KR20150124379A - 취성 재료 기판의 반송 방법 및 반송 장치 - Google Patents

취성 재료 기판의 반송 방법 및 반송 장치 Download PDF

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Publication number
KR20150124379A
KR20150124379A KR1020150016704A KR20150016704A KR20150124379A KR 20150124379 A KR20150124379 A KR 20150124379A KR 1020150016704 A KR1020150016704 A KR 1020150016704A KR 20150016704 A KR20150016704 A KR 20150016704A KR 20150124379 A KR20150124379 A KR 20150124379A
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KR
South Korea
Prior art keywords
head
substrate
brittle material
material substrate
functional region
Prior art date
Application number
KR1020150016704A
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English (en)
Korean (ko)
Inventor
킨야 오타
이쿠오 도키모토
나오히로 구로다
사토시 이소지마
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20150124379A publication Critical patent/KR20150124379A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
KR1020150016704A 2014-04-28 2015-02-03 취성 재료 기판의 반송 방법 및 반송 장치 KR20150124379A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-092494 2014-04-28
JP2014092494A JP6331656B2 (ja) 2014-04-28 2014-04-28 脆性材料基板の搬送方法及び搬送装置

Publications (1)

Publication Number Publication Date
KR20150124379A true KR20150124379A (ko) 2015-11-05

Family

ID=54442835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150016704A KR20150124379A (ko) 2014-04-28 2015-02-03 취성 재료 기판의 반송 방법 및 반송 장치

Country Status (4)

Country Link
JP (1) JP6331656B2 (zh)
KR (1) KR20150124379A (zh)
CN (1) CN105035761B (zh)
TW (1) TWI650830B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6282176B2 (ja) * 2014-05-29 2018-02-21 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離装置
CN108357003A (zh) * 2018-05-11 2018-08-03 青岛高测科技股份有限公司 一种切割机头及包含该机头的两线开方机

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198601B2 (ja) * 2002-04-01 2008-12-17 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及びその方法を用いた分断装置
JP3779237B2 (ja) * 2002-07-04 2006-05-24 住友電気工業株式会社 基板切断方法及び基板切断装置
JP2005225603A (ja) * 2004-02-12 2005-08-25 Toyota Industries Corp パネル搬送装置
JP4139368B2 (ja) * 2004-09-15 2008-08-27 京元電子股▲ふん▼有限公司 電子装置試験用ピックアップ装置
CN2839170Y (zh) * 2005-09-30 2006-11-22 富士迈半导体精密工业（上海）有限公司 基板载具
JP4818767B2 (ja) * 2006-03-22 2011-11-16 株式会社メガトレード 外観検査装置
JP4746579B2 (ja) * 2007-03-29 2011-08-10 シャープ株式会社 低負荷搬送装置
JP2010118424A (ja) * 2008-11-12 2010-05-27 Disco Abrasive Syst Ltd 薄板状ワークの搬送装置
CN201540830U (zh) * 2009-10-30 2010-08-04 天津三星电机有限公司 贴片电容基板切断设备中用于基板投入的装置
JP2011114070A (ja) * 2009-11-25 2011-06-09 Disco Abrasive Syst Ltd 加工装置
JP2011181936A (ja) * 2011-03-28 2011-09-15 Renesas Electronics Corp 半導体装置の製造方法
JP2013078810A (ja) * 2011-10-03 2013-05-02 Smc Corp 真空吸着装置
CN102381554B (zh) * 2011-11-01 2013-03-13 武汉人天包装技术有限公司 一种取盘机
CN202414765U (zh) * 2011-12-31 2012-09-05 无锡市奥曼特科技有限公司 一种板式pecvd设备自动上下料系统的硅片搬运机构
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
CN203143683U (zh) * 2013-03-13 2013-08-21 龙口市埃迪克自动化设备有限公司 小型定向多点位搬送机械装置
JP5744109B2 (ja) * 2013-06-05 2015-07-01 三星ダイヤモンド工業株式会社 脆性基板搬送ユニット

Also Published As

Publication number Publication date
CN105035761B (zh) 2019-01-04
CN105035761A (zh) 2015-11-11
TW201541549A (zh) 2015-11-01
JP6331656B2 (ja) 2018-05-30
JP2015208938A (ja) 2015-11-24
TWI650830B (zh) 2019-02-11

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