KR20160092498A - Resin sealing method and resin sealing apparatus - Google Patents

Resin sealing method and resin sealing apparatus Download PDF

Info

Publication number
KR20160092498A
KR20160092498A KR1020160008192A KR20160008192A KR20160092498A KR 20160092498 A KR20160092498 A KR 20160092498A KR 1020160008192 A KR1020160008192 A KR 1020160008192A KR 20160008192 A KR20160008192 A KR 20160008192A KR 20160092498 A KR20160092498 A KR 20160092498A
Authority
KR
South Korea
Prior art keywords
resin
mold
substrate
lower mold
molding
Prior art date
Application number
KR1020160008192A
Other languages
Korean (ko)
Other versions
KR101764525B1 (en
Inventor
요헤이 오니시
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160092498A publication Critical patent/KR20160092498A/en
Application granted granted Critical
Publication of KR101764525B1 publication Critical patent/KR101764525B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The object of the present invention is to solve the problem of resin sealing molding due to unevenness in the thickness (T) of each substrate fed to the resin sealing mold.
Two resin passage sections 28 and two resin molding sections 29 and a lower mold 18 around the outer periphery of the resin molding section 29. The resin injection section 23 of the lower mold 18, 1) having a size (width) capable of covering the mold surface of the substrate 19 is prepared. The substrate 19 is set on the substrate set portion 13a of the upper mold 13 with the paired sealing parts 19a mounted on the substrate 19 facing downward. The two groups of the pervious pieces 19a on the substrate 19 are accommodated in the two resin molding portions 29 formed on the lower mold 18 when the upper and lower staples 13 · 18 are clamped. Shaped member 19a on the substrate 19 in each of the resin molding sections 29 is made to be a resin made of a solidified resin by solidifying the fluid resin in each of the resin molding sections 29 while keeping the mold- Seal in the package.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation method and a resin encapsulation apparatus for encapsulating an encapsulated part such as an electronic part mounted on a substrate. More specifically, the present invention relates to an improvement which effectively prevents problems such as defective molding due to the difference in thickness of the respective substrates supplied to the resin-sealing mold.

A resin sealing method and a resin sealing apparatus in which two substrates are fed to a resin sealing mold and the pierced parts on the respective substrates are resin sealed at the same time to achieve high efficiency production is widely known.

For example, as schematically shown in Fig. 5, the resin-sealing mold 1 mounted on the resin-sealing apparatus is composed of an upper mold 1a and a lower mold 1b which are vertically opposed to each other have.

A curled block 2 having culls 2a is provided at a central position of the upper mold 1a and adjacent to the curled block 2 at both sides thereof for setting the substrate 3 A substrate set block 4 provided with a substrate set portion 4a is disposed.

A port block 5 is formed at the position of the lower mold 1b corresponding to the upper curl block 2 and at the position of the lower mold 1b corresponding to the upper mold block 4, 6a (resin-molded portion) are formed in the cavity block 6.

A port 5a for supplying the resin material 7 is formed in the port block 5 of the lower mold and a resin material for heating and melting in the port 5a is formed in the port 5a. A plunger 8 (resin pressing member) for pressing the pressing member 7 is inserted.

As shown in Fig. 5 (2), the port block 5 and the cavity block 6 are provided with a plurality of ports 5a which are heated and melted in the ports 5a when the upper and lower leaves 1a, Gates 5b and 6b (resin passages) for transferring the molten resin 7a into the cavity 6a are formed.

In order to simultaneously seal the pierced parts 3a on the two substrates 3 with the resin-sealing mold 1, first, the upper and lower molds 1a and 1b shown in FIG. 5 (1) A releasing film 9 is extended to the mold surface of the lower mold 1b and the resin material 7 is stuck to the port of the lower mold 1b through this releasing film 9, And the two substrates 3 are separately supplied to the substrate set portion 4a of the upper substrate set block 4 and set.

On the other hand, at this time, the pierced part 3a on the substrate 3 is set in a downward attitude.

Next, as shown in Fig. 5 (2), the upper and lower staples 1a and 1b are clamped so that the to-be-sealed parts 3a on the substrate 3 are clamped by the lower mold 1b In the cavity 6a.

Next, the mold clamping pressure by the upper and lower molds 1a and 1b is applied to each substrate 3, and in this state, the molten resin 7a heated and melted in the port 5a is held by the plunger 8 And the molten resin is injected into each of the cavities 6a through the gates 5b and 6b.

On the other hand, the molten resin 7a is solidified by a heating action by the upper and lower deflecting types 1a and 1b and a predetermined resin pressure by the plunger 8 to form a solidified resin (not shown). The pierced part 3a set in each cavity 6a is sealed in a resin package made of a solidified resin which is formed corresponding to the shape of the cavity 6a and is sealed between the port 5a and each cavity 6a A solidified resin which is unnecessary as a product is formed in the space portion constituted by the resin passage portion constituted by the curled elastic member 2a and the gates 5b and 6b.

However, there are cases where the thicknesses T1 and T2 of the two substrates 3 supplied between the upper and lower defects 1a and 1b are different from each other. In this state, when the upper and lower shafts 1a and 1b are clamped, a high clamping pressure is applied to the thicker one (thickness T1), and on the other hand, the thinner one (thickness T2) A low mold clamping pressure is applied.

Therefore, the mold clamping pressure for each substrate 3 is uneven, and so-called mold contact balance is deteriorated. When the molten resin 7a in the port 5a is injected under pressure into the respective cavities 6a through the gates 5b and 6b in the state where the mold clamping pressure for each substrate 3 is uneven, A part of the molten resin 7a leaks from portions of both upper and lower mold surfaces where mold clamping pressure is insufficient to form a resin burr or a part of the substrate which has undergone excessive mold clamping is broken, And the like.

The pierced part 3a on the substrate 3 is sandwiched in the cavity 6a of the lower mold 1b with the release film 9 interposed therebetween and the surface of the part to be pierced The surface of the component to be sealed 3a is exposed to the outside from the molded resin package corresponding to the shape of the cavity 6a by setting the state in which the film 9 is in pressure contact with the bottom surface of the cavity 6a .

However, the to-be-sealed parts 3a on the substrate with the thinner substrate 3 (thickness T2) can be set to be in contact with the bottom surface of the cavity 6a via the release film 9 (See (2) in FIG. 5), there is a problem that the surface of the component to be sealed 3a can not be molded in a state exposed to the outside of the resin package.

When the two substrates 3 are separately supplied to the substrate set portion 4a of the upper substrate set block 4 to set the molten resin 7a in the port 5a to the gate 5b And the predetermined resin pressure is applied to the molten resin 7a through the grooves 6a and 6b in the respective cavities 6a and on the end face 3b on the curl block 2 side of each substrate 3 A part of the molten resin 7a intrudes to form resin burrs, which results in a problem of deteriorating the quality of the resin-sealed substrate as a molded product.

Further, it is proposed that two sheets of substrates are supplied to the upper mold in a state in which the end surfaces of the two substrates are bonded to each other (see Patent Document 1).

In this case, similarly to the above, the pic- tured parts on the two substrates can be sealed and molded substantially simultaneously.

However, in the case of Patent Document 1, it is necessary that the thickness of the two substrates to be set and supplied to the upper mold is the same.

Therefore, when the thicknesses of the two substrates are different from each other, there is a problem that a resin sealing with high efficiency can not be expected.

In addition, when the thicknesses of the two substrates are different from each other, the mold clamping pressure adjusting means (floating structure or the like) for absorbing variations in the thickness of each substrate 3 must be employed, There is a problem that the mold structure of the mold becomes complicated and large and the overall manufacturing cost of the resin-sealing mold and the resin-sealing apparatus is increased.

[Patent Document 1] JP-A-2007-307766 (paragraph [0013], paragraph [0026], paragraph [0046], and Figs. 3, 5,

It is an object of the present invention to solve the problem of resin sealing molding caused by unevenness of the thickness of each substrate supplied to the resin sealing mold and to eliminate the need for a conventional mold clamping pressure adjusting means, And a resin encapsulating device for carrying out the method.

In order to solve the above-mentioned problems, the resin encapsulation method according to the present invention comprises:

Wherein the resin-sealing mold having at least upper and lower molds facing each other has a resin supply portion, and the fluid resin in the resin supply portion is injected into the resin molding portion through the resin passage portion to solidify the fluid resin in the resin molding portion, Forming a resin package made of the solidified resin and sealing the pic- tured parts on one substrate supplied to the resin molding part in the resin package,

The resin supply portion is disposed at a central position of the lower mold and at least two resin passage portions communicating with the resin supply portion are provided at positions adjacent to the resin supply portion, A step of preparing the lower mold,

Wherein a substrate set portion in which the one substrate is set in a posture in which the to-be-sealed parts on the one substrate are downward is disposed in the upper mold, and the to-be-sealed parts on the one set substrate, A step of preparing the upper mold so as to have a shape conforming to a position corresponding to an arrangement position of the at least two resin molding parts;

Preparing the one substrate having a size capable of covering a mold surface of the lower mold positioned at the outer periphery of the resin supply portion, the at least two resin passage portions, the at least two resin molding portions, and the resin molding portion;

A substrate carrying step of carrying the one substrate between the upper mold and the lower mold,

A substrate setting step of setting the one substrate to the substrate setting part of the upper die in a posture in which the to-be-

A resin supplying step of supplying a resin material into the resin supplying part,

A mold clamping step of clamping the upper mold and the lower mold by closing the mold face of the upper mold and the mold face of the lower mold after the substrate setting step and the resin supplying step to accommodate the pierced parts in the respective resin molding parts and,

A mold clamping and holding step for holding the upper mold and the lower mold in a clamped state

/ RTI >

In the mold clamping and holding step, the fluid resin generated from the resin material in the resin supply portion is injected into the resin molding portion through the resin passage portion, and the fluid resin in the resin molding portion is solidified, Sealing a part in the resin package

.

In the resin sealing method according to the present invention,

And a releasing film laying process in which a releasing film is stretched on the mold surface of the lower mold before the resin supplying step

There is an aspect to say.

Further, in the resin sealing method according to the present invention,

And a release film laying step of laying a release film on the mold surface of the lower mold before the resin supplying step,

In the mold clamping step, the pic- ture-sealed component accommodated in the resin molding section and the release film stretched in each resin molding section are brought into pressure contact with each other

There is an aspect to say.

In order to solve the above-mentioned problems, the resin-

And a resin passage portion through which the fluid resin in the resin supply portion flows, wherein the resinous sealing portion comprises a resinous sealing mold in which at least an upper mold and a lower mold are opposed to each other, a resin supply portion formed in the lower mold, Is injected into the resin molding section from the resin supply section through the resin passage section to solidify the fluid resin in the resin molding section to mold a resin package made of a solidified resin, A sealing apparatus for sealing a pierced component on a resin package,

The resin supply portion disposed at a central position of the lower mold,

At least two resin passage portions disposed at positions adjacent to the resin supply portion and communicating with the resin supply portion, respectively,

At least two resin molding portions disposed so as to sandwich the at least two resin passage portions,

The substrate set part

And,

Wherein when the one substrate is set in the substrate setting portion in a posture in which the pierced component is downward, the pierced component matches the position corresponding to the arrangement position of the at least two resin molded portions in the lower mold And the resin supply part, the at least two resin molding parts, and the at least two resin mold parts, so as to cover the resin supply part, the at least two resin passage parts, the at least two resin molding parts, And the mold surface of the lower mold positioned at the outer periphery of the two resin passage portions, the at least two resin molding portions, and the resin molding portion,

Characterized in that, in a state in which the upper mold and the lower mold are clamped, each of the to-be-sealed parts on the one substrate is housed separately in the respective resin molding parts, and the fluid resin in the resin supplying part is passed through the resin passage part Wherein the resin-molded part is injected into the resin-molded part, the fluidic resin is solidified in the resin-molded part, and the pierced part on the one substrate set on the resin- Sealed

.

In the resin-sealing apparatus according to the present invention,

And a releasing film firing mechanism for laying a release film on the mold surface of the lower mold

There is an aspect to say.

In the resin-sealing apparatus according to the present invention,

And a releasing film laying mechanism for laying a releasing film on the die surface of the lower die,

The release film stretched by the releasing film installation mechanism and the pierced component are brought into pressure contact with each other when the upper and lower molds are clamped

There is an aspect to say.

According to the present invention, it is possible to arrange a single substrate so as to cover the entirety of the mold surface in the lower mold (lower mold main body) in which at least two resin molding portions are arranged at the time of clamping the upper and lower molds. When the substrate is arranged in this manner, the thickness of the substrate does not vary. Because of this, the mold clamping pressure by the resin seal mold can be uniformly applied to one substrate, so that the mold contact balance becomes good. Therefore, defective molding caused by the problem of mold contact balance can be prevented efficiently and reliably.

Further, according to the present invention, there is no need for a conventional mold clamping pressure adjusting means which is provided in parallel to the thickness variation of the two substrates supplied between the upper and lower molds. Therefore, the mold structure of the resin-sealing mold can be simplified and reduced, and the overall manufacturing cost of the resin-sealing mold and the resin-sealing apparatus can be reduced.

Fig. 1 schematically shows a main part of a resin-sealing apparatus according to the present invention, and is a partially cut-away front view showing a state in which a substrate, a resin material, and a release film are transferred to a resin-
Fig. 2 shows a main part of the resin sealing apparatus corresponding to Fig. 1, and Fig. 2 (1) is a front view showing a part of the resin sealing mold part when the mold is opened. Fig. 2 (2) Fig.
Fig. 3 shows a resin-sealed mold part corresponding to Fig. 2, and Fig. 3 (1) is a partially cut-away front view when the mold is clamped, and Fig. 3 (2) 3 (3) is a plan view of the molded article, and (4) of FIG. 3 is a bottom view of the molded article.
Figures 4 (1) to 4 (6) are explanatory diagrams of the steps of the method of the present invention.
Fig. 5 is an explanatory view of a problem in the prior art. Fig. 5 (1) is a partially cut front view when the resin-sealed mold portion is opened, and Fig. 5 (2) Front view.

Hereinafter, the present invention will be described based on the drawings of the embodiments shown in Figs. 1 to 4. Fig.

First, an outline of the resin encapsulation device 10 according to the present invention will be described with reference to Fig.

The resin sealing device 10 is provided with an upper mold 13 fixed to the lower surface of the fixing plate 12 through an upper mold base 11 and a lower mold 13 fixed on the table 14 of the resin sealing device 10 (Lower mold) 18 mounted on the upper surface of the movable base 16, which is vertically movable by the up-and-down driving mechanism 15, via the lower base 17. As shown in Fig.

The mold surface (lower surface) of the upper mold 13 and the mold surface (upper surface) of the lower mold 18 are arranged vertically opposed to each other. The upper and lower molds 13 and 18 constitute a resin sealing mold.

On the other hand, when the up-and-down driving mechanism 15 moves the movable mold 16, the lower mold base 17 and the lower mold 18 up and down, a mold opening (see Fig. 1) for opening between the mold faces of the upper and lower molds 13, (See Fig. 3 (1)) for closing the mold surfaces of the upper and lower molds 13, 18, as shown in Fig. Therefore, the up-and-down driving mechanism 15 constitutes a mold opening / closing mechanism.

The substrate set portion 13a in the mold surface of the upper die 13 is configured such that the substrate 19 on which the plurality of pierced parts 19a are mounted is hooked in a posture in which the piercing component 19a is downward The substrate holding mechanism 20 is provided. A seal member 21 for sealing a predetermined range of the upper and lower staples 13 · 18 is disposed at the mold surface position of the upper mold 13 which is the periphery of the substrate engaging mechanism 20.

Reference numeral 20a in the drawing denotes an air intake hole formed by communicating with a substrate adsorption mechanism (not shown) for adsorbing the substrate 19 on the mold surface of the upper die 13. [

On the other hand, the substrate 19 is formed as a single large-sized substrate which is formed by combining two substrates of a currently used size (for example, a rectangular substrate having a size of about 100 mm x 300 mm).

The lower mold 18 is provided with a lower mold main body 22 provided on the lower mold base 17 and a resin supply port (port 23) provided at the center of the lower mold main body 22 to which the resin material R is supplied A resin presser member (plunger) 24 sandwiching the resin supply member 23 so as to be slidable and a vertical drive mechanism 25 for vertically moving the resin presser member 24 are provided have.

The air in the resin supply portion 23 is sucked from the gap between the resin supply portion 23 and the resin pressing member 24 to adsorb the release film 26 to the mold surface of the lower mold 18 (upper surface of the lower mold body 22) And a decompression mechanism 27 (see Fig.

On the other hand, at the time of clamping the upper and lower molds 13 and 18, the resin pressing member 24 is moved upward via the up-and-down driving mechanism 25, (The molten resin R1 shown in Fig. Therefore, the up-and-down driving mechanism 25 constitutes a resin pressurizing mechanism.

The releasing film 26 is brought into the mold surface position of the lower mold 18 (lower mold body 22) by a releasing film laying mechanism (not shown), and is coated on the mold surface of the lower mold 18. [

A plurality of resin passages 28 (gates in the example shown in the figure) are connected to the target positions on both sides of the resin supply portion 23 in the lower mold body 22 (Two) resin molding portions (cavities) 29 are formed. The plurality of pod pieces 19a are divided into the same number (two in the example of the drawing) as the two resin molding parts 29. [ The resin passage portion 28 may have an elongated flow path (runner).

3) of the top and bottom molds 13 and 18 (see Fig. 3 (1)) is provided on each of the resin molding portions 29, And the resin sealing portions 19b (see Fig. 2) at both side positions of the substrate 19 that is caught by the portion 13a can be fitted and set.

On the other hand, as shown in Fig. 2 (2), the resin supply portion 23 is formed into a rectangular shape in plan view. The shapes of the resin molding portions 29 disposed at the target positions on both sides of the resin supply portion 23 are also formed in a rectangular shape in plan view.

1, at the position on the lower base 17 facing the seal member 21 disposed in the upper die 13, at the time of clamping the upper and lower die 13 · 18, And a seal member 30 for sealing the outer periphery of the upper and lower guards 13 · 18 in cooperation with the member 21 is disposed.

On the other hand, the pressure-reducing mechanism 27 is provided so as to positively discharge air within a range (seal range) sealed by the seal members 21 and 30 out of the seal range.

The substrate 19 and the resin material R carry-in mechanism 31 are arranged in advance between the upper and lower positions 13 · 18 in the mold opening of the upper and lower molds 13 · 18 shown in FIG. The substrate 19 on the loading mechanism 31 can be moved to the predetermined position and the substrate 19 can be moved to the substrate set section 13a of the upper mold 13 through the substrate clamping mechanism 20 and the substrate suction mechanism So that it can be taken.

The loading mechanism 31 is provided so as to supply the resin material R on the loading mechanism 31 into the resin supplying portion 23 of the lower mold 18. [

The resin material R supplied to the resin supply portion 23 of the lower mold 18 is a solid resin such as a tablet resin or a sheet resin which is slightly smaller than the resin supply portion 23 . Any of the solid resin can be used in place of such a solid resin. For example, a solid resin such as a granular resin, a particulate resin, and a powdered resin, a jelly resin, a gel resin, and a liquid resin (resin that is liquid at room temperature) can be employed. If necessary, preliminarily heated tablet type resin or the like may be used.

Hereinafter, a case where the pierced parts 19a on the substrate 19 are collectively sealed by resin using the resin sealing apparatus 10 will be described.

First, the preparation process of the upper mold 13 and the lower mold 18 constituting the resin-sealing mold of the resin-sealing apparatus 10 are performed, and the preparation process of the substrate 19 is performed.

On the other hand, a resin supply portion 23 is disposed at the center of the lower mold 18. At least two resin molding portions 29 are disposed at positions adjacent to the resin supply portion 23 with a resin passage portion 28 communicating with the resin supply portion 23 interposed therebetween.

The upper mold 13 is provided with a substrate set portion 13a for setting the piercing member 19a on the substrate 19 in a downward direction. The part 19a to be sealed on the substrate 19 supplied and set to the substrate setting section 13a is aligned with the position corresponding to the arrangement position of the at least two resin molding sections 29 in the lower mold 18 Is set.

The size (width) of the substrate 19 is set such that the resin supply portion 23 of the lower mold 18, the resin passage portion 28, at least two resin molding portions 29 and the outer periphery of the resin molding portion 29 (The lower mold body 22) of the lower mold 18 (the lower mold body 22). In other words, in the resin-sealing apparatus 10, the resin supply portion 23, the resin passage portion 28, the resin molding portion 29, the lower mold 18 located around the outer periphery of the resin molding portion 29, The shape of each member 23, 28, 29, 18 is set so that the mold surface of the member 19 is covered by the substrate 19. The substrate 19 has a uniform thickness T of the substrate 19 and is molded as a single substrate. The expression "the thickness (T) of the substrate 19 is uniform" in the present application means that in the case where the one substrate 19 is resin-sealed with respect to the substrate 19, It means that the unevenness of the thickness T of the one substrate 19 is small to such an extent that the formation of resin burrs and the damage of the substrate 19 do not occur.

Next, the substrate carrying-in step and the resin carrying-in step for bringing the prepared substrate 19 and the resin material R between the upper and lower positions 13 · 18 are carried out through the carrying mechanism 31 (see FIGS. 1 and 4 (1)].

Next, a substrate setting process is performed in which the substrate 19 carried in the substrate loading step is supplied to the substrate set portion 13a of the upper die 13 in a posture in which the to-be-sealed component 19a is downwardly set.

On the other hand, in the substrate setting step, the substrate 19 can be held in a predetermined posture through the substrate jamming mechanism 20. In addition, the substrate 19 is attracted to the substrate set portion 13a of the upper die 13 more reliably by sucking the substrate 19 from the suction hole 20a through the substrate suction mechanism (not shown) (See (2) in FIG. 4).

In addition, a resin supplying step of supplying the resin material R carried in the resin supplying step into the resin supplying part 23 of the lower mold 18 is carried out.

When the resin material (R) is put into the resin supply part (23), the resin material is supplied so as to be put on the upper surface of the resin pressure member (24).

On the other hand, before the resin supplying step is carried out, the releasing film laying step of laying the releasing film 26 on the mold surface of the lower mold 18 (the lower mold body 22) is performed to remove the resin material R from the mold releasing film 26) in the resin supply portion 23 (see (1) and (4) in FIG. 2).

After the substrate setting step and the resin supplying step, a mold clamping step is performed in which the mold surfaces of the upper and lower molds 13, 18 are closed each other, and the upper and lower molds 13, 18 are clamped.

The substrate 19 is set in the substrate setting step so that the respective pieces 19a to be sealed on the substrate 19 are accommodated in the respective resin molding portions 29 of the lower mold 18 during the mold clamping process, (See (3) in Fig. 4).

Next, a resin sealing step is performed as shown in Figs. 3 (1) and 4 (4), while maintaining the clamped state (mold clamping and holding step). First, the resin material R supplied into the resin supply portion 23 is heated and melted to produce a molten resin (fluid resin) R1. Next, the molten resin R1 is pressed by the resin pressing member 24. Thereby, the molten resin R1 is injected into the respective resin molding portions 29 through the resin passage portion 28 and the resin (R1) pressurized at predetermined resin pressure in the respective resin molding portions 29 A sealing step is performed.

On the other hand, the molten resin R1 injected into each of the resin molding portions 29 is solidified by being heated while being subjected to predetermined resin pressure so that the resin sealing portions 19b of the substrate 19, (R2) is formed. The pierced parts 19a on the substrate 19 supplied and set in the respective resin molding parts 29 are each sealed in the resin package R2 to form a resin-sealed substrate 191 3 (2)].

Next, after the elapse of the elapsed time, the upper and lower die opening process for moving the upper and lower die 13 · 18 to the original position is performed (see FIG. 1).

The resin-sealed substrate 191 is easily released from the mold surface of the lower mold 18 (lower mold body 22) because the mold release film 26 is provided on the mold surface of the lower mold 18 in the embodiment. do. The die opening is performed with the resin-sealed substrate 191 held by the substrate setting portion 13a of the upper die 13 (see (5) in FIG. 4).

Next, the resin-sealed substrate 191 is released from the resin-sealed substrate 191 by the substrate holding mechanism 20 and the substrate suction mechanism to take out the resin-sealed substrate 191 between the upper and lower positions 13 · 18, It can be taken out to the outside through a mechanism (not shown).

On the other hand, before the resin supplying step, the step of forming the release film 26 on the mold surface of the lower mold 18 (lower mold body 22) is performed. Thereafter, during the mold clamping step, the exposed surface 19c of the pierced component 19a housed separately in the respective resin molding portions 29 of the lower mold 18 (e.g., 2) and 4 (6)) and the release film 26 provided in each resin molding section 29 are in pressure contact with each other.

Therefore, by performing the resin sealing process in this state, adhesion of the resin to the exposed surface 19c of the pierced component can be prevented.

4 (6), the resin-sealed substrate 191 is formed with a shape corresponding to the shape of each resin molding section 29, and the parts to be sealed 19a (excluding the exposed surface 19c) And the unnecessary resin R3 formed in correspondence with the shape of the resin passage portion 28 between the respective resin packages R2 are integrally adhered to each other.

According to this embodiment, at the time of clamping the upper and lower staples 13 · 18, one substrate 19 having a size corresponding to two substrates, for example, a rectangular shape having a size of about 100 mm × 300 mm The substrate having the same size (width) as that formed by one set of two substrates is arranged so as to cover the entirety of the mold surface of the lower mold 18 (lower mold body 22) in which the at least two resin molding portions 29 are disposed can do.

Since such a single substrate 19 does not have unevenness in the substrate thickness T, the mold clamping pressure by the resin sealing mold can be applied equally and simultaneously, so that the mold contact balance becomes good.

Therefore, defective molding caused by the problem of mold contact balance can be prevented efficiently and reliably, and high-efficiency production can be achieved.

Further, since the conventional mold clamping pressure adjusting means, which is provided in parallel with the thickness variation of the two substrates supplied between the upper and lower molds, is eliminated, the mold structure of the resin seal mold can be simplified and simplified, And the overall manufacturing cost of the resin sealing apparatus can be reduced.

On the other hand, in the embodiment, a case is shown in which the exposed surface 19c on which the resin is not adhered is formed on the pierced component 19a of the resin-sealed substrate 191. [ In the case where it is not necessary to form the exposed surface 19c and resin sealing is carried out so that the entirety of the pierced component 19a is covered with the solidified resin, the surface (bottom surface) It is only necessary to set a required gap between the release films 26 laid out in the support portion 29.

Further, in the embodiment, two resin passage portions 28 and two resin molding portions 29 are formed, respectively. N resin passage portions 28 and resin molded portions 29 may be formed respectively (N is an integer of N? 3). In this case, the plurality of pod pieces 19a are divided into N groups.

Although the embodiment uses the release film 26 as an example, the release film may not necessarily be used when a resin material having a good mold releasing function, a mold structure, a mold, or the like is used .

As the material of the substrate 19, any material can be used. For example, it is possible to adopt a lead frame made of metal, a printed circuit board having plastic, ceramic, glass, metal, or other materials as a base material.

The molded part 19a to be mounted on the substrate 19 may be an electronic device such as a semiconductor chip including an IC (Integrated Circuit) chip, an LED (Light Emitting Diode) chip, Parts and the like can be used.

As the resin material (R), any resin may be used. A tablet resin, a granular resin, a particulate resin, a powdered resin, a sheet resin, a jelly resin, a gel resin, a liquid resin, and the like can be suitably employed based on ease of handling and the like. When the liquid resin is used, the liquid resin itself corresponds to the liquid resin. If necessary, preliminarily heated tablet type resin may be used.

The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected appropriately within the range not deviating from the gist of the present invention.

10: resin sealing device 11: upper mold base
12: Fixing plate 13: Upper mold
13a: substrate setting section 14: table
15: Up and down driving mechanism 16:
17: Lower mold base 18: Lower mold
19: substrate 19a:
19b: resin sealing portion 19c: exposed surface
20: substrate engagement mechanism 20a:
21: seal member 22: lower body
23: resin supply part 24: resin pressing member
25: Up and down drive mechanism 26: Release film
27: Pressure reducing mechanism 28:
29: resin molding section 30: sealing member
31: Carrying mechanism R: Resin material
R1: molten resin (fluid resin) R2: resin package
R3: unnecessary resin T: thickness of substrate

Claims (6)

Wherein a resin sealing mold having at least a top mold and a bottom mold facing each other has a resin supply portion and the fluid resin in the resin supply portion is injected into the resin molding portion through the resin passage portion, A resin sealing step of sealing the resin-sealed part on one substrate supplied to the resin molding part in the resin package by molding a resin package made of the solidified resin by solidifying the fluid resin in the resin package,
The resin supply portion is disposed at a central position of the lower mold and at least two resin passage portions communicating with the resin supply portion are provided at positions adjacent to the resin supply portion, A step of preparing the lower mold,
Wherein a substrate set portion in which the one substrate is set in a posture in which the to-be-sealed parts on the one substrate are downward is disposed in the upper mold, and the to-be-sealed parts on the one set substrate, A step of preparing the upper mold so as to have a shape conforming to a position corresponding to an arrangement position of the at least two resin molding parts;
Preparing the one substrate having a size capable of covering a mold surface of the lower mold positioned at the outer periphery of the resin supply portion, the at least two resin passage portions, the at least two resin molding portions, and the resin molding portion;
A substrate carrying step of carrying the one substrate between the upper mold and the lower mold,
A substrate setting step of setting the one substrate to the substrate setting part of the upper die in a posture in which the to-be-
A resin supplying step of supplying a resin material into the resin supplying part,
A mold clamping step of clamping the upper mold and the lower mold by closing the mold face of the upper mold and the mold face of the lower mold after the substrate setting step and the resin supplying step to accommodate the pierced parts in the respective resin molding parts and,
A mold clamping and holding step for holding the upper mold and the lower mold in a clamped state
/ RTI >
In the mold clamping and holding step, the fluid resin generated from the resin material in the resin supply portion is injected into the resin molding portion through the resin passage portion, and the fluid resin in the resin molding portion is solidified, And sealing the component in the resin package. The resin encapsulation method according to claim 1, further comprising a release film laying step of stretching a release film on the mold surface of the lower mold before the resin supplying step. The method according to claim 1, further comprising a release film laying step of laying a release film on the mold surface of the lower mold before the resin supplying step,
Wherein the mold-closing part separately housed in the resin molding part and the release film stretched in each resin molding part are brought into pressure contact with each other in the mold clamping step. And a resin passage portion through which the fluid resin in the resin supply portion flows, wherein the resinous sealing portion comprises a resinous sealing mold in which at least an upper mold and a lower mold are opposed to each other, a resin supply portion formed in the lower mold, Is injected into the resin molding section from the resin supply section through the resin passage section to solidify the fluid resin in the resin molding section to mold a resin package made of a solidified resin, A sealing apparatus for sealing a pierced component on a resin package,
The resin supply portion disposed at a central position of the lower mold,
At least two resin passage portions disposed at positions adjacent to the resin supply portion and communicating with the resin supply portion, respectively,
At least two resin molding portions disposed so as to sandwich the at least two resin passage portions,
The substrate set part
Lt; / RTI >
Wherein when the one substrate is set in the substrate setting portion in a posture in which the pierced component is downward, the pierced component matches the position corresponding to the arrangement position of the at least two resin molded portions in the lower mold And the resin supply part, the at least two resin molding parts, and the at least two resin mold parts, so as to cover the resin supply part, the at least two resin passage parts, the at least two resin molding parts, And the mold surface of the lower mold positioned at the outer periphery of the two resin passage portions, the at least two resin molding portions, and the resin molding portion,
Characterized in that, in a state in which the upper mold and the lower mold are clamped, each of the to-be-sealed parts on the one substrate is housed separately in the respective resin molding parts, and the fluid resin in the resin supplying part is passed through the resin passage part Wherein the resin-molded part is injected into the resin-molded part, the fluidic resin is solidified in the resin-molded part, and the pierced part on the one substrate set on the resin- And the sealing member is sealed. The resin-sealing apparatus according to claim 4, further comprising a releasing film firing mechanism for laying a release film on the mold surface of the lower mold. The film forming apparatus according to claim 4, further comprising a releasing film firing mechanism for laying a release film on the mold surface of the lower mold,
Wherein the release film stretched by the release film filming mechanism and the pierced part are in pressure contact with each other when the upper mold and the lower mold are clamped.
KR1020160008192A 2015-01-27 2016-01-22 Resin sealing method and resin sealing apparatus KR101764525B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015013673A JP6560498B2 (en) 2015-01-27 2015-01-27 Resin sealing method and resin molded product manufacturing method
JPJP-P-2015-013673 2015-01-27

Publications (2)

Publication Number Publication Date
KR20160092498A true KR20160092498A (en) 2016-08-04
KR101764525B1 KR101764525B1 (en) 2017-08-02

Family

ID=56559611

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160008192A KR101764525B1 (en) 2015-01-27 2016-01-22 Resin sealing method and resin sealing apparatus

Country Status (4)

Country Link
JP (1) JP6560498B2 (en)
KR (1) KR101764525B1 (en)
CN (1) CN105826212B (en)
TW (1) TWI667119B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640770B (en) * 2017-06-02 2018-11-11 優肯科技股份有限公司 Measurement machine for degree of curing and specific volume of packaging materials
JP6296195B1 (en) * 2017-07-21 2018-03-20 第一精工株式会社 Resin sealing mold adjustment method and resin sealing mold
JP6482616B2 (en) * 2017-08-21 2019-03-13 Ｔｏｗａ株式会社 Resin molding apparatus and resin molded product manufacturing method
CN108198764B (en) * 2017-12-18 2019-07-02 重庆市长寿区普爱网络科技有限公司 Electronic component manufacturing method
JP7160770B2 (en) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 Resin molding equipment
JP6837530B1 (en) * 2019-10-17 2021-03-03 Ｔｏｗａ株式会社 Resin molding method and resin molding equipment
CN112976666B (en) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 Dynamic balance buffer mechanism applied to compression forming die
JP7341115B2 (en) * 2020-11-24 2023-09-08 Ｔｏｗａ株式会社 Resin powder collection member, plunger unit, resin molding device, and method for manufacturing resin molded products
CN115008703B (en) * 2022-05-26 2023-09-12 武汉船用机械有限责任公司 Insulating element apparatus for producing for electrical equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007307766A (en) 2006-05-17 2007-11-29 Towa Corp Resin seal-molding method of electronic part

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3680005B2 (en) * 1998-07-10 2005-08-10 アピックヤマダ株式会社 Semiconductor device manufacturing method and resin sealing device
JP3017490B1 (en) * 1999-01-26 2000-03-06 アピックヤマダ株式会社 Resin mold device and mold used for it
JP3581814B2 (en) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 Resin sealing method and resin sealing device
JP2007109831A (en) * 2005-10-13 2007-04-26 Towa Corp Resin sealing molding method for electronic component
JP4954012B2 (en) * 2007-10-05 2012-06-13 Ｔｏｗａ株式会社 Mold for resin sealing molding of electronic parts
JP5387646B2 (en) * 2011-10-07 2014-01-15 第一精工株式会社 Resin sealing device
JP5934139B2 (en) * 2013-04-19 2016-06-15 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007307766A (en) 2006-05-17 2007-11-29 Towa Corp Resin seal-molding method of electronic part

Also Published As

Publication number Publication date
KR101764525B1 (en) 2017-08-02
JP2016137634A (en) 2016-08-04
TWI667119B (en) 2019-08-01
JP6560498B2 (en) 2019-08-14
TW201634220A (en) 2016-10-01
CN105826212B (en) 2019-03-05
CN105826212A (en) 2016-08-03

Similar Documents

Publication Publication Date Title
KR101764525B1 (en) Resin sealing method and resin sealing apparatus
KR100822944B1 (en) Resin Sealing and Molding Method of Electronic Component
JP2005305954A5 (en)
TWI641471B (en) Resin molding die and resin molding method
JP2005305954A (en) Method for molding optical element with resin sealing
CN108688050B (en) Molding die, resin molding device, resin molding method, and method for manufacturing resin molded article
KR102220397B1 (en) Resin molding apparatus and method for manufacturing resin-molded component
JP7084349B2 (en) Resin molding equipment and manufacturing method of resin molded products
KR102184809B1 (en) Resin molding apparatus and method for manufacturing resin-molded component
JP5036372B2 (en) Optoelectronic component and method for manufacturing optoelectronic component
CN110621463B (en) Molding die and resin molding method
JP2015051557A (en) Molding die, resin molding device and resin molding method
WO2018150670A1 (en) Resin sealing method and resin sealing device
KR101667854B1 (en) Resin sealing method and resin sealing apparatus
JP2004200269A (en) Method and device for sealing and forming resin of electronic component
JP4358501B2 (en) Resin sealing molding method for electronic parts and mold
KR20210045922A (en) Resin molded product manufacturing method and resin molding apparatus
KR101052324B1 (en) Encapsulation material forming method
TWI656006B (en) Resin forming device
WO2016125571A1 (en) Resin molding die, resin molding method, and method for producing resin molded article
KR101432423B1 (en) Method and apparatus for compression resin seal molding of semiconductor chip and tape for preventing resin burr
JP7465829B2 (en) Manufacturing method of resin molded product, molding die and resin molding device
WO2020217702A1 (en) Resin molding device and method for manufacturing resin molded article
JP6404734B2 (en) RESIN MOLDING METHOD, RESIN MOLDING MOLD, AND METHOD FOR PRODUCING MOLDED ARTICLE
JP5953602B2 (en) Resin molding apparatus and resin molding method

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant