KR20150073992A - 히트 싱크 부착 장치 및 방법 - Google Patents

히트 싱크 부착 장치 및 방법 Download PDF

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Publication number
KR20150073992A
KR20150073992A KR1020157010075A KR20157010075A KR20150073992A KR 20150073992 A KR20150073992 A KR 20150073992A KR 1020157010075 A KR1020157010075 A KR 1020157010075A KR 20157010075 A KR20157010075 A KR 20157010075A KR 20150073992 A KR20150073992 A KR 20150073992A
Authority
KR
South Korea
Prior art keywords
circuit board
heat sink
shield
electronic device
bend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020157010075A
Other languages
English (en)
Korean (ko)
Inventor
조셉 리 카펜터
신 후이 체아
크리스토퍼 마이클 윌리엄 프록터
Original Assignee
톰슨 라이센싱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 톰슨 라이센싱 filed Critical 톰슨 라이센싱
Publication of KR20150073992A publication Critical patent/KR20150073992A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49227—Insulator making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
KR1020157010075A 2012-10-19 2013-10-17 히트 싱크 부착 장치 및 방법 Withdrawn KR20150073992A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261715876P 2012-10-19 2012-10-19
US61/715,876 2012-10-19
PCT/US2013/065529 WO2014062974A1 (en) 2012-10-19 2013-10-17 Heat sink attachment apparatus and method

Publications (1)

Publication Number Publication Date
KR20150073992A true KR20150073992A (ko) 2015-07-01

Family

ID=49519112

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157010075A Withdrawn KR20150073992A (ko) 2012-10-19 2013-10-17 히트 싱크 부착 장치 및 방법

Country Status (7)

Country Link
US (1) US9603286B2 (enExample)
EP (1) EP2910095B1 (enExample)
JP (1) JP2015537377A (enExample)
KR (1) KR20150073992A (enExample)
CN (1) CN105009699A (enExample)
BR (1) BR112015008465B1 (enExample)
WO (1) WO2014062974A1 (enExample)

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* Cited by examiner, † Cited by third party
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US20170273169A1 (en) * 2014-09-24 2017-09-21 Hewlett Packard Enterprise Development Lp Heat sink with a load spreading bar
US10356948B2 (en) 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US10624245B2 (en) * 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
US9893474B1 (en) * 2016-10-12 2018-02-13 International Business Machines Corporation Active cable heat sink
CN106507651B (zh) * 2016-12-30 2019-11-29 韩端科技（深圳）有限公司 电子设备
US10785864B2 (en) * 2017-09-21 2020-09-22 Amazon Technologies, Inc. Printed circuit board with heat sink
USD835590S1 (en) 2018-06-27 2018-12-11 Advanced Thermal Solutions, Inc. Heat sink clip
USD837753S1 (en) 2018-06-27 2019-01-08 Advanced Thermal Solutions, Inc. Heat sink clip
USD877098S1 (en) 2018-06-27 2020-03-03 Advanced Thermal Solutions, Inc. Heat sink clip and attachment
USD876372S1 (en) 2018-06-27 2020-02-25 Advanced Thermal Solutions, Inc. Heat sink clip and attachment
US11971739B2 (en) * 2019-01-10 2024-04-30 Makersan Makina Otomotiv Sanayi Ticaret Anonim Sirketi Joystick with precise control
WO2022093402A1 (en) * 2020-10-28 2022-05-05 Arris Enterprises Llc Pass-through latching heat sink

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
US5436798A (en) * 1994-01-21 1995-07-25 Wakefield Engineering, Inc. Spring clip and heat sink assembly for electronic components
US5411199A (en) * 1994-03-07 1995-05-02 Motorola, Inc. Method for attaching a shield
SE9401203L (sv) * 1994-04-11 1995-10-12 Ellemtel Utvecklings Ab Skärm och kylare
US5621244A (en) * 1994-05-16 1997-04-15 Lin; Shih-Jen Fin assembly for an integrated circuit
GB2295927A (en) * 1994-12-08 1996-06-12 Gareth Rhys Baron Mounting of an integrated circuit on a printed circuit board
US5570271A (en) * 1995-03-03 1996-10-29 Aavid Engineering, Inc. Heat sink assemblies
US5576933A (en) 1995-05-15 1996-11-19 Wakefield Engineering, Inc. Clamping heat sink for an electric device
US5881800A (en) * 1998-04-03 1999-03-16 Chung; Kuang-Hua Heat sink fastener
CN2342343Y (zh) * 1998-08-04 1999-10-06 钟光华 散热器固定座结构
US6617685B1 (en) * 1999-08-30 2003-09-09 Sun Microsystems, Inc. Clip heat sink assembly
EP1128432B1 (de) * 2000-02-24 2016-04-06 Infineon Technologies AG Befestigung von Halbleitermodulen an einem Kühlkörper
US7061774B2 (en) 2000-12-18 2006-06-13 Franklin Zhigang Zhang Computer board with dual shield housing and heat sink expansion zone apparatuses
US6856511B1 (en) * 2003-07-17 2005-02-15 Cisco Technology, Inc. Methods and apparatus for attaching a heat sink to a circuit board component
US8902603B2 (en) 2004-02-06 2014-12-02 Carmen Rapisarda Solder and lead free electronic circuit and method of manufacturing same
JP2006222388A (ja) * 2005-02-14 2006-08-24 Toshiba Corp 電子機器の放熱装置及び放熱方法
CN1953646A (zh) * 2005-10-18 2007-04-25 鸿富锦精密工业（深圳）有限公司 能防电磁干扰的散热装置
US7355857B2 (en) * 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
US7804696B2 (en) * 2006-12-07 2010-09-28 Finisar Corporation Electromagnetic radiation containment in an electronic module
US7983048B2 (en) * 2007-02-15 2011-07-19 Nec Corporation Structure for mounting semiconductor package
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CN101754639A (zh) * 2008-12-02 2010-06-23 台达电子工业股份有限公司 散热器固定结构
CN201726632U (zh) * 2010-04-15 2011-01-26 鸿富锦精密工业（深圳）有限公司 电子产品之散热片固定结构
US20140036451A1 (en) * 2012-07-31 2014-02-06 Glenn C. Simon Heat sink assembly
US9146062B2 (en) * 2013-03-01 2015-09-29 Radian Thermal Products, Inc. Interlocking clip heatsink mounting system

Also Published As

Publication number Publication date
CN105009699A (zh) 2015-10-28
US9603286B2 (en) 2017-03-21
EP2910095A1 (en) 2015-08-26
BR112015008465A2 (pt) 2017-07-04
WO2014062974A1 (en) 2014-04-24
BR112015008465B1 (pt) 2021-07-20
EP2910095B1 (en) 2019-08-14
JP2015537377A (ja) 2015-12-24
US20150282388A1 (en) 2015-10-01

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20150417

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid