TW201612230A - Epoxy resin composition, composition for anisotropic conductive film, and semiconductor device - Google Patents

Epoxy resin composition, composition for anisotropic conductive film, and semiconductor device

Info

Publication number
TW201612230A
TW201612230A TW104113621A TW104113621A TW201612230A TW 201612230 A TW201612230 A TW 201612230A TW 104113621 A TW104113621 A TW 104113621A TW 104113621 A TW104113621 A TW 104113621A TW 201612230 A TW201612230 A TW 201612230A
Authority
TW
Taiwan
Prior art keywords
composition
epoxy resin
anisotropic conductive
alkyl group
semiconductor device
Prior art date
Application number
TW104113621A
Other languages
Chinese (zh)
Other versions
TWI602876B (en
Inventor
Tae-Ho Kim
Kyoung-Hee Kang
Jung-Seob Kim
Gun-Young Heo
Ha-Na Kim
Sung-Seo Cho
Jae-Sun Han
Original Assignee
Samsung Sdi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Sdi Co Ltd filed Critical Samsung Sdi Co Ltd
Publication of TW201612230A publication Critical patent/TW201612230A/en
Application granted granted Critical
Publication of TWI602876B publication Critical patent/TWI602876B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50—Physical properties
    • C08G2261/51—Charge transport
    • C08G2261/516—Charge transport ion-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

An epoxy resin composition containing an epoxy resin and a curing catalyst represented by Formula 1 is disclosed. (Ar is a monocyclic or polycyclic C6 to C24 aromatic cyclic compound unsubstituted or substituted at least once with a C1 to C10 alkyl group, or a compound to which at least two C6 to C10 aromatic cyclic compounds unsubstituted or substituted at least once with a C1 to C10 alkyl group is directly bonded by a single bond; and R1 to R4 are each independently a C1 to C6 alkyl group or a C3 to C10 cyclic alkyl group). A composition for anisotropic conductive films, which contains the epoxy resin composition, conductive particles and a binder resin, and a semiconductor device connected by an anisotropic conductive film formed of the composition for anisotropic conductive films are also disclosed.
TW104113621A 2014-09-30 2015-04-29 Epoxy resin composition, composition for anisotropic conductive film, and electronic device TWI602876B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140130736A KR20160038248A (en) 2014-09-30 2014-09-30 Epoxy resin composition, composition for an anisotropic conductive film and a semiconductive device

Publications (2)

Publication Number Publication Date
TW201612230A true TW201612230A (en) 2016-04-01
TWI602876B TWI602876B (en) 2017-10-21

Family

ID=55630822

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113621A TWI602876B (en) 2014-09-30 2015-04-29 Epoxy resin composition, composition for anisotropic conductive film, and electronic device

Country Status (3)

Country Link
KR (1) KR20160038248A (en)
TW (1) TWI602876B (en)
WO (1) WO2016052812A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111318303B (en) * 2018-12-13 2023-08-11 中国科学院上海有机化学研究所 Phenolate and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3284407A (en) * 1961-02-06 1966-11-08 Ciba Ltd Epoxide resin compositions containing a polycarboxylic acid anhydride and a substituted ammonium phenate
JP4569076B2 (en) * 2002-06-05 2010-10-27 住友ベークライト株式会社 Curing accelerator, epoxy resin composition, and semiconductor device
DE102004012902A1 (en) * 2004-03-17 2005-10-06 Bayer Materialscience Ag Production of new radiation-curing binders
KR101332436B1 (en) * 2010-12-06 2013-11-22 제일모직주식회사 Anisotropic conductive film
CN104105733A (en) * 2012-02-10 2014-10-15 三井化学株式会社 Surface sealing agent for organic EL element, organic EL device using same, and manufacturing method for same
JP5865292B2 (en) * 2013-05-07 2016-02-17 ヘンケル・アーゲー・アンド・カンパニー・カーゲーアーアー Thermosetting epoxy-amine barrier sealant

Also Published As

Publication number Publication date
WO2016052812A1 (en) 2016-04-07
TWI602876B (en) 2017-10-21
KR20160038248A (en) 2016-04-07

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