TW201708577A - An apparatus, method for depositing organic layer and an organic layer device - Google Patents

Abstract

The present invention relates to an organic film deposition apparatus. The organic film deposition apparatus of the present invention carries out an organic film deposition process using a joule heating method. To this end, the organic film deposition apparatus deposits an organic film on a device substrate using two donor substrates. The present invention is capable of reducing loss of organic matter and shortening a processing time by depositing an organic film on a device substrate by a joule heating method, using first and second donor substrates, and repeating the deposition.

Description

Organic film evaporation device, method and organic film device Field of invention

The present invention relates to an organic film evaporation apparatus, method, and organic film apparatus, and more particularly to an evaporation process of an organic film layer on an element substrate by using two donor substrates and an organic film evaporation process to ensure vapor deposition. The organic film vapor deposition apparatus, method, and organic film apparatus which improve the uniformity of an organic film, reduce the loss of an organic substance, and reduce a process time (TACT time) to improve productivity.

Background of the invention

In the flat panel display device, the response speed of the organic electroluminescence display device is 1 ms or less, has a high response speed, low power consumption, and has no viewing angle problem due to autonomous light emission. Therefore, it is an excellent motion image display medium regardless of the size of the device. In addition, it can be fabricated at a low temperature, and the manufacturing process is simple based on the existing semiconductor process technology, and thus has attracted attention as a new generation of flat panel display devices in the future. Further, since the organic film used in the organic electric field light-emitting display device emits light autonomously, it is possible to use it in an OLED lighting device when an organic film is vapor-deposited on the entire surface and an electric field is applied to the upper and lower ends. Unlike existing LED illumination, which is a point source, OLED illumination is a surface light source, and as a new generation of illumination, it has received great attention.

The materials and processes used to form the organic thin film in the manufacturing process of the organic electric field light-emitting display device and the OLED illumination can be roughly classified into a polymer type element using a wet process and a low molecular type element using a vapor deposition process. For example, in the method of forming a polymer or a low molecular light-emitting layer, when an inkjet printing method is employed, the material of the organic layer other than the light-emitting layer is limited, and there is a need to form a structure for inkjet printing on the substrate. trouble. Further, when the light-emitting layer is formed by the vapor deposition process, an additional metal mask is used, and as the size of the flat-panel display device increases, the metal mask also needs to be enlarged. In this case, as the metal mask is enlarged, Sagging occurs, so there are difficulties in making large components.

On the other hand, a technique of forming an organic light-emitting layer using Joule heating has been disclosed. The technique first forms an organic light-emitting layer on a donor substrate, and then substantially faces the donor substrate and the element, and then heats the donor substrate by Joule heating to evaporate the organic light-emitting layer formed on the donor substrate. Onto the component substrate.

However, the technique of forming the organic light-emitting layer by Joule heating requires an unnecessary process such as inversion of the donor substrate or the element substrate, thereby increasing the process time (TACT time).

Prior technical literature Patent literature

(Patent Document 1) Korean Authorized Patent Gazette No. 10-1405502 (Announcement Date, June 27, 2014)

(Patent Document 2) Korean Authorized Patent Gazette No. 10-1169002 (Announcement Date, July 26, 2012)

(Patent Document 3) Korean Authorized Patent Gazette No. 10-1169001 (Publication Day, July 26, 2012)

(Patent Document 4) Korean Patent Publication No. 10-2012-0129507 (publication date, November 28, 2012)

Summary of invention

An object of the present invention is to provide an organic film vapor deposition apparatus, a method, and an organic film apparatus for depositing an organic film on an element substrate by using two donor substrates, thereby processing an organic film vapor deposition step using a Joule heating method.

Another object of the present invention is to provide an organic film vapor deposition apparatus, method, and organic film apparatus, thereby ensuring uniformity of an evaporated organic film and reducing loss of organic matter.

Still another object of the present invention is to provide an organic film vapor deposition apparatus, method and organic film apparatus, which can shorten the process time.

In order to solve the above technical problem, the organic film evaporation apparatus according to the present invention may include that it includes an evaporation apparatus, and a first donor substrate or an element substrate coated with an organic film is put into the vapor deposition apparatus and formed with The second donor substrate of the conductive film is opposed, wherein the vapor deposition device applies an electric field to the conductive film of the first donor substrate coated with the organic film to generate Joule heat, thereby being coated on the first An organic film on a donor substrate is evaporated onto the second donor substrate, and an electric field is applied to the conductive film of the second donor substrate on which the organic film is evaporated to generate Joule heat, thereby depositing The first An organic film on the substrate is deposited on the element substrate.

Furthermore, the organic film evaporation apparatus according to the present invention may further include a coating device for coating an organic film on the first donor substrate on which the conductive film is formed.

Furthermore, the organic film evaporation apparatus according to the present invention may further include: a load lock chamber for receiving the first donor substrate coated with the organic film from the coating device and inputting to the vapor deposition device Or receiving the first donor substrate discharged from the vapor deposition device.

Further, according to the present invention, the vapor deposition apparatus may include: an evaporation chamber; a fixing stage disposed on one side of the evaporation chamber for arranging the second donor substrate; and a fixing portion disposed at the The other side of the vapor deposition chamber, the first donor substrate is fixed, the first donor substrate is fixed to face the second donor substrate, and is lifted and lowered; the driving portion is used for moving the chamber a fixing portion for bringing the first donor substrate closer to or away from the second donor substrate; and a power supply device for applying a conductive film to the first donor substrate or the second donor substrate electric field.

Further, according to the present invention, the vapor deposition apparatus may include: an evaporation chamber; a fixing stage disposed on one side of the evaporation chamber for arranging the first donor substrate; a fixing portion, and the The first donor substrate is opposite to the second donor substrate and is raised and lowered; the power supply device is configured to apply an electric field to the first donor substrate or the second donor substrate; and a driving portion, For moving the fixing portion.

Further, according to the present invention, the coating apparatus may include: a coating chamber forming an internal space for housing the first donor substrate; a lower portion of the coating chamber for accommodating the first donor substrate; an organic material supply device for supplying organic matter; and a showerhead for receiving organic matter from the organic matter supply device and placed in the The first donor substrate on the stage ejects organic matter to coat the first donor substrate with an organic substance.

Further, according to the present invention, it is possible to further include a side support portion provided in the vapor deposition chamber for supporting the element substrate input into the vapor deposition chamber.

Further, according to the present invention, the vapor deposition chamber may be provided with a lower support portion that protrudes toward the upper portion of the side surface of the table located at the lower portion and that is bent at a part of the end portion, or one or more portions located at the upper portion of the table The central support portion supports the element substrate input into the vapor deposition chamber and prevents the central portion of the element substrate from sagging.

Further, according to the present invention, the vapor deposition device may be part of a leaf-type device connected to a plurality of coating devices and loading and unloading devices for loading the component substrate into the The element substrate is unloaded from or removed from the vapor deposition device.

On the other hand, the vapor deposition apparatus according to the present invention for solving the above technical problems may include: an evaporation chamber; a fixing table disposed on one side of the evaporation chamber for accommodating the second donor substrate; the fixing portion Opposite the second donor substrate for fixing the first donor substrate and lifting the same; and a power supply device for applying an electric field to the first donor substrate or the second donor substrate; a driving portion for moving the fixing portion.

On the other hand, the steam according to the present invention for solving the above technical problems The plating apparatus may include: a vapor deposition chamber; a fixing table disposed on one side of the vapor deposition chamber for arranging the first donor substrate; and a fixing portion opposite to the first donor substrate, And fixed to the second donor substrate and raised and lowered; a power supply device for applying an electric field to the first donor substrate or the second donor substrate; and a driving portion for moving the fixing portion.

Further, according to the present invention, a side support portion may be provided in the vapor deposition chamber to support the element substrate input into the vapor deposition chamber.

Further, according to the present invention, the vapor deposition chamber may be provided with a lower support portion that protrudes toward the upper side of the side surface of the table and that is bent at a part of the end portion, or one or more centers located at the upper portion of the table a support portion for supporting the element substrate input into the vapor deposition chamber and preventing a central portion of the element substrate from sagging.

On the other hand, the organic film evaporation method according to the present invention for solving the above technical problems may include the steps of: coating an organic film on a first donor substrate on which a conductive film is formed; and first coating an organic film The donor substrate is put into the vapor deposition device; the power supply device supplies power to the first donor substrate, thereby applying an electric field to the conductive film of the first donor substrate; and coating the first donor substrate to which the electric field is applied The organic film is transferred onto the second donor substrate, thereby depositing an organic film on the second donor substrate; discharging the first donor substrate from the evaporation chamber; and loading the component substrate into the vapor deposition device by using the transfer device Supplying power to the second donor substrate by the power supply device, thereby applying an electric field to the conductive film of the second donor substrate; transferring the organic film evaporated on the second donor substrate to which the electric field is applied onto the element substrate , thereby evaporating the element substrate An organic film; an element substrate on which an organic film is vapor-deposited is discharged from the vapor deposition device.

On the other hand, the organic film device according to the present invention for solving the above technical problems can be produced by the organic film evaporation method.

As described above, the organic film vapor deposition apparatus, method, and organic film apparatus of the present invention use the two donor substrates and the element substrate to process the organic film vapor deposition step, thereby ensuring uniformity of the vapor deposited organic film and preventing organic substances. Loss.

Further, since the organic film vapor deposition apparatus, method, and organic film apparatus of the present invention process the organic film vapor deposition step using the two donor substrates and the element substrate, it is advantageous for the production of a large-sized element and the process time can be shortened.

Further, the organic film vapor deposition apparatus, method, and organic film apparatus of the present invention form an organic film on the donor substrate by a wet process, thereby reducing the loss of organic matter.

Further, since the organic film vapor deposition apparatus, method, and organic film apparatus of the present invention form the coating chamber, the load lock chamber, and the vapor deposition chamber in a continuous form, the apparatus can be easily realized, the manufacturing cost can be saved, and the process time can be shortened.

1‧‧‧Organic film

100‧‧‧Organic film evaporation device

102‧‧‧Control Department

110‧‧‧ Coating device

112‧‧‧ Coating chamber, coating device

114, 162‧‧‧

116‧‧‧Workbench

117‧‧‧body substrate transfer device

118‧‧‧ sprinkler

119‧‧‧ curing device

120‧‧‧Organic supply device

130‧‧‧Load lock room

132‧‧‧ first door

134‧‧‧ second door

150‧‧‧Vapor deposition unit

152‧‧‧vaporation chamber

154‧‧‧Fixed table, workbench

155‧‧‧ fixed table

156‧‧‧ Fixed Department

158‧‧‧ Drive Department

160‧‧‧Power supply

164‧‧‧Support

166‧‧‧ lower support

168‧‧‧Central Support

170‧‧‧Transporting device

200, 210‧‧‧ body substrate

201‧‧‧First basal layer

202‧‧‧First conductive layer

203‧‧‧First electric heating layer

211‧‧‧Second basal layer

212‧‧‧Second conductive layer

213‧‧‧Second electric heating layer

300‧‧‧Continuous Manufacturing System

A‧‧‧ actuation agency

D‧‧‧distance

L‧‧‧Pole

S300-380‧‧‧Steps

P‧‧‧

1 is a block diagram showing a schematic configuration of an organic film vapor deposition device using Joule heating according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing the structure of the coating device shown in Fig. 1.

Fig. 3 is a cross-sectional view showing the structure of the vapor deposition device shown in Fig. 1.

4 is a view showing a structure in which the fixing portion is lowered in the vapor deposition device shown in FIG. 3 and the first donor substrate and the second donor substrate are arranged at a predetermined distance; Cutaway view.

FIG. 5 is a cross-sectional view showing a configuration in which the element substrate is placed in the vapor deposition chamber by the transfer device and then placed at a predetermined distance from the second donor substrate in the vapor deposition device shown in FIG. 3 .

Fig. 6 is a cross-sectional view showing a structure in which a side surface of a vapor deposition chamber in the vapor deposition device shown in Fig. 3 is provided with a side support portion, according to another embodiment.

Fig. 7 is a cross-sectional view showing a structure in which the vapor deposition device shown in Fig. 3 is provided with a support portion and a central support portion provided on a fixing table, according to still another embodiment.

Fig. 8a is a plan view showing an embodiment of a central support portion in the vapor deposition device shown in Fig. 7.

Fig. 8b is a plan view showing another embodiment of the central support portion in the vapor deposition device shown in Fig. 7.

Fig. 9 is a sequence diagram showing an organic film evaporation method using Joule heating according to the present invention.

FIG. 10 is a plan layout view showing a schematic configuration of an organic film vapor deposition device using Joule heating according to another embodiment of the present invention.

Fig. 11 is a cross-sectional view showing the structure of the coating device shown in Fig. 10.

Fig. 12 is a cross-sectional view showing the structure of the vapor deposition device shown in Fig. 10.

FIG. 13 is a cross-sectional view showing a configuration in which the fixing portion is lowered in the vapor deposition device shown in FIG. 12, and the second donor substrate and the first donor substrate are disposed at a predetermined distance and vapor-deposited.

FIG. 14 is a cross-sectional view showing a configuration in which an element substrate is introduced into a vapor deposition chamber by a transfer device in the vapor deposition device shown in FIG.

Figure 15 is a view showing the second donor substrate in the vapor deposition device shown in Figure 14 A cross-sectional view of a structure that is disposed to be spaced apart from the element substrate by a predetermined distance and subjected to secondary vapor deposition.

FIG. 16 is an enlarged cross-sectional view showing an enlarged example of a first donor substrate in the vapor deposition device shown in FIG. 12. FIG.

Fig. 17 is an enlarged cross-sectional view showing an enlarged example of a second donor substrate in the vapor deposition device shown in Fig. 14;

detailed description

The embodiments of the invention may be varied in various forms and the scope of the invention should not be construed as being limited by the embodiments described below. The provision of this embodiment is intended to more fully illustrate the invention to those of ordinary skill in the art. Therefore, the shapes and the like of the constituent elements are exaggerated in the drawings to emphasize a clearer explanation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 9.

1 is a block diagram showing a schematic configuration of an organic film vapor deposition device using Joule heating according to the present invention, FIG. 2 is a cross-sectional view showing a structure of the coating device shown in FIG. 1, and FIG. 3 is a view showing FIG. 1 is a cross-sectional view showing a structure of a vapor deposition device shown in FIG. 1, and FIG. 4 is a view showing that the fixing portion is lowered in the vapor deposition device shown in FIG. 3 so that the first donor substrate and the second donor substrate are disposed apart by a predetermined distance. FIG. 5 is a cross-sectional view showing a configuration in which the element substrate is placed in the vapor deposition chamber by the transfer device and then lowered to a predetermined distance from the second donor substrate in the vapor deposition device shown in FIG. 3 . FIG. 6 is a cross-sectional view showing a structure in which a side surface of a vapor deposition chamber is provided with a side support portion in the vapor deposition device shown in FIG. 3 according to another embodiment, and FIG. 7 is a view showing FIG. 3 according to still another embodiment. The vapor deposition device shown is a cross-sectional view showing a configuration of a support portion and a central support portion provided on a fixed table, and FIG. 8a is a plan view showing an embodiment of a central support portion in the vapor deposition device shown in FIG. Fig. 8b is a plan view showing another embodiment of the central support portion in the vapor deposition device shown in Fig. 7.

Referring to Fig. 1, in the organic thin film vapor deposition device 100 of the present invention, in order to secure a uniformity of an organic film, a organic light-emitting device (OLED) and an OLED illumination substrate are reduced, and organic matter loss is reduced and shortened. The process time is, for example, an organic film vapor deposition step of a Joule heating method in which an organic film is deposited on the element substrate by using the first and second donor substrates of glass, ceramic or plastic material.

To this end, the organic film evaporation apparatus 100 of the present invention includes: a coating apparatus 110 for coating an organic film on the first donor substrate 200; and an interlocking chamber 130 for applying the first application coated with organic matter The body substrate 200 is placed in the vapor deposition device 150, or the first donor substrate 200 is discharged from the vapor deposition device 150; the vapor deposition device 150 is used to coat the second donor substrate 210 by the Joule heating method. The organic film coated on the first donor substrate 200 is deposited on the element substrate 220; and the control unit 102 controls the processing of the related operation of the organic film vapor deposition device 100.

For example, the control unit 102 is constituted by a notebook computer, a personal computer, a touch panel, a programmable logic controller (PLC), or the like, and controls the coating device 110, the load lock chamber 130, and the vapor deposition device 150 to process the organic film vapor deposition device 100. Related actions. The content of such a control unit 102 will be described in detail in FIG.

Further, in the organic film evaporation apparatus 100 of the present invention, in the coating apparatus 110. A transfer device (not shown) is provided between the load lock chamber 130 and the vapor deposition device 150 for transporting the first donor substrate 200 and the second donor substrate 210. The conveying device may include a conveyor belt, a conveying robot, and the like.

Further, the organic film vapor deposition device 100 may be provided with a wet or dry type cleaning device (not shown) for removing the residual on the first donor substrate 200 on which the organic film evaporation has been completed on the element substrate 220. An organic device; a drying device (not shown) for drying the cleaned first donor substrate 200.

Among them, a conductive film is formed on the first and second donor substrates, so that Joule heat can be generated in the subsequent vapor deposition step. For example, the conductive film is formed of a metal or a metal alloy having the same shape as that of the organic film pattern deposited on the element substrate. Such a conductive film is used to apply an electric field to the electrode to generate Joule heat, and the organic film is evaporated by the generated Joule heat, thereby evaporating the organic film onto the second donor substrate or the element substrate.

Referring specifically to FIG. 2, for example, in order to be able to reduce the process time and the process cost, the coating device 110 coats the organic film by a wet process using, for example, a head, a rotary nozzle, or the like. The coating device 110 of the present embodiment includes a coating chamber 112, a table 116, at least one head 118, and an organic supply device 120.

The coating chamber 112 forms an internal space in which an organic film is applied to the first donor substrate 200 that is put into the interior. One side of the coating chamber 112 is provided with an opening and closing door 114, and the other side is provided with a first door 132 that opens and closes between the loading and interlocking chambers 130. The first donor substrate 200 is introduced into the coating chamber 112 through the gate 114. A lower stage of the coating chamber 112 is provided with a table 116 on which the first donor substrate 200 is placed, and a head 118 is disposed on the upper portion. In order to coat on the first donor substrate 200 The organic film is coated, and the coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130, and a nitrogen atmosphere is formed inside thereof.

The stage 116 is used to house the first donor substrate 200 that is placed into the coating chamber 112. For example, the work table 116 is constituted by a vacuum chuck, an electrostatic chuck, a granite plate, or the like to house and fix the large first donor substrate 200.

The shower head 118 is formed in a spray type for ejecting organic matter in the interior of the coating chamber 112 by coating an organic substance on the surface of the first donor substrate 200 placed on the table 116. According to the size of the first donor substrate 200, at least one showerhead 118 is disposed at an upper portion of the first donor substrate 200.

Further, the organic matter supply device 120 supplies the organic material to the shower head 118. Further, a recovery device (not shown) may be provided in the coating device 110 for recovering the organic matter remaining after the first donor substrate 200 is coated with the organic film into the organic material supply device 120. For convenience of explanation, the spray coating apparatus using a shower head has been described, but it may be a coating apparatus based on a known wet process such as spin coating.

After the first donor substrate 200 is placed in the coating chamber 112 and placed on the table 116, the coating device 110 supplies the organic matter from the organic material supply device 120 to the shower head 118, and ejects the organic matter from the shower head 118. A donor substrate 200 is applied. The sprayed organic matter is deposited on the first donor substrate 200 to coat the organic film. At this time, the thickness of the organic film coated on the first donor substrate 200 only needs to be able to sufficiently cover the conductive film formed on the first donor substrate 200. This is because, in the vapor deposition device 150 of the subsequent step, by controlling the electric field application conditions applied to the electrodes of the first donor substrate 200, the organic layer deposited on the element substrate (220 of FIG. 4) can be organically controlled. membrane The thickness is adjusted. The first donor substrate 200 thus coated with the organic film is transferred to the load lock chamber 130 by the transfer device.

As shown in FIG. 3, the load lock chamber 130 includes a first door 132 disposed on one side for receiving the first donor substrate 200 from the coating device 110, and a second door 134 disposed on the other side. The first donor substrate 200 is placed in the vapor deposition device 150 or the first donor substrate 200 is discharged from the vapor deposition device 150. Thereby, the load lock chamber 130 puts the first donor substrate 200 coated with the organic film into the vapor deposition device 150, or discharges the first donor substrate 200 that vapor-deposits the organic matter onto the second donor substrate 210. .

3 to 5, the vapor deposition device 150 vapor-deposits an organic film on the element substrate by using the first and second donor substrates. The vapor deposition device 150 of the present embodiment includes a vapor deposition chamber 152, a fixing table 154, a fixing portion 156, a driving portion 158, and a power supply device 160.

The vapor deposition chamber 152 forms an internal space in which the organic film is vapor-deposited from the first donor substrate 200 placed in the load lock chamber 130 onto the second donor substrate 210 by Joule heating. The organic film is vapor-deposited from the second donor substrate 210 onto the element substrate 220 by the Joule heating method. On the one side of the vapor deposition chamber 152, a second door 134 for loading the interlocking chamber 130 is disposed for inputting and discharging the first donor substrate 200, and the other side is provided with a door 162 for inputting and discharging the element substrate 220.

Further, a lower portion is provided with a fixing table 154 for fixing the second donor substrate 210, thereby fixing and placing the second donor substrate 210 on the fixing table 154.

On the other hand, when the first donor substrate 200 is put in, by loading the interlock The second door 134 and the door 162 of the chamber 130 form the internal space of the vapor deposition chamber 152 into a vacuum atmosphere. In the vapor deposition chamber 152, in a state where the second donor substrate 210 is fixed and placed on the lower fixing stage 154, the fixing portion 156 of the first donor substrate 200 is fixed to the upper portion to be lifted and lowered to make the first donor substrate The second donor substrate 200 is disposed to be spaced apart by a minimum predetermined distance d. This vapor deposition chamber 152 is sealed by a second door 134 and a door 162.

The fixing table 154 is disposed at a lower portion of the vapor deposition chamber 152 for seating and fixing the second donor substrate 210. At this time, the second donor substrate 210 exhibits a medium for vapor-depositing the organic film coated on the first donor substrate 200 onto the element substrate 220 when performing the organic film vapor deposition step using Joule heating according to the present invention. The function.

The fixing portion 156 is provided at an upper portion of the vapor deposition chamber 152, and has a shape in which a part of the lower end portion is bent so as to fix the first donor substrate 200 that is loaded from the load lock chamber 130, and is driven by the organic film evaporation process. The portion 158 is raised and lowered to maintain a minimum predetermined distance between the first donor substrate 200 and the second donor substrate 210.

At this time, the fixing portion 156 is not limited to the above-described portion of the lower end portion being bent so as to carry the shape of the first donor substrate 200, and is not limited to a specific shape as long as the first donor substrate 200 can be fixed and lifted and lowered. The first donor substrate 200 may be fixed from the upper portion by using a chuck such as an electrostatic chuck.

When the process of vapor-depositing the organic film from the first donor substrate 200 onto the second donor substrate 210 is completed, the first donor substrate 200 is raised, and then discharged from the vapor deposition chamber 152 through the second gate 134, and passed through A door 132 is again placed into the coating device 112.

After the first donor substrate 200 is discharged from the vapor deposition chamber 152, the element substrate 220 is introduced into the vapor deposition chamber 152 from the gate 162 of the vapor deposition chamber 152 by the transfer device 170, and then lowered by the transfer device 170 to be placed and evaporated. The second donor substrate 210 coated with the organic film is kept at a minimum predetermined distance d. As the conveying device 170, a conventional conveying device such as a robot arm can be used.

At this time, in order to accurately maintain the minimum distance d between the second donor substrate 210 and the element substrate 220, as shown in FIG. 6, the side support portion 164 may be provided on the side surface of the vapor deposition chamber 152.

Further, since the large-area element substrate 220 may sag at the center portion of the substrate, as shown in FIG. 7, a portion which is fixed to the lower portion of the vapor deposition chamber 152 and protrudes toward the upper side surface of the lower table 154 and a part of the end portion may be provided. A lower support portion 166 of a bent shape. At this time, one or more central support portions 168 may be provided on the upper portion of the fixed table 154. As shown in FIG. 8a and FIG. 8b, the central support portion 168 is disposed outside the region where the second donor substrate 210 is located, and may be configured as a continuous protruding portion, or may be provided in a plurality of manners spaced apart from each other in the form of a die. .

The driving unit 158 is coupled to the upper portion of the vapor deposition chamber 152, and the fixed portion 156 to which the first donor substrate is fixed and the element substrate 220 transporting and transporting device 170 are vertically moved by the control of the control unit 102.

Further, the power supply device 160 performs power supply to apply an electric field to the electrodes of the first donor substrate 200 or the second donor substrate 210. To this end, the power supply device 160 contacts the conductive film formed on the first donor substrate 200 and the second donor substrate 210, thereby applying an electric field. At this time, the electric field application condition can be determined according to various factors such as the electric resistance, the length, and the thickness of the electroconductive film. The current applied in this embodiment may be direct current or alternating current, the applied electric field may be about 1 kW/cm ² to 1000 kW/cm ² , and the time for applying an electric field may be about 1/1000000 to 100 seconds.

As shown in FIG. 3, the vapor deposition device 150 first places the first donor substrate 200 after the first donor substrate 200 coated with the organic film is loaded from the load lock chamber 130 into the vapor deposition chamber 152. The fixing portion 156 is fixed and fixed. The vapor deposition device 150 lowers the first donor substrate 200 fixed on the fixing portion 156 by the driving portion 158 to be adjacent to and spaced apart from the second donor substrate 210 on the fixing table 154 by a predetermined distance, and then powered The device 160 supplies power to the first donor substrate 200 to apply an electric field to the first donor substrate 200. Thereby, the organic film coated on the first donor substrate 200 is subjected to Joule heating, thereby depositing an organic film on the second donor substrate 210. That is, when an electric field is applied to the first donor substrate 200, Joule heat is generated on the conductive film formed on the first donor substrate 200, and the generated Joule heat is transferred to the organic film formed on the upper portion of the first donor substrate 200. The organic film formed in the portion where the conductive film is present is evaporated by the transferred Joule heat and transferred onto the second donor substrate 210, whereby the organic film is vapor-deposited on the second donor substrate 210.

Further, after the vapor deposition device 150 vapor-deposits the organic film onto the second donor substrate 210, the fixing portion 156 is raised by the driving portion 158 to separate the second donor substrate 210 from the first donor substrate 200, and then The first donor substrate 200 is discharged to the load lock chamber 130.

After the completion of the process, in the vapor deposition device 150 shown in FIG. 5, the transfer device 170 puts the element substrate 220 into the vapor deposition chamber 152 through the gate 162, and then the element substrate 220 is lowered to maintain a certain value with the second donor substrate 210. interval.

Further, the vapor deposition device 150 supplies power to the second donor substrate 210 by the power supply device 160 to apply an electric field to the second donor substrate 210, thereby transferring the organic film deposited on the second donor substrate 210 to On the element substrate 220, an organic film is deposited on the element substrate 220. Similarly, when an electric field is applied to the second donor substrate 210, Joule heat is generated on the conductive film formed on the second donor substrate 210, and the generated Joule heat is transferred to the organic formed on the upper portion of the second donor substrate 210. The film, thereby evaporating the organic film forming the portion where the conductive film exists on the second donor substrate 210, so that the organic film is evaporated onto the element substrate 220, thereby completing the evaporation of the organic film for one element substrate 220 by Joule heating. Plating process.

Next, the vapor deposition device 150 raises the element substrate 220 on which the organic film is vapor-deposited by the transfer device 170, and then discharges it from the vapor deposition chamber 152, and puts it into the other first donor substrate 200 through the load lock chamber 130, thereby repeating The organic film vapor deposition step described above is processed. Further, the first donor substrate 200 discharged from the vapor deposition device 150 in the completion of the organic film vapor deposition step is washed and dried by the cleaning device and the drying device.

The structure described in the present embodiment is such that, in the vapor deposition device 150, the first donor substrate 200 or the element substrate 220 is fixed and moved by the fixing portion 156 of the upper portion of the vapor deposition chamber 152 or the conveying device 170, and the second donor body is The substrate 210 is disposed on the fixed stage 155. However, as long as the first donor substrate 200 or the element substrate 220 is opposed to the second donor substrate 210, it may be modified and deformed into various forms.

Further, in the present embodiment, the first donor substrate 200 or the element substrate 220 is driven to move up and down to be adjacent to the second donor substrate, however, as another As an example, it is obvious that moving the second donor substrate 210 to be adjacent to the first donor substrate 200 or the element substrate 220.

As described above, the organic film vapor deposition device 100 of the present invention vapor-deposits the organic film onto the element substrate 220 by the first donor substrate 200 and the second donor substrate 210 by the Joule heating method, and repeats this. The treatment can reduce the loss of organic matter and can shorten the process time.

Continuing, FIG. 9 is a sequence diagram showing an organic film evaporation method using Joule heating according to the present invention. This sequence is an organic film vapor deposition step using Joule heating treated by the organic film vapor deposition device 100, and is processed by the control of the control unit 102 of the organic film vapor deposition device 100.

Referring to Fig. 9, an organic film vapor deposition apparatus 100 of the present invention first applies an organic film to a first donor substrate 200 on which a conductive film is formed by a coating apparatus 110 in step S300. In the present embodiment, the organic material is supplied to the first donor substrate 200 through the shower head 118 to coat the organic film. The first donor substrate 200 coated with the organic film is transferred to the load lock chamber 130 by a transfer device.

In step S310, the first donor substrate 200 coated with the organic film is introduced into the vapor deposition device 150 from the load lock chamber 130. The input first donor substrate 200 is fixed and disposed on the fixing portion 156 so as to face the second donor substrate 210 placed on the fixing table 154. Then, the fixing portion 156 is moved in the direction of the fixing table 154 by the driving portion 158 so that the first donor substrate 200 and the second donor substrate 210 are adjacent to each other.

In step S320, power is supplied from the power supply device 160 to the first donor substrate 200, thereby applying an electric field to the conductive film of the first donor substrate 200. In step S330, an organic film coated on the first donor substrate 200 to which an electric field is applied is applied The film is transferred onto the second donor substrate 210 to evaporate the organic film. In step S340, after the organic film is vapor-deposited on the second donor substrate 210, the first donor substrate is transferred to the load lock chamber and discharged.

In step S350, the element substrate 220 is introduced into the vapor deposition device 150 by the transfer device 170. At this time, the input element substrate 220 is fixed and disposed so as to face the second donor substrate 210 placed on the fixing table 154. Then, the drive unit 158 is controlled to move the transport device 170 in the direction of the fixed stage 154 so that the element substrate 220 is adjacent to the second donor substrate 210.

In step S360, power is supplied from the power supply device 160 to the second donor substrate 210 to apply an electric field to the conductive film of the second donor substrate 210. In step S370, the organic film deposited on the second donor substrate 210 to which the electric field is applied is transferred onto the element substrate 220 to evaporate the organic film. Next, in step S380, the element substrate 220 on which the organic film is vapor-deposited is discharged from the vapor deposition device 150.

Then, the other organic substrate vapor deposition step S300 to S380 are repeatedly processed by loading the interlock chamber 130 into the other first donor substrate 200.

The present invention may include an organic film device including an organic film, an organic light-emitting element, an organic light-emitting panel, or the like manufactured by the above-described organic film evaporation method.

FIG. 10 is a plan view showing a schematic configuration of an organic film vapor deposition apparatus using Joule heating according to another embodiment of the present invention, and FIG. 11 is a cross-sectional view showing a configuration of the coating apparatus shown in FIG. 12 is a cross-sectional view showing the structure of the vapor deposition device shown in FIG. 10, and FIG. 13 is a view showing that the fixing portion is lowered in the vapor deposition device shown in FIG. 12 to make the second donor substrate and the first donor body FIG. 14 is a cross-sectional view showing a configuration in which a substrate is placed in a vapor deposition chamber by a transfer device in the vapor deposition device shown in FIG. 13 , and FIG. In the vapor deposition device shown in FIG. 14 , a cross-sectional view in which the second donor substrate is lowered and disposed at a predetermined distance from the element substrate and subjected to secondary vapor deposition is performed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 10 to 15.

Referring to FIG. 10, the continuous manufacturing system 300 of the organic light emitting device of the present invention may be centered on the load lock chamber 130 (transport device or transfer module), and the plurality of coating devices 110 and the vapor deposition device 150 are radially A device of the cluster type, which is also referred to as a cluster type moving back and forth along a radial path, wherein the load lock chamber 130 is used to put the first donor substrate 200 coated with organic matter into the vapor deposition Discharged from or in the apparatus 150 for coating an organic film on the first donor substrate 200, the vapor deposition apparatus 150 is used in a Joule heating mode, through the second application The bulk substrate 210 vapor-deposits the organic film coated on the first donor substrate 200 onto the element substrate 220.

Wherein, the vapor deposition device 150 may be part of a leaf-type device connected to the plurality of coating devices 110 and the loading and unloading device, and the loading and unloading device is configured to load the component substrate 220 into the vapor deposition device 150. The element substrate 220 is unloaded from the vapor deposition device 150.

Further, in the continuous manufacturing system 300 of the organic light emitting device of the present invention, between the respective coating device 110, the load lock chamber 130, and the vapor deposition device 150, a first donor substrate 200 and a second donor body are provided. Substrate 210 moving Sending device (not shown). As the transport device, a transport device such as a roller, a conveyor, a transport chain, or a transport line, a transport arm, a transport robot, and the like can be used.

Referring specifically to FIG. 11, in order to be able to reduce process time and process cost, for example, the coating apparatus 110 includes: a spray device having at least one showerhead 118 and an organic matter supply device 120; a coating chamber 112; a curing device 119; and a donor substrate The conveying device 117.

Among them, the multi-stage transfer arm that can be extended and contracted can be provided on the donor substrate transfer device 117. However, the present invention is not limited thereto, and a transfer device, a transfer arm, a transfer robot, or the like using a roller, a conveyor belt, a transport chain, or a transport line may be employed.

The coating chamber 112 forms an internal space for coating the organic film 1 on the first donor substrate 200 that is put into the interior. One side of the coating chamber 112 is provided with an opening and closing door 114, and the other side is provided with a first door 132 that opens and closes between the loading and interlocking chambers 130. The first donor substrate 200 is introduced into the coating chamber 112 through the gate 114. A donor substrate transfer device 117 on which the first donor substrate 200 is placed is disposed at a lower portion of the coating chamber 112, and a shower head 118 that can reciprocate by the forward/reverse drive device is disposed at an upper portion thereof. In order to coat the organic film 1 on the first donor substrate 200, the coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130, and a nitrogen atmosphere is formed therein.

The donor substrate transfer device 117 may be provided with a mounting table for accommodating the first donor substrate 200 that is loaded into the coating chamber 112. For example, such a mounting table is constituted by a vacuum chuck, an electrostatic chuck, a granite plate, or the like to house and fix the large first donor substrate 200.

The shower head 118 is formed in a spray type for ejecting organic matter in order to apply an organic film to the surface of the first donor substrate 200 placed on the table inside the coating chamber 112. In addition to the spray nozzle, such a showerhead 118 can also be an ink jet nozzle.

Further, the organic matter supply device 120 supplies the organic material to the shower head 118. Further, a recovery device (not shown) may be provided in the coating device 110 for recovering the organic matter remaining after the first donor substrate 200 is coated with the organic film into the organic matter supply device 120. For convenience of explanation, the spray coating apparatus using a shower head has been described, but it may be a coating apparatus based on a known wet process such as spin coating.

Further, the curing device 119 is for volatilizing the volatile medium from the mixture of the mixed organic matter and the volatile medium, thereby curing the organic film 1 on the first donor substrate 200, and a baking plate or a light irradiation device may be employed.

After the first donor substrate 200 is placed in the coating chamber 112 and placed on the table 116, the coating device 110 supplies the organic matter to the showerhead 118 by the organic material supply device 120, and the first donor body is directed by the showerhead 118. The substrate 200 ejects organic matter. The sprayed organic matter is deposited on the first donor substrate 200, thereby coating the organic film 1. Next, the first donor substrate 200 coated with the organic film 1 passes through the donor substrate transfer device 117, passes through the load lock chamber 130 capable of realizing a vacuum environment, and is then transferred to the vapor deposition device 150.

Referring to FIGS. 12 to 15 , the vapor deposition device 150 vapor-deposits the organic film 1 on the element substrate 220 by using the first donor substrate 200 and the second donor substrate 210 . The vapor deposition device 150 in the present embodiment includes a vapor deposition chamber 152, a fixing table 154, a fixing portion 156, a driving portion 158, and a power supply device 160.

As shown in FIG. 12, the vapor deposition chamber 152 forms an internal space in which the organic film is vapor-deposited from the first donor substrate 200 loaded into the load lock chamber 130 to the second application by Joule heating. On the bulk substrate 210, an organic film is vapor-deposited from the second donor substrate 210 onto the element substrate 220 by Joule heating. A second door 134 for inserting and discharging the load lock chamber 130 of the first donor substrate 200 is disposed on one side of the vapor deposition chamber 152, and a door 162 for inputting and discharging the element substrate 220 is disposed on the other side.

Further, an upper portion is provided with a fixing portion 156 for fixing the second donor substrate 210 to fix and place the first donor substrate 200 on the fixing table 154.

On the other hand, after the first donor substrate 200 is introduced, the internal space of the vapor deposition chamber 152 is formed into a vacuum environment by loading the second door 134 and the door 162 of the interlocking chamber 130. As shown in FIG. 13, in the lower portion of the vapor deposition chamber 152, in order to electrically connect the first donor substrate 200 placed on the fixed table 154 in a state of being placed on the ejector L, the disk P that can be lifted and lowered by the actuator A, the ejector L is lowered to electrically connect the first donor substrate 200 with the power supply device 160, and at a top portion, the fixing portion 156 to which the second donor substrate 210 is fixed is lifted and lowered to make the second donor substrate 210 and the first The donor substrate 200 is spaced apart by a minimum predetermined distance d. This vapor deposition chamber 152 is sealed by the second door 134 and the door 162.

The fixing table 154 is disposed at a lower portion of the vapor deposition chamber 152, and when the jack L is lowered, the first donor substrate 200 is placed and fixed. At this time, when the second donor substrate 210 performs the organic film vapor deposition step using Joule heating according to the present invention, the organic film 1 coated on the first donor substrate 200 is vapor-deposited onto the element substrate 220. The function of the medium.

The fixing portion 156 is disposed at an upper portion of the vapor deposition chamber 152 for fixing the second donor substrate 210, and is detachably assembled with the second donor substrate 210 by bolts or screws, etc., so that the second application layer The body substrate 210 can be electrically connected to the power supply device 160 through the disk P.

Further, in order to process the organic film vapor deposition step, the fixing portion 156 is moved up and down by the driving portion 158 so as to maintain a minimum distance between the first donor substrate 200 and the second donor substrate 210.

At this time, the fixing portion 156 can fix the second donor substrate 210 from the upper portion using a chuck such as an electrostatic chuck, a vacuum chuck, or a magnet.

Next, as shown in FIG. 13, after the process of vapor-depositing the organic film from the first donor substrate 200 onto the second donor substrate 210 is completed, the first donor substrate 200 passes through the second gate 134 from the evaporation chamber 152. It is discharged and re-introduced into the coating device 112 through the first door 132.

Next, as shown in FIG. 14, after the first donor substrate 200 is discharged from the vapor deposition chamber 152, the element substrate 220 can be introduced into the vapor deposition chamber 152 from the gate 162 of the vapor deposition chamber 152 by the element substrate transfer device 170.

Next, as shown in FIG. 15, the element substrate 220 and the second donor substrate 210 on which the organic film 1 is deposited are kept at a minimum distance d. At this time, the driving unit 158 is coupled to the upper portion of the vapor deposition chamber 152, and the fixing portion 156 to which the second donor substrate 210 is fixed is vertically moved by the control of the control unit 102.

Next, power is supplied from the power supply device 160 to the second donor substrate 210 to apply an electric field to the second donor substrate 210, thereby transferring the organic film evaporated on the second donor substrate 210 onto the element substrate 220. Thereby, an organic film is vapor-deposited on the element substrate 220.

In the vapor deposition device 150, the first donor substrate 200 or the element substrate 220 is disposed in the lower portion of the vapor deposition chamber 152, and the second donor substrate 210 is disposed on the upper portion. The first donor substrate 200 or the element substrate 220 is opposed to the second donor substrate 210, and can be modified and deformed into various forms.

Further, in the present embodiment, the second donor substrate 210 is driven to move up and down to be adjacent to the first donor substrate 200 or the element substrate 220, but as another example, the first donor substrate 200 or the element substrate 220 is moved. It is also obvious that they can be adjacent. On the other hand, although not shown, an inverting device capable of inverting the element substrate 220 or the donor substrates 220 and 221 may be provided between the respective devices as needed.

As described above, the continuous manufacturing system 300 of the organic light-emitting device of the present invention vapor-deposits the organic film onto the element substrate 220 by the Joule heating method using the first donor substrate 200 and the second donor substrate 210, and repeats This treatment is performed to reduce the loss of organic matter and to shorten the process time.

FIG. 16 is an enlarged cross-sectional view showing an enlarged example of a first donor substrate in the vapor deposition device shown in FIG. 12. FIG.

As shown in FIG. 16, the first donor substrate 200 for vapor-depositing the organic film 1 may be formed with a first base layer 201, and a first electrothermal layer 203 formed on the first base layer 201. The first organic material 1-1 can be coated with a solution; and the first conductive layer 202 is formed on the first base layer 201 to apply an electric field to the first electric heating layer 203, and to the first electric heating layer 203 electrical connection.

For example, the first conductive layer 202 and the first electrothermal layer 203 are both one type of a conductive film, and the first conductive layer 202 may include copper, aluminum, platinum, gold, or the like having excellent conductivity, thereby uniformly dispersing and transmitting current. The action to the first electrothermal layer 203 or the role of the terminals.

Further, for example, the first electrothermal layer 203 may contain components such as nickel, chromium, carbon, quartz, and the like having excellent electrothermal characteristics, thereby exerting a function of receiving current from the first conductive layer 202 and converting it into electric resistance heat.

Thereby, the first electrothermal layer 203 can be instantaneously heated by Joule heat, whereby the coated organic film 1 is vapor-deposited onto the second donor substrate 210 in a planar shape.

Fig. 17 is an enlarged cross-sectional view showing an enlarged example of a second donor substrate in the vapor deposition device shown in Fig. 14;

As shown in FIG. 17, the second donor substrate 210 for vapor-depositing the organic film 1 may be formed with a second base layer 211 and a second electrothermal layer 213 formed on the second base layer 211. Corresponding to the first electrothermal layer 203, when an electric field is applied to the first donor substrate 200, the first organic substance 1-1 can be coated on the first donor substrate 200 Sub-vapor deposition onto the second electrothermal layer 213; and a second conductive layer 212 electrically connected to the second electrothermal layer 213 to apply an electric field to the second electrothermal layer 213.

For example, the second conductive layer 212 and the second electrothermal layer 213 are both one type of a conductive film, and the second conductive layer 212 may include copper, aluminum, platinum, gold, or the like having excellent conductivity, thereby uniformly dispersing and transmitting current. The action to the second electric heating layer 213 or the role of the terminal.

Further, for example, the second electrothermal layer 213 may contain components such as nickel, chromium, carbon, quartz, and the like having excellent electrothermal characteristics, thereby exhibiting reception from the second conductive layer 212. The current is converted into electrical resistance heat.

Thereby, the second electrothermal layer 213 can be instantaneously heated by Joule heat, whereby the once-vapor-deposited organic film 1 is secondarily vapor-deposited onto the element substrate 220 in a planar shape.

In the above, the structure and operation of the organic film vapor deposition apparatus using the Joule heating according to the present invention have been described in detail and illustrated. However, this is merely an explanation of the embodiments, and can be carried out without departing from the technical idea of the present invention. Various changes and changes.

130‧‧‧Load lock room

132‧‧‧ first door

134‧‧‧ second door

150‧‧‧Vapor deposition unit

152‧‧‧vaporation chamber

154‧‧‧Fixed table, workbench

156‧‧‧ Fixed Department

158‧‧‧ Drive Department

160‧‧‧Power supply

162‧‧‧

200, 210‧‧‧ body substrate

Claims (15)

An organic film evaporation apparatus comprising an evaporation apparatus, a first donor substrate or an element substrate coated with an organic film is placed in the vapor deposition apparatus and opposed to a second donor substrate on which a conductive film is formed Is characterized in that the vapor deposition device applies an electric field to the conductive film of the first donor substrate coated with the organic film to generate Joule heat, thereby coating the organic film coated on the first donor substrate Evaporating onto the second donor substrate, and then applying an electric field to the conductive film of the second donor substrate on which the organic film is evaporated to generate Joule heat, thereby depositing on the second donor substrate The organic film is evaporated onto the element substrate. The organic film evaporation apparatus according to claim 1, further comprising: coating means for coating the organic film on the first donor substrate on which the conductive film is formed. The organic film evaporation device according to claim 2, further comprising: a load lock chamber for receiving the first donor substrate coated with the organic film from the coating device and putting it into In the vapor deposition device, the first donor substrate discharged from the vapor deposition device is received. The organic film evaporation device according to claim 1, wherein the vapor deposition device comprises: an evaporation chamber; a fixing platform disposed on one side of the vapor deposition chamber for arranging the second donor substrate; a fixing portion disposed on the other side of the vapor deposition chamber to be opposite to the second donor substrate Fixing the first donor substrate and lifting it up; a driving portion for moving the fixing portion to make the first donor substrate approach or away from the second donor substrate; and a power supply device And applying an electric field to the conductive film of the first donor substrate or the second donor substrate. The organic film evaporation device according to claim 1, wherein the vapor deposition device comprises: a vapor deposition chamber; and a fixing table disposed on one side of the vapor deposition chamber for placing the first application a fixing portion facing the first donor substrate for fixing the second donor substrate and lifting the same; and a power supply device for the first donor substrate or the second An electric field is applied to the donor substrate; and a driving portion for moving the fixing portion. The organic film evaporation device according to claim 1, wherein the coating device comprises: a coating chamber forming an internal space for accommodating the first donor substrate; and a work table disposed at the a lower portion of the coating chamber for placing the a first donor substrate; an organic substance supply device for supplying an organic substance; and a showerhead for receiving an organic substance from the organic substance supply device, and ejecting an organic substance to the first donor substrate placed on the table, thereby The organic material is coated on the first donor substrate. The organic film evaporation apparatus according to claim 4 or 5, further comprising: a side support portion provided in the vapor deposition chamber for the component to be input into the vapor deposition chamber The substrate is supported. The organic film vapor deposition apparatus according to claim 4, wherein the vapor deposition chamber is provided with a lower support that protrudes toward an upper portion of a side surface of the table located at a lower portion and a part of the end portion is bent. a portion or one or more central support portions located at an upper portion of the table to support the element substrate input into the vapor deposition chamber and prevent a central portion of the element substrate from sagging. The organic film evaporation device according to claim 3, wherein the vapor deposition device is a part of a leaf type device connected to a plurality of coating devices and a loading and unloading device, and the loading and unloading device is The element substrate is loaded into or unloaded from the vapor deposition device. An evaporation device, comprising: a vapor deposition chamber; a fixing table disposed on one side of the vapor deposition chamber for placing a second donor substrate; a fixing portion opposite to the second donor substrate for fixing the first donor substrate and lifting the same; and a power supply device for applying an electric field to the first donor substrate or the second donor substrate And a driving portion for moving the fixing portion. An evaporation device, comprising: a vapor deposition chamber; a fixing table disposed on one side of the vapor deposition chamber for accommodating a first donor substrate; a fixing portion, and the first donor substrate Oppositely for fixing the second donor substrate and lifting the same; a power supply device for applying an electric field to the first donor substrate or the second donor substrate; and a driving portion for moving the fixing portion . The vapor deposition device according to claim 10 or 11, further comprising: a side support portion provided in the vapor deposition chamber for performing the element substrate input into the vapor deposition chamber support. The vapor deposition device according to claim 10 or 11, wherein the vapor deposition chamber is provided with a lower support portion that protrudes toward an upper portion of the side surface of the table and that is bent at a part of the end portion, or is located at the One or more central support portions on the upper portion of the table are configured to support the element substrate input into the vapor deposition chamber and prevent the central portion of the element substrate from sagging. An organic film evaporation method, comprising the steps of: coating an organic film on a first donor substrate on which a conductive film is formed; and introducing a first donor substrate coated with an organic film into an evaporation device; Supplying power to the first donor substrate by the power supply device, thereby applying an electric field to the conductive film of the first donor substrate; transferring the organic film coated on the first donor substrate to which the electric field is applied to the second donor substrate Thereby, the organic substrate is vapor-deposited on the second donor substrate; the first donor substrate is discharged from the vapor deposition chamber; the component substrate is introduced into the vapor deposition device by the transfer device; and the second donor substrate is supplied from the power supply device Thereby, an electric field is applied to the conductive film of the second donor substrate; the organic film evaporated on the second donor substrate to which the electric field is applied is transferred onto the element substrate, thereby evaporating the organic film on the element substrate; In the vapor deposition device, an element substrate on which an organic film is deposited is discharged. An organic film device produced by the organic film evaporation method described in claim 14.