KR20150123694A - 브레이크 방법 그리고 브레이크 장치 - Google Patents
브레이크 방법 그리고 브레이크 장치 Download PDFInfo
- Publication number
- KR20150123694A KR20150123694A KR1020150007863A KR20150007863A KR20150123694A KR 20150123694 A KR20150123694 A KR 20150123694A KR 1020150007863 A KR1020150007863 A KR 1020150007863A KR 20150007863 A KR20150007863 A KR 20150007863A KR 20150123694 A KR20150123694 A KR 20150123694A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- scribing line
- scribing
- forming member
- line
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mining & Mineral Resources (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2014-091980 | 2014-04-25 | ||
JP2014091980A JP2015209357A (ja) | 2014-04-25 | 2014-04-25 | ブレイク方法並びにブレイク装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20150123694A true KR20150123694A (ko) | 2015-11-04 |
Family
ID=54372560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150007863A KR20150123694A (ko) | 2014-04-25 | 2015-01-16 | 브레이크 방법 그리고 브레이크 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2015209357A (zh) |
KR (1) | KR20150123694A (zh) |
CN (1) | CN104999572B (zh) |
TW (1) | TW201540680A (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106064882B (zh) * | 2016-05-27 | 2019-01-15 | 苏州微米光学科技有限公司 | 大面积光学玻璃分隔机构 |
JP6987437B2 (ja) * | 2017-08-21 | 2022-01-05 | 株式会社ディスコ | チップの製造方法 |
JP6987436B2 (ja) * | 2017-08-21 | 2022-01-05 | 株式会社ディスコ | チップの製造方法 |
CN108793709A (zh) * | 2018-07-24 | 2018-11-13 | 南京中电熊猫液晶显示科技有限公司 | 一种基板切割刀轮装置及基板切割方法 |
JP7174350B2 (ja) * | 2018-11-28 | 2022-11-17 | 日本電気硝子株式会社 | テーブル |
DE102020123928A1 (de) * | 2020-09-15 | 2022-03-17 | Schott Ag | Verfahren und Vorrichtung zum Zuschneiden von Glasfolien |
CN113601023B (zh) * | 2021-07-27 | 2023-07-18 | 杭州康奋威科技股份有限公司 | 一种电池片低温无损切割装置及方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07138039A (ja) * | 1993-11-12 | 1995-05-30 | Fuji Xerox Co Ltd | スクライブ装置 |
JP2700136B2 (ja) * | 1994-06-02 | 1998-01-19 | 双栄通商株式会社 | 脆性材料の割断方法 |
JP4342039B2 (ja) * | 1999-06-15 | 2009-10-14 | 三星ダイヤモンド工業株式会社 | ガラススクライバー及びスクライブ方法 |
JP2011161491A (ja) * | 2010-02-10 | 2011-08-25 | Disco Abrasive Syst Ltd | レーザー加工装置 |
TWI529790B (zh) * | 2010-07-05 | 2016-04-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking device |
JP2012061681A (ja) * | 2010-09-15 | 2012-03-29 | Mitsuboshi Diamond Industrial Co Ltd | レーザ割断装置 |
TW201345685A (zh) * | 2012-05-02 | 2013-11-16 | Jun-Sheng Jiang | 易碎片狀工作物之裁切方法及裝置 |
CN203382654U (zh) * | 2013-06-18 | 2014-01-08 | 芜湖东旭光电科技有限公司 | 一种玻璃基板的划线切割装置 |
JP2015160769A (ja) * | 2014-02-27 | 2015-09-07 | 株式会社レミ | ガラス基板の割断方法 |
-
2014
- 2014-04-25 JP JP2014091980A patent/JP2015209357A/ja active Pending
- 2014-12-31 TW TW103146434A patent/TW201540680A/zh unknown
-
2015
- 2015-01-16 KR KR1020150007863A patent/KR20150123694A/ko not_active Application Discontinuation
- 2015-03-16 CN CN201510114309.8A patent/CN104999572B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104999572B (zh) | 2017-09-19 |
CN104999572A (zh) | 2015-10-28 |
JP2015209357A (ja) | 2015-11-24 |
TW201540680A (zh) | 2015-11-01 |
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