KR20150137986A - 기판 분단 방법 및 기판 분단 장치 - Google Patents

기판 분단 방법 및 기판 분단 장치 Download PDF

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Publication number
KR20150137986A
KR20150137986A KR1020150026078A KR20150026078A KR20150137986A KR 20150137986 A KR20150137986 A KR 20150137986A KR 1020150026078 A KR1020150026078 A KR 1020150026078A KR 20150026078 A KR20150026078 A KR 20150026078A KR 20150137986 A KR20150137986 A KR 20150137986A
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KR
South Korea
Prior art keywords
substrate
scribe line
scribing
forming member
line
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KR1020150026078A
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English (en)
Korean (ko)
Inventor
카츠노리 이치카와
요시타카 니시오
츠토무 우에노
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20150137986A publication Critical patent/KR20150137986A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B26F2003/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020150026078A 2014-05-30 2015-02-24 기판 분단 방법 및 기판 분단 장치 KR20150137986A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014111857A JP6349970B2 (ja) 2014-05-30 2014-05-30 基板分断方法並びに基板分断装置
JPJP-P-2014-111857 2014-05-30

Publications (1)

Publication Number Publication Date
KR20150137986A true KR20150137986A (ko) 2015-12-09

Family

ID=54840959

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150026078A KR20150137986A (ko) 2014-05-30 2015-02-24 기판 분단 방법 및 기판 분단 장치

Country Status (4)

Country Link
JP (1) JP6349970B2 (zh)
KR (1) KR20150137986A (zh)
CN (1) CN105314837B (zh)
TW (1) TWI648233B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3066488B1 (fr) * 2017-05-19 2022-03-04 Saint Gobain Procede de rompage d'une feuille de verre
JP2019025792A (ja) * 2017-07-31 2019-02-21 三星ダイヤモンド工業株式会社 ブレイク装置
TWI664134B (zh) * 2018-08-07 2019-07-01 住華科技股份有限公司 輸送設備及使用其之輸送方式
JP2020066539A (ja) 2018-10-22 2020-04-30 坂東機工株式会社 ガラス板の折割機械
NL2022696B1 (en) * 2019-03-08 2020-09-17 Voortman Steel Machinery Holding B V A sheet processing machine and a method for processing sheet material
CN110154249B (zh) * 2019-06-19 2021-06-18 江苏泽海机械科技有限公司 一种脆性板材剪切机
CN111063641A (zh) * 2020-01-08 2020-04-24 苏州德龙激光股份有限公司 半导体芯片的裂片装置及其方法
TWI754486B (zh) * 2020-12-10 2022-02-01 昌陽科技有限公司 玻璃基板裂片裝置
JP2024004015A (ja) * 2022-06-28 2024-01-16 日東電工株式会社 シート材の分断方法及びシート材の分断装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10338534A (ja) * 1997-06-03 1998-12-22 Toshiba Corp スクライブ装置、ブレーク装置、ガラス切断装置およびスクライブ方法
JP2001347497A (ja) * 2000-06-06 2001-12-18 Hitachi Ltd 分離切断方法及び装置
EP1886782A1 (en) * 2005-05-30 2008-02-13 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for cutting off substrate of fragile material
WO2007142264A1 (ja) * 2006-06-08 2007-12-13 Toray Engineering Co., Ltd. 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板

Also Published As

Publication number Publication date
TW201600481A (zh) 2016-01-01
JP6349970B2 (ja) 2018-07-04
TWI648233B (zh) 2019-01-21
CN105314837B (zh) 2019-05-10
JP2015223818A (ja) 2015-12-14
CN105314837A (zh) 2016-02-10

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