KR20160011183A - 중합체 열산 발생제를 포함하는 조성물 및 이의 제법 - Google Patents

중합체 열산 발생제를 포함하는 조성물 및 이의 제법 Download PDF

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Publication number
KR20160011183A
KR20160011183A KR1020157032739A KR20157032739A KR20160011183A KR 20160011183 A KR20160011183 A KR 20160011183A KR 1020157032739 A KR1020157032739 A KR 1020157032739A KR 20157032739 A KR20157032739 A KR 20157032739A KR 20160011183 A KR20160011183 A KR 20160011183A
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South Korea
Prior art keywords
polymer
acrylate
group
photoresist pattern
methacrylate
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Abandoned
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KR1020157032739A
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English (en)
Korean (ko)
Inventor
헹펭 우
성은 홍
이 카오
지안 음
마가레타 파우네스쿠
무티아 티야가라얀
Original Assignee
에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘.
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Publication of KR20160011183A publication Critical patent/KR20160011183A/ko
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C08F226/10—N-Vinyl-pyrrolidone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/44—Preparation of metal salts or ammonium salts
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
    • C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C09D139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/54—Aqueous solutions or dispersions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020157032739A 2013-05-17 2014-05-15 중합체 열산 발생제를 포함하는 조성물 및 이의 제법 Abandoned KR20160011183A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/896,936 2013-05-17
US13/896,936 US9291909B2 (en) 2013-05-17 2013-05-17 Composition comprising a polymeric thermal acid generator and processes thereof
PCT/EP2014/059999 WO2014184308A1 (en) 2013-05-17 2014-05-15 A composition comprising a polymeric thermal acid generator and processes thereof

Publications (1)

Publication Number Publication Date
KR20160011183A true KR20160011183A (ko) 2016-01-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157032739A Abandoned KR20160011183A (ko) 2013-05-17 2014-05-15 중합체 열산 발생제를 포함하는 조성물 및 이의 제법

Country Status (8)

Country Link
US (1) US9291909B2 (enExample)
EP (1) EP2997058A1 (enExample)
JP (1) JP6342993B2 (enExample)
KR (1) KR20160011183A (enExample)
CN (1) CN105164172B (enExample)
SG (1) SG11201506923PA (enExample)
TW (1) TWI617890B (enExample)
WO (1) WO2014184308A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102845195B1 (ko) * 2024-09-03 2025-08-13 유한회사 디씨티머티리얼 포토레지스트 패턴을 개선하는 방법 및 이를 이용한 반도체 소자

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9530662B2 (en) * 2015-02-25 2016-12-27 GlobalFoundries, Inc. Methods for fabricating integrated circuits using directed self-assembly including a substantially periodic array of topographical features that includes etch resistant topographical features for transferability control
WO2016209205A1 (en) * 2015-06-22 2016-12-29 Intel Corporation Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (beol) interconnects
US9530663B1 (en) * 2015-06-23 2016-12-27 Nanya Technology Corp. Method for forming a pattern
US9574104B1 (en) 2015-10-16 2017-02-21 Az Electronic Materials (Luxembourg) S.A.R.L. Compositions and processes for self-assembly of block copolymers
JP2017157632A (ja) * 2016-02-29 2017-09-07 東芝メモリ株式会社 半導体装置の製造方法及びパターン形成方法
US9869933B2 (en) * 2016-03-07 2018-01-16 Rohm And Haas Electronic Materials Llc Pattern trimming methods
US9910355B2 (en) * 2016-07-29 2018-03-06 Rohm And Haas Electronic Materials Llc Method of negative tone development using a copolymer multilayer electrolyte and articles made therefrom
JP6757618B2 (ja) * 2016-08-01 2020-09-23 東京応化工業株式会社 レジストパターン厚肉化用ポリマー組成物、及びレジストパターン形成方法
JP6757623B2 (ja) * 2016-08-10 2020-09-23 東京応化工業株式会社 レジストパターン厚肉化用ポリマー組成物、及びレジストパターン形成方法
EP3500637B1 (en) 2016-08-18 2022-06-22 Merck Patent GmbH Polymer compositions for self-assembly applications
TWI755344B (zh) 2016-12-21 2022-02-11 德商馬克專利公司 用於嵌段共聚物之自組裝之新穎組合物及方法
JPWO2018131495A1 (ja) * 2017-01-10 2019-11-07 Ｊｓｒ株式会社 カバー膜形成方法、基材の処理方法及び組成物
US10691023B2 (en) * 2017-08-24 2020-06-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method for performing lithography process with post treatment
FR3075774B1 (fr) * 2017-12-21 2021-07-30 Commissariat Energie Atomique Procede de formation d’une structure de guidage chimique sur un substrat et procede de chemo-epitaxie
JPWO2019131953A1 (ja) * 2017-12-27 2020-12-24 Jsr株式会社 パターン形成方法及び感放射線性組成物
JP7554539B2 (ja) * 2019-09-19 2024-09-20 東京エレクトロン株式会社 狭小トレンチを形成する方法
US11682559B2 (en) 2020-06-11 2023-06-20 Tokyo Electron Limited Method to form narrow slot contacts
US11747733B2 (en) * 2021-01-08 2023-09-05 Tokyo Electron Limited Freeze-less methods for self-aligned double patterning
US20220291586A1 (en) * 2021-03-10 2022-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Underlayer composition and method of manufacturing a semiconductor device
CN113835296A (zh) * 2021-09-28 2021-12-24 之江实验室 一种飞秒激光直写光刻胶组合物

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE543031A (enExample) * 1954-12-29
JPS5849410A (ja) * 1981-09-19 1983-03-23 Sanyo Chem Ind Ltd カチオン性高分子凝集剤
US4491628A (en) 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
US6130303A (en) * 1988-12-19 2000-10-10 Cytec Technology Corp. Water-soluble, highly branched polymeric microparticles
EP0440374B1 (en) 1990-01-30 1997-04-16 Wako Pure Chemical Industries Ltd Chemical amplified resist material
US5321110A (en) * 1992-06-29 1994-06-14 Isp Investments Inc. Cationic polymer compositions
US5843624A (en) 1996-03-08 1998-12-01 Lucent Technologies Inc. Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
TW329539B (en) 1996-07-05 1998-04-11 Mitsubishi Electric Corp The semiconductor device and its manufacturing method
US6808859B1 (en) 1996-12-31 2004-10-26 Hyundai Electronics Industries Co., Ltd. ArF photoresist copolymers
US5863707A (en) 1997-02-11 1999-01-26 Advanced Micro Devices, Inc. Method for producing ultra-fine interconnection features
US6849377B2 (en) 1998-09-23 2005-02-01 E. I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
US6790587B1 (en) 1999-05-04 2004-09-14 E. I. Du Pont De Nemours And Company Fluorinated polymers, photoresists and processes for microlithography
US6207778B1 (en) * 1999-05-07 2001-03-27 Isp Investments Inc. Conditioning/styling terpolymers
WO2001098834A1 (en) 2000-06-21 2001-12-27 Asahi Glass Company, Limited Resist composition
US6447980B1 (en) 2000-07-19 2002-09-10 Clariant Finance (Bvi) Limited Photoresist composition for deep UV and process thereof
KR100776551B1 (ko) 2001-02-09 2007-11-16 아사히 가라스 가부시키가이샤 레지스트 조성물
US6723488B2 (en) 2001-11-07 2004-04-20 Clariant Finance (Bvi) Ltd Photoresist composition for deep UV radiation containing an additive
US6916594B2 (en) 2002-12-30 2005-07-12 Hynix Semiconductor Inc. Overcoating composition for photoresist and method for forming photoresist pattern using the same
WO2007141199A2 (de) 2006-06-09 2007-12-13 Basf Se Verfahren zum schutz metallischer oberflächen vor korrosion durch fluide medien unter verwendung von ethylen und aminogruppen umfassenden copolymeren
US7745007B2 (en) 2006-10-31 2010-06-29 S.D. Warren Company Release sheets and methods of making the same
US7923200B2 (en) 2007-04-09 2011-04-12 Az Electronic Materials Usa Corp. Composition for coating over a photoresist pattern comprising a lactam
US8715918B2 (en) 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
US7521094B1 (en) 2008-01-14 2009-04-21 International Business Machines Corporation Method of forming polymer features by directed self-assembly of block copolymers
US7745077B2 (en) 2008-06-18 2010-06-29 Az Electronic Materials Usa Corp. Composition for coating over a photoresist pattern
BR112012013063B1 (pt) * 2009-12-01 2020-01-21 Lubrizol Advanced Mat Inc polímeros de múltiplas finalidades hidroliticamente estáveis
US8309278B2 (en) 2010-07-07 2012-11-13 Massachusetts Institute Of Technology Guided self-assembly of block copolymer line structures for integrated circuit interconnects
US8691925B2 (en) 2011-09-23 2014-04-08 Az Electronic Materials (Luxembourg) S.A.R.L. Compositions of neutral layer for directed self assembly block copolymers and processes thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102845195B1 (ko) * 2024-09-03 2025-08-13 유한회사 디씨티머티리얼 포토레지스트 패턴을 개선하는 방법 및 이를 이용한 반도체 소자

Also Published As

Publication number Publication date
TW201500859A (zh) 2015-01-01
US9291909B2 (en) 2016-03-22
TWI617890B (zh) 2018-03-11
CN105164172A (zh) 2015-12-16
CN105164172B (zh) 2018-07-10
JP2016526183A (ja) 2016-09-01
EP2997058A1 (en) 2016-03-23
JP6342993B2 (ja) 2018-06-13
WO2014184308A1 (en) 2014-11-20
SG11201506923PA (en) 2015-09-29
US20140342290A1 (en) 2014-11-20

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