KR20150092020A - 적층체의 박리 개시부 작성 방법 및 박리 개시부 작성 장치 및 전자 디바이스의 제조 방법 - Google Patents

적층체의 박리 개시부 작성 방법 및 박리 개시부 작성 장치 및 전자 디바이스의 제조 방법 Download PDF

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Publication number
KR20150092020A
KR20150092020A KR1020150017260A KR20150017260A KR20150092020A KR 20150092020 A KR20150092020 A KR 20150092020A KR 1020150017260 A KR1020150017260 A KR 1020150017260A KR 20150017260 A KR20150017260 A KR 20150017260A KR 20150092020 A KR20150092020 A KR 20150092020A
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KR
South Korea
Prior art keywords
substrate
knife
peeling
liquid
laminate
Prior art date
Application number
KR1020150017260A
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English (en)
Korean (ko)
Inventor
야스노리 이토
히로시 우츠기
유키 다테야마
도모유키 시미즈
히로토시 데루이
Original Assignee
아사히 가라스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아사히 가라스 가부시키가이샤 filed Critical 아사히 가라스 가부시키가이샤
Publication of KR20150092020A publication Critical patent/KR20150092020A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
KR1020150017260A 2014-02-04 2015-02-04 적층체의 박리 개시부 작성 방법 및 박리 개시부 작성 장치 및 전자 디바이스의 제조 방법 KR20150092020A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014019160A JP2015145306A (ja) 2014-02-04 2014-02-04 積層体の剥離開始部作成方法及び剥離開始部作成装置並びに電子デバイスの製造方法
JPJP-P-2014-019160 2014-02-04

Publications (1)

Publication Number Publication Date
KR20150092020A true KR20150092020A (ko) 2015-08-12

Family

ID=53731548

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150017260A KR20150092020A (ko) 2014-02-04 2015-02-04 적층체의 박리 개시부 작성 방법 및 박리 개시부 작성 장치 및 전자 디바이스의 제조 방법

Country Status (4)

Country Link
JP (1) JP2015145306A (zh)
KR (1) KR20150092020A (zh)
CN (1) CN104821293A (zh)
TW (1) TW201540516A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108140605B (zh) * 2015-10-16 2022-06-07 Ａｇｃ株式会社 层叠体的剥离装置和剥离方法及电子器件的制造方法
JP6991673B2 (ja) 2018-02-27 2022-01-12 株式会社ディスコ 剥離方法
CN111341715B (zh) * 2018-12-19 2022-11-08 瀚宇彩晶股份有限公司 电子装置及其制作方法
JP7115510B2 (ja) * 2019-06-06 2022-08-09 Ａｇｃ株式会社 積層基板、および梱包体
JP6900540B1 (ja) * 2020-04-08 2021-07-07 信越エンジニアリング株式会社 ワーク分離装置及びワーク分離方法
WO2022009451A1 (ja) * 2020-07-06 2022-01-13 東洋紡株式会社 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3910485B2 (ja) * 2002-05-15 2007-04-25 シャープ株式会社 フィルム剥離装置およびフィルム剥離方法
JP4241697B2 (ja) * 2005-09-06 2009-03-18 ユーテック株式会社 フィルム剥離装置
JP5807554B2 (ja) * 2012-01-19 2015-11-10 旭硝子株式会社 剥離装置、及び電子デバイスの製造方法

Also Published As

Publication number Publication date
TW201540516A (zh) 2015-11-01
CN104821293A (zh) 2015-08-05
JP2015145306A (ja) 2015-08-13

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