.

The control apparatus 100 is an apparatus for controlling the operation of the substrate assembling apparatus 1. [

The transfer apparatus 200 is configured to transfer the upper substrate K1 (glass substrate) or the lower substrate K2 (glass substrate) into the vacuum chamber 5 of the substrate assembling apparatus 1, Or a substrate such as a liquid crystal panel assembled with the vacuum chamber 5 is taken out of the vacuum chamber 5.

The substrate assembling apparatus 1 has a mount 1a and an upper frame 2. [ The mount 1a is mounted on a mounting surface (bottom surface or the like). The upper frame 2 is provided so as to be vertically movable above the table 1a.

The upper frame 2 is mounted on a first driving mechanism (Z-axis driving mechanism 20) mounted on the mount 1a via a load cell 20d. In the present embodiment, it is assumed that the substrate assembling apparatus 1 has four Z-axis driving mechanisms 20 and four load cells 20d.

In the substrate assembling apparatus 1, an upper table 3 and a lower table 4 are provided. The lower table 4 is mounted on the base table 1a via the XY &thetas; The XY &thetas; mobile unit 40 is movable relative to the base table 1a independently in two mutually orthogonal axes (X axis, Y axis). Further, the XY &thetas; mobile unit 40 is configured to be rotatable about the Z axis with respect to the base table 1a. As the XY? Mobile unit 40, a ball bearing fixed in the Z-axis direction and freely movable in the XY-axis direction can be used.

In the substrate assembling apparatus 1 of the present embodiment, the direction of the upper frame 2 with respect to the table 1a is the Z-axis direction (vertical direction). The direction of one axis orthogonal to the Z axis is the X axis direction (horizontal direction), and the direction of one axis orthogonal to the Z axis and the X axis is the Y axis direction (vertical direction).

The upper table 3 and the lower table 4 have a rectangular shape in which the Y axis direction and the X axis direction are transverse and longitudinal directions. The plane (upper substrate surface 3a) of the upper table 3 and the plane (lower substrate surface 4a) of the lower table 4 are opposed to each other.

The upper frame 2 is mounted on the base 1a via four Z-axis driving mechanisms 20. [ Each Z-axis driving mechanism 20 has a ball screw mechanism 20b for vertically moving a ball screw shaft 20a extending in the Z-axis direction (vertical direction). The ball screw shaft 20a is rotated by the electric motor 20c and moved up and down by the ball screw mechanism 20b.

The electric motor 20c is controlled by the control device 100. [ Further, the upper frame 2 is displaced (moved up and down) based on the calculation of the control device 100.

The upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. The upper frame 2 and the upper table 3 move up and down integrally. An upper chamber 5a is arranged around the upper table 3. The upper chamber 5a has a configuration in which the lower side (the side of the mount 1a) is opened and is disposed so as to cover the upper side and the side of the upper table 3. [

The upper chamber 5a is mounted on the upper frame 2 via the suspending mechanism 6. [

2 is a view showing the configuration of the suspending mechanism 6 seen from the side direction. 2, the suspending mechanism 6 includes a support shaft 6a extending downward from the upper frame 2 and an engagement portion 6a extending downward from the upper end of the support shaft 6a in a flange- 6b.

A hook 6c is provided in the upper chamber 5a. The hook 6c freely moves up and down around the support shaft 6a. The hook 6c is engaged with the locking portion 6b at the lower end of the support shaft 6a.

Returning to Fig. 1, the upper shaft 2a penetrates the upper chamber 5a. The space between the upper shaft 2a and the upper chamber 5a is sealed with a vacuum seal (not shown).

When the upper frame 2 moves upward (upward movement), the hook 6c is engaged with the locking portion 6b of the support shaft 6a, whereby the upper chamber 5a is engaged with the upper frame 2 And moves upward. When the upper frame 2 moves downward (downward movement), the hook 6c moves downward due to its own weight, and accordingly the upper chamber 5a moves downward.

On the lower substrate surface 4a of the lower table 4, a plurality of suction holes (not shown) are opened. Each suction hole of the lower table 4 is connected to the vacuum pump P3. When the vacuum pump P3 is driven, the lower substrate K2 placed on the lower substrate surface 4a is adsorbed and held on the lower table 4 (lower substrate surface 4a). The vacuum pump P3 is controlled by the control device 100. [

Further, a lower chamber 5b is disposed around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b mounted on the table 1a. The lower shaft 1b protrudes into the lower chamber 5b. A space between the lower chamber 5b and the lower shaft 1b is sealed with a vacuum seal (not shown).

The lower chamber 5b is configured such that the upper side (the side of the upper frame 2) is open and is arranged to cover the lower side and the side of the lower side table 4. [

The XY? Mobile unit 40 is mounted on a lower shaft 1b protruding into the lower chamber 5b to support the lower table 4.

The upper chamber 5a and the lower chamber 5b are combined with each other to form a vacuum chamber 5. That is, the lower chamber 5a is engaged with the lower chamber 5b from above, and the opening of the lower chamber 5b is closed by the upper chamber 5a. The connection portion between the upper chamber 5a and the lower chamber 5b is sealed by a sealing ring (not shown), so that the airtightness of the vacuum chamber 5 is secured.

The upper frame 2 is further movable downward than the state in which the upper chamber 5a is in contact with the lower chamber 5b. The upper frame 2 is moved downward from the state in which the lower side of the upper chamber 5a is restricted by the lower chamber 5b and the engaging portion 6b and the hook 6c ) Is eliminated. The upper chamber 5a is placed in the lower chamber 5b with its own weight. An upper table 3 and a lower table 4 are disposed and installed inside the vacuum chamber 5.

The substrate assembling apparatus 1 is provided with a vacuum pump mechanism P0. The vacuum pump mechanism P0 is connected to the vacuum chamber 5 to exhaust air in the vacuum chamber 5 to make the inside of the vacuum chamber 5 vacuum. That is, when the vacuum pump mechanism P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump mechanism P0 is controlled by the control device 100. [

The upper table 3 moves downward together with the upper frame 2 moving downward inside the vacuum chamber 5. The upper substrate K1 held by the upper table 3 and the lower substrate K2 held by the lower table 4 are joined by the lower movement of the upper table 3, The substrate K2 is pressed. When the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are vacuum bonded.

Further, as described above, the upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. Therefore, the load when the upper substrate K1 and the lower substrate K2 are pressed by the upper table 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100. [ The control device 100 specifies a load applied to the substrate from the upper table 3 based on the detection value detected by the load cell 20d. In the present embodiment, since the substrate assembling apparatus 1 has four load cells 20d, the total value of the detection values detected by the four load cells 20d becomes the total load value of the entire apparatus. That is, the sum of the detection values detected by the four load cells 20d becomes the value of all the loads applied to the substrate from the upper table 3.

The substrate assembly system 1000 also manages the Z axis coordinates of the upper table 3 which is moved up and down by the Z axis driving mechanism 20 by the control device 100. [ However, in general, the upper substrate K1 and the lower substrate K2 have a thickness tolerance for each product. Therefore, it is difficult to monitor the close contact state between the upper substrate K1 and the lower substrate K2 by the amount of descent of the upper table 3. Therefore, the substrate assembly system 1000 manages the close contact state between the upper substrate K1 and the lower substrate K2 based on the value of the load detected by the four load cells 20d.

(Configuration of the suction mechanism)

Fig. 3 is a diagram showing the configuration of the idle mechanism 7. Fig. The pick-up mechanism 7 is a mechanism for vertically moving the pick-up pin 7a or picking up the upper substrate K1 by the pick-up pin 7a or a dummy substrate (not shown). The suction mechanism (7) is mounted on the upper frame (2).

As shown in Fig. 3, the idler mechanism 7 includes a plurality of pick-up fins 7a, one or more pick-up pin pads 7b, and a vertical pick-up mechanism 70. [ The suction pin 7a is a tubular member extending in the vertical direction and is provided so as to be movable up and down independently of the upper table 3. Each of the pick-up pins 7a is attached to one or more pick-up pin pads 7b. At least one of the plurality of the suction pins 7a is mounted on each of the suction pin pads 7b. Each of the pick-up pins 7a moves upward and downward at the same time as the pick-up pin pad 7b moves up and down. The gripping pin pad 7b is disposed between the upper chamber 5a and the upper table 3. The grip pin pad 7b is moved up and down by the up-and-down moving mechanism 70. [

In the present embodiment, it is assumed that the up-and-down moving mechanism 70 is constituted by a ball screw mechanism. The vertical movement mechanism 70 includes a ball screw shaft 71 rotatably supported on the mounting portion 80a and extending in the Z axis direction as in the later-described vertical movement mechanism 80 (see Fig. 4) An electric motor 73 that rotates the screw shaft 71 and a ball screw mechanism 72 that moves up and down by a rotating ball screw shaft 71. [ The mounting portion 80a is fixed to the upper frame 2 so that the ball screw shaft 81 (see Fig. 4) of the up-and-down moving mechanism 80 and the ball screw shaft 81 71). The ball screw shaft 71 is rotated by the electric motor 73 to move the ball screw mechanism 72 up and down. Then, the ball screw mechanism 72 is mounted on the pick-up pin pad 7b. The wedge pin pad 7b moves up and down integrally with the ball screw mechanism 72 moving up and down by the rotation of the ball screw shaft 71. [

The up-and-down moving mechanism 70 is controlled by the controller 100 and the pick-up pin pad 7b and the pick-up pin 7a move up and down in response to a command from the controller 100. [

The tip 7a is disposed above the plane of the upper table 3 (upper substrate surface 3a) and protrudes downward from the upper substrate surface 3a when moved downward relative to the upper table 3. Further, the upper substrate surface 3a is a plane facing the lower table 4 (see Fig. 1).

The suction pin 7a has a hollow tube shape and the hollow portion 7a1 communicates with the hollow portion 7b1 of the suction pin pad 7b. A vacuum pump P1 is connected to the hollow portion 7b1 of the suction pin pad 7b. When the vacuum pump P1 is driven, the hollow portions 7a1 and 7b1 are evacuated and the upper substrate K1 is vacuum-adsorbed to the suction pin 7a. The vacuum pump P1 is controlled by the control device 100. [ That is, the vacuum pump P1 is driven according to the command of the controller 100, and the upper substrate K1 is vacuum-adsorbed to the suction pin 7a.

(Constitution of adhesive holding mechanism)

Fig. 4 is a view showing the configuration of the adhesive holding mechanism 8. Fig. The adhesive holding mechanism 8 is a mechanism for vertically moving the adhesive pin 8a or for adhering the upper substrate K1 by the adhesive pin 8a or a dummy substrate not shown. The adhesive holding mechanism 8 is mounted on the upper frame 2. [

4, the adhesive holding mechanism 8 includes a plurality of adhesive pins 8a, one to a plurality of adhesive pin plates 8b, and a vertical moving mechanism 80. As shown in Fig. The adhesive pin 8a is a tubular member extending vertically and is vertically movable independently of the upper table 3 and the suction pin 7a. The upward and downward movement of the adhesive pin 8a is a vertical operation to the upper substrate surface 3a of the upper table 3. The adhesive pin 8a is disposed above the upper substrate surface 3a of the upper table 3 and protrudes downward from the upper substrate surface 3a when moved downward with respect to the upper table 3. [ Further, the adhesive pin 8a moves upward and is pulled from the upper substrate surface 3a. The state in which the adhesive pin 8a does not protrude from the upper substrate surface 3a, that is, the state in which the amount of protrusion of the adhesive pin 8a is zero (or less) And is pulled from the upper substrate surface 3a. Then, the adhesive pin 8a moves downward and protrudes from the upper substrate surface 3a. The projecting amount of the adhesive pin 8a indicates the projecting amount of the adhesive pin 8a from the upper substrate surface 3a (the same applies hereinafter).

Each of the adhesive pins 8a is attached to one or more adhesive pin plates 8b (base portion). At least one adhesive pin 8a is attached to each adhesive pin plate 8b. Each of the adhesive pin plates 8b can move up and down independently (vertical motion with respect to the upper substrate surface 3a).

The adhesive pin 8a has, at its tip end, an adhesive portion 8c made of an elastic material and having adhesiveness. The adhesive pin 8a has a hollow tube shape, and a vacuum suction hole 8d is opened at the center. The vacuum suction hole 8d communicates with the negative pressure chamber 8b1 formed as the hollow portion of the adhesive pin plate 8b. A vacuum pump P2 is connected to the negative pressure chamber 8b1 of the adhesive pin plate 8b. Therefore, the vacuum pump P2 is connected to the vacuum suction hole 8d of the adhesive pin 8a via the negative pressure chamber 8b1.

The adhesive pin 8a evacuates the upper substrate K1 when the vacuum pump P2 is driven and the vacuum suction hole 8d is in a vacuum state and the upper substrate K1 vacuum- (Adhered and held). The adhesive pin 8a holds the upper substrate K1 in a state of protruding from the upper substrate surface 3a.

The vacuum pump P2 is controlled by the control device 100. [ The upper substrate K1 is vacuum-sucked to the adhesive pin 8a in accordance with the command of the control device 100 and attached to the adhesive portion 8c.

A gas supply means 8e is connected to the negative pressure chamber 8b1 of the adhesive pin plate 8b. The gas supply means 8e is controlled by the control device 100. [ The gas supply means 8e is driven in accordance with the command of the control device 100 and supplies a predetermined gas (air, nitrogen gas, etc.) to the negative pressure chamber 8b1. The negative pressure chamber 8b1 and the vacuum suction hole 8d are raised by the gas supplied from the gas supply means 8e and the upper substrate K1 attached to the adhesive portion 8c is peeled off from the adhesive portion 8c do.

Each of the adhesive pin plates 8b is provided with a second driving mechanism (up-and-down moving mechanism 80). The vertical movement mechanism 80 includes a ball screw shaft 81 rotatably supported on the mounting portion 80a and extending in the Z axis direction, an electric motor 83 rotating the ball screw shaft 81, And a ball screw mechanism 82 which moves upward and downward by a ball screw shaft 81 which is driven by a motor. The mounting portion 80a is fixed to the upper frame 2. The ball screw shaft 81 is rotated by the electric motor 83 to move the ball screw mechanism 82 up and down. Then, the ball screw mechanism 82 is mounted on the adhesive pin plate 8b. The adhesive pin plate 8b moves up and down integrally with the ball screw mechanism 82 which moves up and down by the rotation of the ball screw shaft 81. [

The up-and-down moving mechanism 80 is controlled by the control device 100 and the adhesive pin plate 8b and the adhesive pin 8a move up and down in accordance with the command of the control device 100. [

The mounting portion 80a is mounted on the upper frame 2 and moves up and down integrally with the upper frame 2. [ Further, the upper table 3 moves up and down integrally with the upper frame 2. The upper frame 2 is moved up and down by the Z-axis driving mechanism 20 (see Fig. 1). When the upper frame 2 is moved downward, the upper table 3 and the mounting portion 80a move downward. As a result, the upper table 3 and the mounting portion 80a proceed toward the lower table 4 (see Fig. 1). The up-and-down moving mechanism 80 is mounted on the mounting portion 80a and the adhesive pin plate 8b (adhesive pin 8a) moves up and down as the mounting portion 80a moves up and down. Therefore, the Z-axis driving mechanism 20 (first driving mechanism) has a function of advancing the adhesive pin 8a and the upper table 3 toward the lower table 4. [

Further, in the present embodiment, the upper table 3 has a back plate 30 and a cushion sheet 31. The back plate 30 is a plate member for supporting the cushion sheet 31, and is made of a rigid material. The cushion sheet 31 is a sheet material composed of an elastic material. The back plate 30 is mounted on the upper shaft 2a and moves up and down integrally with the upper frame 2. [ The back plate 30 is a plate-like member arranged in parallel with the lower substrate surface 4a (see Fig. 1) of the lower table 4. Further, the cushion sheet 31 faces the lower substrate surface 4a.

(Configuration of Upper Substrate Surface)

5 is a view showing the configuration of the upper substrate surface 3a of the upper table 3 and shows an example of the arrangement of the adhesive pins 8a.

As shown in Fig. 5, in this embodiment, 81 adhesive pins 8a are provided on the upper table 3. Nine adhesive pins 8a are mounted on the lower surface side of one adhesive pin plate 8b which shows a rectangular shape. Then, nine adhesive pin plates 8b are arranged on one upper table 3. Further, four vertically moving mechanisms 80 are provided on one adhesive pin plate 8b. The up-and-down moving mechanism 80 is provided, for example, in total of four, one each at four corners of each of the adhesive pin plates 8b representing a rectangle. The nine adhesive pin plates 8b are vertically movable by the up-and-down moving mechanism 80 independently of each other. However, the number of the adhesive fingers 8a can be appropriately changed depending on the operation. Also, the number of the adhesive pin plates 8b can be changed appropriately depending on the operation, and for example, one, four, or another number may be used.

As described above, the up-and-down moving mechanism 80 (second driving mechanism) of the present embodiment is configured such that a plurality of (nine) adhesive pin plates 8b are independently moved up and down ).

The up-and-down moving mechanism 80 is capable of projecting the adhesive pin 8a from the upper substrate surface 3a with a projecting amount set for each adhesive pin plate 8b. This allows the adhesive pin 8a to hold the upper substrate K1 (see FIG. 1) in a state of protruding from the upper substrate surface 3a with a projecting amount set for each adhesive pin plate 8b.

(Operation of the upper table)

6 is a diagram schematically showing the operation of the upper table 3. 6A shows a state immediately before the upper substrate K1 and the lower substrate K2 are bonded to each other and FIG. 6B shows a state in which the upper substrate K1 and the lower substrate K2 are bonded to each other As shown in FIG.

6A, the lower substrate K2 is placed on the lower table 4 just before the upper substrate K1 and the lower substrate K2 are bonded. The upper substrate K1 is held by a plurality of adhesive pins 8a passing through the upper table 3 above the lower substrate K2.

6B, the substrate assembling apparatus 1 drives the Z-axis driving mechanism 20 when the upper substrate K1 and the lower substrate K2 are joined to each other so that the upper frame 2 (Adhesive pin 8a) is moved downward together with the upper table 3 together with the adhesive pin plate 8b (adhesive pin 8a). The substrate assembling apparatus 1 presses the upper substrate K1 and the lower substrate K2 with the upper frame 2 and the upper table 3 and the lower table 4 to press the upper substrate K1 and the lower substrate K1 And the substrate K2 is bonded.

(Structure of Upper and Lower Moving Mechanism of Adhesion and Holding Mechanism)

7 is a diagram schematically showing the structure of the up-and-down moving mechanism 80 of the adhesive holding mechanism 8. As shown in Fig. 7 (a) schematically shows the structure of the entire up-and-down moving mechanism 80 of the substrate assembling apparatus 1, and Fig. 7 (b) (PL1), and the structure of the vertical movement mechanism 80 in the plate PL1 is schematically shown.

As shown in Fig. 7 (a), in the present embodiment, the substrate assembling apparatus 1 has nine rectangular adhesive pin plates 8b. At least four corners of each adhesive pin plate 8b are provided with four vertical moving mechanisms 80 for vertically moving respective portions (four corners) of the adhesive pin plate 8b.

Here, the four up-and-down moving mechanisms 80 are referred to as axes Ax1, Ax2, Ax3, Ax4 (see Fig. 7 (b)). Axes Ax1 and Ax4 are arranged on a diagonal line connecting two vertices whose rectangles are not adjacent to each other. Axes Ax2 and Ax3 are arranged on a diagonal line connecting the other two vertices.

7 (b), each of the up-and-down moving mechanisms 80 has a ball screw shaft 81, a ball screw mechanism 82, and an electric motor 83. As shown in Fig. The ball screw mechanism 82 is integrally formed with the adhesive pin plate 8b and is screwed to the ball screw shaft 81. [ The electric motor 83 rotationally drives the ball screw shaft 81 to vertically move each part (four corners) of the adhesive pin plate 8b.

The electric motor 83 is connected to the control device 100 via an amplifier 211 and a programmable logic controller (PLC) In the present embodiment, a servomotor is used as the electric motor 83 so that the control device 100 can define the operation amount (rotation angle) of each electric motor 83 via the PLC 212. Therefore, the control device 100 controls the operation amount (rotation angle) of the electric motor 83 so that the adhesive pin plate (not shown) from the upper frame 2 on each axis Ax1, Ax2, Ax3, 8b. That is, the control device 100 can define the height of each part (four corners) of the adhesive pin plate 8b.

<Configuration of Control Device>

Hereinafter, the configuration of the control apparatus 100 will be described with reference to FIG. 8 is a diagram showing a configuration of the control apparatus 100. As shown in Fig.

8, the control apparatus 100 includes a control section 110, a storage section 160 such as a ROM, a RAM, and a HDD, a speaker 170, a display section 180 such as a liquid crystal display, And an input unit 190 such as a keyboard, a keyboard, and the like.

The control unit 110 includes a height control unit 111, a movement control unit 112, a vacuum process control unit 113, a measurement unit (not shown) 121, an adjustment data calculation unit 122, an adjustment mode selection unit 123, a change monitoring unit 124, an automatic adjustment unit 131, and a manual adjustment unit 132.

The height control section 111 is a functional means for controlling the operation of the up-and-down moving mechanisms 70 and 80. The height control section 111 drives the vertical movement mechanisms 70 and 80 to control the height of the gripping pin pad 7b and the height adjustment of each part (four corners) of the adhesive pin plate 8b.

The movement control section 112 is a functional means for controlling the operations of the Z-axis drive mechanism 20 and the XY &amp;thetas; The movement control section 112 drives the electric motor 20c of the Z axis driving mechanism 20 to move the upper frame 2 up and down so that the upper table 3 and each of the adhesive pin plates 8b Pin 8a) is moved up and down. The movement control unit 112 drives the moving mechanism 41 of the XY? Mobile unit 40 to displace the lower table 4 to determine the bonding position of the upper substrate K1 and the lower substrate K2 .

The vacuum process control section 113 is a functional means for controlling the operation of the upper chamber 5a, the vacuum pump mechanism P0 and the vacuum pumps P1, P2, and P3.

The measurement unit 121 is a functional unit that measures the load (in this embodiment, the current value of the holding current flowing through each electric motor 83 (holding current value)) of each of the vertical moving mechanisms 80. The measuring section 121 simultaneously records the timing data in which the holding current value of the electric motor 83 is varied and the height data of the adhesive pin plate 8b in the storage section 160 as the measurement data D2. The measuring section 121 has a monitoring function for determining the parallel state of each part (four corners) of each adhesive pin plate 8b in accordance with the timing of the fluctuation of the load of each up-and-down moving mechanism 80. [

The adjustment data calculation unit 122 is a functional unit that calculates later-described adjustment data D3.

The adjustment mode selection unit 123 is a functional unit that selectively accepts adjustment modes such as an automatic adjustment mode and a manual adjustment mode.

The change monitoring unit 124 monitors the change in the height (parallelism) of each part (four corners) of the adhesive pin plate 8b due to aging or other factors, the change in the holding current value of each electric motor 83, As shown in FIG.

The automatic adjustment unit 131 is a functional unit that executes the automatic adjustment mode. The automatic adjustment mode is a mode in which the controller 100 automatically performs parallel adjustment based on the adjustment data D3 calculated by the adjustment data calculation unit 122. [

The manual adjustment unit 132 is a functional unit that executes the manual adjustment mode. The manual adjustment mode is a mode for performing parallel adjustment by accepting an input of an adjustment value manually by an engineer or an operator. Here, the engineer is a person on the provider side of the substrate assembly system 1000. In addition, the operator is a person on the user side of the substrate assembly system 1000. The manual adjustment mode is suitable when an engineer or an operator individually produces a product while confirming the state of parallel adjustment of each board individually.

The storage unit 160 stores, for example, the control program Pr1, the setting data D1, the measurement data D2, the adjustment data D3, the accumulation measurement data D4, and the like.

The control program Pr1 is a program that specifies the operation of the control device 100. [

The setting data D1 is data indicating a setting value of the operation of the substrate assembling apparatus 1. [

Measurement data D2 is data representing the measurement result of the holding current value of each electric motor 83 of each up-and-down moving mechanism 80.

The adjustment data D3 is data indicating the adjustment value of the operation amount (rotation angle) of each electric motor 83 of each up-and-down moving mechanism 80. Details of the adjustment data D3 will be described later.

The accumulation measurement data D4 is data representing the measurement result of the holding current value of each electric motor 83 of each up-and-down moving mechanism 80 measured in the past.

<Example of change of current value of electric motor>

Hereinafter, a variation example of the current value of the electric motor 83 will be described with reference to FIG. Quot; parallel adjustment &quot; in the present embodiment means that the electric motor 83 of the up-and-down moving mechanism 80 of the adhesive holding mechanism 8 is driven to rotate the respective portions of the adhesive pin plate 8b (concretely, By adjusting the heights of the axes Ax1, Ax2, Ax3 and Ax4 (see Fig. 7 (b)) arranged at the four corners of the adhesive pin plate 8b, The projecting amount of the adhesive fingers 8a projecting downward from the upper surface of the base plate 8 is adjusted.

9 is a graph showing the relationship between the Z-axis height and the electric current value of the electric motor 83 of the up-and-down moving mechanism 80. Fig. Fig. 9 (a) shows a state before the parallel adjustment is performed. 9 (b) and 9 (c) show the state after the parallel adjustment is performed.

9, the horizontal axis represents the height of the Z axis, and the vertical axis represents the current value (holding current value) of the holding current flowing through each electric motor 83. [ The value of the horizontal axis decreases as it moves from the left to the right, while the value of the vertical axis increases as it moves from the lower side to the upper side.

Here, the Z axis height indicates the height from the lower substrate surface 4a of the lower table 4 to the upper substrate surface 3a of the upper table 3 (the height of the upper and lower axes of the upper frame 2). When the upper frame 2 is moved upward by the Z-axis driving mechanism 20, the value of the Z-axis height becomes larger. When the upper frame 2 is moved downward by the Z-axis driving mechanism 20, The value becomes smaller.

The holding current value is measured by the measuring section 121 (see Fig. 8) of the control apparatus 100, for example.

Ax1a represents the start point of the decrease of the current value in the electric motor 83 of the axis Ax1. And Ax1b represents a period during which the current value of the electric motor 83 of the axis Ax1 is decreasing. Ax1c represents the end point of the reduction of the current value in the electric motor 83 of the axis Ax1. Ax2a, Ax3a and Ax4a represent starting points of the decrease of the current value in the electric motor 83 of the axes Ax2a, Ax3a and Ax4a, respectively.

Here, the starting points (points Ax1a, Ax2a, Ax3a, Ax4a) of the decrease of the current value are defined by the substrate held by the adhesive pin 8a (for example, the upper substrate K1, (For example, the lower substrate K2 and the lower table 4) of the lower substrate.

As described above, the sum of the detection values detected by the four load cells 20d becomes the total load value of the entire device. The control apparatus 100 monitors whether the upper substrate K1 and the lower substrate K2 are in contact with each other by monitoring the Z axis height and the change in the detection values of the four load cells 20d. The substrate assembling apparatus 1 has a structure in which the upper table 3 is suspended from the upper frame 2 by the suspending mechanism 6. [ The substrate assembling apparatus 1 has a structure in which a load is applied to the upper table 3 without being applied to the adhesive holding mechanism 8 when the adhesive section 8c of the adhesive pin 8a is crushed. Therefore, in the substrate assembling apparatus 1, when the adhesive portion 8c is consumed to some extent, the fluctuation of the holding current value of the electric motor 83 disappears, and the holding current value becomes constant.

Fig. 10 shows the state of the adhesive pin 8a in the process. 10 is a diagram schematically showing the operating state of the electric motor 83 of the up-and-down moving mechanism 80 as the second driving mechanism. In the point Ax1a shown in FIG. 9 (a), the adhesive pin 8a is in the state shown in FIG. 10 (a). In the section Ax1b shown in Fig. 9 (a), the adhesive pin 8a is in the state shown in Fig. 10 (b). In addition, in the point Ax1c shown in Fig. 9 (a), the adhesive pin 8a is in the state shown in Fig. 10 (c).

As shown in Fig. 10A, at the point Ax1a which is the starting point of the decrease in the current value, the substrate held by the adhesive pin 8a (for example, the upper substrate K1, (For example, the lower substrate K2 and the lower table 4) are in contact with each other. Here, it is assumed that the substrate held by the adhesive pin 8a is the upper substrate K1, and the lower member of the upper substrate K1 is the lower substrate K2 (hereinafter the same). At this time, the adhesive portion 8c of the adhesive pin 8a is in a non-distorted state, and the current value I1a equal to the set value is measured as the holding current value of the electric motor 83. [

10 (b), in the section Ax1b during which the current value is decreasing, the upper substrate 2 and the upper table 3 and the lower table 4 are in a state in which the upper substrate K1 is pressed . At this time, the adhesive portion 8c of the adhesive pin 8a is in a collapsed state, and the current value I1b having a value smaller than the current value I1a is measured as the holding current value of the electric motor 83. [

10 (c), at the point Ax1c, which is the end point of the decrease of the current value, the upper substrate 2 and the upper table 3 and the lower table 4 are connected to the upper substrate K1 The cushion sheet 31 of the upper table 3 is in the pressed state. At this time, the adhesive portion 8c of the adhesive pin 8a and the cushion sheet 31 of the upper table 3 are in a collapsed state and the holding current value of the electric motor 83 is lower than the current value I1b A smaller current value I1c is measured.

Referring back to (a) of FIG. 9,? Ax12 represents the difference from the point Ax1a to the point Ax2a. And ΔAx13 represents the difference from the point Ax1a to the point Ax3a. And ΔAx14 represents the difference from the point Ax1a to the point Ax4a. Here, the difference DELTA Ax12 indicates the difference from the start point (point Ax1a) of the first current value to the decrease start point (point Ax2a) of the second current value (the differences DELTA Ax13 and DELTA Ax14 .

In the present embodiment, as an example, when "N (탆)" is a threshold value and "-Nm <(ΔAx14-ΔAx12) <+ Nm", the adhesive pin plate 8b (For example, the substrate held by the upper substrate 8a) is parallel to the lower member (for example, the lower substrate K2 and the lower table 4).

In the example shown in Fig. 9A, the Z axis height values of the points Ax1a, Ax2a, Ax3a, and Ax4a are in the order of the points Ax1a, Ax2a, Ax3a, and Ax4a in that the values are large. This is because the axis Ax1 is the lowest, the axis Ax2 is the second lowest, the axis Ax3 is the third lowest, and the axis Ax4 is the fourth lowest (i.e., the highest) And the plate 8b is inclined. The substrate assembling system 1000 can perform the parallel adjustment as shown in, for example, Figs. 9 (b) and 9 (c) by adjusting the timing of the start of decreasing the holding current value.

9B shows an example in which parallel adjustment is performed so that the timings of the start of decreasing the holding current value coincide with all the axes Ax1, Ax2, Ax3, and Ax4. This means that the parallel adjustment is performed so that the entire surface of the adhesive pin plate 8b becomes parallel to the lower member (for example, the lower substrate K2 and the lower table 4).

On the other hand, FIG. 9C shows an example in which parallel adjustment is carried out such that the timings of the start of decreasing the holding current value are appropriately shifted in each axis Ax1, Ax2, Ax3, Ax4. This case is a condition in which each portion of the adhesive pin plate 8b is parallel to the lower member (for example, the lower substrate K2 or the lower table 4) so as to have a displacement amount deliberately set, It means that the adjustment is made.

<Details of setting data>

Hereinafter, the details of the adjustment data D3 (see Fig. 8) will be described.

In this embodiment, the adjustment data D3 is used for the parallel adjustment of each part of the adhesive pin plate 8b (for example, near each axis Ax1, Ax2, Ax3, Ax4) (The amount of adjustment of the operation of each up-and-down moving mechanism 80). The adjustment data D3 is calculated based on the differences? A12,? AX13, and? AX14 (see FIG. 9A) of the Z-axis height. For example, the substrate assembly system 1000 may be configured such that the adhesive pin plate 8b that is tilted with respect to the upper substrate surface 3a of the upper table 3 is in a state parallel to the upper substrate surface 3a . That is, the substrate assembling system 1000 can perform parallel adjustment such that the state shown in Fig. 9 (a) becomes the state shown in Fig. 9 (b). In this case, the parallel adjustment amounts of the axes Ax2, Ax3, and Ax4 are? A12,? A13, and? A14, respectively. The adjustment data D3 indicates its value.

Further, the substrate assembling system 1000 can be adjusted so that each portion of the adhesive pin plate 8b is bent by an amount of displacement intentionally set. That is, the substrate assembling system 1000 can perform parallel adjustment so that the state shown in FIG. 9 (a) is changed to the state shown in FIG. 9 (c), for example. The parallel adjustment amounts of the axes Ax2, Ax3, and Ax4 in this case can be changed according to the amount of displacement in which the respective portions are intentionally bent. Therefore, the value of the adjustment data D3 in this case varies depending on the amount of displacement.

<Operation of Substrate Assembly System>

The substrate assembly system 1000 makes it possible to simplify the parallel adjustment of the upper substrate K1 with respect to the lower substrate K2. The parallel adjustment is performed by controlling the operation of the up-and-down moving mechanism 80 of the adhesive holding mechanism 8 as the second driving mechanism so that the height of each portion of the adhesive pin plate 8b, which is the base portion of the adhesive holding mechanism 8, (See S140 in Fig. 11A).

Hereinafter, the operation of the substrate assembly system 1000 will be described with reference to FIGS. 11A to 11D, 12, 13, 14A to 14B, and 15. FIG. Figs. 11A to 11D are flowcharts showing the operation during setup of the substrate assembly system 1000, respectively. 12 is a flowchart showing the operation in which the substrate assembling system 1000 is at a standstill. Fig. 13 is a flowchart showing operations in production of the substrate assembling system 1000. Fig. 14A to 14B are flowcharts showing the operation of the substrate assembly system 1000 at the time of pressurization and current measurement. 15 is a diagram showing an example of a display screen PI1 displayed on the display unit 180 (see Fig. 8).

Further, the substrate assembling apparatus 1 operates based on the time measured by a timer (not shown). In addition, a series of operations of the substrate assembling apparatus 1 are specified by a program stored in advance in a storage unit, which is not shown, in a readable manner. Further, each piece of information is temporarily stored in a storage unit so as to be read out, and then outputted to a required component for performing subsequent processes. Hereinafter, these points will be described in detail in the information processing, and a detailed description thereof will be omitted.

(Operation during setup)

First, with reference to FIGS. 11A to 11D, the operation during setup of the substrate assembly system 1000 will be described. The setup operation is performed based on the operation of the engineer on the provider side of the substrate assembly system 1000. The engineer operates the control device 100 to display a registration screen (not shown) on the display unit 180 for registering various setting values in the substrate assembly system 1000. [ Thus, the substrate assembly system 1000 initiates the operation being set up.

As shown in FIG. 11A, when the engineer inputs various set values from a registration screen (not shown), the control device 100 accepts the registration of the entered set values (S105).

Then, when the engineer performs an operation instructing the start of the setup, the control device 100 causes the substrate assembling device 1 to carry the dummy substrate (not shown) into the vacuum chamber 5 (S110). More specifically, the control apparatus 100 drives the Z-axis driving mechanism 20 of the substrate assembling apparatus 1 to move the upper frame 2 upward, thereby moving the upper table 3 upward , The upper chamber 5a is moved upward. Whereby the vacuum chamber 5 is opened. Subsequently, the control apparatus 100 drives the transfer apparatus 200 to carry a dummy substrate (not shown) between the upper table 3 and the lower table 4 in the vacuum chamber 5. Then, The dummy substrate is a parallel adjustment amount (each vertical moving mechanism 80 (see FIG. 7A)) of each portion of the adhesive pin plate 8b (for example, near each axis Ax1, Ax2, Ax3, Ax4 ) Of the operation of the substrate). The dummy substrate is formed to have a uniform thickness on the entire surface.

When the dummy substrate is brought into the space between the upper table 3 and the lower table 4, the control device 100 gives a command to the up-and-down moving mechanism 70 and moves the wiper pin 7a until it reaches the dummy substrate. And the vacuum pump P1 is driven. As a result, the dummy substrate is vacuum-sucked to the suction pin 7a.

Thereafter, the control apparatus 100 causes the transport apparatus 200 to be ejected to the outside of the vacuum chamber 5, moves the pick-up pin 7a upward, moves the dummy substrate to the upper substrate surface 3a ). Since the upper substrate surface 3a is planar, deformation such as warping in the dummy substrate is corrected (deformation such as warp is removed).

Then, the control device 100 gives a command to the up-and-down moving mechanism 80 to move the adhesive pin plate 8b downward and drives the vacuum pump P2. The dummy substrate is evacuated to the adhesive pin 8a moving downward together with the adhesive pin plate 8b. At this time, the adhesive portion 8c at the tip of the adhesive pin 8a is attached to the dummy substrate. Thereafter, the control device 100 moves the adhesive pin plate 8b in a state in which the dummy substrate is attached to the adhered portion 8c of the adhesive pin 8a downward, and moves the dummy substrate from the upper substrate surface 3a It is detached.

At this time, the control device 100 controls the operation of each up-and-down moving mechanism 80 (specifically, the operation of the up-and-down moving mechanism 80) so that the projecting amount of each of the adhesive pins 8a becomes a projecting amount set for each part of the adhesive pin plate 8b. The operation of each electric motor 83 of each up-and-down moving mechanism 80) to move each of the adhesive pin plates 8b downward. Accordingly, the control apparatus 100 defines the height of each portion of each adhesive pin plate 8b. In the present embodiment, the electric motor 83 is constituted by a servomotor and is controlled by the PLC 212. [ The PLC 212 (see Fig. 7 (b)) continuously flows the electric current of a constant value to the electric motor 83 so that the operation amount (rotation angle) of the electric motor 83 is transmitted to the control device 100 To be continuously maintained at the operation amount specified by the instruction of

Thereafter, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 downward, thereby moving the upper table 3 downward and moving the upper chamber 5a downward . Thus, the upper chamber 5a and the lower chamber 5b are engaged with each other, and the vacuum chamber 5 is closed. At this time, the upper table 3, the lower table 4, the suction pins 7a, and the adhesive pins 8a are disposed inside the vacuum chamber 5. [

The processing of S110 is performed as described above.

After S110, the controller 100 causes the substrate assembling apparatus 1 to perform vacuum evacuation (S115). More specifically, when the vacuum chamber 5 is closed, the control device 100 drives the vacuum pump P0 to make the inside of the vacuum chamber 5 vacuum. As a result, the vacuum chamber 5 is in a state in which the upper table 3, the lower table 4, the suction pins 7a, and the adhesive pins 8a are housed under a vacuum environment.

After S115, the control apparatus 100 causes the substrate assembling apparatus 1 to perform pressurization and current measurement (S125). The process of S125 is carried out as follows.

First, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 downward so that the adhesive pins 8b (the adhesive pins 8a) together with the upper table 3, ). The substrate assembling apparatus 1 presses the dummy substrate with the upper frame 2 and the upper table 3 and the lower table 4. [ At the same time, the control device 100 starts measurement of the holding current value of each electric motor 83 of each up-and-down moving mechanism 80.

The control device 100 compares the measurement results of the holding current values of the respective electric motors 83 measured from the start to the end of the measurement of the current value of each electric motor 83 to the Z axis height And stores it in the storage unit 160 as measurement data D2. More specifically, the measuring section 121 of the control apparatus 100 measures the height data of the adhesive pin plate 8b indicating the Z-axis height and the measurement results of the holding current values of the respective electric motors 83 The timing data in which the holding current value of the electric motor 83 representing the fluctuation is recorded in the storage section 160 as the measurement data D2.

When the adhesive pin plate 8b (adhesive pin 8a) moves downward, the lower surface of the dummy substrate held by the adhesive pin 8a comes into a state of being in close contact with the lower substrate surface 4a of the lower table 4 . The control apparatus 100 detects that the lower surface of the dummy substrate is in close contact with the lower substrate surface 4a of the lower table 4 by a detection signal inputted from the load cell 20d. Then, the control device 100 drives each of the up-and-down moving mechanisms 80 at that point to pull each of the adhesive pins 8a from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2, drives the gas supply means 8e to supply the gas to the vacuum suction hole 8d, and attaches the dummy substrate to the adhered portion 8c. .

When the adhesive pin plate 8b (adhesive pin 8a) further moves downward, the adhesive portion 8c of the adhesive pin 8a is in a collapsed state. Thereafter, the upper surface of the dummy substrate is brought into close contact with the upper substrate surface 3a of the upper table 3, and the dummy substrate is further pressed by the upper frame 2 and the upper table 3. [ When the control device 100 judges that a predetermined set load has occurred between the upper table 3 and the lower table 4 by the detection signal inputted from the load cell 20d, the lower side of the upper frame 2 Stop the movement. In addition, the control device 100 ends the measurement of the current value of each electric motor 83. At this time, the dummy substrate is in a state in which a predetermined set load is applied under a vacuum environment in the vacuum chamber 5.

The processing of S125 is performed as described above. Details of the "pressurization and current measurement" process of S125 will be described later with reference to FIGS. 14A and 14B.

After step S125, the control device 100 refers to the measurement data D2 of the current values of the respective electric motors 83 stored in the storage section 160 in step S125, and displays a display screen (for example, , The display screen PI1 shown in Fig. 15) and displays the display screen on the display unit 180 (see Fig. 8) (S130).

15 is a diagram showing an example of the display screen PI1. In the example shown in Fig. 15, the display screen PI1 has a configuration in which the old measurement result is compared with the latest measurement result. The display screen PI1 is a graph showing a variation state of the measured current value of each electric motor 83 and various reference information, automatic adjustment buttons B1a and B2a, manual adjustment buttons B1b and B2b, And an unnecessary button B3. The automatic adjustment buttons B1a and B2a are set to automatically perform the parallel adjustment (i.e., the adjustment to specify the height of each portion of the adhesive pin plate 8b) (the execution of the automatic adjustment mode) . The manual adjustment buttons B1b and B2b are buttons for instructing the control device 100 to perform parallel adjustment manually (execution of the manual adjustment mode). The unnecessary adjustment button B3 is a button for instructing the control device 100 to not perform parallel adjustment.

Returning to Fig. 11A, after step S130, it is determined by the engineer whether parallel adjustment is necessary (S135). When the parallel adjustment is necessary ("Yes"), the automatic adjustment button B1a (see FIG. 15) or the manual adjustment button B1b (see FIG. 15) is pressed by the engineer. When detecting the depression of the automatic adjustment button B1a (see Fig. 15) or the manual adjustment button B1b, the control device 100 performs parallel adjustment (S140). On the other hand, when the parallel adjustment is unnecessary (&quot; No &quot;), the button B3 (see Fig. 15) is pressed by the engineer. When the control device 100 detects the depression of the unnecessary adjustment button B3, the control device 100 ends the processing of the series of routines.

(Details of "adjustment execution" processing)

Hereinafter, with reference to FIG. 11B, details of the "adjustment execution" process (see FIG. 11A) of S140 will be described.

As shown in Fig. 11B, in the &quot; adjustment execution &quot; process of S140, the control device 100 first accepts the adjustment mode (S140a). The reception of the adjustment mode is performed by detecting the depression of the automatic adjustment buttons B1a and B2a or manual adjustment buttons B1b and B2b displayed on the display screen PI1 (see FIG. 15). Subsequently, the control device 100 determines whether the received adjustment mode is the automatic adjustment mode (S140b).

If it is determined in step S140b that the received adjustment mode is the automatic adjustment mode ("Yes"), the control device 100 calculates the adjustment data D3 (see FIG. 8) And performs automatic adjustment of adjustment (S140d). Thus, the control device 100 ends the "adjustment execution" process of S140. Details of the &quot; automatic adjustment execution &quot; processing in S140d will be described later with reference to Fig. 11C.

On the other hand, if it is determined in step S140b that the received adjustment mode is not the automatic adjustment mode ("No"), the adjustment data calculation unit 122 (see FIG. 8) (S140e). The adjustment data is displayed on the display unit 180 (see Fig. 8) (S140f), and the manual adjustment of the parallel adjustment is performed (S140g). Thus, the control device 100 ends the "adjustment execution" process of S140. The details of the &quot; manual adjustment execution &quot; process in S140g will be described later with reference to FIG. 11D.

(Details of &quot; automatic adjustment execution &quot; processing)

Hereinafter, the details of the &quot; automatic adjustment execution &quot; processing (see Fig. 11B) of S140d will be described with reference to Fig. 11C.

11C, in the process of S140d, first, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 upward, thereby moving the upper frame 2 together with the upper table 3 The pin plate 8b (adhesive pin 8a) is moved upward to release the pressing to the dummy substrate (S141a).

Subsequently, the control device 100 automatically updates the set value of the operation amount of each up-and-down moving mechanism 80 (each electric motor 83) for parallel adjustment based on the adjustment data calculated in S140c (see Fig. 11B) S14lb).

After S14lb, the control apparatus 100 causes the substrate assembling apparatus 1 to perform pressurization and current measurement in the same manner as in the process of S125 (see Fig. 11A) (S141c). Based on the measurement result of S141c, the control device 100 determines whether or not the difference in the timing of the variation of the holding current value of each electric motor 83 of each up-and-down moving mechanism 80 is within a preset threshold value (S141d). If it is determined in step S141d that the difference is equal to or greater than the preset threshold value ("Yes"), the control device 100 ends the "automatic adjustment execution" process in step S140d. On the other hand, in the determination of S141d, when it is determined that the difference is not the predetermined threshold ("No"), the control device 100 calculates the adjustment data based on the measurement result of S141c (S141e). Thereafter, the process returns to S141a.

(Details of &quot; manual adjustment execution &quot; processing)

Hereinafter, the details of the &quot; manual adjustment execution &quot; processing (see Fig. 11B) of S140g will be described with reference to Fig.

11D, in the &quot; manual adjustment execution &quot; process of S140g, the control device 100 first releases the pressing to the dummy substrate similarly to the process of S141a (see Fig. 11C) (S142a).

Subsequently, the control device 100 accepts the manual input by the engineer of the set value of the operation amount of the up-and-down moving mechanism 80 (each electric motor 83) for parallel adjustment, receives the set value of the operation amount (S142b).

After S142b, the control device 100 causes the substrate assembling apparatus 1 to perform pressurization and current measurement in the same manner as the process of S125 (see Fig. 11A) (S142c). Subsequently, the control device 100 creates a display screen (for example, a display screen PI1 shown in Fig. 15) showing the measurement result in the same manner as the process of S130 (see Fig. 11A) (See Fig. 8) (S142d).

After S142d, it is determined by the engineer whether or not a readjustment (parallel adjustment) is necessary (S142e). When the re-adjustment (parallel adjustment) is required ("Yes"), the manual adjustment button B1b (see FIG. 15) is pressed by the engineer, for example. When detecting the depression of the manual adjustment button B1b, the control device 100 calculates the adjustment data based on the measurement result of S142c (S142f). Thereafter, the process returns to S142a. On the other hand, when the re-adjustment (parallel adjustment) is unnecessary ("No"), for example, the adjustment-unnecessary button B3 (see FIG. 15) is pressed by the engineer. When detecting the depression of the unnecessary adjustment button B3, the control device 100 ends the "manual adjustment execution" process of S140g.

(Operation during production stop of the substrate)

Next, with reference to Fig. 12, the operation of the substrate assembly system 1000 during the production stop of the substrate will be described. The operation during the production stop of the substrate is performed based on the operation of the operator on the user side of the substrate assembly system 1000.

11A, the operator operates the control device 100 to display a confirmation screen (not shown) for confirming the accumulated measurement data D4 (see Fig. 8) on the display unit 180 (S205 ). When a confirmation screen (not shown) is displayed, whether or not the parallel adjustment is necessary is determined by the operator (S210).

When parallel adjustment is necessary ("Yes"), an automatic adjustment button or manual adjustment button (not shown) included in the confirmation screen, not shown, for example, is pressed by the operator. When detecting the depression of an automatic adjustment button or a manual adjustment button (not shown), the control device 100 performs parallel adjustment (S140). On the other hand, when the parallel adjustment is unnecessary (&quot; No &quot;), for example, an unillustrated unneeded button included in the confirmation screen (not shown) is pressed by the operator. The control device 100 ends the processing of the series of routines when it detects the pressing of an unillustrated unnecessary button.

(Operation during production of the substrate)

Next, with reference to Fig. 13, operation during production of the substrate of the substrate assembly system 1000 will be described. The operation during production of the substrate is performed based on the operation of the operator on the user side of the substrate assembly system 1000. The operator operates the control device 100 to display a production instruction screen (not shown) on the display unit 180 for instructing the production of the substrate. Accordingly, the substrate assembly system 1000 initiates operation during production of the substrate.

As shown in Fig. 13, when the operator inputs various set values such as the number of productions from a production instruction screen (not shown) and instructs to start production, the control device 100 controls the substrate assembly apparatus 1 The upper substrate K1 and the lower substrate K2 are brought into the vacuum chamber 5 (S305). The processing of S305 is performed as follows.

First, the control apparatus 100 drives the Z-axis driving mechanism 20 of the substrate assembling apparatus 1 to move the upper frame 2 upward, thereby moving the upper table 3 upward, Thereby moving the chamber 5a upward. Whereby the vacuum chamber 5 is opened. The control device 100 drives the transfer device 200 to carry the upper substrate K1 between the upper table 3 and the lower table 4 in the vacuum chamber 5. Then,

When the upper substrate K1 is conveyed between the upper table 3 and the lower table 4, the control device 100 gives an instruction to the up-and-down moving mechanism 70 and when it touches the upper substrate K1 The suction pin 7a is moved downward and the vacuum pump P1 is driven. Thus, the upper substrate K1 is vacuum-sucked to the suction pin 7a.

Thereafter, the control apparatus 100 causes the transporting apparatus 200 to be ejected to the outside of the vacuum chamber 5, moves the pick-up pin 7a upward to move the upper substrate K1 to the upper surface of the upper table 3, And is brought into close contact with the surface 3a. Since the upper substrate surface 3a is planar, deformation such as warping in the upper substrate K1 is corrected (deformation such as warp is eliminated).

Then, the control device 100 gives a command to the up-and-down moving mechanism 80 to move the adhesive pin plate 8b downward and drives the vacuum pump P2. The upper substrate K1 is evacuated to the adhesive pin 8a moving downward together with the adhesive pin plate 8b. At this time, the adhesive portion 8c at the tip of the adhesive pin 8a is attached to the upper substrate K1. Thereafter, the control apparatus 100 moves the adhesive pin plate 8b in a state in which the upper substrate K1 is attached to the adhesive pin 8a downward, and moves the upper substrate K1 away from the upper substrate surface 3a Relax.

At this time, the control device 100 controls the operation of the up-and-down moving mechanism 80 (specifically, the operation of the up / down moving mechanism 80) so that the projecting amount of each of the adhesive pins 8a becomes a projecting amount set for each part of the adhesive pin plate 8b The operation of each electric motor 83 of the up-and-down moving mechanism 80) to move each of the adhesive pin plates 8b downward. Accordingly, the control apparatus 100 defines the height of each portion of each adhesive pin plate 8b.

Subsequently, the control apparatus 100 drives the transfer apparatus 200 to transfer the lower substrate K2 between the upper substrate K1 and the lower table 4 in the vacuum chamber 5 and to transfer the lower substrate K2 Is mounted on the lower substrate surface 4a of the lower table 4. [ Thereafter, the control apparatus 100 causes the transport apparatus 200 to be evacuated to the outside of the vacuum chamber 5. The control device 100 also drives the vacuum pump P3 to hold the lower substrate K2 on the lower substrate surface 4a of the lower table 4 and hold it.

Thereafter, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 downward, thereby moving the upper table 3 downward and moving the upper chamber 5a downward . Thus, the upper chamber 5a and the lower chamber 5b are engaged with each other, and the vacuum chamber 5 is closed. At this time, the upper table 3, the lower table 4, the suction pins 7a, and the adhesive pins 8a are disposed inside the vacuum chamber 5. [

The processing of S305 is performed as described above.

After S305, the control device 100 causes the substrate assembling apparatus 1 to perform vacuum evacuation similarly to the process of S115 (see Fig. 11A) (S310). Thus, the vacuum chamber 5 is in a state in which the upper table 3, the lower table 4, the suction pin 7a, and the adhesive pin 8a are housed under a vacuum environment. The lower substrate K2 may be formed of a sealant, a liquid crystal, a spacer, a paste material, or the like in a separate step before being brought into the substrate assembling apparatus 1 (between the upper table 3 and the lower table 4) The necessary material is applied.

After S310, the control device 100 drives the moving mechanism 41 of the XY &amp;thetas; movement unit 40 to displace the lower table 4, thereby displacing the joining position between the upper substrate K1 and the lower substrate K2 to (S315).

After S315, the control apparatus 100 causes the substrate assembling apparatus 1 to perform pressurization and current measurement processing (S320). The process of S320 is carried out as follows.

First, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 downward so that the adhesive pins 8b (the adhesive pins 8a) together with the upper table 3, And presses the upper substrate K1 and the lower substrate K2 with the upper frame 2 and the upper table 3 and the lower table 4. Then, Thus, the upper substrate K1 held by the adhesive pin 8a and the lower substrate K2 held by the lower table 4 are bonded. At the same time, the control device 100 starts measurement of the holding current value of each electric motor 83 of each up-and-down moving mechanism 80. The control device 100 compares the measurement results of the current values of the respective electric motors 83 measured from the start to the end of the measurement of the electric current values of the electric motors 83 to the Z axis height , And stores them in the storage unit 160 as measurement data D2.

The control apparatus 100 detects that the upper substrate K1 and the lower substrate K2 are joined by the detection signal inputted from the load cell 20d. Then, the control device 100 drives each of the up-and-down moving mechanisms 80 at that point to pull the adhesive pin 8a from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2 and drives the gas supply means 8e to supply the gas to the vacuum suction hole 8d, (8c).

The control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 further downward to move the upper frame 2 and the upper table 3 and the lower table 4 to the upper side The substrate K1 and the lower substrate K2 are further pressed. When the control device 100 judges that a predetermined set load has occurred between the upper table 3 and the lower table 4 by the detection signal inputted from the load cell 20d, the lower side of the upper frame 2 Stop the movement. In addition, the control device 100 ends the measurement of the current value of each electric motor 83. At this time, the upper substrate K1 and the lower substrate K2 are bonded under a predetermined setting load in a vacuum environment in the vacuum chamber 5. [ Further, the sealant previously applied to the lower substrate K2 is appropriately pressed by the pressure at this time, and the vacuum of the liquid crystal portion applied within the range enclosed by the sealant is maintained.

Thereafter, the sealant is temporarily cured by ultraviolet light emitted from an unillustrated UV (ultraviolet) irradiation device so that the positions of the upper substrate K1 and the lower substrate K2 are not shifted.

The process of S320 is performed as described above.

After S320, the control device 100 determines whether or not the difference in the timing of the variation of the holding current value of each electric motor 83 of each up-and-down moving mechanism 80 is within a predetermined threshold value, based on the measurement result of S320 (S325).

If it is determined in step S325 that the difference is within the predetermined threshold value (&quot; Yes &quot;), the control apparatus 100 causes the substrate assembling apparatus 1 to perform atmospheric release (S330). Specifically, the control device 100 injects a gas such as nitrogen gas into the vacuum chamber 5 in a vacuum state to increase the pressure in the vacuum chamber 5 to atmospheric pressure. The inside of the vacuum chamber 5 is raised to the atmospheric pressure so that the gap between the upper substrate K1 and the upper substrate K2 is increased until it becomes a gap (cell gap) determined by the amount of the spacer or liquid crystal applied to the substrate (lower substrate K2) And the lower substrate K2 are uniformly pressed (press-pressed). The control device 100 drives the gas supply means 8e to supply the gas to the vacuum suction hole 8d. At this time, since the adhesive pin 8a does not hold the upper substrate K1, the gas supplied to the vacuum suction hole 8d is supplied into the vacuum chamber 5. [ The control device 100 measures the atmospheric pressure in the vacuum chamber 5 with an atmospheric pressure sensor not shown in the figure and stops the gas supply means 8e at the time when the atmospheric pressure in the vacuum chamber 5 is raised to atmospheric pressure. Then, the controller 100 moves the upper frame 2 upward. Whereby the vacuum chamber 5 is opened.

After step S325, the control apparatus 100 drives the transfer apparatus 200 to carry out the substrate bonded with the upper substrate K1 and the lower substrate K2 to the outside of the vacuum chamber 5 (S335).

After S335, the control device 100 determines whether the production of the set number of sheets has been completed (S340). If it is determined in S340 that the production of the set number of sheets has not ended (&quot; No &quot;), the process returns to S305. On the other hand, when it is determined in S340 that the production of the set number of sheets has been completed ("Yes"), the processing of the series of routines ends.

If it is determined in step S325 that the difference is not the preset threshold value (&quot; No &quot;), the control device 100 sends an alarm to the speaker 170 to confirm the measurement result to the operator (Step S350). In step S320, referring to the measurement data D2 of the current values of the respective electric motors 83 stored in the storage unit 160, a display screen (for example, Fig. 15 , And displays the display screen on the display unit 180 (see Fig. 8) (S355).

After S355, whether or not the parallel adjustment is necessary is determined by the operator (S360). When the parallel adjustment is necessary ("Yes"), for example, the automatic adjustment button B1a (see FIG. 15) or the manual adjustment button B1b (see FIG. 15) is pressed by the operator. The control device 100 drives the transporting device 200 to move the substrate being produced to the inside of the vacuum chamber 5 when the automatic adjustment button B1a (see Fig. 15) or the manual adjustment button B1b is detected (S365). Then, the control apparatus 100 performs parallel adjustment (S140). Thereafter, the process returns to S305 through the code SA1. On the other hand, in S360, when the parallel adjustment is unnecessary ("No"), for example, the operator does not need the adjustment button B3 (see FIG. In this case, the process proceeds to S330 via the symbol SA2.

In the present embodiment, in the process of S330, the substrate assembling apparatus 1 is opened to the atmosphere. This is to realize the following operation.

That is, if there is a gap between the upper substrate K1 and the lower substrate K2 for gas to enter, it is not preferable. Therefore, the substrate assembling apparatus 1 presses the upper substrate K1 against the lower substrate K2 to such an extent that the adhered portion 8c of the adhesive pin 8a is crushed, and the upper substrate K1 and the lower substrate K2 ). Then, the substrate assembling apparatus 1 pressurizes the upper substrate K1 at atmospheric pressure by opening the atmosphere to adhere the upper substrate K1 and the lower substrate K2 in close contact with each other.

(Details of "pressure / current measurement" processing)

Hereinafter, details of the "pressurization and current measurement" processing (see FIGS. 11A, 11B, 11D, and 13) of S140g, S141c, S142c, and S320 will be described with reference to FIGS. 14A and 14B. Here, it is assumed that the lowering amount of the upper table 3 is set to four levels of the first lowering amount to the fourth lowering amount. However, the amount of descent of the upper table 3 may be set in multiple stages other than the four stages. It is assumed that the target load used as a condition for setting the amount of descent of the upper table 3 is set to three levels of the first target load to the third target load. However, the target load may be set in multiple stages other than the three stages.

As shown in Fig. 14A, in the "pressurization and current measurement" processing of S140g, S141c, S142c and S320, the controller 100 first sets each of the adhesive pin plates 8b to the pressing start height (S405). The pressurization start height is a height set in advance for starting the pressurization and is set to a value corresponding to the thickness of the substrate (specifically, the dummy substrate thickness or the total thickness of the upper substrate K1 and the lower substrate K2) Thickness &quot;). Subsequently, the control device 100 starts the current measurement (S410). Then, the control device 100 drives the Z-axis driving mechanism 20 to lower the upper table 3 to the press start height (S415).

After S415, the control device 100 sets the descending amount of the upper table 3 to the first descending amount (S420). The first falling amount is a value that is the same as a predetermined value (hereinafter, referred to as &quot; setting projection amount &quot;) as the projection amount of the adhesive portion 8c of the adhesive pin 8a from the upper substrate surface 3a Is set to a value smaller than the set protrusion amount. Subsequently, the control device 100 drives the Z-axis driving mechanism 20 to lower the upper table 3 by the first descent amount (S425).

After S425, the control device 100 determines whether or not the load measured by the four load cells 20d (hereinafter referred to as &quot; measurement load &quot;) reaches the final load (S430). The final load is a set load when the upper substrate K1 and the lower substrate K2 are actually bonded.

When it is determined in S430 that the measured load has reached the final load (&quot; Yes &quot;), the upper substrate K1 and the lower substrate K2 are joined. In this case, the control device 100 waits for the preset time (S435), then terminates the current measurement (S440) and stores the measurement result as the measurement data D2 in the storage unit 160 (S445). Then, the control device 100 ends the processing of &quot; pressurization and current measurement &quot;.

On the other hand, if it is determined in S430 that the measured load does not reach the final load (&quot; No &quot;), the process proceeds to S505 shown in Fig.

If it is determined in S430 that the measured load does not reach the final load (&quot; No &quot;), as shown in Fig. 14B, the control device 100 determines that the measured load has reached the first target load (S505). The first target load is a target load used as a condition for determining whether to set the second fall amount as the fall amount of the upper table 3, and is set to a value smaller than the final load.

If it is determined in step S505 that the measured load has reached the first target load (&quot; Yes &quot;), the controller 100 sets the descending amount of the upper table 3 to the second descending amount (S510). And the second falling amount is set to a value smaller than the first falling amount.

Subsequently, the control device 100 temporarily stops the current measurement (S515). The control device 100 then drives the moving mechanism 41 of the XY? Mobile unit 40 to displace the lower table 4 to determine the bonding position of the upper substrate K1 and the lower substrate K2 S520). Thereafter, the control device 100 resumes the current measurement (S525).

On the other hand, when it is determined in step S505 that the measured load does not reach the first target load (&quot; No &quot;), the control device 100 determines whether or not the measured load has reached the second target load (S530). And the second target load is set to a value smaller than the first target load. If it is determined in S530 that the measured load has reached the second target load (&quot; Yes &quot;), the controller 100 sets the descending amount of the upper table 3 to the third descending amount (S535). And the third falling amount is set to a value smaller than the second falling amount.

On the other hand, when it is determined in S530 that the measured load does not reach the second target load (&quot; No &quot;), the control device 100 determines whether or not the measured load has reached the third target load (S540). And the third target load is set to a value smaller than the second target load. If it is determined in S540 that the measured load has reached the third target load (&quot; Yes &quot;), the control device 100 sets the descending amount of the upper table 3 to the fourth descending amount (S545). And the fourth falling amount is set to a value smaller than the third falling amount. On the other hand, if it is determined in S540 that the measured load does not reach the third target load (&quot; No &quot;), the process proceeds to S550.

After the processing of S525, S535, and S545, or when it is determined in S540 that the measured load does not reach the third target load (&quot; No &quot;), the control device 100 , The Z-axis driving mechanism 20 is driven to lower the upper table 3 by the set amount of descent (S550). As a result, when the process is after step S525, the upper table 3 is lowered by the second fall amount. When the processing is after step S535, the upper table 3 is lowered by the amount corresponding to the third falling amount. When the process is after step S545, the upper table 3 is lowered by the amount corresponding to the fourth descent amount. If it is determined in step S540 that the measured load does not reach the third target load (&quot; No &quot;), the upper table 3 is lowered by the third fall amount.

After S550, the process returns to S430 shown in Fig. 14A through the symbol SB2.

<Main Features of Substrate Assembly System>

(One) The substrate assembly system 1000 has an adjustment data calculation section 122 (see FIG. 8). The adjustment data calculation section 122 calculates the adjustment data 122 based on the fluctuation of the load (the holding current value of the electric motor 83 in this embodiment) of each of the up-and-down moving mechanisms 80 measured according to the falling amount of the Z- (The rotational angle of the electric motor 83) of the up-and-down moving mechanism 80 based on the timing of the up-and-down moving mechanism 80, as shown in Fig. The engineer on the provider side of the substrate assembling system 1000 or the operator on the user side can easily perform the appropriate parallel adjustment by checking the calculated adjustment data D3. Therefore, the substrate assembly system 1000 can simplify the parallel adjustment of the upper substrate K1 with respect to the lower substrate K2.

Particularly, in recent years, it has been desired to cut and obtain a large number of products from a single substrate. When it is desired to satisfy this demand, it is preferable to perform fine setting of the parallel adjustment amount in accordance with each part of the substrate. Since the substrate assembly system 1000 can finely adjust the parallel adjustment amount in accordance with each part of the substrate, this demand can be satisfied.

(2) The substrate assembling system 1000 has a measuring section 121 (see FIG. 8). The measuring unit 121 measures the load (the holding current value of the electric motor 83) of each of the up-and-down moving mechanisms 80 and controls the respective portions (four corners) of the adhesive pin plate 8b, And a monitoring function for determining a parallel state of the sensor. Therefore, when the height of each part of the adhesive pin plate 8b is in a position exceeding a preset threshold value, the board assembly system 1000 alerts an operator to an abnormality of the parallel adjustment by an engineer or an operator .

(3) The control device 100 displays on the display unit 180 (see Fig. 8) a display screen PI1 (see Fig. 15) for selectively displaying the manual adjustment mode and the automatic adjustment mode. Accordingly, the engineer or the operator can select the desired mode depending on the operation. For example, the engineer or the operator can perform the parallel adjustment including the shift amount intentionally set as shown in Fig. 9 (c) by selecting the manual adjustment mode. The engineer or the operator can select the automatic adjustment mode so that the entire surface of the adhesive pin plate 8b is positioned on the lower side member (for example, the lower side substrate K2 or the lower side table (4)) can be performed. However, even in the automatic adjustment mode, by setting the setting data D1 (see Fig. 8) including the shift amount in advance, it is possible to set the parallel data including the shift amount intentionally set as shown in Fig. Adjustment can be performed.

(4) The substrate assembly system 1000 has a monitoring unit 124 (see FIG. 8). The monitoring unit 124 monitors the measurement data D2 representing the load (holding current value of the electric motor 83) of the up-and-down moving mechanism 80 measured by the measuring unit 121 with respect to the measurement And monitors the magnitude of the change from the preset load arbitrarily preset as the load or sample value. Such a substrate assembly system 1000 can feed back and monitor the state of parallel adjustment every time a substrate is manufactured, and can alert or automatically adjust the state when the state of previous and parallel adjustment is changed. Specifically, the control apparatus 100 records measurement data of the past several months as storage measurement data D4 in the storage section 160 as data representing the measurement load measured in the past. The monitoring unit 124 compares the measurement data D2 with the accumulation measurement data D4 and monitors whether or not the measurement data D2 is changed from the accumulation measurement data D4 beyond a preset threshold value. When the measurement data D2 is changed beyond the preset threshold value from the accumulated measurement data D4, the substrate assembly system 1000 notifies the engineer or the operator of the abnormality of the parallel adjustment by issuing an alarm, Alternatively, the parallel adjustment may be automatically performed.

(5) The control device 100 displays a display screen including a graph showing the process of variation of the load (holding current value of the electric motor 83) of the up-and-down moving mechanism 80 measured by the measuring unit 121 (See FIG. 15) on the display unit 180 (see FIG. 8). Accordingly, the substrate assembly system 1000 can provide the engineer or the operator with an intuitive and easy-to-understand view of the amount of shift in the timing of the variation of the load (the holding current value of the electric motor 83) in each axis Ax1, Ax2, Ax3, Ax4 .

(6) The electric motor 83 of the up-and-down moving mechanism 80 is constituted by a servomotor capable of performing the measurement of the fluctuation of the holding current value in accordance with the load by the control device 100. [ However, the electric motor 83 may be constituted by a step motor.

As described above, according to the substrate assembling apparatus 1 related to the present embodiment, it is possible to simplify the parallel adjustment of the upper substrate K1 with respect to the lower substrate K2.

The present invention is not limited to the above-described embodiment, but includes various modifications. For example, the above-described embodiment has been described in detail in order to facilitate understanding of the present invention, and is not limited to the configuration described above. It is also possible to replace some of the configurations of the embodiments with the configurations of the other embodiments, and it is also possible to add configurations of the other embodiments to the configurations of any of the embodiments. Further, it is possible to add, delete, or substitute another configuration with respect to a part of the configuration of each embodiment.

For example, in the above embodiment, the substrate assembling apparatus 1 has 81 adhesive pins 8a and nine adhesive pin plates 8b. However, the number of the adhesive pins 8a can be appropriately changed depending on the operation. Also, the number of the adhesive pin plates 8b can be appropriately changed depending on the operation.

In addition, for example, in the above-described embodiment, the substrate assembling apparatus 1 is configured to move one adhesive pin plate 8b up and down by four up-and-down moving mechanisms 80. However, the substrate assembling apparatus 1 may be configured such that one adhesive pin plate 8b is moved up and down by four or more up-and-down moving mechanisms (80).

For example, the measuring unit 121 and the adjustment data calculating unit 122 may be operated as follows. That is, when the lowering of the upper table 3 is started in the measurement of the holding current value of the electric motor 83, the measuring section 121 stores the measurement result as the measurement data D2 for N seconds in the storage section 160, . The measuring unit 121 (or the adjusting data calculating unit 122) detects a period in which the holding current value of the electric motor 83 is fluctuated and cuts the data of the period from the measured data D2 , And stores the cut data in the storage unit 160 as calculation data. The adjustment data calculation unit 122 calculates the adjustment data D3 based on the calculation data.

Further, for example, the substrate assembly system 1000 may be configured so that the state of parallel adjustment of each substrate can be determined as a remote value through the network.

Further, for example, the substrate assembly system 1000 may perform parallel adjustment once, store the adjustment value at that time in the storage unit 160, and use the adjustment value to continuously produce a plurality of substrates You can. This parallel adjustment is suitable for the production of a product whose adjustment accuracy is comparatively low (for example, one patterning product for obtaining one product from one substrate).

Further, for example, the substrate assembly system 1000 may be configured to produce substrates one by one while performing parallel adjustment every time. This parallel adjustment is suitable for production of a product with a relatively strict adjustment (for example, a product of multiple patterning for obtaining a large number of products from a single substrate).

1 substrate assembly device
1a bracket
1b Lower shaft
2 upper frame
2a Upper shaft
3 upper table
3a upper substrate face
4 Lower table
4a Lower substrate surface
5 Vacuum chamber
5a upper chamber
5b Lower chamber
6 suspensions
6a Support shaft
6b
6c hook
7 Absorption mechanism
7a
7b Wicking pin pad
7a1, 7b1 hollow portion
8 adhesive holding mechanism
8a adhesive pin
8b adhesive pin plate (base portion)
8b1 negative pressure chamber
8c Adhesive
8d Vacuum suction hole
8e gas supply means
20 Z-axis driving mechanism (first driving mechanism)
20a ball screw shaft
20b Ball Screw Mechanism
20c electric motor
20d load cell
30 back plate
31 Cushion Sheet
40 XY &amp;thetas;
70 up-and-down movement mechanism
71, 81 Ball Screw Shaft
72, 82 Ball Screw Mechanism
73, 83 Electric motor
80 Up-and-down moving mechanism (second driving mechanism)
80a mounting portion
110 control unit
111 height control section
112 movement control unit
113 vacuum process control
121 Measuring section
122 Adjustment data calculation unit
123 adjustment mode selection unit
124 Change monitoring section
131 Automatic adjustment section
132 Manual adjustment section
160 memory unit
170 speakers
180 display unit
190 Input unit
211 amplifier
212 Programmable Logic Controller (PLC)
200 conveying device
1000 Board Assembly System
Ax1, Ax2, Ax3, Ax4 axes
D1 setting data
D2 measurement data
Data for D3 adjustment
D4 Accumulated measurement data
K1 upper substrate
K2 Lower substrate
P0 vacuum pump mechanism
P1, P2, P3 Vacuum pump
Pr1 control program

Claims (9)

A substrate assembling device for assembling the substrate by joining the upper substrate and the lower substrate,
And a control device for controlling the operation of the substrate assembling device,
The substrate assembling apparatus includes:
A lower table having a lower substrate surface for holding the lower substrate,
An upper table having an upper substrate surface opposed to the lower substrate surface,
A plurality of adhesive pins provided on an end of the upper substrate and vertically movable with respect to the upper substrate surface to adhere and maintain the upper substrate in the adhesive portion protruding downward from the upper substrate surface,
A vacuum chamber capable of storing the lower table, the upper table, and the adhesive pins under an evacuated environment;
A first driving mechanism for vertically moving the adhesive pin and the upper table,
One or more base portions on which at least one adhesive pin is mounted,
At least four corners of each of the base portions and having a plurality of second driving mechanisms for independently moving up and down each portion of each of the base portions relative to the upper substrate surface,
The control device includes:
A height control unit for controlling the operation of each of the second driving mechanisms to define a height of each portion of each of the base portions with respect to the upper substrate surface;
And an adjusting data calculating section for calculating the adjusting data of the operation amount of each of the second driving mechanisms based on the timing of the variation of the load of each of the second driving mechanisms measured according to the falling amount of the first driving mechanism &Lt; / RTI &gt; The method according to claim 1,
Further comprising a measuring unit having a monitoring function for measuring a load of the second driving mechanism and determining a parallel state of each part of the base unit in accordance with a timing of a variation of the load. 3. The method according to claim 1 or 2,
Further comprising a manual adjustment unit for adjusting an operation amount of each part of the base by accepting an input of an adjustment value by manual operation. 3. The method according to claim 1 or 2,
Further comprising an automatic adjustment section that automatically adjusts the amount of operation of each part of the base section based on the adjustment data. 3. The method according to claim 1 or 2,
Wherein the control unit displays a display screen for selectively displaying a manual adjustment mode for manually adjusting the operation amount of each part of the base unit and an automatic adjustment mode for automatically adjusting the operation amount of each part of the base unit, In the substrate assembly system. 3. The method of claim 2,
Further comprising a monitoring section for monitoring a magnitude of a change from a previously measured load or an arbitrarily set set load with respect to the load of the second driving mechanism measured by the measuring section. 7. The method according to any one of claims 2 to 6,
Wherein the control device displays a display screen on the display section indicating a process of a change in load of the second drive mechanism measured by the measurement section. A lower table having a lower substrate surface for holding a lower substrate;
An upper table having an upper substrate surface opposed to the lower substrate surface,
A plurality of adhesive fingers provided at an end of the upper substrate to vertically move with respect to the upper substrate surface and adhered to the upper substrate in the adhesive portion protruding downward from the upper substrate surface,
A vacuum chamber capable of storing the lower table, the upper table, and the adhesive pins under an evacuated environment;
A first driving mechanism for vertically moving the adhesive pin and the upper table,
One or more base portions on which at least one adhesive pin is mounted,
And a plurality of second driving mechanisms disposed at four corners of each of the base portions and independently moving up and down each portion of each of the base portions relative to the upper substrate surface,
Wherein each of the second driving mechanisms is constituted by a servo motor or a step motor capable of being performed by a control device disposed outside, the variation of the amount of current depending on the load. A lower table having a lower substrate surface for holding a lower substrate, an upper table having an upper substrate surface opposed to the lower substrate surface, and an adhesive portion vertically operating on the upper substrate surface, A plurality of adhesive pins for adhering and holding the upper substrate in the adhesive portion protruding downward from the substrate surface; a vacuum chamber capable of holding the lower table, the upper table, and the adhesive pins under a vacuum environment; A first driving mechanism for vertically moving the upper table, one or more base portions to which at least one adhesive pin is mounted, and at least four corner portions disposed at four corners of the respective base portions, Which has a plurality of second driving mechanisms for independently moving up and down respective portions of the respective base portions A substrate carrying step of carrying a substrate between the lower table and the upper table with respect to the assembling apparatus and adhering and holding the substrate by the adherend of the adhering pin;
A vacuum evacuation step of evacuating air in the vacuum chamber to the outside to make the inside of the vacuum chamber under a vacuum environment;
The operation of each of the second driving mechanisms is controlled to lower the adhesive pin and the upper table with the first driving mechanism in a state in which the height of each portion of each of the base portions with respect to the upper substrate surface is defined A pressing and measuring step of pressing the substrate toward the lower table side and measuring a load of the second driving mechanism,
The adjustment data calculating step of calculating the adjustment data of the operation amount of each of the second drive mechanisms based on the timing of the variation of the load of each of the second drive mechanisms measured according to the amount of descent of the first drive mechanism Wherein the substrate is a substrate.

Images