KR20150079466A - 포지셔닝 프레임 구조체 - Google Patents
포지셔닝 프레임 구조체 Download PDFInfo
- Publication number
- KR20150079466A KR20150079466A KR1020140193614A KR20140193614A KR20150079466A KR 20150079466 A KR20150079466 A KR 20150079466A KR 1020140193614 A KR1020140193614 A KR 1020140193614A KR 20140193614 A KR20140193614 A KR 20140193614A KR 20150079466 A KR20150079466 A KR 20150079466A
- Authority
- KR
- South Korea
- Prior art keywords
- positioning
- chamber
- size
- carrier
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310752418.3A CN104749390B (zh) | 2013-12-31 | 2013-12-31 | 定位框架结构 |
| CN201310752418.3 | 2013-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150079466A true KR20150079466A (ko) | 2015-07-08 |
Family
ID=52423542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140193614A Withdrawn KR20150079466A (ko) | 2013-12-31 | 2014-12-30 | 포지셔닝 프레임 구조체 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9564351B2 (https=) |
| EP (1) | EP2896966B1 (https=) |
| JP (1) | JP6291412B2 (https=) |
| KR (1) | KR20150079466A (https=) |
| CN (1) | CN104749390B (https=) |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2965235A (en) * | 1958-03-07 | 1960-12-20 | Daline Gordon | Perforated display panel with magnetic attachment means |
| DE8711744U1 (de) * | 1987-08-29 | 1988-12-29 | Heidelberger Druckmaschinen Ag, 6900 Heidelberg | Haltevorrichtung für einen Hohlwellen-Inkrementalgeber |
| KR960000342B1 (ko) * | 1989-03-14 | 1996-01-05 | 미쯔비시 덴끼 가부시끼가이샤 | 홀 효과형 센서 장치 |
| JPH0344588A (ja) * | 1989-07-12 | 1991-02-26 | Tdk Corp | 移動物体検出センサ |
| US5007290A (en) * | 1989-10-31 | 1991-04-16 | New Sd, Inc | Method and apparatus for producing preload of an accelerometer assembly |
| US5115194A (en) * | 1990-09-27 | 1992-05-19 | Kearney-National Inc. | Hall effect position sensor with flux limiter and magnetic dispersion means |
| US5255795A (en) * | 1991-12-05 | 1993-10-26 | Vlsi Technology, Inc. | Test fixture |
| JPH07101163B2 (ja) * | 1992-10-14 | 1995-11-01 | カーニー−ナショナル・インコーポレーテッド | 磁束制限器及び磁気分散手段を備えるホール効果位置センサ |
| US7876188B2 (en) * | 2006-11-06 | 2011-01-25 | Tang System | Green technologies: the killer application of EMI-free on-chip inductor |
| US5414355A (en) * | 1994-03-03 | 1995-05-09 | Honeywell Inc. | Magnet carrier disposed within an outer housing |
| JPH08139429A (ja) * | 1994-11-07 | 1996-05-31 | Sumitomo Electric Ind Ltd | 電子回路装置 |
| US5500589A (en) * | 1995-01-18 | 1996-03-19 | Honeywell Inc. | Method for calibrating a sensor by moving a magnet while monitoring an output signal from a magnetically sensitive component |
| US5581179A (en) * | 1995-05-31 | 1996-12-03 | Allegro Microsystems, Inc. | Hall-effect ferrous-article-proximity sensor assembly |
| JPH09133743A (ja) * | 1995-11-08 | 1997-05-20 | Murata Mfg Co Ltd | 磁気センサ |
| US6355885B1 (en) * | 1996-05-02 | 2002-03-12 | William J. Rintz | Sub frame assembly for light switch assembly |
| EP0916074B1 (en) * | 1997-05-29 | 2003-07-30 | AMS International AG | Magnetic rotation sensor |
| US6291990B1 (en) * | 1997-09-29 | 2001-09-18 | Hitachi, Ltd. | Revolution sensor |
| JPH11153452A (ja) * | 1997-11-20 | 1999-06-08 | Hitachi Ltd | 回転検出装置 |
| US6346811B1 (en) * | 1997-10-20 | 2002-02-12 | Wolff Controls Corp. | Methods for mounting a sensor and signal conditioner to form sensing apparatus having enhanced sensing capabilities and reduced size |
| US5868251A (en) * | 1997-11-06 | 1999-02-09 | Lin; Wan-Chang | Disk-shaped storage case for screwdriver tips |
| US6018130A (en) * | 1998-05-20 | 2000-01-25 | Breed Automotive Technology, Inc. | Roll-over sensor with pendulum mounted magnet |
| JP4041797B2 (ja) * | 2001-06-28 | 2008-01-30 | ポラック ラボラトリーズ インコーポレイテッド | 内蔵型センサ装置 |
| US6707293B2 (en) * | 2001-11-15 | 2004-03-16 | Honeywell International Inc. | 360-degree rotary position sensor having a magnetoresistive sensor and a hall sensor |
| JP4179083B2 (ja) * | 2003-07-08 | 2008-11-12 | 株式会社デンソー | 回転検出装置 |
| US7462317B2 (en) * | 2004-11-10 | 2008-12-09 | Enpirion, Inc. | Method of manufacturing an encapsulated package for a magnetic device |
| DE102005047414B4 (de) * | 2005-02-21 | 2012-01-05 | Infineon Technologies Ag | Magnetoresistives Sensormodul und Verfahren zum Herstellen desselben |
| US7425824B2 (en) * | 2005-05-20 | 2008-09-16 | Honeywell International Inc. | Magnetoresistive sensor |
| JP4232771B2 (ja) * | 2005-09-30 | 2009-03-04 | 株式会社デンソー | 回転検出装置 |
| US8701272B2 (en) * | 2005-10-05 | 2014-04-22 | Enpirion, Inc. | Method of forming a power module with a magnetic device having a conductive clip |
| FR2902872B1 (fr) * | 2006-06-27 | 2008-11-14 | Arvinmeritor Light Vehicle Sys | Dispositif de mesure de champ magnetique. |
| US20080013298A1 (en) * | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
| JP2008216043A (ja) * | 2007-03-05 | 2008-09-18 | Honda Lock Mfg Co Ltd | 回転センサ |
| US7570047B2 (en) * | 2007-06-18 | 2009-08-04 | Key Safety Systems, Inc. | Hall effect based angular position sensor |
| US7710110B2 (en) * | 2007-07-07 | 2010-05-04 | Honeywell International Inc. | Rotary sensor with rotary sensing element and rotatable hollow magnet |
| US7920042B2 (en) * | 2007-09-10 | 2011-04-05 | Enpirion, Inc. | Micromagnetic device and method of forming the same |
| US9518815B2 (en) * | 2008-08-06 | 2016-12-13 | Haas Automation, Inc. | Rotary position encoder for rotatable shafts |
| DE102009006529A1 (de) * | 2009-01-28 | 2010-08-26 | Continental Automotive Gmbh | Positionssensor |
| CN201681086U (zh) * | 2010-05-11 | 2010-12-22 | 杭州南科汽车传感器有限公司 | 主动式轮速传感器 |
| US9201123B2 (en) * | 2011-11-04 | 2015-12-01 | Infineon Technologies Ag | Magnetic sensor device and a method for fabricating the same |
| CN103094778A (zh) * | 2011-11-04 | 2013-05-08 | 深圳富泰宏精密工业有限公司 | 便携式电子装置及其芯片卡装取装置 |
| US8727326B2 (en) * | 2012-03-21 | 2014-05-20 | Cheng Uei Precision Industry Co., Ltd. | Assembly jig |
| US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
| DE102013219017A1 (de) * | 2012-12-20 | 2014-06-26 | Continental Teves Ag & Co. Ohg | Sensor zum Ausgeben eines elektrischen Signals |
| DE102012224424A1 (de) * | 2012-12-27 | 2014-07-17 | Robert Bosch Gmbh | Sensorsystem und Abdeckvorrichtung für ein Sensorsystem |
| US20140254835A1 (en) * | 2013-03-05 | 2014-09-11 | Analog Devices, Inc. | Packaged Microphone System with a Permanent Magnet |
| US9446745B2 (en) * | 2013-09-10 | 2016-09-20 | KSR IP Holdings, LLC | Integrated rotary and linear sensor |
| CN203772882U (zh) * | 2013-12-31 | 2014-08-13 | 森萨塔科技(常州)有限公司 | 定位框架结构 |
-
2013
- 2013-12-31 CN CN201310752418.3A patent/CN104749390B/zh active Active
-
2014
- 2014-12-26 JP JP2014263987A patent/JP6291412B2/ja active Active
- 2014-12-29 US US14/584,207 patent/US9564351B2/en active Active
- 2014-12-30 KR KR1020140193614A patent/KR20150079466A/ko not_active Withdrawn
- 2014-12-30 EP EP14200644.4A patent/EP2896966B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20150187623A1 (en) | 2015-07-02 |
| EP2896966B1 (en) | 2021-06-23 |
| US9564351B2 (en) | 2017-02-07 |
| CN104749390B (zh) | 2020-07-03 |
| JP2015132601A (ja) | 2015-07-23 |
| CN104749390A (zh) | 2015-07-01 |
| EP2896966A1 (en) | 2015-07-22 |
| JP6291412B2 (ja) | 2018-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3807977A4 (en) | A sealed axial flux motor with integrated cooling | |
| GB201703988D0 (en) | Method for detecting contamination of an optical component of a surroundings sensor for recording the surrounding area of a vehicle, method for the machine | |
| WO2014079939A3 (de) | Optoelektronisches halbleiterbauteil | |
| WO2011090570A3 (en) | Semiconductor package with embedded die and its methods of fabrication | |
| EP4328608A3 (en) | Process integration of a single chip three axis magnetic field sensor | |
| EP4283676A3 (en) | Precision resistor for non-planar semiconductor device architecture | |
| WO2013102137A3 (en) | Fully molded fan-out | |
| WO2015049321A3 (en) | A sensor for an oral appliance | |
| WO2013185925A8 (de) | Halterungssystem für eine mobilfunk-antenne und eine mobilfunk-komponente | |
| WO2010041230A3 (en) | Microfluidic integrated device for sample processing | |
| GB2514022A (en) | Inductive inertial sensor architecture & fabrication in packaging build-up layers | |
| WO2009011140A1 (ja) | 半導体パッケージとその製造方法 | |
| WO2017050039A1 (zh) | 电容式传感装置、封装结构、感测模组、以及电子设备 | |
| KR20250003449A (ko) | 센서 장치 | |
| WO2013167466A3 (en) | Integrated circuit with directional light sensor, device including such an ic and method of manufacturing such an ic | |
| WO2011143544A3 (en) | Torque sensor assembly and method for producing same | |
| WO2012175836A3 (fr) | Machine et procede d'assemblage d'un modele pour moulage a modele perdu, procede de moulage correspondant | |
| CL2012002518A1 (es) | Un portador de soporte de una estructura de soporte de una criba vibratoria, que posee por lo menos un elemento recto hecho de una sola pieza con por lo menos un parte espaciadora integrada. | |
| KR20150079466A (ko) | 포지셔닝 프레임 구조체 | |
| WO2015084467A3 (en) | Hydromotive and aeromotive machine impeller attachment | |
| JP2017015425A5 (https=) | ||
| JP2017215148A5 (https=) | ||
| WO2011112728A3 (en) | Package having spaced apart heat sink | |
| CN203772882U (zh) | 定位框架结构 | |
| US20130235262A1 (en) | Method for packaging image sensor structure and image sensor structure formed from the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |