KR20160134529A - An in-line type manufacturing system for organic light emitting device, manufacturing method, organic layer device and donor substrate - Google Patents

Abstract

The present invention relates to an in-line manufacturing system for an organic light emitting device. According to the present invention, the in-line manufacturing system for the organic light emitting device processes an organic film deposition process using a Joule heating manner. To this end, the in-line manufacturing system for the organic light emitting device deposits an organic film on an element substrate using two donor substrates. The in-line manufacturing system for the organic light emitting device includes a deposition apparatus in which a first donor substrate or the element substrate coated with the organic film is inputted to be safely seated while facing a second donor substrate formed thereon with a conductive film. The deposition apparatus applies an electric field to the conductive film of the first donor substrate coated with the organic film to generate Joule heat, for depositing the organic film coated on the first donor substrate onto the second donor substrate, and applies the electric field to the conductive film of the second donor substrate deposited thereon with the organic film to generate the Joule heat, for depositing the organic film deposited on the second donor substrate onto the element substrate. According to the present invention, the organic film is deposited on the element substrate by using the first and second donor substrates in the Joule heating manner and the deposition is repeatedly processed, so that loss of an organic matter is reduced, and a processing time is shortened.

Description

TECHNICAL FIELD [0001] The present invention relates to an in-line manufacturing system, an in-line manufacturing method, an organic film device, and a donor substrate set for an organic light-

The present invention relates to an in-line manufacturing system, an in-line manufacturing method, an organic film device, and a donor substrate set of an organic light emitting device, more specifically, to assure uniformity of a deposited organic film, In order to improve the productivity by reducing the TACT time, an in-line manufacturing system of an organic light emitting device for depositing an organic film layer on an element substrate using two donor substrates and an organic film deposition process, an inline manufacturing method, Donor substrate set.

Among the flat panel display devices, the organic light emitting display device has a response speed of 1 ms or less and has a high response speed, low power consumption, and self light emission, so there is no problem with the viewing angle, . In addition, since it can be manufactured at a low temperature and the manufacturing process is simple based on the existing semiconductor process technology, it is attracting attention as a next generation flat panel display device. In addition, since the organic layer used in the organic light emitting display device emits light by itself, it can be used in an OLED lighting device by applying an electric field to the upper and lower ends of the multi-layer organic film after the entire deposition. OLED lighting is a point light source, while LED light is a point light source.

The formation of the organic thin film in the organic light emitting display device and OLED lighting manufacturing process can be broadly classified into a polymer type device using a wet process and a low molecular type device using a deposition process depending on the materials and processes used. For example, in the case of an inkjet printing method among the methods of forming a polymer or a low molecular weight light emitting layer, the materials of the organic layers other than the light emitting layer are limited, and there is a need to form a structure for inkjet printing on the substrate. When a light emitting layer is formed by a vapor deposition process, a separate metal mask is used. In a metal mask, the size of the metal mask must be increased as the size of the flat panel display increases. At this time, There is a problem that it is difficult to manufacture a large-sized device.

On the other hand, a technique of forming an organic light emitting layer by using line heating has already been disclosed. In this technique, an organic light emitting layer is first formed on a donor substrate, and then the donor substrate and the element substrate are positioned to face each other. Then, the row heat is heated on the donor substrate to deposit an organic light emitting layer formed on the donor substrate as an element substrate.

However, the technique of forming the organic light emitting layer using the row heating has a problem in that the process time (TACT time) increases due to the addition of unnecessary processes such as the inversion of the donor substrate or the device substrate.

Korean Patent Registration No. 10-1405502 (Published on June 27, 2014) Korean Registered Patent No. 10-1169002 (Published on July 26, 2012) Korean Registered Patent No. 10-1169001 (public date July 26, 2012) Korean Patent Laid-Open Publication No. 10-2012-0129507 (public date November 28, 2012

It is an object of the present invention to provide an in-line manufacturing system for an organic light emitting device that deposits an organic film on an element substrate using two donor substrates to process an organic film deposition process using a row heating method, And a donor substrate set.

Another object of the present invention is to provide an in-line manufacturing system, an in-line manufacturing method, an organic film device, and a donor substrate set of an organic light emitting device, in order to ensure uniformity of a deposited organic film and reduce loss of organic matter.

It is still another object of the present invention to provide an in-line manufacturing system, an in-line manufacturing method, an organic film device, and a donor substrate set of an organic light emitting device, in order to shorten the processing time.

According to an aspect of the present invention, there is provided an in-line manufacturing system for an organic light emitting diode, comprising: a first coating apparatus for coating a first organic material on a donor substrate for a first organic material; A second coating apparatus for coating the second organic material on the donor substrate for the second organic material; And the first organic material can be deposited on the element substrate by applying an electric field to the transferred first organic material donor substrate in association with the first coating apparatus and the second coating apparatus, And a deposition apparatus capable of depositing the second organic material on the device substrate by applying an electric field to the device substrate.

According to another aspect of the present invention, there is provided a donor substrate for a first organic material, comprising: a first donor substrate installed in the first coating apparatus so that the first organic material can be coated with a first solution; And a second donor substrate mounted on the deposition apparatus such that the first organic material coated with the first donor substrate is applied with an electric field to the first donor substrate.

According to the present invention, there is further provided an n-th coating apparatus (n is a positive integer) for coating an n-th organic material on a donor substrate for a n-th organic material, wherein the deposition apparatus is connected to the n-th coating apparatus , An element substrate for transferring the element substrate from the n-th position to the n + 1-th position can be deposited on the element substrate transferred to the n-th position by applying an electric field to the transferred donor substrate for the n-th organic substance Device. ≪ / RTI >

According to the present invention, it is also preferred that n comprises at least one of from 1 to 4, and the first coating apparatus comprises a HIL coating chamber spray coating the HIL organic material, and the second coating apparatus comprises HTL organic material Wherein the third coating apparatus comprises an EML coating chamber for spray coating the EML organic material and the fourth coating apparatus comprises an ETL coating chamber for spray coating the ETL organics .

Further, according to the present invention, the n may include any one of 1 to 5, and the fifth coating apparatus may include an EIL coating chamber for spray coating an EIL organic material.

According to the present invention, the EML coating chamber may coat an EML organic material on a first donor substrate for an EML organic material, and the deposition apparatus may further comprise an electric field applying means for applying an electric field to the first donor substrate for the EML organic material transferred by the donor substrate transfer device The EML organic material may be deposited on the second donor substrate for EML organic material, and the EML organic material may be deposited on the device substrate by applying an electric field to the second donor substrate for EML organic material.

According to the present invention, the first donor substrate for EML organic material may be installed in the EML coating chamber upwardly and horizontally transported by the donor substrate transporting device, and the second donor substrate for EML organic material may have a first height And may be lowered to a second height by a driving unit so as to be spaced apart from the first donor substrate for EML organic material horizontally transported by the evaporation unit by a first distance, And can be installed downwardly below the second donor substrate.

According to the present invention, the first donor substrate for EML organic material includes an unpatterned rectangular thin film layer having no pattern formed on the heat transfer layer, and the second donor substrate for EML organic material has a pattern formed on the heat transfer layer Or a patterned rectangular thin film layer on which a barrier rib layer having a pattern formed on the heat transfer layer is formed.

According to another aspect of the present invention, there is provided a coating apparatus for coating a first organic material on a first donor substrate for a first organic material, the deposition apparatus including a first donor substrate for the first organic material, The first organic material may be deposited on the second donor substrate for the first organic material and the first organic material may be deposited on the device substrate by applying an electric field to the second donor substrate for the first organic material.

According to another aspect of the present invention, there is provided a deposition apparatus including: a deposition chamber capable of forming a vacuum environment therein; A first power supply unit installed at one side of the deposition chamber and capable of applying an electric field to the first donor substrate; And a second power supply unit installed on the other side of the deposition chamber and capable of applying an electric field to the second donor substrate.

According to another aspect of the present invention, there is provided a deposition apparatus including: a deposition chamber having a charging port formed at a front end thereof, a discharge port formed at a rear end thereof, and a long side of the deposition chamber so as to be connected to the first coating device and the second coating device, And a communication type rectangular chamber in which a partition or gate having a communication hole therein is provided.

In addition, according to the present invention, the first coating apparatus may include: a first side coating chamber installed in a first width direction with respect to a longitudinal direction of the deposition apparatus; And a second lateral coating chamber installed in a second width direction with respect to the longitudinal direction of the deposition apparatus.

In addition, the inline manufacturing system of an organic light emitting device according to the present invention may further comprise: a loading device for loading the device substrate to a first position of the deposition device; An unloading device for unloading the element substrate from the deposition apparatus; And a controller capable of applying control signals to the first coating apparatus, the second coating apparatus, the deposition apparatus, the loading apparatus, and the unloading apparatus.

According to another aspect of the present invention, there is provided an inline manufacturing system for an organic light emitting diode, the apparatus including: a first electrode forming apparatus, disposed between the loading apparatus and the deposition apparatus, for forming a first electrode layer on the element substrate;

The inline manufacturing system of the organic light emitting device according to the present invention may further include a second electrode forming apparatus provided between the deposition apparatus and the unloading apparatus and forming a second electrode layer on the element substrate .

The inline manufacturing system of the organic light emitting device according to the present invention may further include an encapsulation device installed between the second electrode forming device and the unloading device and sealing the device substrate.

According to the present invention, the first coating apparatus further comprises: a first coating chamber; A spray device installed in the first coating chamber for spray coating the first organic material onto the donor substrate for the first organic material; A curing device for curing the first organic material coated on the donor substrate for the first organic material by a baking plate or a light irradiation device; And a donor substrate transfer device for transferring the donor substrate for the first organic material to the deposition apparatus.

Further, according to the present invention, the first coating chamber may be a load-lock chamber spraying chamber capable of forming a vacuum environment after spray coating.

According to the present invention, the spray device may be a vacuum spray device capable of spray coating the first organic material in a vacuum environment.

Further, according to the present invention, a load lock chamber may be provided between the deposition apparatus and the first coating apparatus or between the loading apparatus and the deposition apparatus.

Further, according to the present invention, the load lock chamber may be a vertically-loadable load lock chamber capable of vertically stacking a plurality of the element substrates on a tray.

According to the present invention, the first donor substrate for the first organic material or the aligning device for aligning the element substrate can be provided on at least one of the first coating apparatus and the deposition apparatus.

Further, according to the present invention, the alignment device may include a multi-axis alignment device capable of multi-axis alignment.

According to another aspect of the present invention, there is provided an inline manufacturing system for an organic light emitting diode, comprising: a first coating apparatus for coating a first organic material on a first donor substrate for a first organic material; A second coating apparatus for coating a second organic material on a first donor substrate for a second organic material; An electric field is applied to the first donor substrate for the first organic substance, which is connected to the first coating device and the second coating device and transferred by the donor substrate transfer device, to transfer the first organic substance to the second organic donor substrate And a deposition apparatus capable of depositing the second organic material on a second donor substrate for a second organic material by applying an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device; A loading device for loading an element substrate into a first position of the deposition apparatus; An element substrate transfer device installed in the deposition apparatus, for transferring the element substrate from the first position to the second position; An unloading device for unloading the element substrate from the deposition apparatus; And a control unit capable of applying control signals to the first coating apparatus, the second coating apparatus, the deposition apparatus, the loading apparatus, the element substrate transfer apparatus, and the unloading apparatus, The deposition apparatus may be configured such that an electric field is applied to the first donor substrate for the first organic substance to deposit the first organic substance on the element substrate positioned at the first position and an electric field is applied to the second donor substrate for the second organic substance The second organic material may be deposited on the first organic material of the device substrate located in the second location.

According to another aspect of the present invention, there is provided an inline manufacturing system for an organic light emitting diode, comprising: a first coating apparatus for coating a first organic material on a first donor substrate for a first organic material; A second coating apparatus for coating a second organic material on a first donor substrate for a second organic material; An electric field is applied to the first donor substrate for the first organic substance, which is connected to the first coating device and the second coating device and transferred by the donor substrate transfer device, to transfer the first organic substance to the second organic donor substrate And a deposition apparatus capable of depositing the second organic material on a second donor substrate for a second organic material by applying an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device; An element substrate transfer device installed in the deposition apparatus and transferring the element substrate from the first position to the second position; And a control unit capable of applying a control signal to the first coating apparatus, the second coating apparatus, the deposition apparatus, and the element substrate transfer apparatus, wherein the deposition apparatus includes: Applying an electric field to the donor substrate to deposit the first organic material on the device substrate positioned at the first location and applying an electric field to the second donor substrate for the second organic material to transfer the second organic material to the second location Can be deposited on the first organic material of the device substrate being located.

According to another aspect of the present invention, there is provided an in-line manufacturing system for an organic light emitting diode, comprising: a first coating apparatus for coating a first organic material on a donor substrate for a first organic material; A second coating apparatus for coating the second organic material on the donor substrate for the second organic material; The first organic material may be deposited on the element substrate by using the joule heat of the first organic material donor substrate connected to the first coating apparatus and the second coating apparatus and transferred by the donor substrate transfer apparatus, A deposition apparatus capable of depositing the second organic material on the device substrate using joule heat of the second organic material donor substrate transferred by the substrate transfer device; A loading device for loading an element substrate into a first position of the deposition apparatus; An element substrate transfer device installed in the deposition apparatus, for transferring the element substrate from the first position to the second position; An unloading device for unloading the element substrate from the deposition apparatus; And a control unit capable of applying control signals to the first coating apparatus, the second coating apparatus, the deposition apparatus, the loading apparatus, the element substrate transfer apparatus, and the unloading apparatus .

According to another aspect of the present invention, there is provided an in-line manufacturing system for an organic light emitting diode, comprising: a first organic material coated on a donor substrate for a first organic material; and a second organic material coated on the donor substrate for a second organic material A coating chamber; The first organic material can be deposited on the device substrate by applying an electric field to the donor substrate for the first organic material and the second organic material can be deposited on the device substrate by applying an electric field to the donor substrate for the second organic material, A deposition apparatus capable of depositing on an element substrate; A loading device for loading the element substrate into the deposition apparatus; An unloading device for unloading the element substrate from the deposition apparatus; And a control unit capable of applying control signals to the coating chamber, the deposition apparatus, the loading apparatus, and the unloading apparatus.

According to an aspect of the present invention, there is provided an in-line manufacturing system for an organic light emitting diode, comprising: a first donor substrate for a first organic material; a first liquid body obtained by mixing a volatile medium and a first organic material; A first coating device for volatilizing the volatile medium; A second coating device for coating a second liquid material mixed with a volatile medium and a second organic material on a first donor substrate for a second organic material in a plane and volatilizing the volatile medium; And applying an electric field to the first donor substrate for the first organic material, which is associated with the first coating device and the second coating device and transferred by the donor substrate transfer device, to transfer the first organic material to a second donor- The second organic material can be deposited on the surface of the second organic material donor substrate by applying an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device Wherein the deposition apparatus is configured to apply an electric field to the second donor substrate for the first organic substance to deposit the first organic substance on the element substrate and to apply an electric field to the second donor substrate for the second organic substance The second organic material may be deposited on the first organic material of the device substrate.

According to an aspect of the present invention, there is provided an in-line manufacturing method of an organic light emitting diode, including: a first coating step of coating a first organic material on a first donor substrate for a first organic material; A second coating step of coating a second organic material on the donor substrate; a second coating step of coating an electric field on the first donor substrate for the first organic material, which is connected to the first coating device and the second coating device, A second donor substrate for a first organic material to deposit the first organic material on a second donor substrate for a first organic material, and a second donor substrate for transferring an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device And a second donor substrate preparation step for depositing the second organic material on a second donor substrate for a second organic material; A loading step of loading an element substrate into a first position of the deposition apparatus; A first organic material deposition step of applying an electric field to the first organic material donor substrate to deposit the first organic material on the device substrate positioned at the first location; An element substrate transfer step of transferring the element substrate from the first position to the second position; A second organic material deposition step of applying an electric field to the second organic material donor substrate to deposit the second organic material on the first organic material of the device substrate located at the second location; And an unloading step of unloading the element substrate from the deposition apparatus.

In order to solve the above-mentioned problems, an organic film device according to the present invention may be manufactured by an in-line manufacturing method of the organic light emitting device.

According to another aspect of the present invention, there is provided a donor substrate set for manufacturing an organic light emitting diode, comprising: a first base layer; a first base layer formed on the first base layer, A first donor substrate formed on the first base layer so that an electric field can be applied to the first heat transfer layer and the first heat transfer layer, and a first conductive layer electrically connected to the first heat transfer layer is formed; And a second base layer formed on the second base layer, wherein the first organic material coated on the first donor substrate by applying an electric field to the first donor substrate is formed on the second base layer, And a second donor substrate having a second heat transfer layer corresponding to the first heat transfer layer and a second conductive layer electrically connected to the second heat transfer layer so that an electric field can be applied to the second heat transfer layer, .

As described above, the in-line manufacturing system, the in-line manufacturing method, the organic film device, and the donor substrate set of the organic light-emitting device of the present invention are characterized in that the organic film deposition process is performed using two donor substrates and device substrates, The uniformity of the film can be ensured and the loss of organic matter can be prevented.

In addition, the in-line manufacturing system, the in-line manufacturing method, the organic film device and the donor substrate set of the organic light emitting device of the present invention process the organic film deposition process using two donor substrates and device substrates, And the process time can be reduced.

In addition, the in-line manufacturing system, the in-line manufacturing method, the organic film device, and the donor substrate set of the organic light-emitting device of the present invention can reduce the loss of organic matter by forming an organic film on the donor substrate by a wet process.

The in-line manufacturing system, the in-line manufacturing method, the organic film device, and the donor substrate set of the organic light emitting device of the present invention can be easily implemented in a plant by forming the coating chamber, the load lock chamber, The manufacturing cost can be reduced, and the process time can be shortened.

FIG. 1 is a block diagram showing a schematic configuration of an in-line manufacturing system of an organic light emitting device using row heating according to an embodiment of the present invention.
2 is a cross-sectional view showing the configuration of the coating apparatus shown in Fig.
3 is a cross-sectional view showing the configuration of the deposition apparatus shown in FIG.
FIG. 4 is a cross-sectional view illustrating a structure in which the fixing unit is lowered in the deposition apparatus shown in FIG. 3 so that the first donor substrate and the second donor substrate are spaced apart from each other by a predetermined distance.
FIG. 5 is a cross-sectional view illustrating a configuration in which, in the deposition apparatus shown in FIG. 3, an element substrate is introduced into a deposition chamber by a transfer device and then is lowered and spaced apart from the second donor substrate by a predetermined distance.
FIG. 6 is a cross-sectional view showing a configuration having a side support portion on a side of a deposition chamber in the deposition apparatus shown in FIG. 3 according to another embodiment.
FIG. 7 is a cross-sectional view illustrating a structure including a support portion and a center support portion provided on a fixed stage in the deposition apparatus shown in FIG. 3 according to another embodiment.
FIG. 8A is a plan view showing an embodiment of a center support in the deposition apparatus shown in FIG. 7; FIG.
8B is a plan view showing another embodiment of the center support in the deposition apparatus shown in FIG.
9 is a flowchart illustrating an in-line manufacturing method of an organic light emitting diode according to an embodiment of the present invention.
10 is a plan view showing a schematic configuration of an in-line manufacturing system of an organic light emitting diode using line heating according to another embodiment of the present invention.
11 is a cross-sectional view showing the configuration of the coating apparatus shown in Fig.
12 is a cross-sectional view showing the configuration of the deposition apparatus shown in FIG.
13 is a cross-sectional view illustrating a configuration in which the fixing unit is lowered in the deposition apparatus shown in FIG. 12 to arrange the second donor substrate and the first donor substrate so as to be spaced apart from each other by a predetermined distance and to perform the first deposition.
FIG. 14 is a cross-sectional view illustrating a configuration in which an element substrate is inserted into a deposition chamber by a transfer device in the deposition apparatus shown in FIG. 13;
FIG. 15 is a cross-sectional view illustrating a structure in which the second donor substrate is lowered in the deposition apparatus shown in FIG. 14 and is disposed apart from the element substrate by a predetermined distance to perform secondary deposition.
FIG. 16 is an enlarged cross-sectional view enlarging and showing an example of a first donor substrate in the deposition apparatus shown in FIG. 12;
FIG. 17 is an enlarged cross-sectional view enlarging and showing an example of a second donor substrate in the vapor deposition apparatus shown in FIG. 14;
18 is a plan layout view showing a schematic configuration of an inline manufacturing system of an organic light emitting diode using line heating according to another embodiment of the present invention.
19 is a cross-sectional view showing another example of the load lock chamber of Fig.
Fig. 20 is a cross-sectional view showing another example of the deposition apparatus of Fig. 12;
21 is a cross-sectional view illustrating an organic light emitting device manufactured by an in-line manufacturing method of an organic light emitting device according to an embodiment of the present invention.
22 is a flowchart showing an in-line manufacturing method of an organic light emitting diode according to another embodiment of the present invention.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 9 attached hereto.

FIG. 1 is a view showing a schematic configuration of an in-line manufacturing system of an organic light emitting device using line heating according to the present invention, FIG. 2 is a view showing the configuration of the coating apparatus shown in FIG. 1, FIG. 4 is a view illustrating a structure in which the fixing unit is lowered in the deposition apparatus shown in FIG. 3 so that the first donor substrate and the second donor substrate are spaced apart from each other by a predetermined distance FIG. 5 is a view illustrating a configuration in which an element substrate in a deposition apparatus shown in FIG. 3 is inserted into a deposition chamber by a transfer device and then is lowered and spaced apart from a second donor substrate by a predetermined distance. FIG. 7 is a view illustrating a configuration having a side support portion on the side of a deposition chamber in the deposition apparatus shown in FIG. 3 according to another embodiment, and FIG. 7 is a cross- FIG. 8A is a view showing an embodiment of a central support in the deposition apparatus shown in FIG. 7, and FIG. 8B is a cross-sectional view of the deposition apparatus shown in FIG. 7 FIG. 5 is a view showing another embodiment of the center support in the deposition apparatus. FIG.

Referring to FIG. 1, the in-line manufacturing system 100 of the organic light emitting diode of the present invention can ensure the uniformity of an organic film when manufacturing a large-sized organic light emitting display (OLED) An organic film deposition process such as a row heating method in order to deposit an organic film on an element substrate using first and second donor substrates made of glass, ceramic or plastic, for example, to reduce the loss of organic matter and shorten the processing time Lt; / RTI >

The inline manufacturing system 100 of the organic light emitting diode of the present invention includes a coating apparatus 110 for coating an organic film on a first donor substrate 200 and a first donor substrate 200 coated with an organic substance, A load lock chamber 130 for loading or discharging the droplet from the deposition apparatus 150 and an organic film coated on the first donor substrate 200 using a line heating method, And a control unit 102 for controlling the overall operation of the inline manufacturing system 100 of the organic light emitting device.

The controller 102 controls the coating apparatus 110, the load lock chamber 130, and the deposition apparatus 150, for example, by a notebook computer, a personal computer, a touch panel and a programmable logic controller And controls all operations of the in-line manufacturing system 100 of the organic light-emitting device. The contents of the control unit 102 will be described in detail with reference to FIG.

The inline manufacturing system 100 of the organic light emitting device of the present invention may further include first and second donor substrates 200 and 210 between the coating apparatus 110 and the load lock chamber 130 and the deposition apparatus 150 (Not shown) for conveying the sheet. The transfer device may include a conveyor, a transfer robot, and the like.

The inline manufacturing system 100 of the organic light emitting device may further include a wet or dry type cleaning device (not shown) for removing organic matters remaining from the first donor substrate 200 on which the organic film is deposited on the element substrate 220 And a drying device (not shown) for drying the cleaned first donor substrate 200.

Here, a conductive film is formed on the first and second donor substrates in order to generate heat in the subsequent deposition process. The conductive film is formed of, for example, a metal or a metal alloy, and is formed in the same shape as the pattern of the organic film to be laminated on the element substrate. Such a conductive film is for applying an electric field to an electrode to generate heat of line, and evaporating the organic film through the generated line heat to deposit an organic film on the second donor substrate or the element substrate.

2, the coating apparatus 110 may coat the organic film by a wet process using, for example, a shower head, a spin nozzle, or the like so as to reduce the processing time and the processing cost. The coating apparatus 110 of this embodiment includes a coating chamber 112, a stage 116, at least one showerhead 118, and an organic feeder 120.

The coating chamber 112 forms an inner space for coating the organic film on the first donor substrate 200 inserted therein. The coating chamber 112 is provided with a door 114 having one side opened and closed and a first door 132 having the other side opened and closed between the load lock chambers 130. The coating chamber 112 is connected to the door 114 via a door 114, 1 donor substrate 200 is inserted. The coating chamber 112 is provided with a stage 116 on which a first donor substrate 200 is placed, and a showerhead 118 is disposed on the stage. The coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130 so as to coat the organic film on the first door substrate 200, do.

The stage 116 places the first donor substrate 200 that has been put into the coating chamber 112. The stage 116 is provided with, for example, a vacuum chuck, an electrostatic chuck, a stone quartz, or the like so that the large-size first donor substrate 200 can be seated and fixed.

The shower head 118 is provided in a spray type and injects organic matter to coat the organic material on the surface of the first donor substrate 200 that is placed on the stage 116 inside the coating chamber 112. At least one showerhead 116 is provided on top of the first donor substrate 200, corresponding to the size of the first donor substrate 200.

The organic material supply device 120 supplies the organic material to the shower head 118. In addition, the coating apparatus 110 may be provided with a recovery device (not shown) for coating the organic film on the first donor substrate 200 and recovering the remaining organic materials to the organic material supply device 120. For convenience of explanation, a spray coating apparatus using a shower head has been described, but a coating apparatus using a known wet process such as spin coating is also possible.

When the first donor substrate 200 is placed in the coating chamber 112 and is placed on the stage 116, the coating apparatus 110 supplies organic matter to the showerhead 118 from the organic matter supply apparatus 120, And spray organic matter from the showerhead 118 onto the first donor substrate 200. The injected organic material is laminated on the first donor substrate 200 to coat the organic film. At this time, the thickness of the organic layer coated on the first donor substrate 200 is sufficient to sufficiently cover the conductive layer formed on the first donor substrate 200. This is because it is possible to control the thickness of the organic film deposited on the element substrate (220 in FIG. 4) by controlling the electric field application condition applied to the electrode of the first donor substrate 200 in the deposition apparatus 150 of the subsequent process. The first donor substrate 200 coated with the organic layer is transferred to the load lock chamber 130 by the transfer device.

3, the load lock chamber 130 includes a first door 132 provided at one side thereof for receiving the first donor substrate 200 from the coating apparatus 110 and a second door 132 provided at the other side for receiving the first donor substrate 200, And a second door 134 for introducing the first donor substrate 200 and supplying the first donor substrate 200 to the deposition apparatus 150 or discharging the first donor substrate 200 from the deposition apparatus 150. Therefore, the load lock chamber 130 may be formed by depositing a first donor substrate 200 coated with an organic film on a deposition apparatus 150 or by depositing a coated organic film on a second donor substrate 210, .

Referring to FIGS. 3 to 5, the deposition apparatus 150 deposits an organic layer on the element substrate using the first and second donor substrates. The deposition apparatus 150 of this embodiment includes a deposition chamber 152, a fixing stage 154, a fixing unit 156, a driving unit 158, and a power supply unit 160.

The deposition chamber 152 deposits an organic film from the first donor substrate 200 injected from the load lock chamber 130 onto the second donor substrate 210 using a line heating method, An internal space for depositing an organic film is formed on the element substrate 220 by using a line heating method. The deposition chamber 152 is provided with a second door 134 of the load lock chamber 130 to which the first donor substrate 200 is charged and discharged and a second door 134 to which the element substrate 220 is charged / (Not shown).

The second donor substrate 210 is fixed on the fixing stage 154 with a fixing stage 154 provided to fix the second donor substrate 210 thereunder.

When the first donor substrate 200 is inserted into the deposition chamber 152, the inner space of the deposition chamber 152 is formed in the vacuum atmosphere by the second door 134 and the door 162 of the load lock chamber 130. In the deposition chamber 152, the second donor substrate 210 is fixed on the lower surface of the fixing stage 154, and the fixing unit 156, on which the first donor substrate 200 is fixed, The substrate 200 is lifted and lowered such that the second donor substrates are spaced apart by a minimum distance d. The deposition chamber 152 is sealed by the second door 134 and the door 162.

The fixed stage 154 is provided at a lower portion of the deposition chamber 152, and the second donor substrate 210 is seated and fixed. At this time, the second donor substrate 210 may be formed as a medium for depositing an organic film coated on the first donor substrate 200 on the element substrate 220 in the course of the organic film deposition process using the row heating according to the present invention. It plays a role.

The fixing portion 156 is provided at an upper portion of the deposition chamber 152 so that the lower end portion is bent to fix the first donor substrate 200 inserted from the load lock chamber 130, The first donor substrate 200 is raised and lowered by the driving unit 158 so as to maintain a minimum distance between the second donor substrates 210 in order to process the process.

At this time, the fixing portion 156 is not limited to a shape in which the lower end portion is bent so that the first donor substrate 200 can be covered, as described above, The first donor substrate 200 may be fixed from above by using a chuck such as an electrostatic chuck.

When the organic film deposition process is completed from the first donor substrate 200 to the second donor substrate 210, the first donor substrate 200 is lifted and discharged from the deposition chamber 152 through the second door 134 And is introduced into the coating apparatus 112 through the first door 132 again.

When the first donor substrate 200 is discharged from the deposition chamber 152, the element substrate 220 is transferred from the door 162 of the deposition chamber 152 to the deposition chamber 152 by the transfer device 170, And is lowered by the device 170 so as to maintain a minimum distance d with the second donor substrate 210 on which the organic film is deposited. As the transfer device 170, a conventional transfer device such as a robot arm can be used.

At this time, in order to accurately maintain the minimum distance d between the second donor substrate 210 and the element substrate 220, a side support portion 164 is provided on the side of the deposition chamber 152, as shown in FIG. can do.

7, the supporting portion is fixed to the lower portion of the deposition chamber 152, and the lower portion of the lower stage 154 is provided with the upper portion And may include a lower support portion 166 protruding and partially bent at a distal end. At this time, one or more central supports 168 may be provided on the upper portion of the fixed stage 154. 8A and 8B, the center support portion 168 may be provided in a region other than the region where the second donor substrate 210 is located, and may be provided as a continuous protrusion portion. However, May be installed.

The driving unit 158 is coupled to the upper portion of the deposition chamber 152 and receives the control unit 102 to control the fixing unit 156 to which the first donor substrate is fixed and the transfer device 170 for transferring the device substrate 220 Move it up and down.

The power supply 160 supplies power to the electrodes of the first donor substrate 200 or the second donor substrate 210 to apply an electric field. To this end, the power supply 160 contacts the conductive layers formed on the first and second donor substrates 200 and 210 to apply an electric field. At this time, the electric field application condition can be determined by various factors such as resistance, length, and thickness of the conductive film. In this embodiment, the current applied may be DC or alternating current, the electric field application may be about 1 Kw / cm2 to 1,000 Kw / cm2, and the electric field application time may be about 1 / 1,000,000 to 100 seconds.

3, when the first donor substrate 200 coated with an organic layer is charged into the deposition chamber 152 from the load lock chamber 130, the first donor substrate 200 Is fixed to the fixing portion 156 and then fixed. The deposition apparatus 150 descends the first donor substrate 200 fixed to the fixing unit 156 by the driving unit 158 so as to be adjacent to the second donor substrate 210 located on the fixed stage 154, And then power is supplied from the power supply unit 160 to the first donor substrate 200 to apply an electric field to the first donor substrate 200. The organic film coated on the first donor substrate 200 is subjected to line heating to deposit an organic film on the second donor substrate 210. That is, when an electric field is applied to the first donor substrate 200, a line heat is generated in the conductive film formed on the first donor substrate 200, And the organic film formed on the portion where the conductive film is present is evaporated by the transferred row heat and transferred to the second donor substrate 210 to deposit the organic film on the second donor substrate 210.

When the organic layer is deposited on the second donor substrate 210, the deposition unit 150 raises the fixing unit 156 by the driving unit 158 to move the second donor substrate 210 and the first donor substrate 200, And then the first donor substrate 200 is discharged to the load lock chamber 130.

5, after the device substrate 220 is put into the deposition chamber 152 by the transfer device 170 through the door 162, the device substrate 220 is lowered And is spaced apart from the second donor substrate 210 by a predetermined distance.

The deposition apparatus 150 supplies power from the power supply unit 160 to the second donor substrate 210 to apply an electric field to the second donor substrate 210, The deposited organic film is transferred onto the element substrate 220 to deposit an organic film on the element substrate 220. In this case, when an electric field is applied to the second donor substrate 210, the conductive film formed on the second donor substrate 210 generates line heat, The organic film formed on the conductive layer of the second donor substrate 210 is evaporated to deposit the organic film on the element substrate 220 and the organic film formed on the element substrate 220 The film deposition process is completed.

The deposition apparatus 150 then raises the element substrate 220 on which the organic film is deposited by the transfer device 170 and then discharges the deposition substrate from the deposition chamber 152. Then, The substrate 200 is put in, and the above-described organic film deposition process is repeatedly performed. The first donor substrate 200 discharged from the deposition apparatus 150 after the organic film deposition process is completed is cleaned and dried through the cleaning apparatus and the drying apparatus.

In this embodiment, the first donor substrate 200 or the element substrate 220 is fixedly moved to the deposition apparatus 150 by the fixing unit 156 or the transfer device 170 on the deposition chamber 152, 2 donor substrate 210 is disposed on the fixed stage 155. However, if the first donor substrate 200 or the element substrate 220 and the second donor substrate 210 are opposed to each other, And the like.

In this embodiment, the first donor substrate 200 or the element substrate 220 is moved up and down to move adjacent to the second donor substrate. Alternatively, the second donor substrate 210 may be moved to move the first donor substrate 200, And it may be adjacent to the substrate 200 or the element substrate 220.

As described above, the in-line manufacturing system 100 of the organic light emitting diode of the present invention deposits an organic film on the element substrate 220 by using the first and second donor substrates 200 and 210 in a line heating manner, By repeating the treatment, the loss of organic matter can be reduced and the processing time can be shortened.

9 is a flowchart showing an organic film deposition procedure in an inline manufacturing system of an organic light emitting device using a row heating according to the present invention. This procedure is an organic film deposition process using line heating, which is performed by the inline manufacturing system 100 of the organic light emitting device, and is processed under the control of the control unit 102 of the inline manufacturing system 100 of the organic light emitting device.

Referring to FIG. 9, in the inline manufacturing system 100 of the organic light emitting diode of the present invention, in step S300, the coating apparatus 110 coating an organic film on a first donor substrate 200 on which a conductive film is formed. In this embodiment, the organic material is supplied onto the first donor substrate 200 through the showerhead 118 to coat the organic film. The first donor substrate 200 coated with an organic layer is transferred to the load lock chamber 130 using a transfer device.

In step S310, the first donor substrate 200 coated with the organic film is loaded into the deposition apparatus 150 from the load lock chamber 130. [ The inserted first donor substrate 200 is fixed to the fixing portion 156 so as to face the second donor substrate 210 which is seated on the fixed stage 154. The first donor substrate 200 is moved adjacent to the second donor substrate 210 in the direction of the fixed stage 154 via the driving unit 158.

Power is supplied from the power supply 160 to the first donor substrate 200 to apply an electric field to the conductive film of the first donor substrate 200 in step S320. In step S330, an organic layer coated on the first donor substrate 200 to which an electric field is applied is transferred to the second donor substrate 210 to deposit an organic layer. When an organic film is deposited on the second donor substrate 210 in step S340, the first donor substrate is transferred to the load lock chamber and discharged.

In step S350, the element substrate 220 is charged into the deposition apparatus 150 by the transfer apparatus 170 using the transfer apparatus. At this time, the loaded element substrate 220 is fixedly arranged to face the second donor substrate 210 which is seated on the fixed stage 154. The element substrate 220 controls the driving unit 158 to move the transfer device 170 in the direction of the fixed stage 154 so as to be adjacent to the second donor substrate 210.

Power is supplied from the power supply 160 to the second donor substrate 210 to apply an electric field to the conductive film of the second donor substrate 200 in step S360. In step S370, the organic layer deposited on the second donor substrate 210 to which the electric field is applied is transferred to the element substrate 220 to deposit the organic layer. Subsequently, in step S380, the element substrate 220 on which the organic film is deposited is discharged from the deposition apparatus 150.

Then, the other first donor substrate 200 is loaded through the load lock chamber 130, and the above organic film deposition process steps (S300 to S380) are repeated.

FIG. 10 is a plan layout view showing a schematic configuration of an inline manufacturing system of an organic light emitting diode using line heating according to another embodiment of the present invention, and FIG. 11 is a sectional view showing the configuration of the coating apparatus shown in FIG. FIG. 12 is a cross-sectional view showing the configuration of the deposition apparatus shown in FIG. 10, FIG. 13 is a cross-sectional view of the deposition apparatus shown in FIG. 12 in which the fixing portion is lowered, and the second donor substrate and the first donor substrate are arranged FIG. 14 is a cross-sectional view showing a configuration in which the element substrate in the deposition apparatus shown in FIG. 13 is charged into the deposition chamber by the transfer apparatus, and FIG. 15 is a cross- Sectional view showing a configuration in which the second donor substrate is lowered in the evaporation apparatus and is disposed so as to be spaced apart from the element substrate by a certain distance, and secondary deposition is performed.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 10 to 15 attached hereto.

10, the in-line manufacturing system 400 of the organic light emitting diode of the present invention includes a first coating apparatus 110-1, a second coating apparatus 110-2, a third coating apparatus 110-3 And a fourth coating apparatus 110-4 and a fifth coating apparatus 110-1, and a deposition apparatus 150. The coating apparatus 110 includes a first coating apparatus 110-1 and a fourth coating apparatus 110-4.

For example, the first coating apparatus 110-1 is a device for coating a first organic material 1-1 on a donor substrate DS1 for a first organic material, and the second coating apparatus 110-1 is a device for coating a first organic material The third coating device 110-3 is a device for coating the organic material 1-2 on the donor substrate DS1 for organic material and the third organic material 1-2-3 on the donor substrate DS1 for the third organic material, The fourth coating apparatus 110-4 is a device for coating the fourth organic material 1-4 on the donor substrate DS1 for the second organic material and the fifth coating apparatus 110- 5 may be a device for coating the fifth organic material 1-5 on the donor substrate DS1 for the fifth organic material.

For example, the first coating apparatus 110-1 may include a first lateral coating chamber 110-1a disposed in a first width direction with respect to a longitudinal direction of the deposition apparatus 150, And a second lateral coating chamber 110-1b installed in a second width direction with respect to the longitudinal direction of the first lateral coating chamber 110-150.

Accordingly, since the time required for coating in the coating apparatus 110 is relatively long and the time required for deposition in the deposition apparatus 150 is relatively short, the donor substrates coated in both directions are supplied to improve the productivity And reduce the TACT time.

In addition, for example, the inline manufacturing system 400 of the organic light emitting device of the present invention includes a loading device (LD) for loading the device substrate 220 to a first position of the vapor deposition device, (UD) for unloading from the deposition apparatus and a total of ten of the coating apparatuses 110, the deposition apparatus 150, the loading apparatus (LD) and the unloading apparatus (UD) And a control unit 102 that can apply the control signal.

However, the coating apparatus 110 is not limited to a total of ten coating apparatuses, but may be an n-type coating apparatus, that is, an n-th coating apparatus for coating the n-th organic material on the donor substrate for the n-th organic material and n is a positive integer).

FIG. 11 is a sectional view showing the construction of the coating apparatus shown in FIG. 10, and FIG. 12 is a sectional view showing the construction of the deposition apparatus shown in FIG.

12, the deposition apparatus 150 is connected to the n-th coating apparatus, and the device substrate 220 transferred to the n-th position by applying an electric field to the donor substrate for the n-th organic material is deposited And the inline manufacturing system 400 of the organic light emitting device of the present invention further includes an element substrate transferring apparatus 170 capable of transferring the element substrate 220 from the n-th position to the n + 1-th position .

More specifically, for example, the n may include any one of 1 to 5, and the first coating apparatus 110-1 may include a HIL coating chamber for spray coating a HIL organic material (HIL) The second coating apparatus 110-2 includes an HTL coating chamber for spray coating an HTL organic material (HTL), and the third coating apparatus 110-3 includes an EML coating (spray coating) of EML organic material Wherein the fourth coating apparatus 110-4 comprises an ETL coating chamber for spray coating an ETL organic material ETL and the fifth coating apparatus 110-5 comprises an EIL organic material EIL, Lt; RTI ID = 0.0 > EIL < / RTI > coating chamber. Here, the HIL organic material (HTL), the HTL organic material (HTL), the EML organic material (EML), the ETL organic material (ETL) and the EIL organic material (EIL) One or more of them can be selected and applied, and the respective technical ideas are well known and detailed description is omitted.

21 is a cross-sectional view illustrating an organic light emitting device manufactured by an in-line manufacturing system of an organic light emitting device according to an embodiment of the present invention.

21, the organic light emitting device 1000 manufactured by the inline manufacturing system 400 of an organic light emitting device according to an embodiment of the present invention includes the HIL organic material (HIL), the HTL The organic light emitting layer may be formed by stacking an organic material HTL, an EML organic material ETL, an ETL organic material ETL, and an EIL organic material EIL in this order.

In this case, the EML coating chamber may include a first donor substrate for the EML organic material (EML), a second donor substrate for the EML organic material (EML), and a second donor substrate The EML organic material (EML) is coated on the substrate 200. The deposition apparatus 150 applies an electric field to the first donor substrate 200 for the EML organic material transferred by the donor substrate transfer device 180, The EML organic material (EML) is deposited on the second donor substrate 210 for the EML organic material and an electric field is applied to the second donor substrate 210 for the EML organic material, Can be deposited.

13 is a cross-sectional view illustrating a configuration in which the fixing portion is lowered in the deposition apparatus shown in FIG. 12 to arrange the second donor substrate and the first donor substrate so as to be spaced apart from each other by a predetermined distance, and FIG. 14 FIG. 15 is a cross-sectional view illustrating a structure in which a device substrate is inserted into a deposition chamber by a transfer device in a deposition apparatus in which the second donor substrate is moved downward by a certain distance from the device substrate, Sectional view illustrating the structure in which the secondary deposition is performed.

11 to 15, the first donor substrate 200 for the EML organic material may be vertically installed in the EML coating chamber and horizontally transported by the donor substrate transport device 180, and the EML The second organic donor substrate 210 is installed at a first height H1 in a downward direction and is connected to the first donor substrate 200 for EML organic material horizontally transported by the deposition apparatus 150 and a first distance d The element substrate 220 may be lowered below the second donor substrate 210 for the EML organic material and may be lowered to the second height H2 by the driving unit 158. [ have.

FIG. 16 is an enlarged cross-sectional view enlarging and showing an example of a first donor substrate in the deposition apparatus shown in FIG. 12; FIG. 17 is an enlarged cross-sectional view enlarging and showing an example of a second donor substrate in the vapor deposition apparatus shown in FIG. 14;

16, the first donor substrate 200 for an EML organic material includes an unpatterned rectangular thin film layer in which a pattern is not formed in the heat transfer layer 203, 2, the EML organic donor substrate 210 includes a patterned rectangular thin film layer 210 in which a pattern is formed on the heat transfer layer 203 or a partition wall layer W having a pattern formed on the heat transfer layer 203 is formed. . ≪ / RTI >

For example, the donor substrate DS1 for the first organic material may be formed so that the first organic material 1-1 is coated with the first solution, A first donor substrate 200 installed in the first coating apparatus 110-1 and a second donor substrate 200 applied with an electric field to the first donor substrate 200, And a second donor substrate 210 installed in the deposition apparatus 150 so that the organic material 1-1 can be deposited in a second order.

11 to 15, the first coating apparatus 110-1 is formed by mixing a volatile medium and a first organic material 1-1 with a first donor substrate 200 for a first organic material The deposition device 150 applies an electric field to the first donor substrate 200 for the first organic material transferred by the donor substrate transfer device 180 to form the first organic material The first organic material 1-1 is deposited on the first donor substrate 210 for the first organic material and an electric field is applied to the second donor substrate 210 for the first organic material, Can be deposited on the substrate 220.

The second coating apparatus 110-2 may be formed by coating a first liquid material mixed with a volatile medium and a second organic material 1-2 on a surface of a first donor substrate 200 for a second organic material, The deposition apparatus 150 applies an electric field to the first donor substrate 200 for the second organic material transferred by the donor substrate transfer device 180 to transfer the second organic material 1-2 to the second organic material 2 donor substrate 210 and an electric field is applied to the second donor substrate 210 for the second organic substance to form the second organic substance 1-1 on the second organic substance 1- 2). ≪ / RTI >

The inline manufacturing system 400 of the organic light emitting device of the present invention includes the first and second donor substrates 200 and 210 between the respective coating devices 110, the load lock chamber 130, and the deposition devices 150, (Not shown) for transporting the wafer W. The conveying apparatus may be a conveyor apparatus using a roller, a belt, a chain, or a wire, a conveying arm, a conveying robot, or the like.

11, the coating apparatus 110 may include a spray apparatus having at least one spray head 118a and an organic matter supply apparatus 120, for example, in order to reduce the processing time and the processing cost A coating chamber 112, a hardening device 119, and a donor substrate transfer device 117. [

For example, the first coating apparatus 110-1 may include a first coating chamber 112 and a second coating chamber 112 installed in the first coating chamber 112, A spray device 118a spray-coating the donor substrate DS1; a curing step of curing the first organic material 1-1 coated on the donor substrate DS1 for a first organic material by a baking plate or a light irradiation device; And a donor substrate transfer device 180 for transferring the apparatus 119 and the donor substrate DS1 for the first organic material to the deposition apparatus 150. [

Here, the first coating chamber 112 may be a load-lock chamber spraying chamber capable of forming a vacuum environment after spray coating.

The spray device 118a may be a vacuum spray device capable of spray coating the first organic material 1-1 in a vacuum environment.

The donor substrate transfer device 117 may be provided with a multi-stage transfer arm capable of extending and expanding. However, the present invention is not limited to this, and a conveyor apparatus using a roller, a belt, a chain, or a wire, a transfer arm, a transfer robot, and the like can be applied.

The coating chamber 112 forms an inner space for coating the organic film 1 on the first donor substrate 200 inserted therein. The coating chamber 112 is provided with a door 114 having one side opened and closed and a first door 132 having the other side opened and closed between the load lock chambers 130. The coating chamber 112 is connected to the door 114 via a door 114, 1 donor substrate 200 is inserted. A donor substrate transfer device 117 in which a first donor substrate 200 is mounted is disposed in a lower portion of the coating chamber 112 and an injection head 118a capable of reciprocating motion by a forward / do. The coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130 so as to coat the organic film 1 on the first door substrate 200, Thereby forming a nitrogen atmosphere.

The donor substrate transfer device 117 may be provided with a mounting table on which the first donor substrate 200 loaded in the coating chamber 112 is mounted. The seat is provided with, for example, a vacuum chuck, an electrostatic chuck, or a stone quartz so that the large-size first donor substrate 200 can be seated and fixed.

The spray head 118a is provided in a spray type so as to spray the organic material to coat the organic film 1 on the surface of the first donor substrate 200 that is seated within the coating chamber 112 on the mount table. In addition to the spray nozzles, the nozzles of the ink jet type may also be applied to the jet heads 116.

The organic material supply device 120 supplies the organic material to the injection head 118a. The coating apparatus 110 may be provided with a recovery device (not shown) for coating the organic film 1 on the first donor substrate 200 and recovering the remaining organic materials to the organic material supply device 120. For convenience of explanation, a spray coating apparatus using a spray head has been described. However, it is also possible to use a coating apparatus by a known wet process such as spin coating.

The curing device 119 is for curing the organic film 1 on the first donor substrate 200 by volatilizing the volatile medium in a mixture of the organic material and the volatile medium, and a baking plate or a light irradiation device can be applied .

The coating apparatus 110 supplies the first donor substrate 200 to the coating chamber 112 and supplies the organic material from the organic material supply apparatus 120 to the ejection head 118a. Organic matter is sprayed onto the donor substrate 200. The injected organic substances are laminated on the first donor substrate 200 to coat the organic film 1. The first donor substrate 200 coated with the organic film 1 is transferred to the deposition apparatus 150 via the donor substrate transfer device 117 via the load lock chamber 130 capable of implementing a vacuum environment.

12 to 15, the deposition apparatus 150 deposits the organic layer 1 on the element substrate 220 by using the first donor substrate 200 and the second donor substrate 210. The deposition apparatus 150 of this embodiment includes a deposition chamber 152, a fixed stage 154, a fixing unit 156, a driving unit 158, a first power supply 160-1, And a feeding device 160-2.

Here, the first power supply unit 160-1 is a unit that is installed on one side of the deposition chamber 152 and is capable of applying an electric field to the first donor substrate 200, The second donor substrate 160-2 is disposed on the other side of the deposition chamber 152 and is capable of applying an electric field to the second donor substrate 210. [

The first power supply unit 160-1 and the second power supply unit 160-2 may be integrated into one power supply unit.

12, the deposition chamber 152 is connected to the organic layer 1 by a line heating method from the first donor substrate 200, which is loaded from the load lock chamber 130, onto the second donor substrate 210, And an internal space for depositing the organic film 1 from the second donor substrate 210 onto the element substrate 220 using a line heating method is formed. As shown in FIG. 10, A partition or gate G is formed in the longitudinal direction so that one side can be connected to each of the plurality of coating apparatuses 110 and a communication hole is formed therein, And may be a communication type rectangular chamber.

The deposition chamber 152 is provided with a second door 134 of the load lock chamber 130 to which the first donor substrate 200 is charged and discharged and a charging port And a discharge port through which the substrate 220 is discharged.

The first donor substrate 200 is fixed on the lift pin L by providing a fixing portion 156 for fixing the second donor substrate 210 on the upper portion.

When the first donor substrate 200 is inserted into the deposition chamber 152, the inner space of the deposition chamber 152 is formed in the vacuum atmosphere by the second door 134 and the door 162 of the load lock chamber 130. In the deposition chamber 152, the first donor substrate 200 is placed on the lift pin L so that the first donor substrate 200 can be electrically contacted with the pad P, which can be lifted and lowered by the actuator A, As shown in the figure, the first donor substrate 200 is electrically connected to the power supply unit 160, and the fixing unit 156, on which the second donor substrate 210 is fixed, 210 and the first donor substrate 200 are spaced apart by a minimum distance d. The deposition chamber 152 is sealed by the second door 134 and the door 162.

The first donor substrate 200 is fixed to the lift pin L at a lower portion of the deposition chamber 152. At this time, the second donor substrate 210 is formed by depositing the organic film 1 coated on the first donor substrate 200 on the element substrate 220 during the organic film deposition process using the row heating according to the present invention As a medium to make.

The fixing part 156 is provided on the upper part of the deposition chamber 152 to fix the second donor substrate 210 and the second donor substrate 210 is electrically connected to the power supply unit 160 And is detachably assembled with the second donor substrate 210 by bolts, screws or the like so as to be electrically connected.

The fixing portion 156 is moved up and down by the driving portion 158 so as to maintain a minimum distance between the first donor substrate 200 and the second donor substrate 210 so as to process the organic film deposition process .

At this time, the fixing portion 156 can fix the second donor substrate 210 on the upper portion using a chuck such as an electrostatic chuck or a vacuum chuck or a magnet.

13, when the organic film deposition process is completed from the first donor substrate 200 to the second donor substrate 210, the first donor substrate 200 is transferred through the second door 134 Is discharged from the deposition chamber 152 and is introduced into the coating apparatus 112 through the first door 132 again.

14, when the first donor substrate 200 is discharged from the deposition chamber 152, the element substrate 220 is transferred from the door 162 of the deposition chamber 152 to the element substrate transfer apparatus 170 To the deposition chamber 152. In this case,

14 shows the conveyor apparatus using the rollers in FIG. 14, the present invention is not limited to this, and various conveyor apparatuses, conveying arms, conveying robots, etc. using rollers, belts, chains, Can be applied. In addition, the device substrate transfer device 170 may further include a transfer carriage or a tray for receiving the device substrate 220.

15, the element substrate 220 is positioned so as to maintain a minimum distance d from the second donor substrate 210 on which the organic film 1 is deposited. At this time, the driving unit 158 is coupled to the upper part of the deposition chamber 152, and moves the fixing unit 156, to which the second donor substrate 210 is fixed, up and down under the control of the control unit 102.

Subsequently, power is supplied from the power supply unit 160 to the second donor substrate 210 to apply an electric field to the second donor substrate 210, thereby transferring the organic film deposited on the second donor substrate 210 And transferred onto the substrate 220 to deposit an organic film on the element substrate 220. [

The first donor substrate 200 or the element substrate 220 is disposed below the deposition chamber 152 and the second donor substrate 210 is disposed above the deposition apparatus 150 However, if the first donor substrate 200 or the element substrate 220 and the second donor substrate 210 are opposed to each other, various modifications and variations are possible.

In this embodiment, the second donor substrate 210 is moved up and down to drive the first donor substrate 200 or the element substrate 220 adjacent to the first donor substrate 210 or the element substrate 220. Alternatively, It will be apparent that the movable member 220 can be moved and adjoined.

As described above, the in-line manufacturing system 100 (300) of the organic light emitting diode of the present invention can deposit the organic film on the element substrate 220 by using the first and second donor substrates 200 and 210 in a line heating manner By repeating this treatment, the loss of organic matter can be reduced and the processing time can be shortened.

FIG. 16 is an enlarged cross-sectional view enlarging and showing an example of a first donor substrate in the deposition apparatus shown in FIG. 12;

16, the first donor substrate 200 for depositing the organic film 1 described above includes a first base layer 201 and a second base layer 201 formed on the first base layer 201, A first heat transfer layer 203 in which an organic material 1-1 can be coated with a first solution and a first heat transfer layer 203 formed in the first base layer 201 so that an electric field can be applied to the first heat transfer layer 203, A first conductive layer 202 electrically connected to the first heat transfer layer 203 may be formed.

For example, the first conductive layer 202 and the first heat transfer layer 203 are both a kind of conductive film. The first conductive layer 202 includes copper, aluminum, platinum, gold, It is possible to distribute the current uniformly to the layer 203 and to transfer the current to the layer 203 or to serve as a terminal.

In addition, for example, the first heat transfer layer 203 includes components such as nickel, chromium, carbon, and quartz, which are excellent in heat conduction, and receives a current from the first conductive layer 202 to convert the current into resistance heat energy can do.

Accordingly, the first heat transfer layer 203 is heated at a time by the Joule heat, and the coated organic film 1 can be deposited on the second donor substrate 210 in a planar manner.

FIG. 17 is an enlarged cross-sectional view enlarging and showing an example of a second donor substrate in the vapor deposition apparatus shown in FIG. 14;

17, the second donor substrate 210 for depositing the organic film 1 described above includes a second base layer 211 and a second base layer 211 formed on the second base layer 211, The first heat transfer layer 203 and the second heat transfer layer 203 are formed on the first donor substrate 200 so that the first organic material 1-1 coated with the first donor substrate 200 may be secondarily deposited. A second conductive layer 212 electrically connected to the second heat transfer layer 213 may be formed so that an electric field may be applied to the corresponding second heat transfer layer 213 and the second heat transfer layer 213 .

For example, the second conductive layer 212 and the second heat conductive layer 213 are both a kind of conductive film, and the second conductive layer 212 includes copper, aluminum, platinum, gold, The layer 213 may serve as a role of distributing and delivering the current uniformly or as a terminal.

In addition, for example, the second heat transfer layer 213 includes components such as nickel, chromium, carbon, and quartz, which are excellent in heat conduction, and receives a current from the second conductive layer 212 to convert the current into resistance heat energy can do.

Thus, the second heat transfer layer 213 is heated at a time by the joule heat, through which the primary deposited organic film 1 can be secondarily deposited on the element substrate 220 in a plane.

18 is a plan layout view showing a schematic configuration of an inline manufacturing system of an organic light emitting diode using line heating according to another embodiment of the present invention.

As shown in FIG. 18, an in-line manufacturing system 500 of organic light emitting devices using line heating according to another embodiment of the present invention is installed between the loading apparatus (LD) and the deposition apparatus 150 A first electrode forming apparatus 191 for forming a first electrode layer P1 on the element substrate 220 and a second electrode forming apparatus 191 provided between the evaporating apparatus 150 and the unloading apparatus UD, A second electrode forming apparatus 192 for forming a second electrode layer P2 on the substrate 220 and a second electrode forming apparatus 192 disposed between the second electrode forming apparatus 192 and the unloading apparatus UD, And an encapsulation device 193 for encapsulating the encapsulation material C with the encapsulation material C. [

Although not shown, a reversing device capable of reversing the element substrate 220 or the donor substrates 200 and 210 may be installed between the devices, if necessary.

21, the organic film device 1000 manufactured by the in-line manufacturing system 500 or the method of the organic light emitting device according to an embodiment of the present invention is formed on the element substrate 220 from below The first electrode layer P1, the HIL organic material HIL, the HTL organic material HTL, the EML organic material ETL, the ETL organic material EIL, the second electrode layer P2 ), And the encapsulating material (C) for protecting the encapsulating material (C) from external moisture or foreign substances can be manufactured in a state of encapsulating the encapsulation material (C), thereby performing the organic luminescence function.

The organic film device 1000 may include various organic films such as various organic films, organic light emitting devices, and organic light emitting panels manufactured by the in-line manufacturing system 500 or method of the organic light emitting device according to an embodiment of the present invention All of which can be applied.

19 is a cross-sectional view showing another example of the load lock chamber of Fig.

For example, a load lock chamber 130 may be provided between the deposition apparatus 150 and the first coating apparatus 110-1 or between the loading apparatus (LD) and the deposition apparatus 150. [

As shown in FIG. 19, for example, the load lock chamber 130 may include a plurality of load lock chambers 130, Or a vertically stackable load lock chamber capable of loading the substrate 220 in the vertical direction on the tray T which can be raised and lowered by the driving unit 131. [ Therefore, the vacuum environment can be sequentially formed using the load lock chamber 130, productivity can be improved, and the process time can be shortened.

Fig. 20 is a cross-sectional view showing another example of the deposition apparatus of Fig. 12;

20, the first donor substrate 200 or the element substrate 220 for the first organic material may be deposited on at least one of the first coating apparatus 110-1 and the deposition apparatus 150, An aligning device (AL) capable of being aligned can be installed.

For example, such alignment devices may be implemented in a wide variety of alignment devices, such as various alignment pins, alignment stages, alignment protrusions, alignment grooves, or multi-axis alignment devices capable of multi-axis alignment.

22 is a flowchart showing an in-line manufacturing method of an organic light emitting diode according to another embodiment of the present invention.

As shown in FIGS. 10 and 22, the method for in-line production of an organic light emitting diode according to another embodiment of the present invention includes coating a first organic material 1-1 on a first donor substrate 200 for a first organic material A second coating step S402 for coating the second organic material 1-2 on the first donor substrate 200 for the second organic material and a second coating step S402 for coating the second organic material 1-2 on the first coating device 110- 1) and the second coating device 110-2, and applying an electric field to the first donor substrate 200 for the first organic material transferred by the donor substrate transfer device 180, 1-1) is deposited on the second organic donor substrate 210, the second organic donor substrate preparation step (S403) and the second organic donor substrate transporting step (180) 1 is a second diagram for a second organic material in which an electric field is applied to a donor substrate 200 to deposit the second organic material 1-2 on a second donor substrate 210 for a second organic material A preparation step S400 including a substrate preparation step S404; A loading step (S410) of loading the element substrate (220) to a first position of the deposition apparatus (150); A first organic material deposition step S420 for applying an electric field to the first organic material donor substrate 210 to deposit the first organic material 1-1 on the device substrate 220 located at the first location, ); An element substrate transfer step S430 for transferring the element substrate 220 from the first position to the second position; A first organic material is deposited on the first organic material (1-1) of the device substrate (220) positioned at the second location by applying an electric field to the second organic material second donor substrate (210) 2 Organic material deposition step S440; And an unloading step (S450) of unloading the element substrate 220 from the deposition apparatus 150.

The present invention is not limited to the above-described inline manufacturing system and the inline manufacturing method of the organic light emitting device described above, and can be applied to the organic light emitting device 1000 and the first donor substrate 200 and the second donor substrate 210, May be all included.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Various changes and modifications within the scope are possible.

100: In-line manufacturing system of organic light emitting device
102:
110: Coating device
130: load lock chamber
150: Deposition device
200, 210: donor substrate
220: element substrate

Claims (31)

A first coating device for coating the first organic material on the donor substrate for the first organic material;
A second coating apparatus for coating the second organic material on the donor substrate for the second organic material; And
The first organic material can be deposited on the element substrate by applying an electric field to the transferred first organic material donor substrate in association with the first coating apparatus and the second coating apparatus, A deposition apparatus capable of depositing the second organic material on the device substrate by applying an electric field;
And an inline manufacturing system for an organic light emitting device. The method according to claim 1,
The donor substrate for a first organic material may include:
A first donor substrate installed in the first coating apparatus so that the first organic material can be coated with a first solution; And
A second donor substrate disposed on the deposition apparatus such that the first organic material coated with the first donor substrate is secondarily deposited by applying an electric field to the first donor substrate;
Wherein the organic light emitting device is an organic light emitting device. The method according to claim 1,
(N is a positive integer) for coating the n-th organic material on the donor substrate for the n-th organic material,
The deposition apparatus includes:
An n-th organic compound donor substrate, an n-th organic compound donor substrate, and an n-th coating apparatus,
And an element substrate transfer device capable of transferring the element substrate from the n-th position to the n + 1-th position. The method of claim 3,
Wherein n is any one of 1 to 4,
Wherein the first coating apparatus comprises a HIL coating chamber for spray coating a HIL organic material,
Wherein the second coating apparatus comprises an HTL coating chamber for spray coating HTL organic material,
The third coating apparatus includes an EML coating chamber for spray coating an EML organic material,
Wherein said fourth coating apparatus comprises an ETL coating chamber for spray coating an ETL organics. 5. The method of claim 4,
Wherein n is an integer of 1 to 5,
Wherein said fifth coating apparatus comprises an EIL coating chamber for spray coating an EIL organic material. 6. The method of claim 5,
The EML coating chamber is formed by coating an EML organic material on a first donor substrate for EML organic material,
The deposition apparatus may further include an EML organic substance applying unit that applies an electric field to the first donor substrate for EML organic substance transferred by the donor substrate transfer device to deposit the EML organic substance on a second donor substrate for EML organic substance, And applying an electric field to deposit the EML organic material on the device substrate. The method according to claim 6,
The first donor substrate for EML organic material may be installed in the EML coating chamber in a bottom-up manner and horizontally transported by the donor substrate transport device,
The second donor substrate for EML organic material is disposed at a first height and is disposed at a second height by a driving unit so as to be spaced apart from the first donor substrate for EML organic material horizontally transported by the deposition apparatus by a first distance. Lt; / RTI >
Wherein the element substrate is installed downwardly below the second donor substrate for EML organic material. The method according to claim 6,
Wherein the first donor substrate for EML organic material comprises an unpatterned rectangular thin film layer in which no pattern is formed in the heat transfer layer,
Wherein the second donor substrate for EML organic material comprises a patterned rectangular thin film layer in which a pattern is formed on the heat transfer layer or a partition wall layer on which a pattern is formed on the heat transfer layer. The method according to claim 1,
The first coating apparatus may include coating a first organic material on a first donor substrate for a first organic material,
Wherein the deposition apparatus is configured to apply an electric field to the first donor substrate for the first organic material transferred by the donor substrate transfer device to deposit the first organic material on the second donor substrate for the first organic material, 2 An inline manufacturing system for an organic light emitting device, wherein an electric field is applied to a donor substrate to deposit the first organic material on the device substrate. 10. The method of claim 9,
The deposition apparatus includes:
A deposition chamber capable of forming a vacuum environment therein;
A first power supply unit installed at one side of the deposition chamber and capable of applying an electric field to the first donor substrate; And
A second power supply unit installed on the other side of the deposition chamber and capable of applying an electric field to the second donor substrate;
And an inline manufacturing system for an organic light emitting device. 11. The method of claim 10,
Wherein the deposition chamber comprises:
A partition or a gate having an inlet formed at the tip end thereof and a discharge port formed at the rear end thereof and having a long length in the longitudinal direction so that one side thereof can be connected to the first coating device and the second coating device respectively, Wherein the chamber is a communication type rectangular chamber in which the organic light emitting device is mounted. The method according to claim 1,
Wherein the first coating apparatus comprises:
A first lateral coating chamber installed in a first width direction with respect to a longitudinal direction of the deposition apparatus; And
A second side coating chamber installed in a second width direction with respect to the longitudinal direction of the deposition apparatus;
And an inline manufacturing system for an organic light emitting device. The method according to claim 1,
A loading device for loading the element substrate into a first position of the deposition apparatus;
An unloading device for unloading the element substrate from the deposition apparatus; And
Further comprising a control unit capable of applying control signals to the first coating apparatus, the second coating apparatus, the deposition apparatus, the loading apparatus, and the unloading apparatus. 14. The method of claim 13,
A first electrode forming device installed between the loading device and the deposition device and forming a first electrode layer on the device substrate;
Further comprising: an inline manufacturing system for an organic light emitting device. The method of claim 13,
A second electrode forming apparatus installed between the deposition apparatus and the unloading apparatus and forming a second electrode layer on the element substrate;
Further comprising: an inline manufacturing system for an organic light emitting device. 16. The method of claim 15,
An encapsulation device installed between the second electrode forming device and the unloading device and sealing the device substrate;
Further comprising: an inline manufacturing system for an organic light emitting device. The method according to claim 1,
Wherein the first coating apparatus comprises:
A first coating chamber;
A spray device installed in the first coating chamber for spray coating the first organic material onto the donor substrate for the first organic material;
A curing device for curing the first organic material coated on the donor substrate for the first organic material by a baking plate or a light irradiation device; And
A donor substrate transfer device for transferring the donor substrate for the first organic material to the deposition apparatus;
And an inline manufacturing system for an organic light emitting device. 18. The method of claim 17,
Wherein the first coating chamber is a load lock chamber combined spray chamber capable of creating a vacuum environment after spray coating. 18. The method of claim 17,
The spray device includes:
A vacuum spray device capable of spray coating the first organic material in a vacuum environment. 11. The method of claim 10,
Wherein a load lock chamber is provided between the deposition apparatus and the first coating apparatus or between the loading apparatus and the deposition apparatus. 21. The method of claim 20,
Wherein the load lock chamber is a vertically-loadable load lock chamber capable of loading a plurality of the element substrates in a direction perpendicular to the tray. The method according to claim 1,
Wherein an alignment device capable of aligning the first donor substrate for the first organic material or the device substrate is provided on at least one of the first coating device and the deposition device. The method according to claim 1,
Wherein the alignment device comprises a multi-axis alignment device capable of multi-axis alignment. A first coating apparatus for coating a first organic material on a first donor substrate for a first organic material;
A second coating apparatus for coating a second organic material on a first donor substrate for a second organic material;
An electric field is applied to the first donor substrate for the first organic material, which is connected to the first coating device and the second coating device, and transferred by the donor substrate transfer device to transfer the first organic material to the second donor substrate for the first organic material And a deposition apparatus capable of depositing the second organic material on a second donor substrate for a second organic material by applying an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device;
A loading device for loading an element substrate into a first position of the deposition apparatus;
An element substrate transfer device installed in the deposition apparatus, for transferring the element substrate from the first position to the second position;
An unloading device for unloading the element substrate from the deposition apparatus; And
And a controller capable of applying control signals to the first coating apparatus, the second coating apparatus, the deposition apparatus, the loading apparatus, the element substrate transfer apparatus, and the unloading apparatus,
The deposition apparatus includes:
Applying an electric field to the second donor substrate for the first organic material to deposit the first organic material on the device substrate positioned at the first location, applying an electric field to the second donor substrate for the second organic material, Is deposited on the first organic material of the device substrate located in the second location. A first coating apparatus for coating a first organic material on a first donor substrate for a first organic material;
A second coating apparatus for coating a second organic material on a first donor substrate for a second organic material;
An electric field is applied to the first donor substrate for the first organic substance, which is connected to the first coating device and the second coating device and transferred by the donor substrate transfer device, to transfer the first organic substance to the second organic donor substrate And a deposition apparatus capable of depositing the second organic material on a second donor substrate for a second organic material by applying an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device;
An element substrate transfer device installed in the deposition apparatus and transferring the element substrate from the first position to the second position; And
And a control unit capable of applying control signals to the first coating apparatus, the second coating apparatus, the deposition apparatus, and the element substrate transfer apparatus,
The deposition apparatus includes:
Applying an electric field to the second donor substrate for the first organic material to deposit the first organic material on the device substrate positioned at the first location and applying an electric field to the second donor substrate for the second organic material, Depositing an organic material onto the first organic material of the device substrate located in the second location. A first coating device for coating the first organic material on the donor substrate for the first organic material;
A second coating apparatus for coating the second organic material on the donor substrate for the second organic material;
The first organic material may be deposited on the element substrate by using the joule heat of the first organic material donor substrate connected to the first coating apparatus and the second coating apparatus and transferred by the donor substrate transfer apparatus, A deposition apparatus capable of depositing the second organic material on the device substrate using joule heat of the second organic material donor substrate transferred by the substrate transfer device;
A loading device for loading an element substrate into a first position of the deposition apparatus;
An element substrate transfer device installed in the deposition apparatus, for transferring the element substrate from the first position to the second position;
An unloading device for unloading the element substrate from the deposition apparatus; And
And a controller capable of applying a control signal to the first coating device, the second coating device, the deposition device, the loading device, the device substrate transfer device, and the unloading device, In-line manufacturing system of a device. A coating chamber for coating the first organic material on the donor substrate for the first organic material and coating the second organic material on the donor substrate for the second organic material;
The first organic material can be deposited on the device substrate by applying an electric field to the donor substrate for the first organic material and the second organic material can be deposited on the device substrate by applying an electric field to the donor substrate for the second organic material, A deposition apparatus capable of depositing on an element substrate;
A loading device for loading the element substrate into the deposition apparatus;
An unloading device for unloading the element substrate from the deposition apparatus; And
And a controller capable of applying control signals to the coating chamber, the deposition apparatus, the loading apparatus, and the unloading apparatus. A first coating device for coating a first liquid material mixed with a volatile medium and a first organic material on a first donor substrate for a first organic material in a plane and volatilizing the volatile medium;
A second coating device for coating a second liquid material mixed with a volatile medium and a second organic material on a first donor substrate for a second organic material in a plane and volatilizing the volatile medium; And
An electric field is applied to the first donor substrate for the first organic material, which is associated with the first coating device and the second coating device, and transferred by the donor substrate transfer device to transfer the first organic material to the second donor substrate for the first organic material And an electric field may be applied to the first donor substrate for the second organic substance transferred by the donor substrate transfer device to deposit the second organic substance on the surface of the second donor substrate for the second organic substance A deposition apparatus;
Lt; / RTI >
The deposition apparatus includes:
Applying an electric field to the second donor substrate for the first organic substance to deposit the first organic substance on the device substrate and applying an electric field to the second donor substrate for the second organic substance to form the second organic substance on the device substrate Lt; RTI ID = 0.0 > 1 < / RTI > organic material. A first coating step of coating a first organic material on a first donor substrate for a first organic material; a second coating step of coating a second organic material on a first donor substrate for a second organic material; 2 coating apparatus for depositing a first organic material on a second donor substrate for a first organic material by applying an electric field to the first donor substrate for the first organic material transferred by the donor substrate transfer device, A second donor substrate for depositing the second organic material onto a second donor substrate for a second organic material by applying an electric field to the first donor substrate for the second organic material transferred by the donor substrate transfer device and the donor substrate transfer device, A preparation step including a donor substrate preparation step;
A loading step of loading an element substrate into a first position of the deposition apparatus;
A first organic material deposition step of applying an electric field to the first organic material donor substrate to deposit the first organic material on the device substrate positioned at the first location;
An element substrate transfer step of transferring the element substrate from the first position to the second position;
A second organic material deposition step of applying an electric field to the second organic material donor substrate to deposit the second organic material on the first organic material of the device substrate located at the second location; And
An unloading step of unloading the element substrate from the deposition apparatus;
Wherein the organic light-emitting device is an organic light-emitting device. 29. An organic film device manufactured by the in-line manufacturing method of the organic light emitting device of claim 29. A first base layer, a first heat transfer layer formed on the first base layer, the first heat transfer layer being capable of coating a first solution with a first solution, and a second heat transfer layer formed on the first base layer so that an electric field can be applied to the first heat transfer layer A first donor substrate on which a first conductive layer is formed, the first conductive layer being electrically connected to the first heating layer; And
And a second base layer formed on the second base layer, wherein the first organic material coated on the first donor substrate is applied to the first donor substrate, A second donor substrate having a second heat transfer layer corresponding to the heat transfer layer and a second conductive layer electrically connected to the second heat transfer layer so that an electric field can be applied to the second heat transfer layer;
Wherein the donor substrate is a transparent substrate.

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