KR20160018329A - Scribing method and scribing apparatus - Google Patents

Abstract

The present invention provides a scribing method and a scribing apparatus. The scribing method can form a crack having an enough depth on a substrate when a scribe line is formed directly above and below a sealing material. When forming a scribe line on a mother substrate (G) comprising two glass substrates (G1, G2) glued together by a sealing material (SL), the scribing apparatus moves a scribing wheel (301) along the sealing material (SL) while pressing the scribing wheel (301) at a location facing the sealing material (SL) on a surface of the glass substrate (G1). In parallel with this, the scribing apparatus moves a scribing wheel (401) along the sealing material (SL) while pressing the scribing wheel (401) at a location displaced at a distance (W1) in a direction along the sealing material (SL) at the scribing wheel (301) of the surface of the glass substrate (G2).

Description

[0001] SCRIBING METHOD AND SCRIBING APPARATUS [0002]

The present invention relates to a scribing method and scribing apparatus for forming a scribing line on a substrate.

Conventionally, dividing of a brittle material substrate such as a glass substrate is performed by a scribing process for forming a scribe line on the substrate surface and a braking process for applying a predetermined force to the substrate surface along the scribe line Lt; / RTI > In the scribing step, the edge of the scribing wheel is moved along a predetermined line while being pressed against the surface of the substrate. For forming the scribe line, a scribe apparatus having a scribe head is used.

The following Patent Document 1 discloses a method for cutting a liquid crystal panel from a mother substrate. In this method, a mother substrate is formed by bonding a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter CF is formed, with a sealing material interposed therebetween. This mother substrate is divided so that individual liquid crystal panels are obtained.

The sealing material is arranged such that a space to be a liquid crystal injection region remains in a state in which two substrates are bonded.

When dividing the mother substrate of the above configuration, a method of simultaneously forming scribe lines on both sides of the mother substrate by using two scribe heads can be used (see, for example, Patent Document 2). In this case, two scribe heads are arranged to sandwich the mother substrate. The two scribing wheels are located at the same position when viewed in plan from the mother substrate. In this state, the two scribing wheels are simultaneously moved in the same direction, and scribe lines are formed on each surface of the mother substrate.

Japanese Patent Application Laid-Open No. 2006-137641 Japanese Laid-Open Patent Publication No. 2012-240902

As shown in Patent Document 1, there was a region in the mother substrate of the prior art in which no sealing material is interposed between adjacent liquid crystal injection regions. Therefore, when the scribe lines are simultaneously formed on both sides of the mother substrate by the two scribing heads as described above, the scribe lines can be formed in the area where the sealing material does not intervene. When the scribe line is formed and the mother substrate is thus divided, a frame region of a predetermined width remains around the liquid crystal injection region in the liquid crystal panel.

However, in recent years, particularly in mobile liquid crystal panels, it has become mainstream to narrow the edge region to the limit. In order to meet this demand, a region where the sealing material is not interposed in the mother substrate is omitted, and the adjacent liquid crystal injection regions need to be configured to be separated only by the sealing material. In this case, the scribe line is formed just above and below the sealing material.

However, when the scribe lines are formed just above and below the sealing material, the inventors of the present invention have confirmed that the cracks do not sufficiently enter the two glass substrates. If the breaking process is performed in such a state that the cracks are insufficient, slight cracks or breakage may occur at the edge of the substrate after breaking, which may lower the strength of the glass substrate.

In view of the above problems, it is an object of the present invention to provide a scribe method and scribe device capable of forming a crack of a sufficient depth on a substrate when a scribe line is formed immediately above and below the seal material do.

The inventors of the present invention have found that by scribing the upper and lower scribe positions of the mother substrate by a predetermined distance in the scribing direction when the scribe lines are formed immediately above and below the sealing material after trial and error, I found deep cracks.

A first embodiment of the present invention relates to a scribe method of forming a scribe line on a mother substrate formed by joining a first substrate and a second substrate with a sealing material. The scribing method according to the present embodiment is characterized in that the first blade is moved along the seal member while pressing the first blade at a position opposed to the seal member on the surface of the first substrate, Scribe lines are formed. In parallel with the movement of the first blade, while pressing the second blade at a position displaced from the first blade on the surface of the second substrate by a predetermined distance in the direction along the seal member, And the scribe line is formed on the surface of the second substrate.

According to the scribing method according to the present embodiment, when a scribe line is formed immediately above and below the sealing material, a sufficient depth of cracks can be formed on the mother substrate.

In the scribing method according to the present embodiment, it is preferable that the predetermined distance is set to 0.5 mm or more. In this way, the depth of the crack can be effectively deepened.

In the scribing method according to the present embodiment, the first roller is moved along the seal member while pressing the first roller at a position corresponding to the second edge of the surface of the first substrate, And the second roller is moved along the seal member while pressing the second roller at a position corresponding to the first edge of the surface of the second roller. By doing so, it is possible to stabilize the formation of cracks while deepening the crack depth.

A second embodiment of the present invention relates to a scribe apparatus for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material. The scribing apparatus according to the present embodiment includes a first scribe head for forming a scribe line on the surface of the first substrate, a second scribe head for forming a scribe line on the surface of the second substrate, And a driving unit for moving the second scribe head in parallel with the mother substrate. Wherein the first scribe head is driven so that the first blade is moved along the seal member while pressing the first blade at a position opposed to the seal member on a surface of the first substrate, In a state in which the second blade is pressed at a position displaced from the first blade on the surface of the second substrate by a predetermined distance in the direction along the seal member in parallel with the driving of the first scribing head, And the second blade is driven to move along the seal member.

According to the scribing apparatus according to the present embodiment, when a scribe line is formed just above and immediately below the sealing material as in the scribing method according to the first embodiment, cracks having a sufficient depth are formed on the mother substrate can do.

In the scribing apparatus according to the present embodiment, it is preferable that the predetermined distance is set to 0.5 mm or more. In this way, the depth of the crack can be effectively deepened.

Further, in the scribing apparatus according to the present embodiment, the first scribing head presses the first roller at a position corresponding to the second edge of the surface of the first substrate, And the second scribe head may be configured to move the second roller along the seal while pressing the second roller at a position corresponding to the first edge of the surface of the second substrate . In this way, the depth of the crack can be further deepened.

In the scribing apparatus according to the present embodiment, the first scribing head may include a first scribing tool for holding both the first blade and the first roller, The head may be configured to include a second scribing tool that supports both the second blade and the second roller. In this way, only by mounting the scribing tool, the blade and the roller can be positioned at a desired interval.

Further, in the scribing apparatus according to the present embodiment, the first blade and the second blade each have a V-shaped edge at the outer periphery of the disk, As shown in Fig. In the embodiments described below, it has been confirmed that an experiment is conducted by this kind of blade, and a crack enters deeply.

As described above, according to the present invention, it is possible to provide a scribe method and a scribe apparatus capable of forming a crack of a sufficient depth on a substrate when a scribe line is formed immediately above and below the seal material.

The effect or significance of the present invention will become more apparent from the description of the embodiments described below.

It should be noted, however, that the embodiments described below are merely illustrative of the embodiments of the present invention, and the present invention is not limited to those described in the following embodiments.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a view schematically showing the configuration of a scribing apparatus according to an embodiment. FIG.
2 is an exploded perspective view showing a structure of a scribe head according to the embodiment.
3 is a perspective view showing a configuration of a scribe head according to the embodiment.
4 is a view for explaining a scribing method according to the embodiment.
Fig. 5 is a diagram showing an experimental result by the scribing method according to the embodiment. Fig.
6 is a diagram for explaining another scribing method according to the embodiment.
Fig. 7 is a diagram showing an experimental result by another scribing method according to the embodiment. Fig.
8 is a perspective view showing a configuration of a scribing tool according to the embodiment.
9 is a view schematically showing a mounting method of the scribing tool according to the embodiment.
10 is a perspective view showing a configuration of a scribing tool according to a modified example.
11 is a view schematically showing a configuration of a scribing tool according to a modification.

(Mode for carrying out the invention)

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the X axis, the Y axis, and the Z axis are orthogonal to each other for convenience. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

<Scribe device>

Fig. 1 (a) and Fig. 1 (b) schematically show the configuration of the scribe apparatus 1. Fig. Fig. 1 (a) is a view showing the scribe apparatus 1 from the positive Y-axis side, and Fig. 1 (b) is a view showing the scribe apparatus 1 from the positive X-axis side.

1 (a), the scribe apparatus 1 includes a conveyor 11, struts 12a and 12b, guides 13a and 13b, guides 14a and 14b, a sliding unit 15 , 16, and two scribe heads (2).

As shown in Fig. 1 (b), the conveyor 11 is formed so as to extend in the Y-axis direction except for a portion where the scribe head 2 is disposed. On the conveyor 11, the mother substrate G is placed. The mother substrate (G) has a substrate structure in which a pair of glass substrates are bonded to each other. The mother substrate (G) is conveyed in the Y-axis direction by the conveyor (11).

The supports 12a and 12b are vertically formed by sandwiching the conveyor 11 between the base of the scribe device 1. [ The guides 13a and 13b and the guides 14a and 14b are provided so as to extend between the pillars 12a and 12b so as to be parallel to the X axis direction. The sliding units 15 and 16 are slidably formed on the guides 13a and 13b and the guides 14a and 14b, respectively. Each of the guides 13a and 13b and the guides 14a and 14 is provided with a predetermined driving mechanism and the sliding units 15 and 16 are moved in the X axis direction by the driving mechanism.

Each of the sliding units 15 and 16 is provided with a scribe head 2. Scribing tools 30 and 40 are attached to the scribe head 2 on the positive Z-axis side and the scribe head 2 on the Z-axis side so as to face the mother substrate G, respectively. The scribe head 2 is moved in the X axis direction in a state in which the scribing wheel supported by the scribing tools 30 and 40 is pressed against the surface of the mother substrate G. [ Thus, a scribe line is formed on the surface of the mother substrate (G).

<Scribe head>

Fig. 2 is a partially exploded perspective view showing the structure of the scribe head 2, and Fig. 3 is a perspective view showing the structure of the scribe head 2. Fig.

2, the scribe head 2 includes a lifting mechanism 21, a scribing line forming mechanism 22, a base plate 23, a top plate 24, A bottom plate 25, a rubber frame 26, a cover 27, and a servo motor 28. [

The lifting mechanism 21 includes a cylindrical cam 21a connected to the drive shaft of the servo motor 28 and a cam follower 21c formed on the upper surface of the lifting portion 21b. The elevating portion 21b is supported on the base plate 23 in a vertically movable manner via a slider (not shown) and is elastically supported in the Z-axis direction by a spring 21d. By the elastic support of the spring 21d, the cam follower 21c is pushed against the lower surface of the cylindrical cam 21a. The elevating portion 21b is connected to the scribing line forming mechanism 22. When the cylindrical cam 21a is rotated by the servomotor 28, the elevating portion 21b is lifted and lowered by the cam action of the cylindrical cam 21a. As a result, the scribing line forming mechanism 22, . At the lower end of the scribing line forming mechanism 22, scribing tools 30 and 40 are mounted.

The rubber frame 26 is an elastic member that does not allow air to pass therethrough. The rubber frame 26 has a shape fitted into the groove 23a of the base plate 23, the groove 24a of the top plate 24 and the groove 25a of the bottom plate 25. The surface of the rubber mold 26 is slightly smaller than the side surfaces of the base plate 23, the top plate 24 and the bottom plate 25 with the rubber mold 26 mounted on the grooves 23a, 24a, .

The cover 27 has a shape in which three plate portions of the front surface portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. Two holes 27f are formed on the upper and lower edges of the front portion 27a.

The right side face portion 27b and the left side face portion 27c of the cover 27 are deformed so as to bend outward in a state in which the rubber frame 26 is fitted in the grooves 23a, 24a, 25a, The base plate 23, the top plate 24, and the bottom plate 25, respectively. In this state, the screws are screwed to the top plate 24 and the bottom plate 25 through the two holes 27f formed on the upper and lower edges of the front portion 27a. Screws are screwed to the screw holes formed slightly outside the grooves 23a, 24a, 25a of the base plate 23, the top plate 24, and the bottom plate 25. The cover 27 is sandwiched between the base plate 23, the top plate 24 and the bottom plate 25 by the head of the screw and the peripheral edge of the right side face portion 27b and the left side face portion 27c, And the additional rubber frame 26 is pressed against it. Thus, the scribe head 2 is assembled as shown in Fig.

As shown in Fig. 1 (a), two scribe heads 2 are arranged above and below the mother substrate G, respectively. The two scribe heads 2 have the same configuration. The scribing tools 30 and 40 mounted on the two scribe heads 2 are changed according to the scribing method. Of the two scribing methods shown below, scribing method 1 uses scribing tools 30, 40 that support only scribing wheels 301, 401. In scribe method 2, scribing tools 30 and 40 that support scribing wheels 301 and 401 and rollers 302 and 402 are used.

Hereinafter, these two scribing methods will be described.

<Scribe method 1>

4 (a) to 4 (c) are diagrams for explaining a scribing method according to the present embodiment. Fig. 4 (a) is a schematic view of the vicinity of the scribe position from the Y-axis side, Fig. 4 (b) is a schematic view of the vicinity of the scribe position from the X- It is a schematic diagram when I look around.

4 (a), in this scribing method, the scribing wheel 301 of the scribe head 2 on the upper side (Z-axis positive side) is located on the lower side (Z-axis side) of the scribe head 2 The two scribing wheels 301 and 401 are moved such that the scribing wheel 401 precedes the scribing direction by a distance W1 in the scribing direction (X-axis normal direction). The two scribing wheels 301 and 401 are attached with scribing tools 30 and 40 so as to be rotatable about axes 301a and 401a, respectively.

Referring to Fig. 4 (b), the mother substrate G is constituted by joining two glass substrates G1 and G2 through a sealing material SL. A color filter CF is formed on the glass substrate G1 and a thin film transistor TFT is formed on the glass substrate G2. A liquid crystal injection region R is formed by the sealing material SL and the two glass substrates G1 and G2 and the liquid crystal is injected into the liquid crystal injection region R. The two scribing wheels 301 and 401 are positioned without deviating from each other in the Y-axis direction. The scribing wheel 301 is pushed against the surface of the glass substrate G1 at a position just above the sealing material SL and the scribing wheel 401 is pressed against the surface of the glass substrate G1 just below the sealing material SL To the surface of the glass substrate G2.

As shown in Fig. 4 (c), the sealing materials SL are arranged in a lattice form. The two scribing wheels 301 and 401 are moved in the X-axis normal direction along the seal material SL. Thus, as shown in Figs. 4 (b) and 4 (c), scribe lines L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.

In the scribing method shown in Figs. 4 (a) to 4 (c), no rollers for pressing the surface of the mother substrate G on the side opposite to the scribing wheel 301 (Z-axis side) are formed, No rollers for pressing the surface of the mother substrate G on the opposite side (Z-axis positive side) to the scribing wheel 401 are formed.

<Experiment 1>

The inventors of the present invention conducted an experiment for forming scribe lines on the mother substrate G according to the scribing method shown in Figs. 4 (a) to 4 (c). Hereinafter, these experiments and experimental results will be described.

In the experiment, a substrate (mother substrate) obtained by bonding glass substrates G1 and G2 each having a thickness of 0.2 mm via a sealing material SL was used. The size of the bonded substrate (mother substrate) is 118 mm x 500 mm. The scribing wheels 301 and 401 were manufactured by Micro Penett (registered trademark of Mitsubishi Diamond High School) manufactured by Mitsubishi Diamond High School. Each of the scribing wheels 301 and 401 has a structure in which a V-shaped blade edge is formed on the outer periphery of the disk and a groove is formed at a predetermined interval on the ridge line of the blade edge. The scribing wheels 301 and 401 have a diameter of 3 mm, a blade edge angle of 110, a groove number of 550, and a groove depth of 3 占 퐉.

The scribing wheels 301 and 401 of this configuration were moved while being pressed against the glass substrates G1 and G2 as shown in Figs. 4 (a) to 4 (c), respectively.

During the scribing operation, the load applied to the scribing wheels 301 and 401 was controlled to 6.5N. In addition, the moving speed of the scribing wheels 301 and 401 was fixed (200 mm / sec).

Under the above conditions, the penetration amount of the cracks in the glass substrates G1 and G2 was measured while changing the distance W1 between the two scribing wheels 301 and 401. As a comparative example, the amount of crack penetration when the distance W1 between the scribing wheels 301 and 401 was 0 was also measured. In each measurement, in addition to the amount of crack penetration, the amount of rib mark was also measured.

5 (a) to 5 (e) show experimental results. 5B is a cross-sectional photograph of a mother substrate G on a scribe line, and Fig. 5B is a cross-sectional view of the mother substrate G. Fig. 5B is a cross- , And the distances W1 are 0.4 mm, 0.6 mm, 0.8 mm, and 1.0 mm, respectively. 5 (b) to 5 (e), D1 and D3 indicate the amount of rib marks, and D2 and D4 indicate the amount of crack penetration.

Referring to Fig. 5 (a), when the distance W1 exceeds 0.6 mm, the penetration amount of cracks in the glass substrate G1 becomes larger than in the case where the distance W1 is 0 mm. When a crack is introduced into any one of the glass substrates G1 and G2 with a large infiltration amount, the mother substrate G can be appropriately divided in the breaking process.

For example, if the amount of cracks in the glass substrates G1 and G2 is about half the thickness (0.2 mm) of the glass substrates G1 and G2, as in the comparative example (W1 = 0 mm) , It is necessary to break the glass substrates G1 and G2 on both sides of the mother substrate G, respectively. When the operations of breaking the glass substrates G1 and G2 on both sides of the mother substrate G are performed in this way, the glass substrates G1 and G2 are slightly cracked or broken at the edge of the glass substrate G1 and G2 May be lowered.

On the other hand, when the distance W1 is 0.6 mm to 1.4 mm, the penetration amount of cracks in the glass substrate G2 is small, but the amount of crack penetration in the glass substrate G1 is large. When the amount of crack penetration in the glass substrate G1 is large in this manner, in the breaking step, it is only necessary to perform an operation of braking the glass substrate G2 having a smaller crack penetration amount on only one side of the mother substrate G At the time of breaking operation, the glass substrate G1 having a deep crack is simultaneously divided along the crack. When the glass substrates G1 and G2 are broken only on one side of the mother substrate G in this way, no microscopic cracks or damage are generated on the edge of the glass substrates G1 and G2, Is maintained at a high level.

For the above reasons, it is preferable that at the division of the mother substrate G, a crack is introduced into one of the glass substrates G1 and G2 with a large penetration amount. 5A, when the distance W1 between the two scribing wheels 301 and 401 exceeds 0.6 mm, as compared with the comparative example (W1 = 0 mm) The amount of crack penetration of the core G1 is increased. In this respect, it can be said that the distance W1 between the two scribing wheels 301, 401 is preferably 0.6 mm or more. By setting the distance W1 between the two scribing wheels 301 and 401 as described above, it is possible to appropriately perform the braking of the mother substrate G.

<Scribe method 2>

In the scribing method (scribing method 1) shown in Figs. 4 (a) to 4 (c), the surface of the mother substrate G on the side opposite to the scribing wheel 301 , And the surface of the mother substrate G on the opposite side (the Z-axis positive side) to the scribing wheel 401 is not pressed by the roller. On the contrary, in this scribing method, the surface of the mother substrate G on the side opposite to the scribing wheel 301 (on the Z axis side) and the mother substrate G on the side opposite to the scribing wheel 401 G are pressed by the rollers, respectively.

6 (a) and 6 (b) are diagrams for explaining the scribe method 2. Fig. 6 (a) is a schematic view of the vicinity of the scribe position from the Y-axis side, and Fig. 6 (b) is a schematic view of the vicinity of the scribe position from the X-axis positive side.

6 (a), in this scribing method, the surface of the mother substrate G on the opposite side (Z-axis side) to the scribing wheel 301 is pressed by the two rollers 402, The surface of the mother substrate G on the opposite side (the Z-axis positive side) to the crying wheel 401 is also pressed by the two rollers 302. [ The two rollers 302 are arranged so as to sandwich the scribing wheel 301, and are rotatable about the axis 302a as a rotation axis. The two rollers 402 are disposed so as to sandwich the scribing wheel 401, and are rotatable about the axis 402a as a rotation axis.

Similarly to the scribing method 1, the two scribing wheels 301 and 401 are displaced by a distance W1 in the scribing direction (X-axis direction). The two scribing wheels 301 and 401 are moved along the sealing material SL while being pressed against the glass substrates G1 and G2, respectively. There is a gap in the Y axis direction between the scribing wheel 301 and the two rollers 302 and a gap in the Y axis direction between the scribing wheel 401 and the two rollers 402 . Therefore, the rollers 302 and 402 move in the X-axis normal direction so as to cover the scribe lines L1 and L2 formed by the scribing wheels 301 and 401.

<Experiment 2>

The inventors of the present invention conducted an experiment to form scribe lines on the mother substrate G according to the scribing method shown in Figs. 6 (a) and 6 (b). Hereinafter, these experiments and experimental results will be described.

The mother substrate (G) and the scribing wheels (301, 401) used in this experiment were the same as those of Experiment 1. In this experiment, the distance W1 between the scribing wheels 301 and 401 was set at 2.2 mm. In addition, the moving speed of the scribing wheels 301 and 401 was fixed (200 mm / sec). The amount of eccentricity of the scribing wheel 301 with respect to the load center of the upper scribing head 2 was 1.0 mm and the amount of eccentricity of the scribing wheel 401 with respect to the load center of the lower scribing head 2 was 3.2 mm .

The center positions of the axes 301a and 401a of the scribing wheels 301 and 401 coincide with the center positions of the axes 302a and 402a of the rollers 302 and 402 in the Z axis direction, The diameter of each of the scribing wheels 302 and 402 is set to 3 mm, which is equal to the diameter of the scribing wheels 301 and 401, respectively.

Under the above conditions, the amount of penetration of the cracks in the glass substrates G1 and G2 was measured while changing the load applied to the scribing tools 30 and 40.

Figs. 7 (a) to 7 (e) show experimental results. Figs. 7 (a) to 7 (e) are cross-sectional photographs of a mother substrate G on a scribe line, and Figs. 7 , And the loads are 6N, 7N, 8N, and 9N. 5 (b) to 5 (e), D1 and D3 indicate the amount of rib marks, and D2 and D4 indicate the amount of crack penetration.

Referring to Fig. 7 (a), it can be seen that when the load changes from 5N to 6N, the amount of crack penetration in the glass substrate G1 sharply increases. If the load exceeds 6N, the amount of penetration of the cracks of the glass substrate G1 exceeds 80% of the thickness (0.2 mm) of the glass substrate G1, and cracks enter the glass substrate G1 with a large penetration amount. As described above, when a crack is introduced into any one of the glass substrates G1 and G2 with a large penetration amount, the mother substrate G can be appropriately divided in the breaking process. Therefore, in the scribe method 2, it can be said that it is preferable to set the load applied to the scribing tools 30, 40 to 6N or more.

Further, in this experiment, the penetration amount of cracks to the glass substrate G1 is larger than that of Experiment 1 above. Therefore, in order to form a crack stably while increasing the amount of penetration of cracks, it is necessary to press the surface of the mother substrate G opposite to the scribing wheels 301 and 401 with the rollers 402 and 302 as in the scribing method 2 It is desirable to do so.

<Scribing tool>

8 (a) and 8 (b) are perspective views showing the configuration of scribing tools 30 and 40, respectively.

The scribing tools 30 and 40 have the same configuration except for the order of arrangement of the scribing wheels 301 and 401 and the rollers 302 and 402. [ The scribing tools 30 and 40 have holders 303 and 403 for supporting the scribing wheels 301 and 401 and the rollers 302 and 402, respectively. The holders 303 and 403 are provided with grooves 303a and 403a on which the scribing wheels 301 and 401 are mounted and grooves 303b and 403b on which the rollers 302 and 402 are mounted and slopes 303c and 403c ). The scribing wheels 301 and 401 are mounted by inserting the shafts 301a and 401a into the holes of the holders 303 and 403. The rollers 302 and 402 are mounted by inserting the shafts 302a and 402a into the holes of the holders 303 and 403.

Figs. 9 (a) and 9 (b) are diagrams schematically showing a method of attaching the scribing tool 30 to the scribing line forming mechanism 22. Fig. 9 (a) and 9 (b) show a state in which the inside of the scribing line forming mechanism 22 is viewed.

A support portion 221 for supporting the scribing tool 30 is formed at the lower end of the scribing line forming mechanism 22. A hole 222 into which the scribe tool 30 can be inserted is formed in the support portion 221, Respectively. A magnet 224 is provided at the bottom of the hole 224 and a pin 223 is formed at an intermediate position of the hole 224. As described above, the holder 303 of the scribing tool 30 is made of a ferromagnetic material.

The holder 303 of the scribing tool 30 is inserted into the hole 222 of the support portion 221 when attaching the scribing tool 30 to the scribing line forming mechanism 22. [ When the upper end of the holder 303 approaches the magnet 224, the holder 303 is attracted to the magnet 224. At this time, the inclined surface 303c of the holder 303 comes into contact with the pin 223, and the holder 303 is positioned at a regular position. Thus, as shown in Fig. 9 (b), the scribing tool 30 is mounted at the lower end of the scribing line forming mechanism 22. [

The scribing tool 40 is also mounted on the lower end of the scribing line forming mechanism 22 in the same manner. 6 (a) and 6 (b), when the scribing tools 30 and 40 are mounted on the scribing line forming mechanism 22 of the corresponding scribe head 2, , The roller 402 is positioned at a position corresponding to the scribing wheel 301 and the roller 302 is positioned at a position corresponding to the scribing wheel 401. By using the scribing tools 30 and 40 having the configurations shown in Figs. 8 (a) and 8 (b), the scribing tools 30 and 40 are respectively disposed on the scribe line 2 of the corresponding scribe head 2 The scribing wheels 301 and 401 and the scribing wheels 401 and 402 are rotated while keeping the distance W1 between the scribing wheel 301 and the scribing wheel 401 at a predetermined distance, The rollers 402 and 302 can face each other.

In Experiment 2, the scribing tools 30 and 40 having the structures shown in Figs. 8 (a) and 8 (b) were used. In Experiment 1, the grooves 303b and 403b were omitted from the holders 303 and 403, and the scribing wheels 301 and 401 were respectively attached to the holders 303 and 403 having only the grooves 303a and 403a, ) Equipped with scribing tools (30, 40).

&Lt; Effect of Embodiment >

According to the present embodiment, the following effects are obtained.

As shown in Experiments 1 and 2, the scribe line L1 can be formed at a position immediately above the seal material SL with a deep crack. Particularly, by forming the rollers 302 and 402 as in the scribing method 2, it is possible to stably form cracks while further increasing the penetration amount of the cracks.

<Example of change>

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications may be made to the embodiments of the present invention.

For example, in the above embodiment, scribing holes in which grooves are formed at regular intervals on the ridgelines of the blade edges are used, but it is presumed that even if a scribing wheel in which no grooves are formed on the ridgeline is used, have. The size and shape of the scribing wheel (edge) are not limited to those described in the above embodiment, but other sizes, shapes, and types of edges can be suitably used.

Although the scribing wheel 301 on the upper side of the mother substrate G is preceded in the scribing direction with respect to the scribing wheel 401 on the lower side in the above embodiment, The ice wheel 301 may be preceded in the scribing direction with respect to the scribing wheel 401 on the upper side. In this case as well, the same effect as described above can be obtained.

6A, 6B, 8A and 8B, since the distance W1 is small, the two rollers 302 are arranged on the scribing wheels 301 Two rollers 302 and a scribing wheel 301 are disposed. However, when the distance W1 is large, the two rollers 302 and the scribing wheel 301 are disposed without sandwiching the two scraping wheels 301 between them.

Figs. 10 (a) and 10 (b) are diagrams schematically showing other structural examples in a case where the distance W1 is large.

In this configuration example, one roller 304, 404 having a wide width in the Y-axis direction is used. The rollers 304 and 404 are rotatable around the shafts 304a and 404a. On the outer periphery of the rollers 304 and 404, grooves 304b and 404b are formed around the entire circumference at a central position in the Y-axis direction. By forming the grooves 304b and 404b in this way, the scribing wheels 301 and 401 can be formed in the same manner as the configurations of Figs. 6A, 6B, 8A and 8B, It is possible to avoid that the rollers 304 and 404 pass the scribe lines L1 and L2 formed by the rollers 304 and 404, respectively.

10 (a) and 10 (b), since the distance W1 is large, compared with the configurations of Figs. 8 (a) and 8 (b), the holder of the scribing tools 30, The lower portions of the upper and lower portions 303 and 403 are wider in the X-axis direction. 9 (b), since the lower portions of the holders 303 and 403 are exposed from the lower end of the scribing line forming mechanism 22, the lower portions of the holders 303 and 403 are extended in the X- The scribing tools 30 and 40 can be mounted on the scribing line forming mechanism 22 without any hindrance even if the width is widened.

10 (a) and 10 (b), when the grooves 304b and 404b are deep, the outer peripheral portion of the scribing wheels 301 and 401 is pushed into the grooves 304b and 404b Lt; / RTI &gt; In this case, as in the case of Fig. 6A, a part of the scribing wheels 301 and 401 overlaps the rollers 304 and 404 in the Y-axis direction. Thus, the width W1 can be narrowed by making the grooves 304b and 404b deep and letting the outer periphery of the scribing wheels 301 and 401 into the grooves 304b and 404b.

6A, 6B, 8A and 8B, the center positions of the axes 301a, 401a of the scribing wheels 301, The diameters of the scribing wheels 301 and 401 coincide with the center positions of the axes 302a and 402a of the rollers 302 and 402 and the Z axis direction respectively, Diameter. However, the relationship between the scribing wheels 301, 401 and the rollers 302, 402 is not limited to this, and various other changes are possible.

For example, as shown in Fig. 11 (a), the diameter of the scribing wheel 301 may be larger than the diameter of the roller 302 by? D1, or as shown in Fig. 11 (b) The diameter of the ice wheel 301 may be smaller than the diameter of the roller 302 by? D2. 11 (c), even if the center position of the shaft 301a of the scribing wheel 301 is deviated from the center position of the shaft 302a of the roller 302 by? D3 in the Z axis direction 11 (d), the center position of the shaft 301a of the scribing wheel 301 is shifted in the Z-axis direction by Δd4 from the center position of the shaft 302a of the roller 302 There may be. The same can be applied to the scribing wheel 401 and the roller 402 as well.

11 (b) and 11 (d), since the lower end of the roller 302 is located below the lower end of the scribing wheel 301, the roller 302a And is pressed against the glass substrate G1 more strongly. When the roller 302a is strongly pressed in this manner, the glass substrate G1 is bent in the direction of the Z axis, thereby applying a tensile force in the direction of cracking the back surface of the glass substrate G1. Therefore, when the blade edge of the other scraping wheel 401 is pushed against the back surface of the portion of the glass substrate G1 on which the roller 302 is pushed, the crack tends to get deeper due to this tensile force. 11 (b) and 11 (d), it is assumed that a deeper crack is formed by the scraping wheel 401 on the opposite side corresponding to the roller 302a .

10 (a) and 10 (b), the diameters of the scribing wheels 301 and 401 and the rollers 302 and 402 are adjusted in the same manner as described above, The center positions of the axes 301a and 401a of the ice wheels 301 and 401 and the center positions of the axes 302a and 402a of the rollers 302 and 402 may be adjusted.

6A, 6B, 8A and 8B, a pair of rollers 302 and 402 are provided on both sides of the scribing wheels 301 and 401, It is also possible to assume a configuration in which one roller 302, 402 is disposed on only one side of the scribing wheels 301, 401.

The configuration, thickness, material, and the like of the mother substrate G are not limited to those shown in the above-described embodiment, but the scribing methods 1 and 2 and the scribing apparatus Can be used.

The embodiments of the present invention can be modified in various ways as appropriate within the scope of the technical idea shown in the claims.

1: scribe device
2: scribe head
30, 40: Scribing tool
301, 401: scribing wheel
302, 402: rollers
G: Mother substrate
G1, G2: glass substrate

Claims (8)

A scribe method for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate by a sealing material,
Moving the first blade along the seal member while pressing the first blade at a position opposed to the seal member on the surface of the first substrate to form a scribe line on the surface of the first substrate,
The second blade is pressed against the first blade at a position displaced from the first blade on the surface of the second substrate by a predetermined distance in the direction along the seal member in parallel with the movement of the first blade, And a scribe line is formed on the surface of the second substrate. The method according to claim 1,
Wherein the predetermined distance is set to 0.5 mm or more. 3. The method according to claim 1 or 2,
Moving the first roller along the seal member while pressing the first roller at a position corresponding to the second edge of the surface of the first substrate,
Wherein the second roller is moved along the seal member while pressing the second roller at a position corresponding to the first edge of the surface of the second substrate. A scribe apparatus for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate by a sealing material,
A first scribe head for forming a scribe line on a surface of the first substrate,
A second scribe head for forming a scribe line on a surface of the second substrate,
And a driving unit for moving the first scribe head and the second scribe head in parallel with the mother substrate,
The first scribe head is driven so that the first blade moves along the seal member while pressing the first blade at a position opposed to the seal member on the surface of the first substrate,
The second scribing head is configured to move the first scribing head in a direction in which the second scribing head is displaced by a predetermined distance in the direction along the seal member from the first edge of the surface of the second substrate, , The second blade is driven to move along the seal member. 5. The method of claim 4,
Wherein the predetermined distance is set to 0.5 mm or more. The method according to claim 4 or 5,
The first scribing head moves the first roller along the seal member while pressing the first roller at a position corresponding to the second edge of the surface of the first substrate,
Wherein the second scribing head moves the second roller along the seal member while pressing the second roller at a position corresponding to the first edge of the surface of the second substrate. The method according to claim 6,
The first scribing head includes a first scribing tool for supporting both the first blade and the first roller,
Wherein the second scribing head includes a second scribing tool for supporting both the second blade and the second roller. The method according to claim 4 or 5,
Wherein the first blade and the second blade are each formed of a scribing wheel having a V-shaped edge at the outer periphery of the disk and a groove at a predetermined interval on the ridge of the edge of the blade, Lt; / RTI &gt;

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