KR20170001555A - 은합금 물질 및 상기 은합금 물질의 제조 방법 - Google Patents

은합금 물질 및 상기 은합금 물질의 제조 방법 Download PDF

Info

Publication number
KR20170001555A
KR20170001555A KR1020160014957A KR20160014957A KR20170001555A KR 20170001555 A KR20170001555 A KR 20170001555A KR 1020160014957 A KR1020160014957 A KR 1020160014957A KR 20160014957 A KR20160014957 A KR 20160014957A KR 20170001555 A KR20170001555 A KR 20170001555A
Authority
KR
South Korea
Prior art keywords
silver
alloy material
silver alloy
indium
gold
Prior art date
Application number
KR1020160014957A
Other languages
English (en)
Korean (ko)
Inventor
레이먼드 왕
씨. 리 친
Original Assignee
레이먼드 왕
레이샤인 포토닉스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 레이먼드 왕, 레이샤인 포토닉스 코포레이션 filed Critical 레이먼드 왕
Publication of KR20170001555A publication Critical patent/KR20170001555A/ko

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09Mixtures of metallic powders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0466Alloys based on noble metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Adornments (AREA)
  • Conductive Materials (AREA)
KR1020160014957A 2015-06-25 2016-02-05 은합금 물질 및 상기 은합금 물질의 제조 방법 KR20170001555A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW104120478 2015-06-25
TW104120478A TWI535865B (zh) 2015-06-25 2015-06-25 一種銀合金材料及其製作方法

Publications (1)

Publication Number Publication Date
KR20170001555A true KR20170001555A (ko) 2017-01-04

Family

ID=56755747

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160014957A KR20170001555A (ko) 2015-06-25 2016-02-05 은합금 물질 및 상기 은합금 물질의 제조 방법

Country Status (5)

Country Link
US (1) US20160376684A1 (zh)
JP (1) JP2017008408A (zh)
KR (1) KR20170001555A (zh)
DE (1) DE102016103503A1 (zh)
TW (1) TWI535865B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107619920B (zh) * 2017-10-25 2019-03-19 无锡日月合金材料有限公司 一种银基焊料环片的定型方法
CN109943745A (zh) * 2019-04-29 2019-06-28 邵明战 一种抗变色银合金及其制备方法
CN113070602A (zh) * 2021-04-12 2021-07-06 常熟理工学院 一种高力学性能的In-Ag复合钎料及其制备方法
CN115948675A (zh) * 2022-12-06 2023-04-11 合肥矽格玛应用材料有限公司 一种键合银丝的三元配方及制备方法
CN118478139A (zh) * 2024-05-27 2024-08-13 上海富乐华半导体科技有限公司 一种基于银烧结用Ag-In复合焊片连接体及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2157933A (en) * 1938-08-06 1939-05-09 Mallory & Co Inc P R Silver-indium contact
US4052531A (en) 1975-08-14 1977-10-04 Eutectic Corporation Indium-containing silver-copper-zinc brazing alloy
JPS5266953A (en) * 1975-12-01 1977-06-02 Alps Electric Co Ltd Electric contact alloy
DE3822966C2 (de) * 1988-07-07 1993-09-30 Degussa Verwendung einer Silberlegierung als Lot zum direkten Verbinden von Keramikteilen
US5558833A (en) * 1995-06-09 1996-09-24 Zamojski; Marek R. Silver alloy
JP3025245B1 (ja) * 1998-11-04 2000-03-27 株式会社日本ゲルマニウム研究所 装身具用銀合金および装身具
DE10327336A1 (de) 2003-06-16 2005-01-27 W. C. Heraeus Gmbh & Co. Kg Legierung und deren Verwendung
JPWO2005056848A1 (ja) * 2003-12-10 2007-07-05 田中貴金属工業株式会社 反射膜用の銀合金
TWI404809B (zh) 2009-09-23 2013-08-11 Univ Nat Pingtung Sci & Tech 特殊複合合金組成物
CN102214630A (zh) * 2011-05-18 2011-10-12 苏州衡业新材料科技有限公司 银基微合金键合丝及其制备方法
CN102312120A (zh) 2011-09-01 2012-01-11 王一平 耐电迁移银铟合金键合丝及其制备方法

Also Published As

Publication number Publication date
US20160376684A1 (en) 2016-12-29
TWI535865B (zh) 2016-06-01
JP2017008408A (ja) 2017-01-12
DE102016103503A1 (de) 2016-12-29
TW201700737A (zh) 2017-01-01

Similar Documents

Publication Publication Date Title
KR20170001555A (ko) 은합금 물질 및 상기 은합금 물질의 제조 방법
US20210167034A1 (en) Chip arrangements
TWI508204B (zh) High-speed signal line with bonding wire
US8101123B2 (en) Composite alloy bonding wire and manufacturing method thereof
US20060113683A1 (en) Doped alloys for electrical interconnects, methods of production and uses thereof
KR20150024441A (ko) 고온 납 프리 땜납 합금
JP6423447B2 (ja) 亜鉛を主成分として、アルミニウムを合金化金属として含む鉛フリー共晶はんだ合金
CN104103616B (zh) 高速信号线用接合线
JP2000197988A (ja) 無鉛はんだ合金
JP5490258B2 (ja) 無鉛はんだ合金、半導体装置、および半導体装置の製造方法
JP5541440B2 (ja) 合金線およびその製造方法
JP4401754B2 (ja) 熱電変換モジュールの製造方法
KR20040035863A (ko) 고온 무연 땜납용 조성물, 방법 및 장치
KR101513494B1 (ko) 무연 솔더, 솔더 페이스트 및 반도체 장치
CN106319276A (zh) 一种银合金材料及其制备工艺
CN109570813B (zh) 焊料合金和使用其的接合结构体
US7644855B2 (en) Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
JP6887183B1 (ja) はんだ合金および成形はんだ
KR102221859B1 (ko) 솔더링용 저융점 고연성 무연합금 및 이의 용도
KR20160107005A (ko) 저융점 무연 솔더
JP2021502258A (ja) 電子用途のコスト効率の良い鉛フリーはんだ合金
JP2005161397A (ja) はんだおよびその製造方法
KR101549810B1 (ko) 무연 솔더 및 그를 포함하는 반도체 부품
JP2009148832A (ja) 高温鉛フリーハンダ用組成物、方法およびデバイス
Chachula et al. Interaction of BiAg11 solder with Cu, Ag and Ni substrates

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application