KR20160105479A - 점성 유체 디스펜싱 시스템을 위한 교정 방법들 - Google Patents
점성 유체 디스펜싱 시스템을 위한 교정 방법들 Download PDFInfo
- Publication number
- KR20160105479A KR20160105479A KR1020167020856A KR20167020856A KR20160105479A KR 20160105479 A KR20160105479 A KR 20160105479A KR 1020167020856 A KR1020167020856 A KR 1020167020856A KR 20167020856 A KR20167020856 A KR 20167020856A KR 20160105479 A KR20160105479 A KR 20160105479A
- Authority
- KR
- South Korea
- Prior art keywords
- fluid
- reference point
- dot
- computer
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000012937 correction Methods 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims abstract description 5
- 238000012935 Averaging Methods 0.000 claims 1
- 238000013459 approach Methods 0.000 description 9
- 230000033001 locomotion Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 241001572615 Amorphus Species 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012804 iterative process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/0092—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume for metering by volume
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
- G05B19/4015—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes going to a reference at the beginning of machine cycle, e.g. for calibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
- G01D18/001—Calibrating encoders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39026—Calibration of manipulator while tool is mounted
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45235—Dispensing adhesive, solder paste, for pcb
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45238—Tape, fiber, glue, material dispensing in layers, beads, filling, sealing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/50—Machine tool, machine tool null till machine tool work handling
- G05B2219/50033—Align tool, tip with a calibration mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fluid Mechanics (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Feedback Control In General (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361921850P | 2013-12-30 | 2013-12-30 | |
| US61/921,850 | 2013-12-30 | ||
| US14/560,032 US10082417B2 (en) | 2013-12-30 | 2014-12-04 | Calibration methods for a viscous fluid dispensing system |
| US14/560,032 | 2014-12-04 | ||
| PCT/US2014/069263 WO2015102821A1 (en) | 2013-12-30 | 2014-12-09 | Calibration methods for a viscous fluid dispensing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160105479A true KR20160105479A (ko) | 2016-09-06 |
Family
ID=53481317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167020856A Withdrawn KR20160105479A (ko) | 2013-12-30 | 2014-12-09 | 점성 유체 디스펜싱 시스템을 위한 교정 방법들 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10082417B2 (enExample) |
| JP (1) | JP6549131B2 (enExample) |
| KR (1) | KR20160105479A (enExample) |
| CN (1) | CN105849658B (enExample) |
| DE (1) | DE112014006090T5 (enExample) |
| WO (1) | WO2015102821A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9815081B2 (en) | 2015-02-24 | 2017-11-14 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
| US10881005B2 (en) * | 2016-06-08 | 2020-12-29 | Nordson Corporation | Methods for dispensing a liquid or viscous material onto a substrate |
| WO2018006050A1 (en) | 2016-06-30 | 2018-01-04 | Beckman Coulter, Inc. | Substance dispense evaluation system |
| CN108876859B (zh) * | 2018-04-28 | 2022-06-07 | 苏州赛腾精密电子股份有限公司 | 一种点胶机的标定方法、装置、设备和介质 |
| JP7604343B2 (ja) * | 2021-09-16 | 2024-12-23 | キヤノン株式会社 | 液体吐出装置、液体吐出方法、成形装置及び物品の製造方法 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US224180A (en) * | 1880-02-03 | Bag-tie | ||
| US4812666A (en) | 1987-09-17 | 1989-03-14 | Universal Instruments Corporation | Position feedback enhancement over a limited repositioning area for a moveable member |
| US5138868A (en) * | 1991-02-13 | 1992-08-18 | Pb Diagnostic Systems, Inc. | Calibration method for automated assay instrument |
| US6224180B1 (en) | 1997-02-21 | 2001-05-01 | Gerald Pham-Van-Diep | High speed jet soldering system |
| US6186609B1 (en) * | 1997-10-27 | 2001-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd | Apparatus and method for dispensing ink on an object |
| SE9901253D0 (sv) | 1999-04-08 | 1999-04-08 | Mydata Automation Ab | Dispensing assembly |
| SE0003647D0 (sv) * | 2000-10-09 | 2000-10-09 | Mydata Automation Ab | Method, apparatus and use |
| US20030113233A1 (en) * | 2001-10-26 | 2003-06-19 | Elizabeth Nanthakumar | Resin dispensing device |
| JP3838964B2 (ja) | 2002-03-13 | 2006-10-25 | 株式会社リコー | 機能性素子基板の製造装置 |
| US6991825B2 (en) * | 2002-05-10 | 2006-01-31 | Asm Assembly Automation Ltd. | Dispensation of controlled quantities of material onto a substrate |
| JP4121014B2 (ja) * | 2002-07-18 | 2008-07-16 | アスリートFa株式会社 | ニードル位置補正方法およびポッティング装置 |
| US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
| TWI251722B (en) * | 2002-09-20 | 2006-03-21 | Asml Netherlands Bv | Device inspection |
| US20040148763A1 (en) | 2002-12-11 | 2004-08-05 | Peacock David S. | Dispensing system and method |
| CN100518954C (zh) | 2003-05-23 | 2009-07-29 | 诺德森公司 | 利用非接触式投放器将粘性物质喷射到基底上的方法 |
| US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
| CN1819922A (zh) | 2003-07-10 | 2006-08-16 | 皇家飞利浦电子股份有限公司 | 用于将图案准确定位在基片上的方法和设备 |
| US20050079106A1 (en) * | 2003-10-10 | 2005-04-14 | Baker Rodney W. | Robotic filling device |
| JP2005246130A (ja) * | 2004-03-01 | 2005-09-15 | Seiko Epson Corp | 液滴吐出装置 |
| US7708362B2 (en) * | 2004-04-21 | 2010-05-04 | Hewlett-Packard Development Company, L.P. | Printhead error compensation |
| US20060029724A1 (en) | 2004-08-06 | 2006-02-09 | Nordson Corporation | System for jetting phosphor for optical displays |
| KR20070093053A (ko) | 2004-11-15 | 2007-09-17 | 크레던스 시스템스 코포레이션 | 집속 이온 빔 데이터 분석에 관한 시스템 및 방법 |
| JP2008532048A (ja) * | 2005-03-07 | 2008-08-14 | ノブックス システムズ インコーポレーテッド | 自動分析器 |
| EP1701231A1 (en) | 2005-03-08 | 2006-09-13 | Mydata Automation AB | Method of calibration |
| US20080006653A1 (en) * | 2006-03-13 | 2008-01-10 | Biomachines, Inc. | Small volume liquid handling system |
| KR100884834B1 (ko) * | 2006-05-16 | 2009-02-20 | 주식회사 탑 엔지니어링 | 페이스트 도포기의 기판 정렬 방법 |
| US7833572B2 (en) | 2007-06-01 | 2010-11-16 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
| JP4661840B2 (ja) * | 2007-08-02 | 2011-03-30 | セイコーエプソン株式会社 | アライメントマスクおよびドット位置認識方法 |
| US8765212B2 (en) | 2007-09-21 | 2014-07-01 | Nordson Corporation | Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material |
| US7531047B1 (en) * | 2007-12-12 | 2009-05-12 | Lexmark International, Inc. | Method of removing residue from a substrate after a DRIE process |
| JP2010117441A (ja) * | 2008-11-11 | 2010-05-27 | Konica Minolta Holdings Inc | アライメントマスク及びアライメントマスクを用いた着弾ドット位置の測定方法 |
| JP2011222705A (ja) * | 2010-04-08 | 2011-11-04 | Canon Inc | インプリント装置およびインプリント基板の製造方法 |
| CA2835713C (en) | 2011-05-13 | 2023-04-04 | Fibics Incorporated | Microscopy imaging method and system |
| JP2013237005A (ja) * | 2012-05-15 | 2013-11-28 | Sumitomo Heavy Ind Ltd | 薄膜形成装置及び薄膜形成装置の調整方法 |
| AU2013289898A1 (en) * | 2012-07-13 | 2015-01-22 | Roche Diagnostics Hematology, Inc. | Controlled dispensing of samples onto substrates |
| US8944001B2 (en) * | 2013-02-18 | 2015-02-03 | Nordson Corporation | Automated position locator for a height sensor in a dispensing system |
| US9374905B2 (en) * | 2013-09-30 | 2016-06-21 | Illinois Tool Works Inc. | Method and apparatus for automatically adjusting dispensing units of a dispenser |
-
2014
- 2014-12-04 US US14/560,032 patent/US10082417B2/en active Active
- 2014-12-09 CN CN201480071470.5A patent/CN105849658B/zh active Active
- 2014-12-09 WO PCT/US2014/069263 patent/WO2015102821A1/en not_active Ceased
- 2014-12-09 JP JP2016544078A patent/JP6549131B2/ja active Active
- 2014-12-09 KR KR1020167020856A patent/KR20160105479A/ko not_active Withdrawn
- 2014-12-09 DE DE112014006090.9T patent/DE112014006090T5/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017512120A (ja) | 2017-05-18 |
| US20150184996A1 (en) | 2015-07-02 |
| CN105849658A (zh) | 2016-08-10 |
| DE112014006090T5 (de) | 2016-11-03 |
| US10082417B2 (en) | 2018-09-25 |
| WO2015102821A1 (en) | 2015-07-09 |
| JP6549131B2 (ja) | 2019-07-24 |
| CN105849658B (zh) | 2019-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20160729 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |