JP2017068074A - Substrate assembly system, substrate assembly device used for the same and substrate assembly method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify parallel adjustment of an upper substrate to a lower substrate.SOLUTION: A substrate assembly system 1000 comprises a substrate assembly device 1 and a control device 200. The substrate assembly device includes a lower table 4 having a lower substrate surface 4a which holds a lower substrate K2, an upper table 3 having an upper substrate surface 3a, a plurality of adhesive pins 8a for adhesively holding an upper substrate K1 at adhesive parts in the state of projecting downward from the upper substrate surface, a first drive mechanism 20 for vertically moving the adhesive pins and the upper table, one or plural base parts 8b to which one or more adhesive pins are attached and a plurality of second drive mechanisms 80 for vertically moving the respective portions of the respective base parts independently. The control device includes a height control unit for regulating the height of the respective portions of the respective base parts by controlling operation of the respective second drive mechanisms, and a data-for-adjustment calculation unit for calculating data for adjustment of an operation amount of the respective second drive mechanisms on the basis of timing of fluctuation of a load in the respective second drive mechanisms according to a fall amount of the first drive mechanism.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a board assembly system, a board assembly apparatus used in the system, and a board assembly method using the system.

  Conventionally, there has been a substrate assembly system for assembling a substrate such as a liquid crystal panel by bonding an upper substrate (glass substrate) and a lower substrate (glass substrate) in a vacuum (see, for example, Patent Document 1). The substrate assembly system includes a substrate assembly device that assembles a substrate by bonding an upper substrate and a lower substrate in a vacuum chamber, a control device that controls the operation of the substrate assembly device, and a vacuum for the substrate assembly device. The apparatus includes a transfer device that carries the substrate into the chamber and carries the substrate assembled by the substrate assembly device out of the vacuum chamber.

  The substrate assembly apparatus has a lower table and an upper table in a vacuum chamber. The substrate assembly apparatus holds the lower substrate on which the liquid crystal is dropped on the lower table, and holds the upper substrate on the upper table so as to face the lower substrate. Note that an adhesive is applied to one of the lower substrate and the upper substrate. The substrate assembly apparatus evacuates the vacuum chamber and pressurizes the upper substrate and the lower substrate with an upper table, thereby bonding the upper substrate and the lower substrate with an adhesive applied to one of the substrates. Thus, the substrate assembly system assembles a substrate such as a liquid crystal panel. In such a substrate assembly system, the upper substrate and the lower substrate are made substantially parallel in a vacuum chamber in order to reduce errors generated when the upper substrate and the lower substrate are bonded to each other and to improve the positional accuracy of the bonding. Need to be placed.

Japanese Patent No. 4379435

However, the conventional board assembly system has a problem that it takes time and effort to adjust the upper board in parallel with the lower board.
For example, the parallel adjustment in the conventional board assembly system is not clear, and the tilt of the upper board is manually adjusted until it is confirmed that the condition is good (the parallelism is within the threshold). Repeat the adjustment process. Therefore, the parallel adjustment has been troublesome.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. A substrate assembly system capable of simplifying parallel adjustment of the upper substrate with respect to the lower substrate, a substrate assembly apparatus used in the system, and the system It is a main object to provide a method for assembling a substrate using the substrate.

  In order to achieve the above object, the first invention is a substrate assembly system, a substrate assembly apparatus for assembling a substrate by bonding an upper substrate and a lower substrate, a control device for controlling the operation of the substrate assembly apparatus, The substrate assembly apparatus includes: a lower table having a lower substrate surface that holds the lower substrate; an upper table having an upper substrate surface facing the lower substrate surface; and a vertical operation with respect to the upper substrate surface A plurality of adhesive pins that adhere to and hold the upper substrate with the adhesive portion protruding downward from the upper substrate surface, the lower table, the upper table, and the adhesive pins in a vacuum environment. A vacuum chamber that can be housed in a first, a first drive mechanism that moves the adhesive pin and the upper table up and down, one or more base parts to which one or more of the adhesive pins are attached, A plurality of second drive mechanisms arranged at the four corners of each of the base portions and independently moving up and down each part of the base portions with respect to the upper substrate surface, and the control The apparatus controls the operation of each of the second drive mechanisms to define the height of each part of the base portion with respect to the upper substrate surface, and the descending amount of the first drive mechanism An adjustment data calculation unit that calculates adjustment data for the operation amount of each of the second drive mechanisms based on the timing of fluctuations in the load of each of the second drive mechanisms measured according to And

  The adjustment data calculation unit of the board assembly system adjusts the operation amount of each second drive mechanism based on the load fluctuation timing of each second drive mechanism measured according to the descending amount of the first drive mechanism. Data is calculated. An engineer on the provider side and an operator on the user side of the board assembly system can easily perform appropriate parallel adjustment by confirming the calculated adjustment data. Therefore, this board assembly system can simplify the parallel adjustment of the upper board with respect to the lower board.

  The second invention is a substrate assembling apparatus, comprising a lower table having a lower substrate surface for holding a lower substrate, an upper table having an upper substrate surface facing the lower substrate surface, and the upper substrate surface. A plurality of adhesive pins that stick and hold the upper substrate with the adhesive portion protruding downward from the upper substrate surface, the lower table, the upper table, and the adhesive pins are vacuumed. A vacuum chamber that can be stored in an environment; a first drive mechanism that moves the adhesive pin and the upper table up and down; one or more base parts to which one or more of the adhesive pins are attached; A plurality of second drive mechanisms that are arranged at the four corners of the base part, and that vertically move each part of the base part independently with respect to the upper substrate surface, The second drive mechanism has a structure in which the measurement of the current amount of change corresponding to the load is constituted by a servo motor or a step motor capable of performing a control device that is disposed outside.

The third invention is a substrate assembly method, comprising: a lower table having a lower substrate surface for holding a lower substrate; an upper table having an upper substrate surface facing the lower substrate surface; and the upper substrate surface. A plurality of adhesive pins that stick and hold the upper substrate with the adhesive portion protruding downward from the upper substrate surface, the lower table, the upper table, and the adhesive pins are vacuumed. A vacuum chamber that can be stored in an environment; a first drive mechanism that moves the adhesive pin and the upper table up and down; one or more base parts to which one or more of the adhesive pins are attached; A plurality of second drive mechanisms which are arranged at the four corners of the base portion and vertically move each part of the base portion independently with respect to the upper substrate surface; The substrate is carried in between the lower table and the upper table, and the substrate carrying-in process in which the substrate is adhered and held by the adhesive portion of the adhesive pin, and the air in the vacuum chamber is discharged to the outside. A state in which the height of each part of the base part relative to the upper substrate surface is regulated by controlling the operation of the second driving mechanism and the evacuation step of bringing the inside of the vacuum chamber into a vacuum environment Then, by pressing down the adhesive pin and the upper table by the first drive mechanism, the substrate is pressurized to the lower table side, and the pressurization / measurement step of measuring the load of the second drive mechanism; Based on the fluctuation timing of the load of each second drive mechanism measured according to the descending amount of the first drive mechanism, the adjustment data for the operation amount of each second drive mechanism is calculated. And adjustment data calculating step of a structure including a.
Other means will be described later.

  According to the present invention, it is possible to simplify the parallel adjustment of the upper substrate with respect to the lower substrate.

It is a figure showing composition of a substrate assembly system concerning an embodiment. It is a figure which shows the structure of the suspension mechanism of the board | substrate assembly apparatus used by embodiment. It is a figure which shows the structure of the siphoning mechanism of the board | substrate assembly apparatus used by embodiment. It is a figure which shows the structure of the adhesion holding mechanism of the board | substrate assembly apparatus used by embodiment. It is a figure which shows the structure of the upper board | substrate surface of an upper table. It is a figure which shows typically operation | movement of an upper table. It is a figure which shows the structure of a vertical movement mechanism typically. It is a figure which shows the structure of the control apparatus used by embodiment. It is a graph which shows the relationship between Z-axis height and the electric current value of the electric motor of a vertical movement mechanism. It is a figure which shows the operation state of the electric motor of a vertical movement mechanism. It is a flowchart (1) which shows the operation | movement in the setup of a board | substrate assembly system. It is a flowchart (2) which shows the operation | movement in the setup of a board | substrate assembly system. It is a flowchart (3) which shows the operation | movement in the setup of a board | substrate assembly system. It is a flowchart (4) which shows the operation | movement in the setup of a board | substrate assembly system. It is a flowchart which shows the operation | movement in the stop of a board | substrate assembly system. It is a flowchart which shows the operation | movement in production of a board | substrate assembly system. It is a flowchart (1) which shows the operation | movement at the time of pressurization and electric current measurement of a board | substrate assembly system. It is a flowchart (2) which shows the operation | movement at the time of pressurization and electric current measurement of a board | substrate assembly system. It is a figure which shows an example of a display screen.

  Hereinafter, an embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail with reference to the drawings. Each figure is only schematically shown so that the present invention can be fully understood. Therefore, the present invention is not limited to the illustrated example. Moreover, in each figure, the same code | symbol is attached | subjected about the common component and the same component, and those overlapping description is abbreviate | omitted.

[Embodiment]
<Configuration of board assembly system>
Hereinafter, the configuration of the substrate assembly system 1000 according to the present embodiment will be described with reference to FIG. FIG. 1 is a diagram showing a configuration of a board assembly system 1000.
As shown in FIG. 1, a board assembly system 1000 according to this embodiment includes a board assembly apparatus 1, a control apparatus 100, and a transfer apparatus 200.

The substrate assembly apparatus 1 is an apparatus for assembling a substrate such as a liquid crystal panel by bonding an upper substrate K1 (glass substrate) and a lower substrate K2 (glass substrate) in a vacuum.
The control device 100 is a device that controls the operation of the board assembly apparatus 1.
The transfer device 200 carries the upper substrate K1 (glass substrate) or the lower substrate K2 (glass substrate) into the vacuum chamber 5 of the substrate assembly apparatus 1 or a substrate such as a liquid crystal panel assembled by the substrate assembly apparatus 1. It is a device that carries out the vacuum chamber 5.

The board assembly apparatus 1 includes a gantry 1 a and an upper frame 2. The gantry 1a is placed on an installation surface (floor surface or the like). The upper frame 2 is provided so as to be vertically movable above the gantry 1a.
The upper frame 2 is attached to a first drive mechanism (Z-axis drive mechanism 20) attached to the gantry 1a via a load cell 20d. In the present embodiment, the substrate assembly apparatus 1 will be described as having four Z-axis drive mechanisms 20 and four load cells 20d.

  The board assembly apparatus 1 includes an upper table 3 and a lower table 4. The lower table 4 is attached to the gantry 1a via the XYθ moving unit 40. The XYθ moving unit 40 is configured to be movable independently of the gantry 1a in two orthogonal directions (X-axis and Y-axis). Further, the XYθ moving unit 40 is configured to be rotatable around the Z axis with respect to the gantry 1a. As the XYθ moving unit 40, a unit using a ball bear or the like that is fixed in the Z-axis direction and can freely move in the XY-axis direction can be used.

In the substrate assembly apparatus 1 of the present embodiment, the direction of the upper frame 2 with respect to the gantry 1a is the Z-axis direction (vertical direction). Also, the direction of one axis orthogonal to the Z axis is defined as the X axis direction (lateral direction), and the direction of one axis orthogonal to the Z axis and the X axis is defined as the Y axis direction (vertical direction).
Further, the upper table 3 and the lower table 4 have a rectangular shape with the Y-axis direction and the X-axis direction as vertical and horizontal directions. The plane of the upper table 3 (upper substrate surface 3a) and the plane of the lower table 4 (lower substrate surface 4a) face each other.

The upper frame 2 is attached to the gantry 1 a via four Z-axis drive mechanisms 20. Each Z-axis drive mechanism 20 has a ball screw mechanism 20b that vertically moves a ball screw shaft 20a extending in the Z-axis direction (vertical direction). The ball screw shaft 20a is rotated by the electric motor 20c and moved up and down by the ball screw mechanism 20b.
The electric motor 20 c is controlled by the control device 100. The upper frame 2 is displaced (moves up and down) based on the calculation of the control device 100.

  The upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. The upper frame 2 and the upper table 3 move up and down together. An upper chamber 5 a is disposed around the upper table 3. The upper chamber 5a has a configuration in which the lower side (the side of the gantry 1a) is opened, and is arranged so as to cover the upper side and the side of the upper table 3.

The upper chamber 5 a is attached to the upper frame 2 via a suspension mechanism 6.
FIG. 2 is a diagram illustrating a configuration of the suspension mechanism 6 as viewed from the side. As shown in FIG. 2, the suspension mechanism 6 has a support shaft 6a extending downward from the upper frame 2 and a locking portion 6b formed by expanding the lower end portion of the support shaft 6a in a flange shape. .
The upper chamber 5a is provided with a hook 6c. The hook 6c freely moves up and down around the support shaft 6a. Further, the hook 6c engages with the locking portion 6b at the lower end of the support shaft 6a.

Returning to FIG. 1, the upper shaft 2a passes through the upper chamber 5a. The upper shaft 2a and the upper chamber 5a are sealed with a vacuum seal (not shown).
When the upper frame 2 moves upward (upward movement), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves up together with the upper frame 2 accordingly. Further, when the upper frame 2 moves downward (downward movement), the hook 6c is moved down by its own weight, and the upper chamber 5a is moved down accordingly.

A plurality of suction holes (not shown) are opened in the lower substrate surface 4 a of the lower table 4. Each suction hole of the lower table 4 is connected to the vacuum pump P3. When the vacuum pump P3 is driven, the lower substrate K2 placed on the lower substrate surface 4a is attracted and held by the lower table 4 (lower substrate surface 4a). The vacuum pump P3 is controlled by the control device 100.
A lower chamber 5b is disposed around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the gantry 1a. The lower shaft 1b protrudes into the lower chamber 5b. A space between the lower chamber 5b and the lower shaft 1b is sealed with a vacuum seal (not shown).
The lower chamber 5b has a configuration in which the upper side (the side of the upper frame 2) is opened, and is disposed so as to cover the lower side and the side of the lower table 4.

  The XYθ moving unit 40 is attached to the lower shaft 1b protruding into the lower chamber 5b and supports the lower table 4.

  The upper chamber 5a and the lower chamber 5b are joined together to form a vacuum chamber 5. That is, the upper chamber 5a moved downward is engaged with the lower chamber 5b from above, and the opening of the lower chamber 5b is closed by the upper chamber 5a. The connecting portion between the upper chamber 5a and the lower chamber 5b is sealed with a seal ring (not shown), and the airtightness of the vacuum chamber 5 is ensured.

  Further, the upper frame 2 can move further lower than the state in which the upper chamber 5a is in contact with the lower chamber 5b. As a result, the upper frame 2 moves downward from the state in which the downward movement of the upper chamber 5a is regulated by the lower chamber 5b, and the engagement between the locking portion 6b and the hook 6c in the suspension mechanism 6 is released. The upper chamber 5a is placed on the lower chamber 5b by its own weight. An upper table 3 and a lower table 4 are disposed inside the vacuum chamber 5.

  The substrate assembly apparatus 1 is equipped with a vacuum pump mechanism P0. The vacuum pump mechanism P0 is connected to the vacuum chamber 5 and exhausts the air in the vacuum chamber 5 to make the inside of the vacuum chamber 5 a vacuum. That is, when the vacuum pump mechanism P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump mechanism P0 is controlled by the control device 100.

The upper table 3 moves down together with the upper frame 2 that moves down inside the vacuum chamber 5. By such downward movement of the upper table 3, the upper substrate K1 held on the upper table 3 and the lower substrate K2 held on the lower table 4 are bonded together, and the upper substrate K1 and the lower substrate K2 are pressurized. The If the inside of the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are bonded together in a vacuum.
Further, as described above, the upper table 3 is fixed to the upper frame 2 via the plurality of upper shafts 2a. For this reason, the load when the upper substrate K1 and the lower substrate K2 are pressurized by the upper table 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100. The control device 100 specifies the load applied to the substrate from the upper table 3 based on the detection value detected by the load cell 20d. In this embodiment, since the board assembly apparatus 1 has four load cells 20d, the total value of the detection values detected by the four load cells 20d becomes the total load value of the entire apparatus. That is, the total value of the detection values detected by the four load cells 20d is the value of all loads applied to the substrate from the upper table 3.

  The board assembly system 1000 manages the Z-axis coordinates of the upper table 3 that is moved up and down by the Z-axis drive mechanism 20 by the control device 100. However, generally, the upper substrate K1 and the lower substrate K2 have a tolerance in thickness for each product. Therefore, it is difficult to monitor the close contact state between the upper substrate K1 and the lower substrate K2 with the descending amount of the upper table 3. Therefore, the substrate assembly system 1000 manages the close contact state between the upper substrate K1 and the lower substrate K2 based on the load values detected by the four load cells 20d.

(Structure of suction mechanism)
FIG. 3 is a view showing the configuration of the suction mechanism 7. The sucking mechanism 7 is a mechanism for moving the sucking pin 7a up and down and sucking up the upper substrate K1 and a dummy substrate (not shown) by the sucking pin 7a. The suction mechanism 7 is attached to the upper frame 2.

  As shown in FIG. 3, the suction mechanism 7 includes a plurality of suction pins 7 a, one to a plurality of suction pin pads 7 b, and a vertical movement mechanism 70. The suction pin 7 a is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3. Each suction pin 7a is attached to one or more suction pin pads 7b. One or more suction pins 7a are attached to each suction pin pad 7b. Each suction pin 7a moves up and down at the same time as the suction pin pad 7b moves up and down. The suction pin pad 7 b is disposed between the upper chamber 5 a and the upper table 3. The suction pin pad 7b moves up and down by a vertical movement mechanism 70.

  In the present embodiment, the case where the vertical movement mechanism 70 is configured by a ball screw mechanism will be described. The vertical movement mechanism 70 includes a ball screw shaft 71 that is rotatably supported by the mounting portion 80a and extends in the Z-axis direction, and a ball screw shaft 71, similarly to a vertical movement mechanism 80 (see FIG. 4) described later. It has an electric motor 73 that rotates, and a ball screw mechanism 72 that moves up and down by a rotating ball screw shaft 71. The mounting portion 80a is fixed to the upper frame 2 and supports a ball screw shaft 71 of the vertical movement mechanism 70 together with a ball screw shaft 81 (see FIG. 4) of the vertical movement mechanism 80 described later. The ball screw shaft 71 is rotated by an electric motor 73 to move the ball screw mechanism 72 up and down. The ball screw mechanism 72 is attached to the suction pin pad 7b. The suction pin pad 7b moves up and down integrally with the ball screw mechanism 72 that moves up and down by the rotation of the ball screw shaft 71.

  The vertical movement mechanism 70 is controlled by the control device 100, and the suction pin pad 7 b and the suction pin 7 a move up and down according to a command from the control device 100.

  The suction pin 7a is disposed above the plane of the upper table 3 (upper substrate surface 3a), and protrudes downward from the upper substrate surface 3a when moved downward with respect to the upper table 3. The upper substrate surface 3a is a plane facing the lower table 4 (see FIG. 1).

  The suction pin 7a has a hollow tubular shape, and the hollow portion 7a1 communicates with the hollow portion 7b1 of the suction pin pad 7b. A vacuum pump P1 is connected to the hollow portion 7b1 of the suction pin pad 7b. When the vacuum pump P1 is driven, the hollow portions 7a1 and 7b1 are evacuated, and the upper substrate K1 is vacuum-sucked by the suction pins 7a. The vacuum pump P1 is controlled by the control device 100. That is, the vacuum pump P1 is driven in accordance with a command from the control device 100, and the upper substrate K1 is vacuum-sucked by the suction pins 7a.

(Configuration of adhesive holding mechanism)
FIG. 4 is a diagram showing a configuration of the adhesive holding mechanism 8. The adhesive holding mechanism 8 is a mechanism for moving the adhesive pin 8a up and down, and adhering and sucking the upper substrate K1 and a dummy substrate (not shown) by the adhesive pin 8a. The adhesive holding mechanism 8 is attached to the upper frame 2.

  As shown in FIG. 4, the adhesive holding mechanism 8 includes a plurality of adhesive pins 8 a, one to a plurality of adhesive pin plates 8 b, and a vertical movement mechanism 80. The adhesive pin 8a is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3 and the suction pin 7a. The vertical movement of the adhesive pin 8 a is a vertical movement with respect to the upper substrate surface 3 a of the upper table 3. The adhesive pins 8a are disposed above the upper substrate surface 3a of the upper table 3, and project downward from the upper substrate surface 3a when moved downward relative to the upper table 3. The adhesive pin 8a moves upward and is pulled from the upper substrate surface 3a. In this embodiment, the adhesive pin 8a is drawn from the upper substrate surface 3a in a state where the adhesive pin 8a does not protrude from the upper substrate surface 3a, that is, in a state where the protruding amount of the adhesive pin 8a is zero (or less). State. The adhesive pin 8a moves downward and protrudes from the upper substrate surface 3a. The protruding amount of the adhesive pin 8a indicates the protruding amount of the adhesive pin 8a from the upper substrate surface 3a (hereinafter the same).

  Each adhesive pin 8a is attached to one or more adhesive pin plates 8b (base portion). One or more adhesive pins 8a are attached to each adhesive pin plate 8b. Each adhesive pin plate 8b is independently movable up and down (perpendicular operation with respect to the upper substrate surface 3a).

  The adhesive pin 8a has an adhesive part 8c made of an elastic material and having adhesiveness at the tip. The adhesive pin 8a has a hollow tubular shape, and a vacuum suction hole 8d is opened at the center. The vacuum suction hole 8d communicates with a negative pressure chamber 8b1 formed as a hollow portion of the adhesive pin plate 8b. A vacuum pump P2 vacuum pump P2 is connected to the negative pressure chamber 8b1 of the adhesive pin plate 8b. Therefore, the vacuum pump P2 is connected to the vacuum suction hole 8d of the adhesive pin 8a via the negative pressure chamber 8b1.

The adhesive pin 8a vacuum-sucks the upper substrate K1 when the vacuum pump P2 is driven and the vacuum suction hole 8d is in a vacuum state, and further holds the vacuum-suctioned upper substrate K1 attached to the adhesive portion 8c. (Adhesion retention). The adhesive pin 8a holds the upper substrate K1 when protruding from the upper substrate surface 3a.
The vacuum pump P2 is controlled by the control device 100. The upper substrate K1 is vacuum-sucked by the adhesive pins 8a in accordance with a command from the control device 100 and attached to the adhesive portion 8c.

  A gas supply means 8e is connected to the negative pressure chamber 8b1 of the adhesive pin plate 8b. The gas supply means 8e is controlled by the control device 100. The gas supply means 8e is driven in accordance with a command from the control device 100 and supplies a predetermined gas (such as air or nitrogen gas) to the negative pressure chamber 8b1. The negative pressure chamber 8b1 and the vacuum suction hole 8d are pressurized by the gas supplied from the gas supply means 8e, and the upper substrate K1 adhered to the adhesive portion 8c is peeled from the adhesive portion 8c.

Each adhesive pin plate 8b is provided with a second drive mechanism (vertical movement mechanism 80). The vertical movement mechanism 80 is vertically supported by a ball screw shaft 81 that is rotatably supported by the mounting portion 80 a and extends in the Z-axis direction, an electric motor 83 that rotates the ball screw shaft 81, and a rotating ball screw shaft 81. A ball screw mechanism 82 that moves. The attachment portion 80a is fixed to the upper frame 2. The ball screw shaft 81 is rotated by the electric motor 83 to move the ball screw mechanism 82 up and down. The ball screw mechanism 82 is attached to the adhesive pin plate 8b. The adhesive pin plate 8b moves up and down integrally with the ball screw mechanism 82 that moves up and down by the rotation of the ball screw shaft 81.
The vertical movement mechanism 80 is controlled by the control device 100, and the adhesive pin plate 8 b and the adhesive pin 8 a move up and down according to a command from the control device 100.

  The attachment portion 80a is attached to the upper frame 2 and moves up and down integrally with the upper frame 2. The upper table 3 moves up and down integrally with the upper frame 2. The upper frame 2 is moved up and down by the Z-axis drive mechanism 20 (see FIG. 1), and when the upper frame 2 is moved down, the upper table 3 and the mounting portion 80a are moved down. As a result, the upper table 3 and the mounting portion 80a advance toward the lower table 4 (see FIG. 1). The vertical movement mechanism 80 is attached to the attachment portion 80a, and the adhesive pin plate 8b (adhesive pin 8a) moves up and down according to the vertical movement of the attachment portion 80a. Therefore, the Z-axis drive mechanism 20 (first drive mechanism) has a function of causing the adhesive pins 8 a and the upper table 3 to advance toward the lower table 4.

  In the present embodiment, the upper table 3 includes a back plate 30 and a cushion sheet 31. The back plate 30 is a plate material that supports the cushion sheet 30 and is made of a rigid material. The cushion sheet 30 is a sheet material made of an elastic material. The back plate 30 is attached to the upper shaft 2 a and moves up and down integrally with the upper frame 2. The back plate 30 is a plate-like member disposed in parallel with the lower substrate surface 4a (see FIG. 1) of the lower table 4. The cushion sheet 30 faces the lower substrate surface 4a.

(Configuration of upper substrate surface)
FIG. 5 is a diagram showing the configuration of the upper substrate surface 3a of the upper table 3, and shows an example of the arrangement of the adhesive pins 8a.
As shown in FIG. 5, in the present embodiment, 81 adhesive pins 8 a are provided on the upper table 3. Nine adhesive pins 8a are attached to the lower surface side of one adhesive pin plate 8b having a rectangular shape. Nine adhesive pin plates 8 b are arranged on one upper table 3. Further, four vertical movement mechanisms 80 are provided on one adhesive pin plate 8b. For example, a total of four vertical movement mechanisms 80 are provided, one at each of the four corners of each adhesive pin plate 8b having a rectangular shape. The nine adhesive pin plates 8b can be moved up and down independently of each other by a vertical movement mechanism 80. However, the number of adhesive pins 8a can be appropriately changed according to the operation. Further, the number of the adhesive pin plates 8b can be appropriately changed according to the operation, and can be one, four, or other numbers, for example.

  As described above, the vertical movement mechanism 80 (second drive mechanism) of the present embodiment can move the plurality (nine) of the adhesive pin plates 8b up and down independently (perpendicular movement with respect to the upper substrate surface 3a). It is configured.

  The vertical movement mechanism 80 can cause the adhesive pins 8a to protrude from the upper substrate surface 3a with a protrusion amount set for each adhesive pin plate 8b. As a result, the adhesive pin 8a can hold the upper substrate K1 (see FIG. 1) in a state of protruding from the upper substrate surface 3a with a protruding amount set for each adhesive pin plate 8b.

(Upper table operation)
FIG. 6 is a diagram schematically showing the operation of the upper table 3. FIG. 6A shows a state immediately before the upper substrate K1 and the lower substrate K2 are bonded together, and FIG. 6B shows a state when the upper substrate K1 and the lower substrate K2 are bonded together. Yes.

  As shown in FIG. 6A, the lower substrate K2 is placed on the lower table 4 immediately before the upper substrate K1 and the lower substrate K2 are bonded together. The upper substrate K1 is held above the lower substrate K2 by a plurality of adhesive pins 8a penetrating the upper table 3.

  As shown in FIG. 6B, the board assembly apparatus 1 drives the Z-axis drive mechanism 20 and moves the upper frame 2 downward when the upper board K1 and the lower board K2 are bonded together. Each adhesive pin plate 8b (adhesive pin 8a) is moved downward together with the upper table 3. Thus, the substrate assembly apparatus 1 pressurizes the upper substrate K1 and the lower substrate K2 with the upper frame 2, the upper table 3, and the lower table 4, and bonds the upper substrate K1 and the lower substrate K2.

(Configuration of vertical movement mechanism of adhesive holding mechanism)
FIG. 7 is a diagram schematically showing the configuration of the vertical movement mechanism 80 of the adhesive holding mechanism 8. FIG. 7A schematically shows the configuration of the entire vertical movement mechanism 80 of the board assembly apparatus 1, and FIG. 7B shows an arbitrary one adhesive pin plate 8b as the plate PL1, and the vertical movement of the plate PL1. The structure of the moving mechanism 80 is shown typically.

  As shown in FIG. 7A, in this embodiment, the board assembly apparatus 1 has nine rectangular adhesive pin plates 8b. Four vertical movement mechanisms 80 for moving each part (four corners) of the adhesive pin plate 8b up and down are attached to at least four corners of each adhesive pin plate 8b.

  Here, the four vertical movement mechanisms 80 are referred to as axes Ax1, Ax2, Ax3, and Ax4 (see FIG. 7B). The axes Ax1 and Ax4 are arranged on a diagonal line connecting two vertices of the rectangle that are not adjacent to each other. The axis Ax2 and the axis Ax3 are arranged on a diagonal line connecting two other vertices.

  As shown in FIG. 7B, each vertical movement mechanism 80 includes a ball screw shaft 81, a ball screw mechanism 82, and an electric motor 83. The ball screw mechanism 82 is formed integrally with the adhesive pin plate 8 b and is screwed with the ball screw shaft 81. The electric motor 83 moves the parts (four corners) of the adhesive pin plate 8b up and down by rotating the ball screw shaft 81.

  The electric motor 83 is connected to the control device 100 via an amplifier 211 and a programmable logic controller (PLC) 212. In the present embodiment, a servo motor is used as the electric motor 83 so that the operation amount (rotation angle) of each electric motor 83 can be defined by the control device 100 via the PLC 212. Therefore, the control device 100 can regulate the distance from the upper frame 2 to the adhesive pin plate 8b in each axis Ax1, Ax2, Ax3, Ax4 by controlling the operation amount (rotation angle) of the electric motor 83. . That is, the control device 100 can define the height of each part (four corners) of the adhesive pin plate 8b.

<Configuration of control device>
Hereinafter, the configuration of the control device 100 will be described with reference to FIG. FIG. 8 is a diagram illustrating a configuration of the control device 100.

  As shown in FIG. 8, the control device 100 includes a control unit 110, a storage unit 160 such as a ROM, a RAM, and an HDD, a speaker 170, a display unit 180 such as a liquid crystal display, and an input unit 190 such as a touch panel, a numeric keypad, and a keyboard. have.

  The control unit 110 is constituted by a CPU, and executes a control program Pr1 stored in advance in the storage unit 160, whereby the height control unit 111, the movement control unit 112, the vacuum process control unit 113, the measurement unit 121, and the adjustment unit It functions as a data calculation unit 122, an adjustment mode selection unit 123, a change monitoring unit 124, an automatic adjustment unit 131, and a manual adjustment unit 132.

The height control unit 111 is a functional unit that controls the operation of the vertical movement mechanisms 70 and 80. The height control unit 111 drives the vertical movement mechanisms 70 and 80 to control the height adjustment of the suction pin pad 7b and the height adjustment of each part (four corners) of the adhesive pin plate 8b.
The movement control unit 112 is a functional unit that controls operations of the Z-axis drive mechanism 20 and the XYθ movement unit 40. The movement control unit 112 drives the electric motor 20 c of the Z-axis drive mechanism 20 to move the upper frame 2 up and down, thereby moving the adhesive pin plates 8 b (adhesive pins 8 a) up and down together with the upper table 3. Further, the movement control unit 112 drives the moving mechanism 41 of the XYθ moving unit 40 to displace the lower table 4 and determines a bonding position between the upper substrate K1 and the lower substrate K2.

The vacuum process control unit 113 is a functional unit that controls operations of the upper chamber 5a, the vacuum pump mechanism P0, and the vacuum pumps P1, P2, and P3.
The measurement unit 121 is a functional unit that measures the load of each vertical movement mechanism 80 (in this embodiment, the current value (holding current value) of the holding current flowing through each electric motor 83). The measurement unit 121 simultaneously records the timing data in which the holding current value of the electric motor 83 fluctuates and the height data of the adhesive pin plate 8b in the storage unit 160 as the measurement data D2. The measuring unit 121 has a monitoring function for determining the parallel state of each part (four corners) of each adhesive pin plate 8b according to the timing of the load variation of each vertical movement mechanism 80.

The adjustment data calculation unit 122 is a functional unit that calculates adjustment data D3 to be described later.
The adjustment mode selection unit 123 is a functional unit that selectively receives an adjustment mode such as an automatic adjustment mode or a manual adjustment mode.
The change monitoring unit 124 is a functional unit that monitors the magnitude of change in the height (parallelism) of each part (four corners) of the adhesive pin plate 8b and the holding current value of each electric motor 83 due to secular change and other factors. It is.

The automatic adjustment unit 131 is a functional unit that executes an automatic adjustment mode. The automatic adjustment mode is a mode in which the control device 100 automatically performs parallel adjustment based on the adjustment data D3 calculated by the adjustment data calculation unit 122.
The manual adjustment unit 132 is a functional unit that executes a manual adjustment mode. The manual adjustment mode is a mode in which parallel adjustment is performed by receiving an input of an adjustment value manually by an engineer or an operator. Here, the engineer is a person on the provider side of the board assembly system 1000. The operator is a person on the user side of the board assembly system 1000. The manual adjustment mode is suitable when an engineer or an operator produces a product while checking the parallel adjustment state of each substrate individually.

The storage unit 160 stores, for example, a control program Pr1, setting data D1, measurement data D2, adjustment data D3, accumulated measurement data D4, and the like.
The control program Pr1 is a program that defines the operation of the control device 100.
The setting data D1 is data representing setting values for the operation of the board assembly apparatus 1.
The measurement data D2 is data representing the measurement result of the holding current value of each electric motor 83 of each vertical movement mechanism 80.
The adjustment data D3 is data representing an adjustment value of the operation amount (rotation angle) of each electric motor 83 of each vertical movement mechanism 80. Details of the adjustment data D3 will be described later.
The accumulated measurement data D4 is data representing the measurement result of the holding current value of each electric motor 83 of each vertical movement mechanism 80 measured in the past.

<Example of change in electric motor current value>
Hereinafter, with reference to FIG. 9, an example of a change in the current value of the electric motor 83 will be described. In this embodiment, “parallel adjustment” means that the electric motor 83 of the vertical movement mechanism 80 of the adhesive holding mechanism 8 is driven and each part of the adhesive pin plate 8b (specifically, the four corners of the adhesive pin plate 8b). The amount of protrusion of the adhesive pin 8a protruding downward from the upper substrate surface 3a of the upper table 3 by adjusting the height of each of the axes Ax1, Ax2, Ax3, Ax4 (see FIG. 7B) Means the operation to adjust.

  FIG. 9 is a graph showing the relationship between the Z-axis height and the current value of the electric motor 83 of the vertical movement mechanism 80. FIG. 9A shows a state before parallel adjustment. FIGS. 9B and 9B show the state after the parallel adjustment.

  In FIG. 9, the horizontal axis represents the Z-axis height, and the vertical axis represents the current value (holding current value) of the holding current flowing through each electric motor 83. The value on the horizontal axis decreases as it proceeds from the left side to the right side, while the value on the vertical axis increases as it proceeds from the lower side to the upper side.

Here, the Z-axis height represents the height from the lower substrate surface 4a of the lower table 4 to the upper substrate surface 3a of the upper table 3 (the height of the vertical axis of the upper frame 2). When the upper frame 2 is moved upward by the Z-axis drive mechanism 20, the value of the Z-axis height is increased, and when the upper frame 2 is moved downward by the Z-axis drive mechanism 20, the value of the Z-axis height is decreased.
The holding current value is measured by, for example, the measurement unit 121 (see FIG. 8) of the control device 100.

  Ax1a represents the starting point of the decrease of the current value in the electric motor 83 of the axis Ax1. Ax1b represents a section in which the current value in the electric motor 83 of the axis Ax1 is decreasing. Ax1c represents the end point of the decrease of the current value in the electric motor 83 of the axis Ax1. Ax2a, Ax3a, and Ax4a represent starting points of reduction of current values in the electric motor 83 of the axes Ax2a, Ax3a, and Ax4a, respectively.

  Here, the current value decrease starting point (points Ax1a, Ax2a, Ax3a, Ax4a) is a substrate held by the adhesive pin 8a (for example, the upper substrate K1 or a dummy substrate (not shown) below). The point which contacted the member of the side (for example, the lower board | substrate K2 and the lower table 4) is represented.

  As described above, the total value of the detection values detected by the four load cells 20d is the total load value of the entire apparatus. The control device 100 monitors whether or not the upper substrate K1 and the lower substrate K2 are in contact with each other by monitoring the Z-axis height and changes in the detected values of the four load cells 20d. The board assembly apparatus 1 has a structure in which the upper table 3 is suspended from the upper frame 2 by a suspension mechanism 6. And the board | substrate assembly apparatus 1 has a structure applied to the upper table 3 without applying a load to the adhesive holding mechanism 8 when the adhesive portion 8c of the adhesive pin 8a is crushed. For this reason, in the board assembly apparatus 1, when the adhesive portion 8c is crushed to some extent, the holding current value of the electric motor 83 does not fluctuate further and the holding current value becomes constant.

  FIG. 10 shows the state of the adhesive pin 8a in the process. FIG. 10 is a diagram schematically showing an operation state of the electric motor 83 of the vertical movement mechanism 80 which is the second drive mechanism. At point Ax1a shown in FIG. 9A, the adhesive pin 8a is in the state shown in FIG. Further, in the section Ax1b shown in FIG. 9A, the adhesive pin 8a is in the state shown in FIG. Further, at a point Ax1c shown in FIG. 9A, the adhesive pin 8a is in the state shown in FIG.

  As shown in FIG. 10A, at the point Ax1a which is the starting point of the decrease in the current value, the substrate (for example, the upper substrate K1 or a dummy substrate not shown later) held by the adhesive pin 8a is on the lower side. The member is in contact with a member (for example, the lower substrate K2 or the lower table 4). Here, the case where the substrate held by the adhesive pins 8a is the upper substrate K1 and the lower member of the upper substrate K1 is the lower substrate K2 will be described (hereinafter the same). At this time, the adhesive portion 8c of the adhesive pin 8a is not crushed, and the current value I1a as the set value is measured as the holding current value of the electric motor 83.

  As shown in FIG. 10B, in the section Ax1b during which the current value is decreasing, the upper substrate K1, the upper table 3, and the lower table 4 are in a state of being pressurized. At this time, the adhesive portion 8c of the adhesive pin 8a is in a collapsed state, and a current value I1b smaller than the current value I1a is measured as the holding current value of the electric motor 83.

  As shown in FIG. 10C, at the point Ax1c, which is the end point of the decrease in the current value, the upper substrate K1, the upper table 3, and the lower table 4 add the upper substrate K1 and the cushion sheet 31 of the upper table 3. It is in a pressed state. At this time, the adhesive portion 8c of the adhesive pin 8a and the cushion sheet 31 of the upper table 3 are crushed, and the current value I1c of a value smaller than the current value I1b is a holding current value of the electric motor 83. Measured.

  Returning to FIG. 9A, ΔAx12 represents the difference from the point Ax1a to the point Ax2a. ΔAx13 represents the difference from the point Ax1a to the point Ax3a. ΔAx14 represents the difference from the point Ax1a to the point Ax4a. Here, the difference ΔAx12 represents the difference from the first current value decrease start point (point Ax1a) to the second current value decrease start point (point Ax2a) (the other differences ΔAx13 and ΔAx14 also represent). The same).

  In the present embodiment, as an example, for example, when “N (μm)” is set as a threshold value and “−N μm <(ΔAx14−ΔAx12) <+ N μm”, the adhesive pin plate 8b (the substrate held by the adhesive pins 8a) is provided. The parallel adjustment is performed by determining that the lower member (for example, the lower substrate K2 or the lower table 4) is in a parallel state.

  In the example shown in FIG. 9A, the Z-axis height values of the points Ax1a, Ax2a, Ax3a, and Ax4a are in the order of the points Ax1a, Ax2a, Ax3a, and Ax4a from the largest value. This means that the adhesive pin plate 8b is such that the axis Ax1 is the lowest, the axis Ax2 is the second lowest, the axis Ax3 is the third lowest, and the axis Ax4 is the fourth lowest (ie highest). Indicates that it is tilted. The board assembly system 1000 can perform parallel adjustment as shown in FIG. 9B and FIG. 9C, for example, by adjusting the timing at which the holding current value starts to decrease.

  FIG. 9B shows an example in which parallel adjustment is performed so that the holding current value decrease start timings coincide with each other on all axes Ax1, Ax2, Ax3, and Ax4. This case means that the parallel adjustment is performed so that the entire surface of the adhesive pin plate 8b is parallel to the lower member (for example, the lower substrate K2 or the lower table 4).

  On the other hand, FIG. 9C shows an example in which parallel adjustment is performed so that the timing of starting to decrease the holding current value is appropriately shifted on each of the axes Ax1, Ax2, Ax3, and Ax4. In this case, parallel adjustment is performed so that each part of the adhesive pin plate 8b is arranged substantially parallel to the lower member (for example, the lower substrate K2 or the lower table 4) with an intentionally set amount of deviation. It means that.

<Details of setting data>
Hereinafter, the details of the adjustment data D3 (see FIG. 8) will be described.
In the present embodiment, the adjustment data D3 is a parallel adjustment amount (for each vertical movement mechanism 80) of each part (for example, the vicinity of each axis Ax1, Ax2, Ax3, Ax4 (see FIG. 7B)) of the adhesive pin plate 8b. This means data indicating the adjustment amount of the operation. The adjustment data D3 is calculated based on Z-axis height differences ΔAX12, ΔAX13, ΔAX14 (see FIG. 9A). For example, the substrate assembly system 1000 can adjust the adhesive pin plate 8b that is inclined with respect to the upper substrate surface 3a of the upper table 3 to be parallel to the upper substrate surface 3a. That is, the board assembly system 1000 can perform parallel adjustment from the state shown in FIG. 9A to the state shown in FIG. 9B. In this case, the parallel adjustment amounts of the axes Ax2, Ax3, and Ax4 are ΔAX12, ΔAX13, and ΔAX14. The adjustment data D3 represents the value.

  The board assembly system 1000 can be adjusted so that each part of the adhesive pin plate 8b is distorted by a deliberately set amount of displacement. That is, the board assembly system 1000 can perform parallel adjustment so that the state shown in FIG. 9A is changed to the state shown in FIG. 9C, for example. In this case, the parallel adjustment amount of each axis Ax2, Ax3, Ax4 can be changed according to the amount of displacement of each part that is intentionally distorted. Therefore, the value of the adjustment data D3 in this case varies according to the amount of displacement.

<Operation of board assembly system>
The board assembly system 1000 can simplify the parallel adjustment of the upper board K1 with respect to the lower board K2. The parallel adjustment is an adjustment that regulates the height of each part of the adhesive pin plate 8b that is the base part of the adhesive holding mechanism 8 by controlling the operation of the vertical movement mechanism 80 of the adhesive holding mechanism 8 that is the second drive mechanism. This is performed by executing (see S140 in FIG. 11A).

  Hereinafter, the operation of the substrate assembly system 1000 will be described with reference to FIGS. 11A to 11D, 12, 13, 14 </ b> A to 14 </ b> B, and 15. 11A to 11D are flowcharts showing operations during setup of the board assembly system 1000, respectively. FIG. 12 is a flowchart showing the operation of the substrate assembly system 1000 while it is stopped. FIG. 13 is a flowchart showing an operation during production of the board assembly system 1000. 14A to 14B are flowcharts showing the operation of the substrate assembly system 1000 during pressurization / current measurement. FIG. 15 is a diagram illustrating an example of the display screen PI1 displayed on the display unit 180 (see FIG. 8).

  The board assembly apparatus 1 operates based on the time measured by a timer (not shown). The series of operations of the board assembly apparatus 1 is defined by a program stored in a readable manner in a storage unit (not shown). In addition, each information is temporarily stored in a storage unit so as to be readable, and then output to a required component for performing subsequent processing. Hereinafter, since these points are conventional means in information processing, detailed description thereof will be omitted.

(Operation during setup)
First, operations during setup of the board assembly system 1000 will be described with reference to FIGS. 11A to 11D. The operation during the setup is performed based on the operation of the engineer on the provider side of the board assembly system 1000. The engineer operates the control device 100 to display a registration screen (not shown) for registering various setting values in the board assembly system 1000 on the display unit 180. Thereby, the board assembly system 1000 starts an operation during the setup.

As shown in FIG. 11A, when the engineer inputs various setting values from a registration screen (not shown), the control device 100 accepts registration of the input setting values (S105).
When the engineer performs an operation to instruct the start of setup, the control apparatus 100 causes the substrate assembly apparatus 1 to carry a dummy substrate (not shown) into the vacuum chamber 5 (S110). Specifically, the control device 100 drives the Z-axis drive mechanism 20 of the board assembly apparatus 1 to move the upper frame 2 upward, thereby moving the upper table 3 upward and moving the upper chamber 5a upward. Let This opens the vacuum chamber 5. Next, the control device 100 drives the transfer device 200 to carry a dummy substrate (not shown) between the upper table 3 and the lower table 4 in the vacuum chamber 5. The dummy substrate confirms the parallel adjustment amount (the adjustment amount of the operation of each vertical movement mechanism 80) of each part of the adhesive pin plate 8b (for example, the vicinity of each axis Ax1, Ax2, Ax3, Ax4 (see FIG. 7B)). It is a board for. The dummy substrate is formed with a uniform thickness over the entire surface.

When the dummy substrate is carried between the upper table 3 and the lower table 4, the control device 100 gives a command to the vertical movement mechanism 70 to move the suction pin 7a downward until it hits the dummy substrate, and the vacuum pump P1. Drive. As a result, the dummy substrate is vacuum-sucked by the suction pins 7a.
Thereafter, the control device 100 retracts the transfer device 200 to the outside of the vacuum chamber 5 and moves the suction pin 7 a upward to bring the dummy substrate into close contact with the upper substrate surface 3 a of the upper table 3. Since the upper substrate surface 3a is a flat surface, deformation such as bending in the dummy substrate is corrected (deformation such as bending is removed).

  Then, the control device 100 gives a command to the vertical movement mechanism 80 to move the adhesive pin plate 8b downward and drive the vacuum pump P2. The dummy substrate is vacuum-sucked by the adhesive pins 8a that move downward together with the adhesive pin plate 8b. At this time, the adhesive portion 8c at the tip of the adhesive pin 8a sticks to the dummy substrate. Thereafter, the control device 100 moves down the adhesive pin plate 8b with the dummy substrate attached to the adhesive portion 8c of the adhesive pin 8a, and moves the dummy substrate away from the upper substrate surface 3a.

  At this time, the control device 100 operates the vertical movement mechanisms 80 (specifically, each of the vertical movement mechanisms 80 so that the protruding amount of each adhesive pin 8a becomes the protruding amount set for each part of the adhesive pin plate 8b. The operation of each electric motor 83 of the vertical movement mechanism 80 is controlled to move each adhesive pin plate 8b downward. Thereby, the control apparatus 100 prescribes | regulates the height of each site | part of each adhesion pin plate 8b. In the present embodiment, the electric motor 83 is configured by a servo motor and is controlled by the PLC 212. The PLC 212 (see FIG. 7B) keeps the operation amount (rotation angle) of the electric motor 83 at the operation amount defined by the command of the control device 100 by continuously supplying a constant current to the electric motor 83. to continue.

Thereafter, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, thereby lowering the upper table 3 and lowering the upper chamber 5a. Thereby, the upper chamber 5a and the lower chamber 5b are engaged, and the vacuum chamber 5 is closed. At this time, the upper table 3, the lower table 4, the suction pin 7a, and the adhesive pin 8a are arranged inside the vacuum chamber 5.
The process of S110 is performed as described above.

  After S110, the control device 100 causes the substrate assembly apparatus 1 to perform evacuation (S115). Specifically, when the vacuum chamber 5 is closed, the control device 100 drives the vacuum pump P0 to make the inside of the vacuum chamber 5 a vacuum. As a result, the vacuum chamber 5 is in a state in which the upper table 3, the lower table 4, the suction pin 7a, and the adhesive pin 8a are accommodated in a vacuum environment.

After S115, the control apparatus 100 causes the board assembly apparatus 1 to perform pressurization / current measurement (S125). The process of S125 is performed as follows.
First, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, thereby moving the adhesive pin plates 8b (adhesive pins 8a) together with the upper table 3. As a result, the substrate assembly apparatus 1 pressurizes the dummy substrate with the upper frame 2, the upper table 3, and the lower table 4. At the same time, the control device 100 starts measuring the holding current value of each electric motor 83 of each vertical movement mechanism 80.

  The control apparatus 100 measures the measurement result of the holding current value of each electric motor 83 measured from the start to the end of the measurement of the current value of each electric motor 83 in association with the Z-axis height. It memorize | stores in the memory | storage part 160 as data D2. Specifically, the measurement unit 121 of the control device 100, for example, the holding current of the electric motor 83 that represents the measurement result of the height data of the adhesive pin plate 8b that represents the Z-axis height and the holding current value of each electric motor 83. The timing data whose value has fluctuated is recorded in the storage unit 160 as measurement data D2.

  When the adhesive pin plate 8 b (adhesive pin 8 a) moves downward, the lower surface of the dummy substrate held by the adhesive pin 8 a comes into close contact with the lower substrate surface 4 a of the lower table 4. The control device 100 detects that the lower surface of the dummy substrate is in close contact with the lower substrate surface 4a of the lower table 4 based on the detection signal input from the load cell 20d. Then, the control apparatus 100 drives each vertical movement mechanism 80 at that time, and draws each adhesive pin 8a from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2 and drives the gas supply means 8e to supply gas to the vacuum suction hole 8d, thereby peeling the dummy substrate from the adhesive portion 8c.

When the adhesive pin plate 8b (adhesive pin 8a) further moves down, the adhesive portion 8c of the adhesive pin 8a is crushed. Thereafter, the upper surface of the dummy substrate comes into close contact with the upper substrate surface 3 a of the upper table 3, and the dummy substrate is further pressed by the upper frame 2 and the upper table 3. The control device 100 stops the downward movement of the upper frame 2 when it is determined by the detection signal input from the load cell 20d that a predetermined set load is generated between the upper table 3 and the lower table 4. In addition, the control device 100 ends the measurement of the current value of each electric motor 83. At this time, the dummy substrate is in a state where a predetermined set load is applied in a vacuum environment in the vacuum chamber 5.
The process of S125 is performed as described above. Details of the “pressurization / current measurement” process in S125 will be described later with reference to FIGS. 14A and 14B.

  After S125, the control device 100 refers to the measurement data D2 of the current value of each electric motor 83 stored in the storage unit 160 in S125, and displays a display screen (for example, the display screen PI1 shown in FIG. ) And the display screen thereof is displayed on the display unit 180 (see FIG. 8) (S130).

  FIG. 15 is a diagram illustrating an example of the display screen PI1. In the example illustrated in FIG. 15, the display screen PI1 has a configuration in which the old measurement result is compared with the latest measurement result. The display screen PI1 includes a graph showing the measured fluctuation state of each electric motor 83, various reference information, automatic adjustment buttons B1a and B2a, manual adjustment buttons B1b and B2b, and an adjustment unnecessary button B3. It has become. The automatic adjustment buttons B1a and B2a are buttons for instructing the control device 100 to automatically execute parallel adjustment (that is, adjustment that regulates the height of each part of the adhesive pin plate 8b) (execution of the automatic adjustment mode). It is. The manual adjustment buttons B1b and B2b are buttons for instructing the control device 100 to execute parallel adjustment manually (execution of the manual adjustment mode). The adjustment unnecessary button B3 is a button for instructing the control device 100 not to execute the parallel adjustment.

  Returning to FIG. 11A, after S130, the engineer determines whether parallel adjustment is necessary (S135). When parallel adjustment is necessary (in the case of “Yes”), for example, an engineer presses the automatic adjustment button B1a (see FIG. 15) or the manual adjustment button B1b (see FIG. 15). When detecting that the automatic adjustment button B1a (see FIG. 15) or the manual adjustment button B1b is pressed, the control device 100 performs parallel adjustment (S140). On the other hand, when parallel adjustment is unnecessary (in the case of “No”), for example, an engineer presses the adjustment unnecessary button B3 (see FIG. 15). When detecting that the adjustment unnecessary button B3 is pressed, the control device 100 ends the series of routine processing.

(Details of “Adjustment execution” processing)
Hereinafter, the details of the “adjustment execution” process in S140 (see FIG. 11A) will be described with reference to FIG. 11B.
As shown in FIG. 11B, in the “adjustment execution” process in S140, the control device 100 first accepts the adjustment mode (S140a). The acceptance of the adjustment mode is performed, for example, by detecting pressing of the automatic adjustment buttons B1a and B2a and the manual adjustment buttons B1b and B2b displayed on the display screen PI1 (see FIG. 15). Next, the control device 100 determines whether or not the accepted adjustment mode is the automatic adjustment mode (S140b).

  When it is determined in S140b that the accepted adjustment mode is the automatic adjustment mode (in the case of “Yes”), the control device 100 calculates adjustment data D3 (see FIG. 8) (S140c). Automatic adjustment of parallel adjustment is executed (S140d). Thus, the control device 100 ends the “adjustment execution” process in S140. Details of the “automatic adjustment execution” process in S140d will be described later with reference to FIG. 11C.

  On the other hand, when it is determined in S140b that the accepted adjustment mode is not the automatic adjustment mode (in the case of “No”), the adjustment data calculation unit 122 (see FIG. 8) of the control device 100 performs adjustment data. D3 (see FIG. 8) is calculated (S140e), adjustment data is displayed on the display unit 180 (see FIG. 8) (S140f), and parallel adjustment manual adjustment is executed (S140g). Thus, the control device 100 ends the “adjustment execution” process in S140. Details of the “manual adjustment execution” process in S140g will be described later with reference to FIG. 11D.

(Details of "Automatic adjustment execution" processing)
Hereinafter, with reference to FIG. 11C, the details of the “automatic adjustment execution” process (see FIG. 11B) in S140d will be described.
As shown in FIG. 11C, in the process of S140d, first, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 upward, thereby moving each adhesive pin plate 8b (adhesive pin) together with the upper table 3. 8a) is moved up to release the pressure on the dummy substrate (S141a).
Next, the control device 100 automatically updates the set value of the operation amount of each vertical movement mechanism 80 (each electric motor 83) for parallel adjustment based on the adjustment data calculated in S140c (see FIG. 11B) (S141b). .

  After S141b, the control device 100 causes the substrate assembly apparatus 1 to perform pressurization / current measurement in the same manner as the processing of S125 (see FIG. 11A) (S141c). And the control apparatus 100 determines whether the difference of the timing of the fluctuation | variation of the holding current value of each electric motor 83 of each vertical movement mechanism 80 is within a preset threshold based on the measurement result of S141c (S141d). ). When it is determined in S141d that the difference is within the preset threshold (in the case of “Yes”), the control device 100 ends the “automatic adjustment execution” process in S140d. On the other hand, when it is determined in S141d that the difference is not within the preset threshold value (in the case of “No”), the control device 100 calculates adjustment data based on the measurement result in S141c (S141e). . Thereafter, the process returns to S141a.

(Details of “Manual adjustment execution” processing)
Hereinafter, the details of the “manual adjustment execution” process (see FIG. 11B) in S140g will be described with reference to FIG. 11D.
As shown in FIG. 11D, in the “manual adjustment execution” process of S140g, first, the control device 100 releases the pressure on the dummy substrate in the same manner as the process of S141a (see FIG. 11C) (S142a).
Next, the control device 100 accepts manual input by the engineer of the set value of the operation amount of each vertical movement mechanism 80 (each electric motor 83) for parallel adjustment, and updates the set value of the operation amount to the received value (S142b). ).

  After S142b, the control device 100 causes the substrate assembly apparatus 1 to perform pressurization / current measurement in the same manner as in the process of S125 (see FIG. 11A) (S142c). Next, similarly to the process of S130 (see FIG. 11A), the control device 100 creates a display screen (for example, the display screen PI1 shown in FIG. 15) representing the measurement result, and displays the display screen on the display unit 180 (FIG. 8) (S142d).

  After S142d, the engineer determines whether readjustment (parallel adjustment) is necessary (S142e). When readjustment (parallel adjustment) is necessary (in the case of “Yes”), the manual adjustment button B1b (see FIG. 15) is pressed by an engineer, for example. When detecting the pressing of the manual adjustment button B1b, the control device 100 calculates adjustment data based on the measurement result of S142c (S142f). Thereafter, the process returns to S142a. On the other hand, when readjustment (parallel adjustment) is not necessary (in the case of “No”), for example, an engineer presses the adjustment unnecessary button B3 (see FIG. 15). When detecting that the adjustment unnecessary button B3 is pressed, the control device 100 ends the “manual adjustment execution” process of S140g.

(Operation while substrate production is stopped)
Next, with reference to FIG. 12, the operation of the substrate assembly system 1000 during production stop of the substrate will be described. The operation during the production stop of the substrate is performed based on the operation of the operator on the user side of the substrate assembly system 1000.

  As shown in FIG. 11A, the operator operates the control device 100 to display a confirmation screen (not shown) for confirming the accumulated measurement data D4 (see FIG. 8) on the display unit 180 (S205). When a confirmation screen (not shown) is displayed, the operator determines whether parallel adjustment is necessary (S210).

  When parallel adjustment is necessary (in the case of “Yes”), for example, an operator presses an automatic adjustment button or a manual adjustment button (not shown) included in a confirmation screen (not shown). When detecting that the automatic adjustment button or the manual adjustment button (not shown) is pressed, the control device 100 executes parallel adjustment (S140). On the other hand, when parallel adjustment is not necessary (in the case of “No”), for example, an operator presses an adjustment unnecessary button (not shown) included in a confirmation screen (not shown). When the control device 100 detects pressing of an adjustment-unnecessary button (not shown), the control device 100 ends the series of routine processing.

(Operation during substrate production)
Next, the operation of the substrate assembly system 1000 during production of the substrate will be described with reference to FIG. The operation during the production of the substrate is performed based on the operation of the operator on the user side of the substrate assembly system 1000. The operator operates the control device 100 to cause the display unit 180 to display a production instruction screen (not shown) for instructing the production of the substrate. Thereby, the board assembly system 1000 starts an operation during the production of the board.

  As shown in FIG. 13, when the operator inputs various setting values such as the number of productions from a production instruction screen (not shown) and instructs the start of production, the control device 100 causes the substrate assembly apparatus 1 to perform an upper substrate. The K1 and the lower substrate K2 are carried into the vacuum chamber 5 (S305). The process of S305 is performed as follows.

  First, the control apparatus 100 drives the Z-axis drive mechanism 20 of the board assembly apparatus 1 to move the upper frame 2 upward, thereby moving the upper table 3 upward and the upper chamber 5a. This opens the vacuum chamber 5. Next, the control device 100 drives the transfer device 200 to carry the upper substrate K <b> 1 between the upper table 3 and the lower table 4 in the vacuum chamber 5.

  When the upper substrate K1 is transported between the upper table 3 and the lower table 4, the control device 100 gives a command to the vertical movement mechanism 70 to move the suction pin 7a downward until it hits the upper substrate K1, and to vacuum The pump P1 is driven. As a result, the upper substrate K1 is vacuum-sucked by the suction pins 7a.

  Thereafter, the control device 100 retracts the transfer device 200 to the outside of the vacuum chamber 5 and moves the suction pin 7a upward to bring the upper substrate K1 into close contact with the upper substrate surface 3a of the upper table 3. Since the upper substrate surface 3a is a flat surface, deformation such as bending in the upper substrate K1 is corrected (deformation such as bending is removed).

  Then, the control device 100 gives a command to the vertical movement mechanism 80 to move the adhesive pin plate 8b downward and drive the vacuum pump P2. The upper substrate K1 is vacuum-sucked by the adhesive pins 8a that move downward together with the adhesive pin plate 8b. At this time, the adhesive portion 8c at the tip of the adhesive pin 8a sticks to the upper substrate K1. Thereafter, the control device 100 moves down the adhesive pin plate 8b with the upper substrate K1 adhered to the adhesive pins 8a, and moves the upper substrate K1 away from the upper substrate surface 3a.

  At this time, the control device 100 operates the vertical movement mechanism 80 (specifically, the vertical movement of each vertical pin 80a so that the protruding amount of each adhesive pin 8a is set for each part of the adhesive pin plate 8b. The operation of each electric motor 83 of the moving mechanism 80 is controlled to move each adhesive pin plate 8b downward. Thereby, the control apparatus 100 prescribes | regulates the height of each site | part of each adhesion pin plate 8b.

  Next, the control device 100 drives the transfer device 200 to carry the lower substrate K2 between the upper substrate K1 and the lower table 4 in the vacuum chamber 5, and the lower substrate K2 onto the lower substrate surface 4a of the lower table 4. Place. Thereafter, the control device 100 causes the transfer device 200 to leave the vacuum chamber 5. Further, the control device 100 drives the vacuum pump P <b> 3 to attract and hold the lower substrate K <b> 2 on the lower substrate surface 4 a of the lower table 4.

Thereafter, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, thereby lowering the upper table 3 and lowering the upper chamber 5a. Thereby, the upper chamber 5a and the lower chamber 5b are engaged, and the vacuum chamber 5 is closed. At this time, the upper table 3, the lower table 4, the suction pin 7a, and the adhesive pin 8a are arranged inside the vacuum chamber 5.
The process of S305 is performed as described above.

  After S305, the control device 100 causes the substrate assembly apparatus 1 to perform evacuation in the same manner as the processing of S115 (see FIG. 11A) (S310). As a result, the vacuum chamber 5 is in a state where the upper table 3, the lower table 4, the suction pin 7a, and the adhesive pin 8a are accommodated in a vacuum environment. In addition, before the lower substrate K2 is carried into the substrate assembly apparatus 1 (between the upper table 3 and the lower table 4), necessary substances such as a sealant, a liquid crystal, a spacer, and a paste material are applied in another process. ing.

  After S310, the control device 100 drives the moving mechanism 41 of the XYθ moving unit 40 to displace the lower table 4, and determines the bonding position between the upper substrate K1 and the lower substrate K2 (S315).

After S315, the control device 100 causes the board assembly device 1 to perform a pressurization / current measurement process (S320). The process of S320 is performed as follows.
First, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 downward, thereby moving the adhesive pin plates 8b (adhesive pins 8a) together with the upper table 3 to move the upper frame 2 The upper table 3 and the lower table 4 pressurize the upper substrate K1 and the lower substrate K2. As a result, the upper substrate K1 held by the adhesive pins 8a and the lower substrate K2 held by the lower table 4 are bonded together. At the same time, the control device 100 starts measuring the holding current value of each electric motor 83 of each vertical movement mechanism 80. The control device 100 associates the measurement result of the current value of each electric motor 83 measured between the start and end of the measurement of the current value of each electric motor 83 with the Z-axis height, and the measurement data It is stored in the storage unit 160 as D2.

  The control device 100 detects that the upper substrate K1 and the lower substrate K2 are bonded together by a detection signal input from the load cell 20d. Then, the control device 100 drives each vertical movement mechanism 80 at that time and pulls the adhesive pin 8a from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2 and drives the gas supply means 8e to supply gas to the vacuum suction holes 8d, thereby peeling the upper substrate K1 from the adhesive portion 8c.

Then, the control device 100 drives the Z-axis drive mechanism 20 to further move the upper frame 2 downward, so that the upper substrate K1, the upper table 3, and the lower table 4 move the upper substrate K1 and the lower substrate K2. Further pressurize. The control device 100 stops the downward movement of the upper frame 2 when it is determined by the detection signal input from the load cell 20d that a predetermined set load is generated between the upper table 3 and the lower table 4. In addition, the control device 100 ends the measurement of the current value of each electric motor 83. At this time, the upper substrate K1 and the lower substrate K2 are bonded together with a predetermined set load in a vacuum environment in the vacuum chamber 5. Further, the pressure applied at this time appropriately presses the sealing agent previously applied to the lower substrate K2, and the vacuum of the liquid crystal portion applied in the frame surrounded by the sealing agent is maintained.
Thereafter, the sealing agent is temporarily cured with ultraviolet rays irradiated from a UV (ultraviolet) irradiation device (not shown) so that the positions of the upper substrate K1 and the lower substrate K2 do not shift.
The process of S320 is performed as described above.

After S320, the control device 100 determines whether or not the difference in the timing of fluctuation of the holding current value of each electric motor 83 of each vertical movement mechanism 80 is within a preset threshold based on the measurement result of S320. (S325).
When it is determined in S325 that the difference is within the preset threshold (in the case of “Yes”), the control device 100 causes the substrate assembly apparatus 1 to release the atmosphere (S330). Specifically, the control device 100 injects a gas such as nitrogen gas into the vacuum chamber 5 in a vacuum state to increase the pressure in the vacuum chamber 5 to atmospheric pressure. By increasing the pressure inside the vacuum chamber 5 to atmospheric pressure, the upper substrate K1 and the lower substrate are changed until a gap (cell gap) determined by the amount of spacers or liquid crystals previously applied to the substrate (lower substrate K2) is reached. K2 is pressed uniformly (pressure press). The control device 100 drives the gas supply means 8e to supply gas to the vacuum suction hole 8d. At this time, since the adhesive pin 8a does not hold the upper substrate K1, the gas supplied to the vacuum suction hole 8d is supplied into the vacuum chamber 5. The control device 100 measures the atmospheric pressure in the vacuum chamber 5 with an atmospheric pressure sensor (not shown), and stops the gas supply means 8e when the atmospheric pressure in the vacuum chamber 5 is increased to atmospheric pressure. Then, the control device 100 moves up the upper frame 2. As a result, the vacuum chamber 5 is opened.

After S325, the control device 100 drives the transfer device 200 to carry out the substrate on which the upper substrate K1 and the lower substrate K2 are bonded to the outside of the vacuum chamber 5 (S335).
After S335, the control device 100 determines whether or not production for the set number of sheets has been completed (S340). If it is determined in S340 that production for the set number of sheets has not been completed (in the case of “No”), the process returns to S305. On the other hand, if it is determined in S340 that production for the set number of sheets has been completed (in the case of “Yes”), a series of routine processing ends.

  Further, when it is determined in S325 that the difference is not within the preset threshold value (in the case of “No”), the control device 100 issues an alarm with the speaker 170 in order to make the operator confirm the measurement result. In addition to issuing a notification (S350), a display screen (for example, display screen PI1 shown in FIG. 15) showing the measurement result with reference to the measurement data D2 of the current value of each electric motor 83 stored in the storage unit 160 in S320. And the display screen is displayed on the display unit 180 (see FIG. 8) (S355).

  After S355, the operator determines whether parallel adjustment is necessary (S360). When parallel adjustment is necessary (in the case of “Yes”), for example, the operator presses the automatic adjustment button B1a (see FIG. 15) or the manual adjustment button B1b (see FIG. 15). When detecting that the automatic adjustment button B1a (see FIG. 15) or the manual adjustment button B1b is pressed, the control device 100 drives the transfer device 200 to carry out the substrate being produced to the outside of the vacuum chamber 5 (S365). Then, the control device 100 performs parallel adjustment (S140). Thereafter, the process returns to S305 via the code SA1. On the other hand, if parallel adjustment is not required (in the case of “No”) in S360, for example, the operator presses the adjustment unnecessary button B3 (see FIG. 15). In this case, the process proceeds to S330 via the symbol SA2.

In the present embodiment, the substrate assembly apparatus 1 is opened to the atmosphere in the process of S330. This is to realize the following operation.
That is, it is not preferable that there is a gap for gas to enter between the upper substrate K1 and the lower substrate K2. Therefore, the substrate assembly apparatus 1 presses the upper substrate K1 against the lower substrate K2 so that the adhesive portion 8c of the adhesive pin 8a is crushed, and partially bonds the upper substrate K1 and the lower substrate K2. And the board | substrate assembly apparatus 1 pressurizes the upper board | substrate K1 by atmospheric pressure by open | releasing to air | atmosphere, the upper board | substrate K1 and the lower board | substrate K2 are closely_contact | adhered, and it bonds together.

(Details of the “Pressurization / Current Measurement” process)
Hereinafter, with reference to FIG. 14A and FIG. 14B, the details of the “pressurization / current measurement” processing (see FIGS. 11A, 11B, 11D, and 13) of S140g, S141c, S142c, and S320 will be described. Here, a description will be given assuming that the descending amount of the upper table 3 is set in four stages of the first descending amount to the fourth descending amount. However, the lowering amount of the upper table 3 can be set in multiple stages other than the four stages. Further, the description will be made assuming that the target load used as a condition for determining whether or not the lowering amount of the upper table 3 is set is set in three stages of the first target load to the third target load. However, the target load can be set in multiple stages other than three stages.

  As shown in FIG. 14A, in the “pressurization / current measurement” process of S140g, S141c, S142c, and S320, first, the control device 100 sets each adhesive pin plate 8b to a pressure start height (S405). The pressurization start height is a height set in advance for pressurization start, and the thickness of the substrate disposed in the vacuum chamber 5 (specifically, the thickness of the dummy substrate or above The total thickness of the substrate K1 and the lower substrate K2) is set to a larger value. Next, the control device 100 starts current measurement (S410). Then, the control device 100 drives the Z-axis drive mechanism 20 to lower the upper table 3 to the pressurization start height (S415).

  After S415, the control device 100 sets the descending amount of the upper table 3 to the first descending amount (S420). The first descending amount is a value similar to a preset value (hereinafter referred to as “set projection amount”) or a set projection amount as a projection amount of the adhesive portion 8c of the adhesive pin 8a from the upper substrate surface 3a. Is also set to a small value. Next, the control device 100 drives the Z-axis drive mechanism 20 to lower the upper table 3 by the first lowering amount (S425).

  After S425, the control device 100 determines whether or not the load measured by the four load cells 20d (hereinafter referred to as “measurement load”) has reached the final load (S430). The final load is a set load when the upper substrate K1 and the lower substrate K2 are actually bonded together.

  When it is determined in S430 that the measured load has reached the final load (in the case of “Yes”), the upper substrate K1 and the lower substrate K2 are bonded together. In this case, the control device 100 waits for the set time (S435), thereafter ends the current measurement (S440), and stores the measurement result in the storage unit 160 as the measurement data D2 (S445). Then, the control device 100 ends the “pressurization / current measurement” process.

  On the other hand, when it is determined in S430 that the measured load has not reached the final load (in the case of “No”), the process proceeds to S505 illustrated in FIG. 14B via the code SB1.

  When it is determined in S430 that the measured load has not reached the final load (in the case of “No”), as illustrated in FIG. 14B, the control device 100 causes the measured load to reach the first target load. It is determined whether or not (S505). The first target load is a target load used as a condition for determining whether or not the second descending amount is set as the descending amount of the upper table 3, and is set to a value smaller than the final load.

  When it is determined in S505 that the measured load has reached the first target load (in the case of “Yes”), the control device 100 sets the descending amount of the upper table 3 to the second descending amount. (S510). The second descending amount is set to a value smaller than the first descending amount.

  Next, the control device 100 temporarily stops the current measurement (S515). Then, the control device 100 drives the moving mechanism 41 of the XYθ moving unit 40 to displace the lower table 4, and determines the bonding position between the upper substrate K1 and the lower substrate K2 (S520). Thereafter, the control device 100 resumes the current measurement (S525).

  On the other hand, when it is determined in S505 that the measured load has not reached the first target load (in the case of “No”), the control device 100 determines whether the measured load has reached the second target load. Is determined (S530). The second target load is set to a value smaller than the first target load. When it is determined in S530 that the measured load has reached the second target load (in the case of “Yes”), the control device 100 sets the descending amount of the upper table 3 to the third descending amount. (S535). The third descending amount is set to a value smaller than the second descending amount.

  On the other hand, when it is determined in S530 that the measured load has not reached the second target load (in the case of “No”), the control device 100 determines whether the measured load has reached the third target load. Is determined (S540). The third target load is set to a value smaller than the second target load. When it is determined in S540 that the measured load has reached the third target load (in the case of “Yes”), the control device 100 sets the descending amount of the upper table 3 to the fourth descending amount. (S545). The fourth descending amount is set to a value smaller than the third descending amount. On the other hand, when it is determined in S540 that the measured load has not reached the third target load (in the case of “No”), the process proceeds to S550.

After one of the processes of S525, S535, and S545, or after the determination in S540 determines that the measured load has not reached the third target load (in the case of “No”), the control device 100 drives the Z-axis drive mechanism 20 to lower the upper table 3 by the set lowering amount (S550). As a result, when the process is after S525, the upper table 3 is lowered by the second descending amount. Further, when the process is after S535, the upper table 3 is lowered by the third descending amount. Further, when the process is after S545, the upper table 3 is lowered by the fourth descending amount. Further, after the process is determined in S540 and it is determined that the measured load has not reached the third target load (in the case of “No”), the upper table 3 is lowered by the third descending amount.
After S550, the process returns to S430 illustrated in FIG. 14A via the code SB2.

<Main features of board assembly system>
(1) The board assembly system 1000 includes an adjustment data calculation unit 122 (see FIG. 8). The adjustment data calculation unit 122 is based on the variation timing of the load of each vertical movement mechanism 80 (in this embodiment, the holding current value of the electric motor 83) measured according to the descending amount of the Z-axis drive mechanism 20. Then, the adjustment data D3 of the operation amount (rotation angle of the electric motor 83) of each vertical movement mechanism 80 is calculated. An engineer on the provider side and an operator on the user side of the board assembly system 1000 can easily perform appropriate parallel adjustment by confirming the calculated adjustment data D3. Therefore, the board assembly system 1000 can simplify the parallel adjustment of the upper board K1 with respect to the lower board K2.

  In particular, in recent years, there has been a demand for cutting out and obtaining a large number of products from a single substrate. In order to satisfy this demand, it is desirable to set the parallel adjustment amount in detail according to each part of the substrate. The board assembly system 1000 can satisfy such a demand because the parallel adjustment amount can be finely set according to each part of the board.

  (2) The board assembly system 1000 includes a measurement unit 121 (see FIG. 8). The measuring unit 121 measures the load of each vertical movement mechanism 80 (the holding current value of the electric motor 83), and performs monitoring for determining the parallel state of each part (four corners) of the adhesive pin plate 8b in accordance with the load fluctuation timing. It has a function. Therefore, for example, when the height of each part of the adhesive pin plate 8b exceeds a preset threshold, the board assembly system 1000 issues an alarm and notifies an engineer or operator of an abnormality in parallel adjustment. can do.

  (3) The control device 100 displays on the display unit 180 (see FIG. 8) a display screen PI1 (see FIG. 15) that displays the manual adjustment mode and the automatic adjustment mode in a selectable manner. This allows an engineer or operator to select a preferred mode according to the operation. For example, by selecting the manual adjustment mode, an engineer or an operator can perform parallel adjustment including an intentionally set shift amount as shown in FIG. 9C. Further, the engineer or the operator selects the automatic adjustment mode so that the entire surface of the adhesive pin plate 8b is parallel to the lower member (for example, the lower substrate K2 or the lower table 4) as shown in FIG. Parallel adjustment can be performed. However, even in the automatic adjustment mode, by setting setting data D1 including a deviation amount (see FIG. 8) in advance, an intentionally set deviation amount as shown in FIG. 9C is included. Parallel adjustment can also be performed.

  (4) The board assembly system 1000 includes a monitoring unit 124 (see FIG. 8). The monitoring unit 124 arbitrarily sets in advance as a measurement load or a sample value measured in the past with respect to the measurement data D2 representing the load of the vertical movement mechanism 80 (the holding current value of the electric motor 83) measured by the measurement unit 121. Monitor the magnitude of change from the configured load. Such a board assembly system 1000 feeds back and monitors the state of parallel adjustment every time a board is manufactured, and issues an alarm or automatically adjusts when the state of parallel adjustment changes from before. be able to. Specifically, the control device 100 records measurement data for the past several months as accumulated measurement data D4 in the recording unit 160 as data representing a measurement load measured in the past. The monitoring unit 124 compares the measurement data D2 and the accumulated measurement data D4, and monitors whether the measurement data D2 has changed from the accumulated measurement data D4 beyond a preset threshold. When the measurement data D2 changes from the accumulated measurement data D4 exceeding a preset threshold, the board assembly system 1000 issues an alarm to notify an engineer or operator of an abnormality in parallel adjustment, Alternatively, the parallel adjustment can be automatically performed.

  (5) The control device 100 displays a display screen PI1 (see FIG. 15) including a graph showing the process of fluctuation of the load of the vertical movement mechanism 80 (the holding current value of the electric motor 83) measured by the measuring unit 121. 180 (see FIG. 8). As a result, the board assembly system 1000 can intuitively identify the shift amount of the variation timing of the load (the holding current value of the electric motor 83) in each axis Ax1, Ax2, Ax3, and Ax4 at a glance.

  (6) The electric motor 83 of the vertical movement mechanism 80 is configured by a servo motor that can measure the fluctuation of the holding current value according to the load by the control device 100. However, the electric motor 83 can also be configured by a step motor.

  As described above, according to the substrate assembly apparatus 1 according to the present embodiment, it is possible to simplify the parallel adjustment of the upper substrate K1 with respect to the lower substrate K2.

  The present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. In addition, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

For example, in the above-described embodiment, the board assembly apparatus 1 has 81 adhesive pins 8a and 9 adhesive pin plates 8b. However, the number of adhesive pins 8a can be appropriately changed according to the operation. Further, the number of the adhesive pin plates 8b can be appropriately changed according to the operation.
Further, for example, in the above-described embodiment, the board assembly apparatus 1 is configured to move one adhesive pin plate 8b up and down by four vertical movement mechanisms 80. However, the substrate assembly apparatus 1 may be configured to move one adhesive pin plate 8b up and down by four or more vertical movement mechanisms 80.

  For example, the measurement unit 121 and the adjustment data calculation unit 122 may be operated as follows. That is, when measuring the holding current value of the electric motor 83, the measurement unit 121 starts recording the upper table 2 and continues to record the measurement result as measurement data D2 in the storage unit 160 for N seconds. Then, the measurement unit 121 (or the adjustment data calculation unit 122) detects a section where the holding current value of the electric motor 83 is fluctuating, cuts out data of the section from the measurement data D2, and extracts the cut out data. The data is stored in the storage unit 160 as calculation data. The adjustment data calculation unit 122 calculates adjustment data D3 based on the calculation data.

  For example, the board assembly system 1000 may be configured so that the parallel adjustment state of each board can be determined by a remote value via a network.

Further, for example, the substrate assembly system 1000 may perform parallel adjustment once, store the adjustment value at that time in the storage unit 160, and continuously produce a large number of substrates using the adjustment value. Good. Such parallel adjustment is suitable for the production of a product whose adjustment accuracy is relatively loose (for example, a single chamfered product in which one product is obtained from one substrate).
Further, for example, the board assembly system 1000 may produce one board at a time while performing parallel adjustment every time. Such parallel adjustment is suitable for the production of a product with relatively strict adjustment accuracy (for example, a multi-cavity product that acquires a large number of products from a single substrate).

DESCRIPTION OF SYMBOLS 1 Board | substrate assembly apparatus 1a Base 1b Lower shaft 2 Upper frame 2a Upper shaft 3 Upper table 3a Upper board surface 4 Lower table 4a Lower board surface 5 Vacuum chamber 5a Upper chamber 5b Lower chamber 6 Suspension mechanism 6a Support shaft 6b Locking part 6c Hook 7 Suction mechanism 7a Suction pin 7b Suction pin pad 7a1, 7b1 Hollow part 8 Adhesive holding mechanism 8a Adhesive pin 8b Adhesive pin plate (base part)
8b1 Negative pressure chamber 8c Adhesive part 8d Vacuum suction hole 8e Gas supply means 20 Z-axis drive mechanism (first drive mechanism)
20a Ball screw shaft 20b Ball screw mechanism 20c Electric motor 20d Load cell 30 Back plate 31 Cushion seat 40 XYθ moving unit 70 Vertical movement mechanism 71, 81 Ball screw shaft 72, 82 Ball screw mechanism 73, 83 Electric motor 80 Vertical movement mechanism (first movement mechanism) (2 drive mechanism)
80a Attaching part 110 Control part 111 Height control part 112 Movement control part 113 Vacuum process control part 121 Measurement part 122 Adjustment data calculation part 123 Adjustment mode selection part 124 Change monitoring part 131 Automatic adjustment part 132 Manual adjustment part 160 Storage part 170 Speaker 180 Display unit 190 Input unit 211 Amplifier 212 Programmable logic controller (PLC)
200 Transfer device 1000 Substrate assembly system Ax1, Ax2, Ax3, Ax4 Axis D1 Setting data D2 Measurement data D3 Adjustment data D4 Accumulation measurement data K1 Upper substrate K2 Lower substrate P0 Vacuum pump mechanism P1, P2, P3 Vacuum pump Pr1 Control program

Claims (9)

A board assembly apparatus for assembling a board by bonding an upper board and a lower board;
A control device for controlling the operation of the substrate assembly apparatus,
The substrate assembly apparatus includes:
A lower table having a lower substrate surface for holding the lower substrate;
An upper table having an upper substrate surface facing the lower substrate surface;
A plurality of adhesive pins that are provided at the tip with an adhesive portion that operates vertically with respect to the upper substrate surface, and that adheres and holds the upper substrate with the adhesive portion protruding downward from the upper substrate surface;
A vacuum chamber capable of storing the lower table, the upper table, and the adhesive pin in a vacuum environment;
A first drive mechanism for vertically moving the adhesive pin and the upper table;
One or more bases to which one or more of the adhesive pins are attached;
A plurality of second drive mechanisms disposed at least at the four corners of each of the base portions, and independently moving up and down each portion of the base portions with respect to the upper substrate surface;
The controller is
A height control unit that controls the operation of each of the second drive mechanisms and defines the height of each part of the base part with respect to the upper substrate surface;
For adjustment that calculates adjustment data for the operation amount of each of the second drive mechanisms based on the timing of fluctuation of the load of each of the second drive mechanisms measured according to the descending amount of the first drive mechanism And a data calculation unit. The board assembly system according to claim 1,
The board assembly system further includes a measurement unit having a monitoring function of measuring a load of the second drive mechanism and determining a parallel state of each part of the base unit according to a load variation timing. . In the board | substrate assembly system of Claim 1 or Claim 2,
The board assembly system further includes a manual adjustment unit that adjusts an operation amount of each part of the base unit by receiving an input of a manual adjustment value. In the board | substrate assembly system as described in any one of Claims 1 thru | or 3,
The substrate assembly system further includes an automatic adjustment unit that automatically adjusts the operation amount of each part of the base unit based on the adjustment data. In the board | substrate assembly system as described in any one of Claims 1 thru | or 4,
The control device displays a selectable display of a manual adjustment mode for manually adjusting the operation amount of each part of the base part and an automatic adjustment mode for automatically adjusting the operation amount of each part of the base part. A board assembly system, wherein a screen is displayed on a display unit. The board assembly system according to claim 2,
Furthermore, it has a monitoring unit that monitors the magnitude of a change from a measurement load measured in the past or an arbitrarily set load with respect to the load of the second drive mechanism measured by the measurement unit. A board assembly system. In the board | substrate assembly system of Claim 2 or Claim 6,
The said control apparatus displays the display screen showing the process of the fluctuation | variation of the load of the said 2nd drive mechanism measured by the said measurement part on a display part, The board | substrate assembly system characterized by the above-mentioned. A lower table having a lower substrate surface for holding the lower substrate;
An upper table having an upper substrate surface facing the lower substrate surface;
A plurality of adhesive pins that are provided at the tip with an adhesive portion that operates vertically with respect to the upper substrate surface, and that adheres and holds the upper substrate with the adhesive portion protruding downward from the upper substrate surface;
A vacuum chamber capable of storing the lower table, the upper table, and the adhesive pin in a vacuum environment;
A first drive mechanism for vertically moving the adhesive pin and the upper table;
One or more bases to which one or more of the adhesive pins are attached;
A plurality of second drive mechanisms disposed at least at the four corners of each of the base portions, and independently moving up and down each portion of the base portions with respect to the upper substrate surface;
Each of the second drive mechanisms is constituted by a servo motor or a step motor that can measure a variation in current amount according to a load by a control device arranged outside. apparatus. A lower table having a lower substrate surface for holding a lower substrate; an upper table having an upper substrate surface facing the lower substrate surface; and an adhesive portion operating perpendicularly to the upper substrate surface at a tip, the upper substrate A plurality of adhesive pins for adhering and holding the upper substrate with the adhesive portion protruding downward from the surface; a vacuum chamber capable of storing the lower table, the upper table and the adhesive pins in a vacuum environment; the adhesive pins and the A first drive mechanism that moves the upper table up and down; one or more base parts to which one or more of the adhesive pins are attached; and at least four corners of each of the base parts; and the upper substrate And a plurality of second drive mechanisms for independently moving each part of the base part up and down with respect to a surface. A substrate loading step was carrying a substrate to adhesive holding the substrate with the adhesive portion of the adhesive pin between,
Evacuation step of exhausting the air in the vacuum chamber to the outside to bring the vacuum chamber into a vacuum environment; and
The operation of each of the second drive mechanisms is controlled to define the height of each part of the base portion relative to the upper substrate surface, and the adhesive pins and the upper table are moved by the first drive mechanism. A pressurization / measurement step of measuring the load of the second drive mechanism while pressing the substrate toward the lower table by lowering;
For adjustment that calculates adjustment data for the operation amount of each of the second drive mechanisms based on the timing of fluctuation of the load of each of the second drive mechanisms measured according to the descending amount of the first drive mechanism And a data calculating step.

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