CN115494305A - Testing device for double-sided semiconductor diaphragm workpiece - Google Patents

Abstract

The invention relates to the technical field of test equipment, and discloses a test device for a double-sided semiconductor diaphragm workpiece. The device for testing the double-sided semiconductor film workpiece comprises a rack, a test board, a fixed carrying platform, a movable carrying platform, a lifting driving assembly and a pressure head assembly. The test board can detect a workpiece and comprises a main body part and a movable part, wherein a first test golden finger is arranged on the upper side of the main body part, and a second test golden finger is arranged on the lower side of the movable part; the fixed bearing platform is used for fixing the main body part, and the fixed bearing platform is provided with an air passing assembly; the workpiece is supported on a movable carrying platform; the air passing assembly can blow and tilt the movable part to enable the lower golden finger to be lapped on the first testing golden finger, the upper golden finger is located below the second testing golden finger, and the air passing assembly can adsorb the movable part to enable the second testing golden finger to be lapped on the upper golden finger; the lifting driving assembly can drive the press head assembly to press the lap joint position between the test board and the double-sided semiconductor membrane workpiece. The testing device is convenient to operate and high in efficiency.

Description

Testing device for double-sided semiconductor diaphragm workpiece

Technical Field

The invention relates to the technical field of test equipment, in particular to a test device for a double-sided semiconductor diaphragm workpiece.

Background

The touch screen is widely applied to various fields of daily life, such as mobile phones, media players, displays, medical equipment and the like. As shown in fig. 1 to 4, a touch panel generally includes a panel, a semiconductor film adhered to one or both sides of the panel by a conductive adhesive, and the semiconductor film may be an ITO (Indium Tin Oxide) thin film. The touch screen with the semiconductor film arranged on both sides (hereinafter referred to as a double-sided semiconductor film workpiece) further comprises an upper golden finger and a lower golden finger which are respectively arranged on both sides of the panel. The upper golden finger and the lower golden finger are respectively and electrically connected with the semiconductor film on the corresponding side, and are respectively used for being connected with a gas electrical component outside the workpiece.

Before the double-sided semiconductor diaphragm workpiece leaves a factory, the resistance value, the short circuit condition and the like of the double-sided semiconductor diaphragm workpiece need to be detected. In the prior art, when a double-sided semiconductor diaphragm workpiece is tested, a test board is used, specifically, a test golden finger on the test board is connected with a golden finger on one side of the workpiece to test the semiconductor diaphragm on one side of the workpiece, and after the test on one side is finished, the semiconductor diaphragm on the other side of the workpiece is tested, so that the operation is complex and the efficiency is low.

Therefore, a testing apparatus for a double-sided semiconductor film workpiece of a double-sided semiconductor film is needed to solve the above technical problems.

Disclosure of Invention

The invention aims to provide a testing device for a double-sided semiconductor membrane workpiece, which can test the double sides of a double-sided semiconductor membrane simultaneously and is convenient to operate.

In order to achieve the purpose, the invention adopts the following technical scheme:

a testing device for double-sided semiconductor membrane workpieces comprises:

a frame;

the test board can detect a double-sided semiconductor membrane workpiece, and comprises a main body part and an active part flexibly connected with the main body part, wherein a first test golden finger is arranged on the upper side of the main body part, and a second test golden finger is arranged on the lower side of the active part;

the fixed carrying platform is arranged on the rack and can fix the main body part, and an air passing assembly is arranged below the movable part on the fixed carrying platform;

the movable carrying platform is arranged on the rack and is used for supporting the double-sided semiconductor film workpiece;

the air passing assembly can blow air to the movable part and tilt the movable part so that a lower golden finger of the double-sided semiconductor membrane workpiece is lapped on the first testing golden finger, an upper golden finger of the double-sided semiconductor membrane workpiece is located below the second testing golden finger, and the air passing assembly can adsorb the movable part so that the second testing golden finger is lapped on the upper golden finger;

The lifting driving assembly is arranged on the rack and can drive the pressure head assembly to move downwards, so that the pressure head assembly can press the test board and the lap joint position between the double-sided semiconductor diaphragm workpieces.

As an optional scheme, the double-sided semiconductor membrane workpiece further comprises a start key, wherein the start key is electrically connected with the lifting driving assembly and can enable the lifting driving assembly to drive the pressure head assembly to move downwards; and/or

The lifting driving component is electrically connected with the test board and can drive the pressure head component to lift up or keep the pressure head component stationary according to the detection result of the test board.

As an optional scheme, the testing device for the double-sided semiconductor membrane workpiece further comprises a reset key, the reset key is electrically connected with the lifting driving assembly, and the reset key enables the lifting driving assembly to drive the pressure head assembly to lift.

As an optional solution, the apparatus for testing a double-sided semiconductor film workpiece further includes:

the indicating component is electrically connected with the testing board and can display according to the detection result of the testing board.

As an alternative, the ram assembly comprises:

the connecting plate is connected with the output end of the lifting driving assembly;

the first pressure head is connected below the connecting plate, a first elastic piece is arranged between the connecting plate and the first pressure head, and the first pressure head is used for pressing the lower golden finger and the first testing golden finger;

the second pressure head is connected to the lower portion of the connecting plate, a second elastic piece is arranged between the connecting plate and the second pressure head, and the second pressure head is used for pressing the upper golden finger and the second testing golden finger.

As an optional solution, the testing apparatus for a double-sided semiconductor film workpiece further includes:

the camera is connected with the rack and can shoot the lap joint area of the test board and the double-sided semiconductor film workpiece;

the display screen, the display screen with the camera electricity is connected, the display screen can show the result of shooing of camera.

As an optional solution, a first adsorption port is arranged on the movable carrying platform, and the first adsorption port can adsorb and fix the double-sided semiconductor membrane workpiece.

As an optional solution, the positions of the movable carrier and the frame are adjustable.

As an optional scheme, the testing device for the double-sided semiconductor membrane workpiece further comprises an adjusting piece, one end of the adjusting piece is in rotating fit with the machine frame, the other end of the adjusting piece is in threaded connection with the movable carrying platform, and the adjusting piece can rotate relative to the machine frame to drive the movable carrying platform to move along a first direction.

As an optional solution, the rack comprises:

the machine table is provided with a machine table,

the two limiting blocks are respectively arranged at two ends of the machine table along the first direction, the movable carrying platform is arranged on the machine table and positioned between the two limiting blocks, and the adjusting piece is in running fit with one of the limiting blocks;

the guide posts extend along the first direction, each limiting block is connected with each guide post, and the movable carrying platform is in sliding fit with the guide posts.

The invention has the beneficial effects that:

the invention discloses a testing device for a double-sided semiconductor membrane workpiece, which comprises a rack, a fixed carrying platform, a movable carrying platform, a gas passing assembly arranged on the fixed carrying platform, a lifting driving assembly and a pressure head assembly. When the test board is used, the air passing assembly blows air to the movable part of the test board to enable the movable part to tilt and avoid; then, a workpiece to be tested is placed on the movable carrying platform, the lower golden finger of the workpiece is lapped on the first testing golden finger on the testing board, and the upper golden finger of the workpiece is positioned below the tilted movable part; then the air passing assembly sucks air again, so that the tilted movable part is adsorbed downwards, and a second testing golden finger on the movable part is lapped on the golden finger on the upper side of the workpiece; then the lifting driving assembly drives the pressure head assembly to move downwards to press the testing board and the golden fingers corresponding to the double-sided semiconductor membrane workpiece, so that the golden fingers on the two sides of the double-sided semiconductor membrane are electrically connected with the testing board, the semiconductor membranes on the two sides of the workpiece are detected at the same time, and the detection efficiency of the detection device is improved; in addition, through the cooperation of air passing assembly and movable part for the movable part can realize automatically with the golden finger overlap joint of work piece upside, convenient operation.

Drawings

FIG. 1 is a schematic diagram of a double-sided semiconductor film workpiece from one perspective;

FIG. 2 is an enlarged view at A in FIG. 1;

FIG. 3 is a schematic view of a double-sided semiconductor film workpiece from another perspective;

FIG. 4 is an enlarged view at B in FIG. 3;

FIG. 5 is a schematic structural diagram of a double-sided semiconductor film workpiece testing apparatus according to an embodiment of the present invention;

FIG. 6 is a schematic view of a test board according to one embodiment of the present invention;

FIG. 7 is a schematic diagram of a test board according to another view angle provided by an embodiment of the present invention;

FIG. 8 is an enlarged view at C in FIG. 5;

FIG. 9 is a schematic view of the structure of FIG. 8 with the test plate removed;

FIG. 10 is a schematic view of the structure of FIG. 8 after the movable portion is tilted;

fig. 11 is a schematic view of the structure of fig. 8 after placement of a double-sided semiconductor film workpiece.

In the figure:

10. a double-sided semiconductor diaphragm workpiece; 101. an upper golden finger; 102. a lower side golden finger;

1. a frame; 11. a machine platform; 111. an upper bearing plate; 112. a lower supporting plate; 113. a support bar; 12. a gantry; 13. a limiting block; 14. a guide post;

2. a test board; 21. a main body portion; 22. a movable portion; 23. a first test golden finger; 24. a second test golden finger; 25. an interface;

3. Fixing a carrying platform; 31. a gas passing assembly;

4. a movable carrying platform; 41. a first adsorption port; 42. sinking a groove;

5. a lift drive assembly;

6. a ram assembly; 61. a connecting plate; 62. a first ram; 63. a second ram;

71. a start key; 72. a reset key; 73. an indicating component; 74. a power key; 75. a blowing and sucking key;

81. a camera; 82. a display screen;

91. an adjustment member;

20. and controlling the main board.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used based on the orientations or positional relationships shown in the drawings for convenience of description and simplicity of operation, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to be limiting.

The embodiment provides a testing device for a double-sided semiconductor membrane workpiece. As shown in fig. 1 to 4, the double-sided semiconductor film workpiece 10 is substantially plate-shaped, and semiconductor films are disposed on both sides of the workpiece. The upper side of the double-sided semiconductor diaphragm workpiece is provided with an upper golden finger 101 electrically connected with the semiconductor diaphragm on the side, and the lower side is provided with a lower golden finger 102 electrically connected with the semiconductor diaphragm on the side. In this embodiment, as shown in fig. 2 and 4, the double-sided semiconductor film workpiece 10 includes two lower gold fingers 102 and one upper gold finger 101, and the upper gold finger 101 is located between the two lower gold fingers 102.

As shown in fig. 5, the testing device for double-sided semiconductor film workpieces comprises a frame 1, a control mainboard 20, a testing board 2, a fixed carrier 3, a movable carrier 4, a lifting drive assembly 5 and a pressure head assembly 6. The rack 1 includes a machine table 11 and a portal frame 12, the machine table 11 includes an upper supporting plate 111 and a lower supporting plate 112 arranged at an upper and lower interval, and the upper supporting plate 111 and the lower supporting plate 112 are connected by a plurality of supporting rods 113. The control main board 20 is disposed on the lower support plate 112. The gantry 12 is connected to the upper side of the upper supporting plate 111, and the lifting driving assembly 5 is fixed to the gantry 12. The fixed carrier 3 and the movable carrier 4 are both arranged on the upper supporting plate 111 and are respectively positioned at two sides of the portal frame 12. The test board 2 is arranged on the fixed carrier 3, and the double-sided semiconductor diaphragm workpiece 10 is supported on the movable carrier 4, so that the test board 2 and the double-sided semiconductor diaphragm workpiece 10 can be overlapped at a position below the portal frame 12. The test board 2 is electrically connected with the control mainboard 20, the test board 2 can detect the double-sided semiconductor film workpiece 10 and send the detection result to the control mainboard 20, so that the control mainboard 20 can judge whether the workpiece is qualified or not according to the detection result, and further control other components of the test device to operate according to the judgment result.

Specifically, as shown in fig. 6 and 7, the test board 2 includes a main body portion 21 and a movable portion 22 flexibly connected to the main body portion 21, a first test golden finger 23 is disposed on an upper side of the main body portion 21, and a second test golden finger 24 is disposed on a lower side of the movable portion 22. As shown in fig. 8 and 9, the test board 2 is disposed on the fixed stage 3, and the air passing assembly 31 is disposed on the fixed stage 3 under the movable portion 22, the air passing assembly 31 can blow air to the movable portion 22 of the test board 2, so as to tilt the movable portion 22, and further enable the lower golden finger 102 of the double-sided semiconductor film workpiece 10 to overlap the first testing golden finger 23, and the upper golden finger 101 to be disposed under the second testing golden finger 24, and the air passing assembly 31 can also absorb the movable portion 22, so as to enable the second testing golden finger 24 to overlap the upper golden finger 101. The lifting drive assembly 5 can drive the press head assembly 6 to move downwards so that the press head assembly 6 presses the lap joint position between the test plate 2 and the double-sided semiconductor film workpiece 10. Preferably, as shown in fig. 5, the apparatus for testing double-sided semiconductor film workpieces further comprises a power key 74, the power key 74 being used to power up or power down the entire testing apparatus. In this embodiment, the power key 74 is provided on the upper support plate 111.

When the testing device for the double-sided semiconductor film workpiece of the embodiment is used: first, a power key 74 is pressed, thereby powering up the test apparatus for double-sided semiconductor film workpieces; next, as shown in fig. 10, the air passing member 31 blows air to the active portion 22 of the test board 2, so that the active portion 22 tilts and avoids; next, as shown in fig. 11, the double-sided semiconductor film workpiece 10 to be tested is placed on the movable stage 4, the lower golden finger 102 of the double-sided semiconductor film workpiece 10 is lapped on the first testing golden finger 23 on the testing board 2, and the upper golden finger 101 of the double-sided semiconductor film workpiece 10 is positioned below the tilted movable portion 22; then, the air passing assembly 31 sucks air again, so that the tilted movable part 22 is sucked downwards, and the second testing golden finger 24 on the movable part 22 is lapped on the upper golden finger 101 of the double-sided semiconductor diaphragm workpiece 10; then, the lifting driving component 5 drives the press head component 6 to move downwards so as to press the test board 2 and the golden fingers corresponding to the double-sided semiconductor diaphragm workpiece 10, at the moment, the golden fingers on the two sides of the double-sided semiconductor diaphragm workpiece 10 are electrically connected with the test board 2 correspondingly, and then the test board 2 can simultaneously detect the semiconductor diaphragms on the two sides of the double-sided semiconductor diaphragm workpiece 10, so that the detection efficiency of the detection device is improved; in addition, through the cooperation of the air passing assembly 31 and the movable part 22, the movable part 22 can automatically overlap with the upper golden finger 101 of the double-sided semiconductor film workpiece 10, and the operation is convenient.

The testing principle of the testing board 2 is prior art and will not be described herein. In this embodiment, as shown in fig. 6 and 7, the main body 21 of the test board 2 is substantially u-shaped, the movable portion 22 is disposed on the recessed portion of the main body 21, the lower side of the movable portion 22 is disposed with the second test golden fingers 24, and the lower sides of the portions of the main body 21 located at the two sides of the movable portion 22 are respectively disposed with the first test golden fingers 23, so that the first test golden fingers 23 are exactly butted with the lower golden fingers 102 at the two sides of the double-sided semiconductor film workpiece 10, and the second golden fingers are exactly butted with the upper golden fingers 101 of the double-sided semiconductor film workpiece 10. Preferably, as shown in fig. 6, the test board 2 is further provided with a socket 25, and the socket 25 is used for connecting a wire harness to electrically connect the test board 2 and the control motherboard 20. Preferably, the fixed stage 3 is provided with suction holes (not shown) connected to a vacuum pump, and the vacuum pump can generate a negative pressure in the suction holes to stably suck the main body portion 21 of the test board 2 on the fixed stage 3.

In this embodiment, the air passing assembly 31 includes a plurality of air passing holes and an air supply source, and the air passing holes are located on the fixed stage 3 and are located at positions right below the movable portion 22 of the test board 2. The air supply source is communicated with the air passing hole. The air supply source may blow air into the through-holes to blow the movable portion 22. The air supply source also generates a suction force to generate a negative pressure at the through-holes, and the movable portion 22 is sucked downward to be abutted against the upper golden fingers 101 of the double-sided semiconductor film workpiece 10. The air supply source may be any conventional device capable of supplying air and sucking air, and is not particularly limited herein.

As shown in fig. 5, the testing apparatus for the double-sided semiconductor film piece 10 further includes an air blowing and sucking key 75, and the air blowing and sucking key 75 is provided on the upper support plate 111. The air blowing and sucking key 75 is electrically connected with the control mainboard 20, and the air blowing and sucking key 75 can enable the control mainboard 20 to trigger the air blowing and sucking actions of the air passing assembly 31. Specifically, when the air blowing and sucking key 75 is pressed once, the air supply source blows air through the air holes, when the air blowing and sucking key 75 is pressed again, the air supply source sucks air through the air holes, and when the air blowing and sucking key 75 is pressed again, the air supply source stops working.

In this embodiment, as shown in fig. 5, the lifting driving component 5 may be a cylinder, the cylinder is fixed on the gantry 12, and a piston of the cylinder is disposed downward. The pressure head assembly 6 is connected with the output end of the lifting driving assembly 5. Preferably, as shown in fig. 5, the ram assembly 6 includes a connection plate 61, a first ram 62 and a second ram 63, wherein the connection plate 61 is connected to the output end of the lift driving assembly 5. The first pressure head 62 is connected below the connecting plate 61, a first elastic part is arranged between the connecting plate 61 and the first pressure head 62, the first pressure head 62 is used for pressing the lower golden finger 102 and the first testing golden finger 23, the second pressure head 63 is connected below the connecting plate 61, a second elastic part is arranged between the connecting plate 61 and the second pressure head 63, and the first pressure head 62 is used for pressing the upper golden finger 101 and the second testing golden finger 24. In this embodiment, the independent first pressing head 62 and second pressing head 63 are disposed on the pressing head assembly 6, so that when the same lifting driving assembly 5 is used for driving, by adjusting the heights of the first pressing head 62 and the second pressing head 63, the pressing force of the first pressing head 62 and the second pressing head 63 on the corresponding positions can be ensured to be appropriate, and the test board 2 or the double-sided semiconductor film workpiece 10 can be prevented from being damaged by pressing. In addition, through setting up first elastic component and second elastic component, can the first pressure head 62 of adaptability adjustment and second pressure head 63 respectively to the pressfitting dynamics of the golden finger of corresponding position department, both guarantee the golden finger of corresponding position reliably to connect, can avoid too big crushing the work piece of pressure again. In this embodiment, the pressing head assembly 6 includes two first pressing heads 62 and one second pressing head 63, and the two first pressing heads 62 are respectively disposed on both sides of the second pressing head 63. The first and second elastic members may each be a spring.

Preferably, as shown in fig. 5, the double-sided semiconductor film workpiece 10 further includes a start key 71, and the start key 71 is electrically connected to the control main board 20 and further electrically connected to the lifting driving assembly 5. The start key 71 enables the control main board 20 to trigger the lifting drive assembly 5 to drive the pressure head assembly 6 to move downwards. After the lower golden finger 102 of the double-sided semiconductor diaphragm workpiece 10 is lapped on the first testing golden finger 23 of the testing board 2 and the second testing golden finger 24 of the movable part 22 of the testing board 2 is lapped on the upper golden finger 101 of the double-sided semiconductor diaphragm workpiece 10, the worker presses the start key 71, and at this time, the lifting driving assembly 5 drives the press head assembly 6 to move downwards and press the lapping positions of the testing board 2 and the double-sided semiconductor diaphragm workpiece 10, so that the testing board 2 starts to perform testing. In this embodiment, the start key 71 is provided on the upper support plate 111.

Preferably, as shown in fig. 5, the testing device for the double-sided semiconductor film piece further comprises an indicating component 73. The indication component 73 is electrically connected to the control motherboard 20 and further electrically connected to the test board 2. When the test board 2 obtains the detection result of the current double-sided semiconductor diaphragm workpiece 10, the detection result is sent to the control mainboard 20, the control mainboard 20 judges whether the current workpiece is qualified according to the detection result, and the indicating component 73 displays different results according to the judgment result, so that a worker is prompted whether the current double-sided semiconductor diaphragm workpiece 10 is qualified. Optionally, in this embodiment, the indication assembly 73 includes two indicator lights, and the two indicator lights correspond to the passing or failing of the double-sided semiconductor membrane workpiece 10, respectively, and if the double-sided semiconductor membrane workpiece is passing, the corresponding passing indicator light is turned on, and if the double-sided semiconductor membrane workpiece is failing, the corresponding failing indicator light is turned on. In other embodiments, the indicating component 73 may also be an indicating lamp, and the indicating lamp displays green if the double-sided semiconductor film workpiece 10 is qualified, and displays red if the double-sided semiconductor film workpiece 10 is not qualified. It is understood that, in other embodiments, any manner capable of prompting whether the double-sided semiconductor film workpiece 10 is qualified or not by displaying different information may be used in this embodiment, and is not limited herein.

Preferably, the lifting driving assembly 5 is electrically connected with the control motherboard 20, so as to be electrically connected with the test board 2. When the test board 2 obtains the test result of the current double-sided semiconductor diaphragm workpiece 10, the test result is sent to the control mainboard 20, the control mainboard 20 determines whether the current workpiece is qualified according to the result, and controls the action of the lifting driving assembly 5 according to the determination result. If the control mainboard 20 judges that the workpiece is qualified, the lifting drive assembly 5 drives the press head assembly 6 to lift, and if the control mainboard 20 judges that the workpiece is unqualified, the position of the lifting drive assembly 5 is kept unchanged, so that a worker is reminded that the current double-sided semiconductor diaphragm workpiece 10 is unqualified. Further, as shown in fig. 5, the testing apparatus for double-sided semiconductor film workpieces further includes a reset key 72, the reset key 72 is electrically connected to the control motherboard 20, and the reset key 72 enables the control motherboard 20 to control the elevation driving assembly 5 to drive the head assembly 6 to be elevated. That is, for the unqualified double-sided semiconductor film workpiece 10, the worker manually presses the reset key 72 to lift the lifting drive assembly 5 and the drive head assembly 6, so that the unqualified double-sided semiconductor film workpiece 10 can be taken off from the movable carrier 4.

In this embodiment, as shown in fig. 5, a sinking groove 42 is provided on the movable stage 4, and the double-sided semiconductor film workpiece 10 can be engaged in the sinking groove 42, so that the movable stage 4 preliminarily limits the double-sided semiconductor film workpiece 10. Further, as shown in fig. 8, a first adsorption port 41 is provided on the movable stage 4, and the first adsorption port 41 can adsorb and fix the double-sided semiconductor film workpiece 10, so as to prevent the double-sided semiconductor film workpiece 10 from shaking during the testing process. In this embodiment, the first suction port 41 is communicated with a vacuum pump, and the vacuum pump can make the first suction port 41 generate vacuum, so as to suck the double-sided semiconductor film workpiece 10.

Preferably, the position of the movable carrier 4 and the frame 1 is adjustable. Therefore, the position of the double-sided semiconductor film workpiece 10 on the movable carrying platform 4 relative to the rack 1 is adjustable, and each golden finger on the double-sided semiconductor film workpiece 10 can be accurately butted with a corresponding golden finger on the test board 2.

As shown in fig. 5, the testing apparatus for double-sided semiconductor film workpieces further includes an adjusting member 91, one end of the adjusting member 91 is rotatably engaged with the frame 1, and the other end of the adjusting member 91 is screwed with the movable stage 4, and the adjusting member 91 can rotate relative to the frame 1 to drive the movable stage 4 to move along a first direction (X direction in fig. 5). Wherein the first direction is the arrangement direction of two lower golden fingers 102 and one upper golden finger 101 on the double-sided semiconductor film workpiece 10.

Specifically, as shown in fig. 5, the frame 1 further includes two limiting blocks 13 and a plurality of guide pillars 14, wherein the two limiting blocks 13 are respectively disposed at two ends of the machine 11 along the first direction, the movable carrier 4 is disposed on the machine 11 and located between the two limiting blocks 13, and the adjusting member 91 is rotatably fitted with one of the limiting blocks 13. The guide post 14 extends along the first direction, each limiting block 13 is connected with the guide post 14, and the movable carrier 4 is in sliding fit with the guide post 14. The guide posts 14 can limit the moving direction of the movable carrier 4 on the frame 1, and the two limit blocks 13 can limit the maximum moving distance of the movable carrier 4 on the frame 1. The operator rotates the adjusting member 91 to drive the movable stage 4 to move in the first direction relative to the frame 1. Specifically, one end of the adjusting member 91 is rotatably engaged with the stopper 13 through a bearing (not shown), and the other end is a threaded rod. The movable carrier 4 is provided with a threaded hole along the first direction, and the threaded rod is in threaded fit with the threaded hole, so that the movable carrier 4 can move along the first direction when the adjusting piece 91 is rotated.

In this embodiment, as shown in fig. 5, the testing apparatus for double-sided semiconductor film workpieces further includes a camera 81 and a display screen 82, wherein the camera 81 is connected to the frame 1 and can photograph the overlapping area between the testing board 2 and the double-sided semiconductor film workpiece 10, the display screen 82 is connected to the frame 1 and is electrically connected to the camera 81, and the display screen 82 can display the photographing result of the camera 81. The camera 81 and the display screen 82 are matched to amplify the overlapping area of the test board 2 and the double-sided semiconductor film workpiece 10, so that a worker can more intuitively see whether each golden finger accurately realizes overlapping, and the position of the double-sided semiconductor film workpiece 10 can be properly adjusted if the golden fingers are not accurately butted. The camera 81 and the display 82 are both in the prior art, and the detailed structure thereof is not limited herein. In this embodiment, the camera 81 and the display 82 are both disposed on the gantry 12.

In summary, the use process of the testing apparatus for the double-sided semiconductor film of the present embodiment is as follows:

pressing the power key 74 to electrify the whole testing device of the double-sided semiconductor membrane;

pressing the air blowing and sucking key 75 to make the air passing component 31 blow the movable part 22 of the test plate 2 to the tilting;

placing the double-sided semiconductor film workpiece 10 on the movable stage 4, and enabling the lower golden finger 102 to be lapped on the first testing golden finger 23 of the testing board 2 and the upper golden finger 101 to be located below the movable part 22;

pressing the air blowing and sucking key 75 again to enable the air passing assembly 31 to adsorb the movable part 22, and further enabling the second testing golden finger 24 to be lapped on the upper golden finger 101 of the double-sided semiconductor diaphragm workpiece 10;

the staff work sees the display result on the display screen 82, if the golden fingers are not accurately butted, the position of the movable carrying platform 4 is adjusted through the adjusting piece 91, and if the golden fingers are accurately butted, the next step is carried out;

pressing a starting key 71, and driving a press head assembly 6 to move downwards by a lifting driving assembly 5 so as to press the lap joint position between the test board 2 and the double-sided semiconductor film workpiece 10;

a worker observes the indicating assembly 73 to judge whether the double-sided semiconductor diaphragm workpiece 10 is qualified or not, if so, the lifting driving assembly 5 automatically drives the pressure head assembly 6 to lift, and if not, the worker presses the reset key 72 to manually lift the lifting assembly driving pressure head assembly 6;

Pressing the air blowing and sucking key 75 again to make the air passing assembly 31 not adsorb the movable part 22 any more;

the worker takes the double-sided semiconductor film work 10 off the movable stage 4.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the invention and are not intended to limit the embodiments of the present invention, and that the technical spirit of the present invention may be changed by those skilled in the art in the aspects of the specific embodiments and the application scope, and the content of the present specification should not be construed as limiting the invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A testing device for double-sided semiconductor film workpieces is characterized by comprising:

a frame (1);

the test board (2) can detect the double-sided semiconductor diaphragm workpiece (10), the test board (2) comprises a main body part (21) and a movable part (22) flexibly connected with the main body part (21), a first test golden finger (23) is arranged on the upper side of the main body part (21), and a second test golden finger (24) is arranged on the lower side of the movable part (22);

The fixed carrying platform (3), the fixed carrying platform (3) is arranged on the frame (1) and can fix the main body part (21), and an air passing assembly (31) is arranged on the fixed carrying platform (3) and is positioned below the movable part (22);

the movable carrying platform (4) is arranged on the rack (1) and is used for supporting the double-sided semiconductor film workpiece (10);

the air passing assembly (31) can blow air to the movable part (22) and tilt the movable part (22) so that a lower side golden finger (102) of the double-sided semiconductor film workpiece (10) is lapped on the first testing golden finger (23), an upper side golden finger (101) is located below the second testing golden finger (24), and the air passing assembly (31) can also adsorb the movable part (22) so that the second testing golden finger (24) is lapped on the upper side golden finger (101);

the device comprises a lifting driving component (5) and a pressure head component (6), wherein the lifting driving component (5) is arranged on the rack (1) and can drive the pressure head component (6) to move downwards, so that the pressure head component (6) can press the test board (2) and the double-sided semiconductor film workpieces (10) at the overlapping position.

2. The double-sided semiconductor film piece testing device as claimed in claim 1, wherein the double-sided semiconductor film piece (10) further comprises an activation key (71), the activation key (71) is electrically connected with the lifting driving assembly (5) and enables the lifting driving assembly (5) to drive the ram assembly (6) to move downwards; and/or

The lifting driving component (5) is electrically connected with the test board (2), and the lifting driving component (5) can drive the pressure head component (6) to lift or keep the pressure head component (6) stationary according to the detection result of the test board (2).

3. The double-sided semiconductor film workpiece testing device according to claim 2, further comprising a reset key (72), wherein the reset key (72) is electrically connected with the lifting driving assembly (5), and the reset key (72) enables the lifting driving assembly (5) to drive the ram assembly (6) to lift.

4. The apparatus for testing a double-sided semiconductor film work piece of claim 1, further comprising:

the indicating component (73), the indicating component (73) is electrically connected with the testing board (2), and the indicating component (73) can display according to the detection result of the testing board (2).

5. A double-sided semiconductor film sheet workpiece testing apparatus as defined in claim 1 wherein said ram assembly (6) comprises:

the connecting plate (61), the connecting plate (61) is connected with the output end of the lifting driving component (5);

The first pressure head (62), the first pressure head (62) is connected below the connecting plate (61), a first elastic piece is arranged between the connecting plate (61) and the first pressure head (62), and the first pressure head (62) is used for pressing the lower golden finger (102) and the first testing golden finger (23);

the second pressure head (63), the second pressure head (63) connect in the below of connecting plate (61), be provided with the second elastic component between connecting plate (61) and the second pressure head (63), second pressure head (63) are used for the pressfitting upside golden finger (101) with second test golden finger (24).

6. The apparatus for testing a double-sided semiconductor film workpiece as recited in any one of claims 1 to 5, further comprising:

the camera (81) is connected with the rack (1) and can shoot the lap joint area of the test board (2) and the double-sided semiconductor film workpiece (10);

display screen (82), display screen (82) with camera (81) electricity is connected, display screen (82) can show the result of shooing of camera (81).

7. The double-sided semiconductor film workpiece testing device according to any one of claims 1 to 5, wherein a first suction port (41) is provided on the movable stage (4), and the first suction port (41) can suck and fix the double-sided semiconductor film workpiece.

8. The device for testing double-sided semiconductor film workpieces according to any one of claims 1 to 5, characterized in that the positions of the movable stage (4) and the frame (1) are adjustable.

9. The double-sided semiconductor film workpiece testing device according to claim 8, further comprising an adjusting member (91), wherein one end of the adjusting member (91) is rotatably engaged with the frame (1), and the other end of the adjusting member is in threaded connection with the movable carrying platform (4), and the rotation of the adjusting member (91) relative to the frame (1) can drive the movable carrying platform (4) to move along a first direction.

10. The apparatus for testing double-sided semiconductor film workpieces according to claim 9, wherein the frame (1) comprises:

a machine table (11),

the two limiting blocks (13) are respectively arranged at two ends of the machine table (11) along the first direction, the movable carrying platform (4) is arranged on the machine table (11) and located between the two limiting blocks (13), and the adjusting piece (91) is in rotating fit with one of the limiting blocks (13);

the guide columns (14) extend along the first direction, each limiting block (13) is connected with each guide column (14), and the movable carrying platform (4) is in sliding fit with each guide column (14).

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