KR20160038248A - 에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치 - Google Patents

에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치 Download PDF

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Publication number
KR20160038248A
KR20160038248A KR1020140130736A KR20140130736A KR20160038248A KR 20160038248 A KR20160038248 A KR 20160038248A KR 1020140130736 A KR1020140130736 A KR 1020140130736A KR 20140130736 A KR20140130736 A KR 20140130736A KR 20160038248 A KR20160038248 A KR 20160038248A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
dsc
formula
measured
Prior art date
Application number
KR1020140130736A
Other languages
English (en)
Korean (ko)
Inventor
김태호
강경희
김정섭
허건영
김하나
조성서
한재선
Original Assignee
삼성에스디아이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성에스디아이 주식회사 filed Critical 삼성에스디아이 주식회사
Priority to KR1020140130736A priority Critical patent/KR20160038248A/ko
Priority to PCT/KR2014/012180 priority patent/WO2016052812A1/fr
Priority to TW104113621A priority patent/TWI602876B/zh
Publication of KR20160038248A publication Critical patent/KR20160038248A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50—Physical properties
    • C08G2261/51—Charge transport
    • C08G2261/516—Charge transport ion-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020140130736A 2014-09-30 2014-09-30 에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치 KR20160038248A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020140130736A KR20160038248A (ko) 2014-09-30 2014-09-30 에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치
PCT/KR2014/012180 WO2016052812A1 (fr) 2014-09-30 2014-12-11 Composition de résine époxy, composition pour film conducteur anisotrope, et dispositif à semi-conducteurs
TW104113621A TWI602876B (zh) 2014-09-30 2015-04-29 環氧樹脂組成物、各向異性導電膜用組成物以及電子裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140130736A KR20160038248A (ko) 2014-09-30 2014-09-30 에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치

Publications (1)

Publication Number Publication Date
KR20160038248A true KR20160038248A (ko) 2016-04-07

Family

ID=55630822

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140130736A KR20160038248A (ko) 2014-09-30 2014-09-30 에폭시 수지 조성물, 이방성 도전 필름용 조성물 및 반도체 장치

Country Status (3)

Country Link
KR (1) KR20160038248A (fr)
TW (1) TWI602876B (fr)
WO (1) WO2016052812A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111318303B (zh) * 2018-12-13 2023-08-11 中国科学院上海有机化学研究所 一种酚盐及其应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3284407A (en) * 1961-02-06 1966-11-08 Ciba Ltd Epoxide resin compositions containing a polycarboxylic acid anhydride and a substituted ammonium phenate
JP4569076B2 (ja) * 2002-06-05 2010-10-27 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
DE102004012902A1 (de) * 2004-03-17 2005-10-06 Bayer Materialscience Ag Herstellung von neuen strahlenhärtenden Bindemitteln
KR101332436B1 (ko) * 2010-12-06 2013-11-22 제일모직주식회사 이방 전도성 필름
CN104105733A (zh) * 2012-02-10 2014-10-15 三井化学株式会社 有机el元件用面封装剂、使用该面封装剂的有机el装置及其制造方法
JP5865292B2 (ja) * 2013-05-07 2016-02-17 ヘンケル・アーゲー・アンド・カンパニー・カーゲーアーアー 熱硬化性エポキシ−アミンバリヤシーラント

Also Published As

Publication number Publication date
TWI602876B (zh) 2017-10-21
WO2016052812A1 (fr) 2016-04-07
TW201612230A (en) 2016-04-01

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