KR20150079466A - 포지셔닝 프레임 구조체 - Google Patents
포지셔닝 프레임 구조체 Download PDFInfo
- Publication number
- KR20150079466A KR20150079466A KR1020140193614A KR20140193614A KR20150079466A KR 20150079466 A KR20150079466 A KR 20150079466A KR 1020140193614 A KR1020140193614 A KR 1020140193614A KR 20140193614 A KR20140193614 A KR 20140193614A KR 20150079466 A KR20150079466 A KR 20150079466A
- Authority
- KR
- South Korea
- Prior art keywords
- positioning
- chamber
- size
- carrier
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H10P95/00—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
- G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
- G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
- G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
- G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H10P72/50—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310752418.3 | 2013-12-31 | ||
| CN201310752418.3A CN104749390B (zh) | 2013-12-31 | 2013-12-31 | 定位框架结构 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150079466A true KR20150079466A (ko) | 2015-07-08 |
Family
ID=52423542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140193614A Withdrawn KR20150079466A (ko) | 2013-12-31 | 2014-12-30 | 포지셔닝 프레임 구조체 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9564351B2 (enExample) |
| EP (1) | EP2896966B1 (enExample) |
| JP (1) | JP6291412B2 (enExample) |
| KR (1) | KR20150079466A (enExample) |
| CN (1) | CN104749390B (enExample) |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2965235A (en) * | 1958-03-07 | 1960-12-20 | Daline Gordon | Perforated display panel with magnetic attachment means |
| DE8711744U1 (de) * | 1987-08-29 | 1988-12-29 | Heidelberger Druckmaschinen Ag, 6900 Heidelberg | Haltevorrichtung für einen Hohlwellen-Inkrementalgeber |
| KR960000342B1 (ko) * | 1989-03-14 | 1996-01-05 | 미쯔비시 덴끼 가부시끼가이샤 | 홀 효과형 센서 장치 |
| JPH0344588A (ja) * | 1989-07-12 | 1991-02-26 | Tdk Corp | 移動物体検出センサ |
| US5007290A (en) * | 1989-10-31 | 1991-04-16 | New Sd, Inc | Method and apparatus for producing preload of an accelerometer assembly |
| US5115194A (en) * | 1990-09-27 | 1992-05-19 | Kearney-National Inc. | Hall effect position sensor with flux limiter and magnetic dispersion means |
| US5255795A (en) * | 1991-12-05 | 1993-10-26 | Vlsi Technology, Inc. | Test fixture |
| JPH07101163B2 (ja) * | 1992-10-14 | 1995-11-01 | カーニー−ナショナル・インコーポレーテッド | 磁束制限器及び磁気分散手段を備えるホール効果位置センサ |
| US7876188B2 (en) * | 2006-11-06 | 2011-01-25 | Tang System | Green technologies: the killer application of EMI-free on-chip inductor |
| US5414355A (en) * | 1994-03-03 | 1995-05-09 | Honeywell Inc. | Magnet carrier disposed within an outer housing |
| JPH08139429A (ja) * | 1994-11-07 | 1996-05-31 | Sumitomo Electric Ind Ltd | 電子回路装置 |
| US5500589A (en) * | 1995-01-18 | 1996-03-19 | Honeywell Inc. | Method for calibrating a sensor by moving a magnet while monitoring an output signal from a magnetically sensitive component |
| US5581179A (en) * | 1995-05-31 | 1996-12-03 | Allegro Microsystems, Inc. | Hall-effect ferrous-article-proximity sensor assembly |
| JPH09133743A (ja) * | 1995-11-08 | 1997-05-20 | Murata Mfg Co Ltd | 磁気センサ |
| US6355885B1 (en) * | 1996-05-02 | 2002-03-12 | William J. Rintz | Sub frame assembly for light switch assembly |
| DE69816755T2 (de) * | 1997-05-29 | 2004-06-03 | Ams International Ag | Magnetischer drehgeber |
| US6291990B1 (en) * | 1997-09-29 | 2001-09-18 | Hitachi, Ltd. | Revolution sensor |
| JPH11153452A (ja) * | 1997-11-20 | 1999-06-08 | Hitachi Ltd | 回転検出装置 |
| US6346811B1 (en) * | 1997-10-20 | 2002-02-12 | Wolff Controls Corp. | Methods for mounting a sensor and signal conditioner to form sensing apparatus having enhanced sensing capabilities and reduced size |
| US5868251A (en) * | 1997-11-06 | 1999-02-09 | Lin; Wan-Chang | Disk-shaped storage case for screwdriver tips |
| US6018130A (en) * | 1998-05-20 | 2000-01-25 | Breed Automotive Technology, Inc. | Roll-over sensor with pendulum mounted magnet |
| WO2003003407A1 (en) * | 2001-06-28 | 2003-01-09 | Greene, Tweed Of Delaware, Inc. | Self contained sensing apparatus and system |
| US6707293B2 (en) * | 2001-11-15 | 2004-03-16 | Honeywell International Inc. | 360-degree rotary position sensor having a magnetoresistive sensor and a hall sensor |
| JP4179083B2 (ja) * | 2003-07-08 | 2008-11-12 | 株式会社デンソー | 回転検出装置 |
| US7462317B2 (en) * | 2004-11-10 | 2008-12-09 | Enpirion, Inc. | Method of manufacturing an encapsulated package for a magnetic device |
| DE102005047414B4 (de) * | 2005-02-21 | 2012-01-05 | Infineon Technologies Ag | Magnetoresistives Sensormodul und Verfahren zum Herstellen desselben |
| US7425824B2 (en) * | 2005-05-20 | 2008-09-16 | Honeywell International Inc. | Magnetoresistive sensor |
| JP4232771B2 (ja) * | 2005-09-30 | 2009-03-04 | 株式会社デンソー | 回転検出装置 |
| US8701272B2 (en) * | 2005-10-05 | 2014-04-22 | Enpirion, Inc. | Method of forming a power module with a magnetic device having a conductive clip |
| FR2902872B1 (fr) * | 2006-06-27 | 2008-11-14 | Arvinmeritor Light Vehicle Sys | Dispositif de mesure de champ magnetique. |
| US20080013298A1 (en) * | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
| JP2008216043A (ja) * | 2007-03-05 | 2008-09-18 | Honda Lock Mfg Co Ltd | 回転センサ |
| US7570047B2 (en) * | 2007-06-18 | 2009-08-04 | Key Safety Systems, Inc. | Hall effect based angular position sensor |
| US7710110B2 (en) * | 2007-07-07 | 2010-05-04 | Honeywell International Inc. | Rotary sensor with rotary sensing element and rotatable hollow magnet |
| US7920042B2 (en) * | 2007-09-10 | 2011-04-05 | Enpirion, Inc. | Micromagnetic device and method of forming the same |
| US9518815B2 (en) * | 2008-08-06 | 2016-12-13 | Haas Automation, Inc. | Rotary position encoder for rotatable shafts |
| DE102009006529A1 (de) * | 2009-01-28 | 2010-08-26 | Continental Automotive Gmbh | Positionssensor |
| CN201681086U (zh) * | 2010-05-11 | 2010-12-22 | 杭州南科汽车传感器有限公司 | 主动式轮速传感器 |
| US9201123B2 (en) * | 2011-11-04 | 2015-12-01 | Infineon Technologies Ag | Magnetic sensor device and a method for fabricating the same |
| CN103094778A (zh) * | 2011-11-04 | 2013-05-08 | 深圳富泰宏精密工业有限公司 | 便携式电子装置及其芯片卡装取装置 |
| US8727326B2 (en) * | 2012-03-21 | 2014-05-20 | Cheng Uei Precision Industry Co., Ltd. | Assembly jig |
| US8779635B2 (en) * | 2012-04-10 | 2014-07-15 | Kla-Tencor Corporation | Arrangement of reticle positioning device for actinic inspection of EUV reticles |
| DE102013219018A1 (de) * | 2012-12-20 | 2014-06-26 | Continental Teves Ag & Co. Ohg | Winkelsensors |
| DE102012224424A1 (de) * | 2012-12-27 | 2014-07-17 | Robert Bosch Gmbh | Sensorsystem und Abdeckvorrichtung für ein Sensorsystem |
| US20140254835A1 (en) * | 2013-03-05 | 2014-09-11 | Analog Devices, Inc. | Packaged Microphone System with a Permanent Magnet |
| CN105722737B (zh) * | 2013-09-10 | 2019-04-12 | Ksr智财控股公司 | 集成的制动控制传感器 |
| CN203772882U (zh) * | 2013-12-31 | 2014-08-13 | 森萨塔科技(常州)有限公司 | 定位框架结构 |
-
2013
- 2013-12-31 CN CN201310752418.3A patent/CN104749390B/zh active Active
-
2014
- 2014-12-26 JP JP2014263987A patent/JP6291412B2/ja active Active
- 2014-12-29 US US14/584,207 patent/US9564351B2/en active Active
- 2014-12-30 KR KR1020140193614A patent/KR20150079466A/ko not_active Withdrawn
- 2014-12-30 EP EP14200644.4A patent/EP2896966B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015132601A (ja) | 2015-07-23 |
| EP2896966B1 (en) | 2021-06-23 |
| CN104749390A (zh) | 2015-07-01 |
| EP2896966A1 (en) | 2015-07-22 |
| JP6291412B2 (ja) | 2018-03-14 |
| US20150187623A1 (en) | 2015-07-02 |
| CN104749390B (zh) | 2020-07-03 |
| US9564351B2 (en) | 2017-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |