KR20170001556A - 브레이크 장치 및 브레이크 방법 - Google Patents
브레이크 장치 및 브레이크 방법 Download PDFInfo
- Publication number
- KR20170001556A KR20170001556A KR1020160031904A KR20160031904A KR20170001556A KR 20170001556 A KR20170001556 A KR 20170001556A KR 1020160031904 A KR1020160031904 A KR 1020160031904A KR 20160031904 A KR20160031904 A KR 20160031904A KR 20170001556 A KR20170001556 A KR 20170001556A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- guide bar
- scribe line
- region
- impact
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/08—Means for actuating the cutting member to effect the cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/20—Cutting beds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/02—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of stacked sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-128813 | 2015-06-26 | ||
JP2015128813A JP6540272B2 (ja) | 2015-06-26 | 2015-06-26 | ブレイク装置及びブレイク方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20170001556A true KR20170001556A (ko) | 2017-01-04 |
Family
ID=57651278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160031904A KR20170001556A (ko) | 2015-06-26 | 2016-03-17 | 브레이크 장치 및 브레이크 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6540272B2 (zh) |
KR (1) | KR20170001556A (zh) |
CN (1) | CN106277738B (zh) |
TW (1) | TWI689984B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6949371B2 (ja) * | 2017-12-15 | 2021-10-13 | 三星ダイヤモンド工業株式会社 | 基板分断装置 |
CN108947228B (zh) * | 2018-07-24 | 2021-04-02 | 宿迁市恒胜装饰工程有限公司 | 一种浮法玻璃分片装置 |
JP7228883B2 (ja) | 2019-01-30 | 2023-02-27 | 三星ダイヤモンド工業株式会社 | 分断方法およびブレイク方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010159187A (ja) | 2009-01-09 | 2010-07-22 | Epson Imaging Devices Corp | 基板ブレイク方法、基板ブレイク装置及びブレイクバー |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3495436B2 (ja) * | 1994-11-11 | 2004-02-09 | 三洋電機株式会社 | 表示パネルの加工方法及び加工装置 |
JP2001166699A (ja) * | 1999-12-09 | 2001-06-22 | Toyota Autom Loom Works Ltd | 貼り合わせガラスパネルの不要部除去方法及び装置 |
JP5284726B2 (ja) * | 2008-08-29 | 2013-09-11 | 三星ダイヤモンド工業株式会社 | 脆性材料ブレーク装置 |
JP2010111534A (ja) * | 2008-11-05 | 2010-05-20 | Sharp Corp | 基板切断方法および基板切断装置 |
JP5187366B2 (ja) * | 2010-08-31 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | 基板ブレーク装置 |
JP5156085B2 (ja) * | 2010-12-13 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | 貼り合せ基板の分断方法 |
US8842254B2 (en) * | 2010-12-17 | 2014-09-23 | Japan Display West Inc. | Liquid crystal display panel and manufacturing method for the same |
JP6163341B2 (ja) * | 2013-04-02 | 2017-07-12 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6140012B2 (ja) * | 2013-07-08 | 2017-05-31 | 三星ダイヤモンド工業株式会社 | 貼り合わせ基板のブレイク方法 |
-
2015
- 2015-06-26 JP JP2015128813A patent/JP6540272B2/ja active Active
-
2016
- 2016-03-17 KR KR1020160031904A patent/KR20170001556A/ko not_active Application Discontinuation
- 2016-04-21 TW TW105112472A patent/TWI689984B/zh active
- 2016-05-13 CN CN201610319916.2A patent/CN106277738B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010159187A (ja) | 2009-01-09 | 2010-07-22 | Epson Imaging Devices Corp | 基板ブレイク方法、基板ブレイク装置及びブレイクバー |
Also Published As
Publication number | Publication date |
---|---|
TW201701342A (zh) | 2017-01-01 |
TWI689984B (zh) | 2020-04-01 |
JP6540272B2 (ja) | 2019-07-10 |
CN106277738A (zh) | 2017-01-04 |
CN106277738B (zh) | 2021-01-15 |
JP2017013239A (ja) | 2017-01-19 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |