KR20150051926A - 도금 배쓰 및 방법 - Google Patents

도금 배쓰 및 방법 Download PDF

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Publication number
KR20150051926A
KR20150051926A KR1020140153138A KR20140153138A KR20150051926A KR 20150051926 A KR20150051926 A KR 20150051926A KR 1020140153138 A KR1020140153138 A KR 1020140153138A KR 20140153138 A KR20140153138 A KR 20140153138A KR 20150051926 A KR20150051926 A KR 20150051926A
Authority
KR
South Korea
Prior art keywords
tin
alkyl
acid
crystal growth
composition
Prior art date
Application number
KR1020140153138A
Other languages
English (en)
Korean (ko)
Inventor
줄리아 베르틴크
이 친
조나단 디. 프랜지
페드로 오. 로페즈 몬테시노스
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 filed Critical 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
Publication of KR20150051926A publication Critical patent/KR20150051926A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020140153138A 2013-11-05 2014-11-05 도금 배쓰 및 방법 KR20150051926A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/071,677 2013-11-05
US14/071,677 US20150122661A1 (en) 2013-11-05 2013-11-05 Plating bath and method

Publications (1)

Publication Number Publication Date
KR20150051926A true KR20150051926A (ko) 2015-05-13

Family

ID=51932182

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140153138A KR20150051926A (ko) 2013-11-05 2014-11-05 도금 배쓰 및 방법

Country Status (6)

Country Link
US (1) US20150122661A1 (zh)
EP (1) EP2868775A3 (zh)
JP (1) JP2015092021A (zh)
KR (1) KR20150051926A (zh)
CN (1) CN104674312A (zh)
TW (1) TW201533278A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200080615A (ko) * 2018-12-27 2020-07-07 솔브레인 주식회사 도금 조성물 및 솔더 범프 형성 방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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JP5590259B1 (ja) * 2014-01-28 2014-09-17 千住金属工業株式会社 Ｃｕ核ボール、はんだペーストおよびはんだ継手
BR112018016802A2 (pt) * 2016-02-16 2018-12-26 Lumishield Tech Incorporated deposição eletroquímica de elementos em meio aquoso
US10879156B2 (en) 2016-03-08 2020-12-29 Washington State University Mitigation of whisker growth in tin coatings by alloying with indium
US20170321340A1 (en) * 2016-03-08 2017-11-09 Washington State University Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte
KR101757192B1 (ko) * 2016-03-30 2017-07-12 주식회사 호진플라텍 웨이퍼 범프 도금을 위한 주석-은 합금 전기도금액
JP6818520B2 (ja) * 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
WO2019082885A1 (ja) * 2017-10-24 2019-05-02 三菱マテリアル株式会社 錫又は錫合金めっき液
JP6620859B2 (ja) * 2017-10-24 2019-12-18 三菱マテリアル株式会社 錫又は錫合金めっき堆積層の形成方法
WO2019121092A1 (en) 2017-12-20 2019-06-27 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
US20190259722A1 (en) * 2018-02-21 2019-08-22 Rohm And Haas Electronic Materials Llc Copper pillars having improved integrity and methods of making the same
KR20210002514A (ko) * 2018-04-20 2021-01-08 바스프 에스이 억제제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물
WO2021193696A1 (ja) * 2020-03-27 2021-09-30 三菱マテリアル株式会社 電解めっき液及び電解めっき方法

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NL151449B (nl) * 1966-09-14 1976-11-15 Philips Nv Werkwijze voor de bereiding van een zuur bad voor het elektrolytisch neerslaan van tin.
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
JPH0233795B2 (ja) * 1983-05-16 1990-07-30 Matsugiin Rooko Inc Metsukyokusoseibutsu
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5174887A (en) 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US5061351A (en) * 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
JP2001181889A (ja) * 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
US6578754B1 (en) * 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
JP4362568B2 (ja) * 2000-06-02 2009-11-11 奥野製薬工業株式会社 錫−銅合金電気めっき液
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
TWI240979B (en) 2004-10-28 2005-10-01 Advanced Semiconductor Eng Bumping process
KR100921919B1 (ko) 2007-11-16 2009-10-16 (주)화백엔지니어링 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법
JP5554718B2 (ja) * 2007-12-11 2014-07-23 エンソン インコーポレイテッド ナノ粒子を含む金属系複合コーティングの電解デポジット
JP5583894B2 (ja) * 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
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JP5033979B1 (ja) * 2011-09-29 2012-09-26 ユケン工業株式会社 スズからなるめっき用酸性水系組成物
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200080615A (ko) * 2018-12-27 2020-07-07 솔브레인 주식회사 도금 조성물 및 솔더 범프 형성 방법

Also Published As

Publication number Publication date
EP2868775A3 (en) 2015-08-12
CN104674312A (zh) 2015-06-03
US20150122661A1 (en) 2015-05-07
JP2015092021A (ja) 2015-05-14
TW201533278A (zh) 2015-09-01
EP2868775A2 (en) 2015-05-06

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E902 Notification of reason for refusal
E601 Decision to refuse application