JP6291412B2 - 位置決めフレーム構造 - Google Patents

位置決めフレーム構造 Download PDF

Info

Publication number
JP6291412B2
JP6291412B2 JP2014263987A JP2014263987A JP6291412B2 JP 6291412 B2 JP6291412 B2 JP 6291412B2 JP 2014263987 A JP2014263987 A JP 2014263987A JP 2014263987 A JP2014263987 A JP 2014263987A JP 6291412 B2 JP6291412 B2 JP 6291412B2
Authority
JP
Japan
Prior art keywords
chamber
positioning
carrier
frame structure
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014263987A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015132601A (ja
JP2015132601A5 (https=
Inventor
ウー ティエンシュン
ウー ティエンシュン
ホワン チュヨンウエイ
ホワン チュヨンウエイ
シェイ シャオチー
シェイ シャオチー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensata Technologies Changzhou Co Ltd
Original Assignee
Sensata Technologies Changzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Technologies Changzhou Co Ltd filed Critical Sensata Technologies Changzhou Co Ltd
Publication of JP2015132601A publication Critical patent/JP2015132601A/ja
Publication of JP2015132601A5 publication Critical patent/JP2015132601A5/ja
Application granted granted Critical
Publication of JP6291412B2 publication Critical patent/JP6291412B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/026—Housings for speed measuring devices, e.g. pulse generator
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/42—Devices characterised by the use of electric or magnetic means
    • G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
    • G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
    • G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
    • G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
JP2014263987A 2013-12-31 2014-12-26 位置決めフレーム構造 Active JP6291412B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310752418.3A CN104749390B (zh) 2013-12-31 2013-12-31 定位框架结构
CN201310752418.3 2013-12-31

Publications (3)

Publication Number Publication Date
JP2015132601A JP2015132601A (ja) 2015-07-23
JP2015132601A5 JP2015132601A5 (https=) 2018-02-08
JP6291412B2 true JP6291412B2 (ja) 2018-03-14

Family

ID=52423542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014263987A Active JP6291412B2 (ja) 2013-12-31 2014-12-26 位置決めフレーム構造

Country Status (5)

Country Link
US (1) US9564351B2 (https=)
EP (1) EP2896966B1 (https=)
JP (1) JP6291412B2 (https=)
KR (1) KR20150079466A (https=)
CN (1) CN104749390B (https=)

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2965235A (en) * 1958-03-07 1960-12-20 Daline Gordon Perforated display panel with magnetic attachment means
DE8711744U1 (de) * 1987-08-29 1988-12-29 Heidelberger Druckmaschinen Ag, 6900 Heidelberg Haltevorrichtung für einen Hohlwellen-Inkrementalgeber
KR960000342B1 (ko) * 1989-03-14 1996-01-05 미쯔비시 덴끼 가부시끼가이샤 홀 효과형 센서 장치
JPH0344588A (ja) * 1989-07-12 1991-02-26 Tdk Corp 移動物体検出センサ
US5007290A (en) * 1989-10-31 1991-04-16 New Sd, Inc Method and apparatus for producing preload of an accelerometer assembly
US5115194A (en) * 1990-09-27 1992-05-19 Kearney-National Inc. Hall effect position sensor with flux limiter and magnetic dispersion means
US5255795A (en) * 1991-12-05 1993-10-26 Vlsi Technology, Inc. Test fixture
JPH07101163B2 (ja) * 1992-10-14 1995-11-01 カーニー−ナショナル・インコーポレーテッド 磁束制限器及び磁気分散手段を備えるホール効果位置センサ
US7876188B2 (en) * 2006-11-06 2011-01-25 Tang System Green technologies: the killer application of EMI-free on-chip inductor
US5414355A (en) * 1994-03-03 1995-05-09 Honeywell Inc. Magnet carrier disposed within an outer housing
JPH08139429A (ja) * 1994-11-07 1996-05-31 Sumitomo Electric Ind Ltd 電子回路装置
US5500589A (en) * 1995-01-18 1996-03-19 Honeywell Inc. Method for calibrating a sensor by moving a magnet while monitoring an output signal from a magnetically sensitive component
US5581179A (en) * 1995-05-31 1996-12-03 Allegro Microsystems, Inc. Hall-effect ferrous-article-proximity sensor assembly
JPH09133743A (ja) * 1995-11-08 1997-05-20 Murata Mfg Co Ltd 磁気センサ
US6355885B1 (en) * 1996-05-02 2002-03-12 William J. Rintz Sub frame assembly for light switch assembly
EP0916074B1 (en) * 1997-05-29 2003-07-30 AMS International AG Magnetic rotation sensor
US6291990B1 (en) * 1997-09-29 2001-09-18 Hitachi, Ltd. Revolution sensor
JPH11153452A (ja) * 1997-11-20 1999-06-08 Hitachi Ltd 回転検出装置
US6346811B1 (en) * 1997-10-20 2002-02-12 Wolff Controls Corp. Methods for mounting a sensor and signal conditioner to form sensing apparatus having enhanced sensing capabilities and reduced size
US5868251A (en) * 1997-11-06 1999-02-09 Lin; Wan-Chang Disk-shaped storage case for screwdriver tips
US6018130A (en) * 1998-05-20 2000-01-25 Breed Automotive Technology, Inc. Roll-over sensor with pendulum mounted magnet
JP4041797B2 (ja) * 2001-06-28 2008-01-30 ポラック ラボラトリーズ インコーポレイテッド 内蔵型センサ装置
US6707293B2 (en) * 2001-11-15 2004-03-16 Honeywell International Inc. 360-degree rotary position sensor having a magnetoresistive sensor and a hall sensor
JP4179083B2 (ja) * 2003-07-08 2008-11-12 株式会社デンソー 回転検出装置
US7462317B2 (en) * 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
DE102005047414B4 (de) * 2005-02-21 2012-01-05 Infineon Technologies Ag Magnetoresistives Sensormodul und Verfahren zum Herstellen desselben
US7425824B2 (en) * 2005-05-20 2008-09-16 Honeywell International Inc. Magnetoresistive sensor
JP4232771B2 (ja) * 2005-09-30 2009-03-04 株式会社デンソー 回転検出装置
US8701272B2 (en) * 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
FR2902872B1 (fr) * 2006-06-27 2008-11-14 Arvinmeritor Light Vehicle Sys Dispositif de mesure de champ magnetique.
US20080013298A1 (en) * 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
JP2008216043A (ja) * 2007-03-05 2008-09-18 Honda Lock Mfg Co Ltd 回転センサ
US7570047B2 (en) * 2007-06-18 2009-08-04 Key Safety Systems, Inc. Hall effect based angular position sensor
US7710110B2 (en) * 2007-07-07 2010-05-04 Honeywell International Inc. Rotary sensor with rotary sensing element and rotatable hollow magnet
US7920042B2 (en) * 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US9518815B2 (en) * 2008-08-06 2016-12-13 Haas Automation, Inc. Rotary position encoder for rotatable shafts
DE102009006529A1 (de) * 2009-01-28 2010-08-26 Continental Automotive Gmbh Positionssensor
CN201681086U (zh) * 2010-05-11 2010-12-22 杭州南科汽车传感器有限公司 主动式轮速传感器
US9201123B2 (en) * 2011-11-04 2015-12-01 Infineon Technologies Ag Magnetic sensor device and a method for fabricating the same
CN103094778A (zh) * 2011-11-04 2013-05-08 深圳富泰宏精密工业有限公司 便携式电子装置及其芯片卡装取装置
US8727326B2 (en) * 2012-03-21 2014-05-20 Cheng Uei Precision Industry Co., Ltd. Assembly jig
US8779635B2 (en) * 2012-04-10 2014-07-15 Kla-Tencor Corporation Arrangement of reticle positioning device for actinic inspection of EUV reticles
DE102013219017A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Sensor zum Ausgeben eines elektrischen Signals
DE102012224424A1 (de) * 2012-12-27 2014-07-17 Robert Bosch Gmbh Sensorsystem und Abdeckvorrichtung für ein Sensorsystem
US20140254835A1 (en) * 2013-03-05 2014-09-11 Analog Devices, Inc. Packaged Microphone System with a Permanent Magnet
US9446745B2 (en) * 2013-09-10 2016-09-20 KSR IP Holdings, LLC Integrated rotary and linear sensor
CN203772882U (zh) * 2013-12-31 2014-08-13 森萨塔科技（常州）有限公司 定位框架结构

Also Published As

Publication number Publication date
US20150187623A1 (en) 2015-07-02
KR20150079466A (ko) 2015-07-08
EP2896966B1 (en) 2021-06-23
US9564351B2 (en) 2017-02-07
CN104749390B (zh) 2020-07-03
JP2015132601A (ja) 2015-07-23
CN104749390A (zh) 2015-07-01
EP2896966A1 (en) 2015-07-22

Similar Documents

Publication Publication Date Title
US8984964B2 (en) Torque measurement device
EP3807977A4 (en) A sealed axial flux motor with integrated cooling
EP4328608A3 (en) Process integration of a single chip three axis magnetic field sensor
EP4283676A3 (en) Precision resistor for non-planar semiconductor device architecture
WO2013003784A3 (en) Process for a sealed mems device with a portion exposed to the environment
KR101978027B1 (ko) 집적 회로 조립체용 성형 복합 인클로저
FR3047560B1 (fr) Procede de fabrication d’un capteur de couple comprenant une etape d’encapsulation du circuit electronique du capteur.
JP2016540393A5 (https=)
WO2009057927A3 (en) Package for semiconductor device and packaging method thereof
EP2952886A8 (en) Method for manufacturing a gas sensor package
CN105393089A (zh) 用于检测车辆车轮转速的传感器装置和传感器设备、用于车辆的车轮转速检测系统和具有车轮转速检测系统的车辆及这种传感器装置的应用和制造方法
KR20250003449A (ko) 센서 장치
WO2015036287A3 (de) Verfahren zum herstellen eines bauelementes
JP2018163120A5 (https=)
WO2017050039A1 (zh) 电容式传感装置、封装结构、感测模组、以及电子设备
WO2017160496A8 (en) Assembly using a magnetic field sensor for detecting a rotation and a linear movement of an object
WO2015088658A3 (en) Integrated wire bonder and 3d measurement system with defect rejection
JP6291412B2 (ja) 位置決めフレーム構造
JP2017215148A5 (https=)
JP2017015425A5 (https=)
JP2016186580A5 (https=)
JP2011107104A5 (https=)
JP6349506B2 (ja) ハルバッハ配列及び磁性リングによるｄｑ比を用いた円筒リニアモータの位置検出装置及び方法
CN106481656B (zh) 一种具有自动保护及检测功能的智能轴承
CN203772882U (zh) 定位框架结构

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171219

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20171219

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20171219

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20180109

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180209

R150 Certificate of patent or registration of utility model

Ref document number: 6291412

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250