KR20160086272A - 냉각 구조물 및 평행 평판 에칭 장치 - Google Patents

냉각 구조물 및 평행 평판 에칭 장치 Download PDF

Info

Publication number
KR20160086272A
KR20160086272A KR1020150187625A KR20150187625A KR20160086272A KR 20160086272 A KR20160086272 A KR 20160086272A KR 1020150187625 A KR1020150187625 A KR 1020150187625A KR 20150187625 A KR20150187625 A KR 20150187625A KR 20160086272 A KR20160086272 A KR 20160086272A
Authority
KR
South Korea
Prior art keywords
cooling
plate
cooled
cooling plate
electrode plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020150187625A
Other languages
English (en)
Korean (ko)
Inventor
게이타 감바라
료 사사키
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20160086272A publication Critical patent/KR20160086272A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H01L21/3065
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32715Workpiece holder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32715Workpiece holder
    • H01J37/32724Temperature
    • H01L21/02255
    • H01L21/32135
    • H01L21/67098
    • H01L21/68721

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
KR1020150187625A 2015-01-09 2015-12-28 냉각 구조물 및 평행 평판 에칭 장치 Ceased KR20160086272A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015002997A JP6541355B2 (ja) 2015-01-09 2015-01-09 冷却構造及び平行平板エッチング装置
JPJP-P-2015-002997 2015-01-09

Publications (1)

Publication Number Publication Date
KR20160086272A true KR20160086272A (ko) 2016-07-19

Family

ID=56368020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150187625A Ceased KR20160086272A (ko) 2015-01-09 2015-12-28 냉각 구조물 및 평행 평판 에칭 장치

Country Status (3)

Country Link
US (2) US20160203955A1 (enExample)
JP (1) JP6541355B2 (enExample)
KR (1) KR20160086272A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200038173A (ko) * 2018-10-02 2020-04-10 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 플라즈마 처리 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3813092A1 (en) * 2019-10-23 2021-04-28 EMD Corporation Plasma source
US20240312770A1 (en) * 2023-03-16 2024-09-19 Applied Materials, Inc. Apparatus and methods for controlling substrate temperature during processing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382022A (ja) 1989-08-24 1991-04-08 Nec Corp ドライエッチング装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0624187B2 (ja) * 1986-09-24 1994-03-30 東京エレクトロン株式会社 プラズマ処理装置
JPH01227438A (ja) * 1988-03-07 1989-09-11 Tokyo Electron Ltd 半導体基板用載置台
JP4777790B2 (ja) * 2005-09-29 2011-09-21 東京エレクトロン株式会社 プラズマ処理室用構造物、プラズマ処理室、及びプラズマ処理装置
US7895970B2 (en) * 2005-09-29 2011-03-01 Tokyo Electron Limited Structure for plasma processing chamber, plasma processing chamber, plasma processing apparatus, and plasma processing chamber component
JP5002505B2 (ja) * 2008-03-26 2012-08-15 株式会社アルバック 搬送トレー及びこの搬送トレーを用いた真空処理装置
JP6068849B2 (ja) * 2012-07-17 2017-01-25 東京エレクトロン株式会社 上部電極、及びプラズマ処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382022A (ja) 1989-08-24 1991-04-08 Nec Corp ドライエッチング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200038173A (ko) * 2018-10-02 2020-04-10 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 플라즈마 처리 방법

Also Published As

Publication number Publication date
US20200035464A1 (en) 2020-01-30
US20160203955A1 (en) 2016-07-14
JP6541355B2 (ja) 2019-07-10
JP2016129176A (ja) 2016-07-14

Similar Documents

Publication Publication Date Title
CN102150243B (zh) 温控热边缘环组合件
JP6345030B2 (ja) プラズマ処理装置及びフォーカスリング
JP5348919B2 (ja) 電極構造及び基板処理装置
US20070283891A1 (en) Table for supporting substrate, and vacuum-processing equipment
JP6552346B2 (ja) 基板処理装置
JP5274918B2 (ja) プラズマ処理装置のチャンバー内部材の温度制御方法、チャンバー内部材及び基板載置台、並びにそれを備えたプラズマ処理装置
KR100861261B1 (ko) 전열 구조체 및 기판 처리 장치
US20140083615A1 (en) Antenna assembly and a plasma processing chamber having the same
US9427913B2 (en) Heat transfer sheet adhering apparatus and method
JP7055040B2 (ja) 被処理体の載置装置及び処理装置
US10923333B2 (en) Substrate processing apparatus and substrate processing control method
US10217616B2 (en) Method of controlling temperature and plasma processing apparatus
US7718007B2 (en) Substrate supporting member and substrate processing apparatus
KR20200051494A (ko) 배치대, 엣지 링의 위치 결정 방법 및 기판 처리 장치
JP4869610B2 (ja) 基板保持部材及び基板処理装置
KR102903244B1 (ko) 적재대, 기판 처리 장치 및 기판 처리 방법
JP2014107387A (ja) 載置台構造及びフォーカスリングを保持する方法
KR20200051505A (ko) 배치대 및 기판 처리 장치
US11201039B2 (en) Mounting apparatus for object to be processed and processing apparatus
US20200035464A1 (en) Cooling structure and parallel plate etching apparatus
US8052364B2 (en) Coupling member and plasma processing apparatus
JP2021176186A (ja) 載置台アセンブリ、基板処理装置および基板処理方法
JP2021180283A (ja) 載置台アセンブリ、基板処理装置および基板処理方法
US20210332931A1 (en) Piping system and processing apparatus
JP2013110440A (ja) 電極ユニット及び基板処理装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000