KR20140128388A

KR20140128388A - Sheet application device and application method

Info

Publication number: KR20140128388A
Application number: KR1020147024248A
Authority: KR
Inventors: 요시아키 스기시타
Original assignee: 린텍 가부시키가이샤
Priority date: 2012-01-31
Filing date: 2013-01-17
Publication date: 2014-11-05
Also published as: JP6078233B2; CN104221139B; TWI560761B; CN104221139A; JP2013157517A; TW201335984A; WO2013114951A1; KR102038812B1

Abstract

The sheet attaching apparatus 1 has a slanting surface 21 inclined with respect to a horizontal plane and has supporting means 2 for supporting the sheet member WF at the inclined surface 21 and a supporting means 2 for supporting the adhesive sheet AS in a belt- A feeding means 3 for feeding a raw material RS temporarily attached to one side of the peeling sheet RL as a feeding object and a peeling sheet RL of the raw material RS fed to the feeding means 3, A pressing means 5 for pressing the adhesive sheet AS peeled off by the peeling means 4 against the sheet member WF, a supporting means 2, (7) for attaching the adhesive sheet (AS) to the sheet member (WF) by relatively moving the sheet member (5) in the in-plane direction of the inclined surface (21).

Description

[0001] SHEET APPLICATION DEVICE AND APPLICATION METHOD [0002]

The present invention relates to a sheet attaching apparatus and an attaching method for attaching an adhesive sheet to a plate-shaped member.

Conventionally, in a semiconductor manufacturing process, an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape is attached to the surface of a semiconductor wafer (hereinafter, simply referred to as a " wafer " A sheet attaching device is known (see, for example, Patent Document 1).

The sheet attaching apparatus described in Patent Document 1 includes a table for sucking and holding a wafer, a sheet attaching portion for attaching a strip-shaped adhesive sheet to the held wafer, and a cutter unit for cutting the adhesive sheet, The adhesive sheet is cut while the strip-shaped adhesive sheet is attached, so that the adhesive sheet having a predetermined shape can be attached to the wafer.

Japanese Patent Application Laid-Open No. 2003-257898

However, in recent years, the diameter of the wafer has been increased, and a wafer having a size of 18 inches (wafer outer diameter of about 450 mm) has been processed. In the conventional sheet attaching apparatus as disclosed in Patent Document 1, the whole surface area of the support surface of the wafer, the conveyance path of the wafer, and the stock area of the wafer when viewed from above in the gravity direction is increased. As a result, in the conventional sheet attaching apparatus, there is a problem that the larger the wafer, the larger the installation area of the apparatus (the horizontal projection area for installing the apparatus) becomes.

In addition, since the supporting means is horizontally installed, impurities such as dust and dirt in the air are likely to fall on the wafer, thereby increasing the risk that impurities are mixed between the wafer and the adhesive sheet.

An object of the present invention is to provide a sheet attaching apparatus and an attaching method that can suppress an increase in the installation area accompanied by an increase in the size of the sheet member.

Another object of the present invention is to provide a sheet attaching apparatus and an attaching method that can minimize the risk of impurities entering the sheet-like member and the adhesive sheet.

The sheet attaching apparatus of the present invention comprises: a supporting means having an inclined surface inclined with respect to a horizontal plane and supporting the plate-like member on the inclined surface; and a conveying means for conveying the raw material temporarily adhered to one surface of the strip- Peeling means for peeling off the adhesive sheet from the peeling sheet of the raw material fed to the feeding means, pressing means for pressing the adhesive sheet peeled off by the peeling means against the plate member, And moving means for moving the pressing means relatively in the in-plane direction of the inclined surface to attach the adhesive sheet to the plate-shaped member.

The sheet attaching apparatus of the present invention comprises: a supporting means having an inclined surface inclined with respect to a horizontal plane and supporting the plate-like member on the inclined surface; feeding means for feeding the strip-shaped adhesive sheet as a feeding object; A moving means for moving the supporting means and the pressing means relative to each other in the in-plane direction of the inclined surface to attach the adhesive sheet to the plate-shaped member; And a cutting means for cutting the attached adhesive sheet into a predetermined shape.

In the sheet attaching apparatus of the present invention, it is preferable that the supporting means includes first positioning means for contacting the outer edge of the plate member and positioning the plate member at a predetermined position of the inclined plane.

It is preferable that the sheet attaching apparatus of the present invention further comprises a receiving and fixing means for receiving the sheet member when the support of the sheet member by the support means is released.

Further, in the sheet attaching apparatus of the present invention, the feeding means is provided so that the feeding object can be fed out in a state in which the width direction orthogonal to the feeding direction of the feeding object is parallel to the slope face, And a skew prevention means for preventing skewing in the width direction.

The sheet attaching apparatus of the present invention further includes second positioning means for relatively positioning the supporting means and the feeding means in the width direction of the feeding object to position the adhesive sheet with respect to the sheet member .

On the other hand, in the sheet attaching method of the present invention, a sheet-like member is supported on an inclined surface inclined with respect to a horizontal plane, and the adhesive sheet is conveyed as a target to be fed as a raw material temporarily attached to one surface of a strip- The adhesive sheet is peeled from the peeling sheet, the peeled adhesive sheet is pressed against the sheet member by the pressing means, and the sheet member and the pressing means are relatively moved in the in-plane direction of the inclined surface, Is attached.

Further, in the sheet attaching method of the present invention, the sheet-like member is supported on an inclined surface inclined with respect to the horizontal plane, the strip-shaped adhesive sheet is fed out as the object to be fed, the fed adhesive sheet is pressed onto the sheet- , The adhesive sheet is attached to the sheet member by relatively moving the sheet member and the pressing means in the in-plane direction of the inclined surface, and the adhesive sheet attached to the sheet member is cut into a predetermined shape.

According to the present invention as described above, since the adhesive sheet can be attached in a state in which the sheet member is tilted with respect to the horizontal plane, the increase in the installation area accompanying the increase in the size of the sheet member can be suppressed as much as possible.

Further, since the adhesive sheet is adhered in a state in which the sheet member is inclined with respect to the horizontal plane, the possibility of impurities in the air dropping onto the sheet member is reduced, and even if the sheet member is dropped on the sheet member, It is possible to suppress the impurities from remaining on the plate-like member, and the risk that the impurities are mixed between the plate-like member and the adhesive sheet can be minimized.

In the present invention, by providing the first positioning means, even when the tabular member is supported on the inclined surface, the tabular member can be positioned only by bringing the tabular member into contact with the contact portion. As a result, the time required for positioning the plate-shaped member can be shortened, so that the processing capability per unit time can be improved.

Further, by providing the receiving and fixing means, even if the support of the plate-like member is released, the plate-like member can be prevented from dropping and being damaged.

Further, by providing the skew prevention means, it is possible to prevent the object to be fed from skewing in a direction orthogonal to the dispensing direction due to its own weight, thereby avoiding a problem that the dispensing position of the object to be dispensed to the plate-shaped member is shifted.

Further, by providing the second positioning means, the feeding position of the adhesive sheet relative to the sheet-like member can be arbitrarily changed.

1 is a perspective view showing a sheet attaching apparatus according to a first embodiment of the present invention.
Fig. 2 is a front view of the sheet attachment apparatus of Fig. 1; Fig.
3 is a perspective view showing a sheet attaching apparatus according to a second embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the second and subsequent embodiments, the same constituent members as those of the constituent members described in the following first embodiment and constituent members having the same function are given the same reference numerals as the constituent members of the first embodiment, The description is omitted or simplified. In the present specification, the X axis, the Y axis, and the Z axis are in an orthogonal relationship, the X axis and the Y axis are axes in the horizontal plane, and the Z axis is an axis orthogonal to the horizontal plane. In the case of indicating the direction in each axis, " + " is an arrow direction of each axis, and " - "

[First Embodiment]

1, the sheet attaching apparatus 1 attaches an adhesive sheet AS to a wafer WF as a sheet member. Here, the adhesive sheet AS has an adhesive layer AD on one side of the base sheet BS, and is preliminarily cut to an outer size of a predetermined size, and is provided with a strip- Is prepared in advance as a raw material (RS) to be fed out temporarily attached to the feed roller (RL).

The sheet attaching apparatus 1 includes a supporting means 2 for supporting a wafer WF, a feeding means 3 for feeding out a raw end RS and a fixing means 3 for bonding the peeling sheet RL of the fed- A peeling means 4 for peeling the sheet AS and a pressing means 5 for pressing the adhesive sheet AS peeled off by the peeling means 4 against the wafer WF, A sheet positioning means 6 as a second positioning means for positioning the adhesive sheet AS on the wafer WF by relatively moving the supporting means 2 and the pressing means 5, And a receiving and fixing means 8 for receiving the wafer WF when the holding of the wafer WF by the holding means 2 is released. In this embodiment, the conveying means 9 for conveying the wafer WF is provided to the sheet attaching apparatus 1 side by side.

The support means 2 includes a table 22 having a support surface 21 serving as an inclined surface capable of holding and holding the wafer WF by a suction and holding means such as a vacuum pump or a vacuum ejector, 2) supported by the linear motor 23 so as to be rotatable from the opening 24 of the support surface 21 and to be protruded from the support surface 21 And a contact portion 25 (Fig. 2) as a first positioning means for positioning the wafer WF in a state where the wafer W is held in a state in which the wafer W is held. The support surface 21 is a plane parallel to the plane including the X axis and the Z axis, and is arranged in a tilted state (inclined angle 90 degrees) with respect to the horizontal plane.

The feeding means 3 includes a supporting roller 31 for supporting and supporting the fabricated end RS, a plurality of guide rollers 32 for guiding the end RS, a driving roller A pinch roller 34 sandwiching the release sheet RL between the drive roller 33 and the drive roller 33 and a recovery roller 35 driven by an unillustrated driving device to recover the release sheet RL And the entirety thereof is supported by the base frame 30. The feeding means 3 is configured such that the far end RS perpendicular to the feeding direction of the far end RS is parallel to the supporting surface 21 (in the Z-axis direction) have. In addition, skew prevention means is constituted by the base frame 30 to prevent the far end RS from skewing in the width direction thereof.

The peeling means 4 is provided with a peeling plate 41 supported by the base frame 30 in an extended posture in the Z axis direction and is provided with a peeling sheet 41 of the fabric RS at the edge of the peeling plate 41, The adhesive sheet AS is peeled off from the release sheet RL by folding back the release sheet RL.

The pressing means 5 is provided with a pressing roller 51 arranged in a posture extending in the Z-axis direction. The pressure roller 51 is constituted by a member that is elastically deformable, such as rubber or resin.

The seat positioning means 6 is provided with a linear motor 61 as a driving device in which an output shaft (not shown) is fixed to the base frame 30 and the base frame 30 is rotated by the linear motor 61 in the Z- The supporting means 2 and the feeding means 3 are configured to be movable in the in-plane direction of the support surface 21 and relatively movable in the width direction of the far end RS.

The moving means 7 is provided with a linear motor 72 as a driving device extending in the X axis direction and the slider 71 is movable in the X axis direction by supporting the table 22. [

The receiving and fixing means 8 includes a receiving member 81 having a U-shaped cross section and provided along the X-axis direction below the range in which the table 22 moves, And two hardness-preventing plates 82 arranged in parallel to each other. Absorptive means 83, 83 composed of an elastic member such as rubber, resin, sponge, etc. are provided on the surface of the receiving portion 81 of the housing WF and the surface of the hardness preventing plate 82 on the table 22 side, 84 are installed. A gap 82A is provided between the hardness prevention plates 82 to allow the pressure roller 51 to press the adhesive sheet AS against the wafer WF.

The transfer means 9 is provided with a articulated robot 91 as a driving device and a suction tool 92 detachably provided at the distal end of the articulated robot 91. The transfer means 9 is provided with suction means such as a suction pump So that the wafer WF can be held and held by suction. The articulated robot 91 is a so-called six-axis robot having six joints rotatable. The articulated robot 91 is capable of displacing the suction tool 92 at any position or angle within the working range of the articulated robot 91 Consists of.

The procedure for attaching the adhesive sheet AS to the wafer WF in the above sheet attaching apparatus 1 will be described.

First, the fabric RS is set as shown in Fig. The linear motor 61 is driven to move the base frame 30 in the Z-axis direction to position the feeding position of the adhesive sheet AS with respect to the wafer WF.

Next, the transfer means 9 drives the articulated robot 91 to take out the wafer WF from the wafer storage cassette CT via the suction tool 92, and positions the wafer WF at the position indicated by the two- The wafer WF is brought into contact with the support surface 21 of the table 22 that is standing by. At this time, the transfer means 9 contacts two points of the outer edge of the wafer WF with the contact portion 25 protruding from the support surface 21, and transfers the wafer WF to a predetermined position of the support surface 21 As shown in Fig. Subsequently, the support means 2 drives a suction and holding means (not shown) to adsorb and hold the wafer WF on the support surface 21, drive the linear motor 23, The contact portion 25 is retracted into the table 22 as shown.

Then, the moving means 7 drives the linear motor 72 to move the table 22 in the + X axis direction. When the detection means (not shown) detects that the wafer WF reaches a predetermined position, the feeding means 3 drives the driving roller 33 in synchronization with the movement of the table 22, Out. The adhesive sheet AS is peeled off from the release sheet RL by the peeling plate 41 and the peeled adhesive sheet AS is pressed and attached to the wafer WF by the pressure roller 51 . At this time, the movement of the far end (RS) in the -Z axis direction is restricted by the base frame (30), thereby preventing the skew in the Z axis direction.

When the attachment of the adhesive sheet AS is completed, the moving means 7 stops driving the linear motor 72. [ Thereafter, when the conveying means 9 drives the articulated robot 91 and the wafer WF is attracted and held by the attraction tool 92, the supporting means 2 is driven by the suction holding means Lt; / RTI > Then, the transfer means 9 drives the articulated robot 91 to store the wafer WF in the wafer storage cassette CT.

Thereafter, the moving means 7 drives the linear motor 72 to move the table 22 in the -X-axis direction, returning to the position indicated by the two-dot chain line in Fig. 1, do.

Here, when the wafer WF is held on the table 22, if the suction holding means is released by the suction holding means due to some factor, the wafer WF falls and is damaged. In the case of the present embodiment, even when the suction holding by the suction holding means is released, the wafer WF is held by the housing member 81 and the hardness preventing plate 82 So that there is no problem that the wafer WF is damaged. The buffering means 83 of the housing member 81 and the buffering means 84 of the hardness preventing plate 82 absorb the impact when the wafer WF falls and therefore the damage of the wafer WF is prevented It can be suppressed more reliably.

According to the present embodiment as described above, the following effects are obtained.

The supporting means 2 supports the wafer WF with the supporting surface 21 inclined with respect to the horizontal plane and the moving means 7 moves the supporting means 2 and the pressing means 5 onto the supporting surface 21, In the in-plane direction of the wafer WF to adhere the adhesive sheet AS to the wafer WF. Therefore, the increase in the installation area of the apparatus due to the increase in the size of the wafer WF can be suppressed as much as possible. Since the support surface 21 is inclined with respect to the horizontal plane, the possibility of impurities in the air dropping onto the wafer WF is reduced. Even if the wafer W falls on the wafer WF, The impurities can be prevented from remaining on the wafer WF, and the risk that impurities are mixed in between the wafer WF and the adhesive sheet can be reduced as much as possible.

[Second Embodiment]

Next, a second embodiment of the present invention will be described with reference to Fig.

The sheet attaching apparatus 1A of the present embodiment is provided with the peeling means and the cutting means 10 and has the adhesive layer AD1 on one side of the strip-shaped base sheet BS1 The adhesive sheet AS1 is attached to the wafer WF and then the adhesive sheet AS1 is cut off from the first embodiment. The configuration of the feeding means 3A and the moving means 7A is different from that of the first embodiment.

The feeding means 3A is constituted of a supporting roller 31 for winding and supporting the strip-shaped adhesive sheet AS1, a guide roller 32 for guiding the adhesive sheet AS1, A pinch roller 34 for sandwiching the adhesive sheet AS1 between the drive roller 33 and the drive roller 33 and an unnecessary sheet US generated by cutting the strip-shaped adhesive sheet AS1 A plurality of guide rollers 36 driven by a driving device (not shown), a collection roller 35 for winding up and recovering the unnecessary sheet US, and a drive roller 37 And a pinch roller 38 for sandwiching the adhesive sheet AS1 between the drive roller 37 and the drive roller 37. [ The supporting roller 31, the guide roller 32, the driving roller 33 and the pinch roller 34 are supported by the base frame 30 in this feeding means 3A. On the other hand, the guide roller 36 and the collection roller 35 are supported by a collection-side frame 39 which can also be a skew prevention means.

The moving means 7A includes a linear motor 74 as a driving device that extends in the X-axis direction and drives the first slider 73 supporting the pressing roller 51, (Not shown) for supporting the pressing means 5 relative to the supporting means 2 so as to be movable in the X-axis direction and the Y-axis direction. The driving roller 37 and the pinch roller 38 of the feeding means 3A are supported by the second slider 75 of the linear motor 74 and are movable relative to the supporting means 2 in the X- Direction relative to each other.

The cutting means 10 includes a joint articulated robot 91 which is also used as the conveying means 9 and a cutter tool 94 which is detachably attached to the articulated robot 91 and has a cutter blade 93 And the adhesive sheet AS1 attached to the wafer WF can be cut along the outer edge of the wafer WF.

Hereinafter, the operation of the sheet attaching apparatus 1A will be described.

First, the adhesive sheet AS1 is set as shown in Fig. At this time, the pressing roller 51, the driving roller 37 and the pinch roller 38 are located in the vicinity of the driving roller 33, and a gap is formed between the unnecessary sheet US and the supporting surface 21. [ When the wafer WF is conveyed by the conveying means 9 in the same manner as in the first embodiment and the wafer WF is sucked and held on the supporting surface 21, the feeding means 3A is driven by the driving roller 37, The linear motor 74 is driven and the drive roller 37 and the pinch roller 38 are moved in the + X axis direction. At this time, the unnecessary sheet US is wound by the driving of the collecting roller 35. Thus, the unused portion of the adhesive sheet AS1 is fed so as to face the wafer WF in the + Y axis direction. Also at this time, a slight gap is formed between the adhesive sheet AS1 and the support surface 21. [

Subsequently, the moving means 7A drives a driving device (not shown), moves the pressing roller 51 in the -Y-axis direction, and presses the adhesive sheet (AS1) to the support surface (21). Subsequently, the moving means 7A drives the linear motor 74 and moves the pressing roller 51 in the + X axis direction, thereby adhering the adhesive sheet AS1 to the wafer WF. The cutting means 10 drives the articulated robot 91 to cause the suction tool 92 to exchange the tool with the cutter blade 93. [ Subsequently, the cutting means 10 drives the articulated robot 91 to move the cutter blade 93 along the outer edge of the wafer WF while sticking the cutter blade 93 to the adhesive sheet AS1 The adhesive sheet AS1 is cut along the outer edge thereof.

When the attachment and cutting of the adhesive sheet AS1 is completed, the cutting means 10 drives the articulated robot 91 to cause the cutter blade 93 to exchange the tool with the suction tool 92 again. Subsequently, as in the first embodiment, the transfer means 9 stores the wafer WF in the wafer storage cassette CT. Thereafter, the moving means 7A drives the linear motor 74 to move the pressure roller 51, the driving roller 37 and the pinch roller 38 in the -X-axis direction, And moves the linear motor 74 in the + Y axis direction. Thereby, the unnecessary sheet US attached to the support surface 21 is peeled off, and a gap is formed between the unnecessary sheet US and the support surface 21. Then, the same operation as described above is repeated thereafter.

The same effects as those of the first embodiment can also be obtained by the present embodiment as described above.

In the sheet attaching apparatus 1A, the table 22 is provided with an outer table having a cylindrical opening, and an outer table disposed in the opening of the outer table and having a disc-shaped outer shape for sucking and holding the wafer WF The inner table may be movably supported in the Y axis direction by a linear motor serving as a driving device fixed to the outer table. According to this configuration, since the support surface of the inner table can be relatively moved in the Y-axis direction with respect to the support surface of the outer table by driving the linear motor, the adhesive sheet AS1 is fixed to the outer edge portion of the wafer WF Or the sheet attaching surface of the wafer WF and the sheet attaching surface of the outer table are set at the same level so that the pressing force per unit area by the pressing roller 51 is substantially equal to the adhesive sheet AS1, Can be attached to the wafer WF. Further, a gap through which the cutter blade 93 enters may be formed between the outer table and the inner table.

As described above, the best configuration, method, and the like for carrying out the present invention are disclosed by the above description, but the present invention is not limited thereto. While the present invention has been particularly shown and described with respect to particular embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form, material, So that a person skilled in the art can apply various variations. It should be noted that the description of the shape, material, and the like described above is merely illustrative for the purpose of facilitating understanding of the present invention and is not intended to limit the present invention. Therefore, Or the description of the members out of the whole range is included in the present invention.

For example, in the above-described embodiment, the support surface 21 has an inclination angle of 90 degrees. However, the support surface 21 may be inclined relative to the horizontal surface. For example, (The supporting surface 21 is in a direction in which the supporting surface 21 is viewed from above in the gravity direction) or greater than 90 degrees (in a direction in which the supporting surface 21 is invisible from above in the gravity direction) From the viewpoint of suppressing the increase of the area, it is preferable that the inclination angle is 45 DEG to 135 DEG with respect to the horizontal plane.

The mounting device 2 is configured to be capable of supporting the ring frame and the wafer WF so that the sheet attaching device 1 or 1A can be mounted on the wafer WF and the ring frame as a mounting device for attaching the mounting sheet .

Further, the contact portion 25 may always be in a state of being projected from the support surface 21 (non-projecting).

The sheet positioning means 6 may move the supporting means 2 or both the supporting means 2 and the feeding means 3 while the feeding means 3 is stopped.

Further, the moving means 7 may move both the supporting means 2 and the pressing means 5.

The receiving and fixing means 8 may be constituted by a single member in which the receiving member 81 and the hardness preventing plate 82 are continuous and the receiving and fixing means 8 may not be provided.

Instead of the pressure roller 51, a pressure member made of a blade material, rubber, resin, sponge, or the like may be employed as the pressure means 5, and a configuration in which pressure is applied by air jetting may be employed.

The peeling means 4 may be replaced with a peeling plate 41, and a roller may be employed.

In the second embodiment, the strip-shaped adhesive sheet is adhered temporarily to one surface of the strip-shaped release sheet, and the strip-shaped adhesive sheet is fed to the feeding roller 3A in the vicinity of the pinch roller 34 A peeling means for peeling the strip-shaped adhesive sheet from the strip-shaped peeling sheet is provided, or the strip-shaped peeling sheet is wound around the driving roller 33 to peel the strip-shaped adhesive sheet from the strip- .

In addition to the wafer WF, the plate-shaped member may be a glass plate, a steel plate, a resin plate, or other plate-like member, or a plate-shaped member other than the wafer WF. Examples of the wafers WF include silicon semiconductor wafers and compound semiconductor wafers. The adhesive sheets AS and AS1 adhered to the semiconductor wafers are made of a protective sheet, a dicing tape and a die attach film But it is also possible to use any other sheet, film, tape, sheet, or the like for any use and shape.

The types and materials of the adhesive sheets AS and AS1 are not particularly limited and may be, for example, those having an intermediate layer provided between the base sheet BS and the adhesive layer AD, It may be three or more layers, or an adhesive layer (AD) group having no base sheet (BS).

Further, the sheet member may be a substrate of an optical disk, and the adhesive sheet may have a resin layer constituting a recording layer. As described above, the plate-shaped member can be a member or an article of any form.

The drive device in the above embodiment can adopt an electric device such as a rotary motor, a linear motor, a linear motor, a uniaxial robot, a multi-joint robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder and a rotary cylinder And a combination of them directly or indirectly may be adopted (some of them may overlap with those exemplified in the embodiment).

1, 1A: sheet attaching device
2: support means
3, 3A: Feeding means
4: peeling means
5: Pressurizing means
6: Seat position determining means (second positioning means)
7, 7A: Moving means
8:
10: Cutting means
21: Support surface (inclined surface)
25: contact portion (first positioning means)
30: Base frame (skew prevention means)
39: Recovering side frame (skew prevention means)
AS: Adhesive sheet
AS1: Adhesive sheet (object to be fed)
RL: Peeling sheet
RS: Fabric (Feeding object)
WF: wafer (plate member)

Claims

A supporting means having an inclined surface inclined with respect to the horizontal plane and supporting the plate-like member on the inclined surface,
A feeding means for feeding the raw material temporarily adhered to one surface of the strip-shaped release sheet as an object to be fed,
Peeling means for peeling off the adhesive sheet from the peeling sheet of the raw fabric fed out by the feeding means,
A pressing means for pressing the adhesive sheet peeled off by the peeling means against the plate-
And a moving means for moving the supporting means and the pressing means relative to each other in the in-plane direction of the inclined surface to attach the adhesive sheet to the plate-shaped member.

A supporting means having an inclined surface inclined with respect to the horizontal plane and supporting the plate-like member on the inclined surface,
A feeding means for feeding out the strip-shaped adhesive sheet as a feeding object,
Pressing means for pressing the adhesive sheet fed to the feeding means against the sheet-like member,
Moving means for moving the supporting means and the pressing means relative to each other in the in-plane direction of the inclined surface to attach the adhesive sheet to the plate-
And a cutting means for cutting the adhesive sheet attached to the plate-shaped member into a predetermined shape.

3. The image forming apparatus according to claim 1 or 2, characterized in that the supporting means includes first positioning means for positioning the plate-like member at a predetermined position on the inclined surface in contact with the outer edge of the plate-like member , A sheet attaching device.

The sheet attaching device according to any one of claims 1 to 3, further comprising a receiving and fixing means for receiving the sheet member when the support of the sheet member by the support means is released.

The image forming apparatus according to any one of claims 1 to 4, wherein the feeding means is provided so that the feeding object can be fed out in a state in which the width direction orthogonal to the feeding direction of the feeding object is parallel to the slope face,
And a skew prevention means for preventing skewing of the object to be traversed in the width direction.

The sheet feeding apparatus according to any one of claims 1 to 5, further comprising: a second positioning unit for relatively moving the supporting means and the feeding means in the width direction of the feeding object to perform positioning of the adhesive sheet with respect to the plate- Wherein the means for attaching the sheet is provided with means.

Supporting the plate-shaped member at an inclined surface inclined with respect to the horizontal plane,
The adhesive sheet is fed out as a target to be dyed temporarily attached to one side of a strip-shaped release sheet,
The adhesive sheet is peeled off from the release sheet of the raw fabric,
The peeled adhesive sheet is pressed against the sheet member by a pressing means,
And the adhesive sheet is attached to the sheet-like member by relatively moving the sheet-like member and the pressing means in an in-plane direction of the inclined surface.

Supporting the plate-shaped member at an inclined surface inclined with respect to the horizontal plane,
A strip-shaped adhesive sheet is fed out as an object to be fed,
The fed adhesive sheet is pressed against the sheet member by a pressing means,
And the adhesive sheet is attached to the sheet-like member by relatively moving the sheet-like member and the pressing means in the in-plane direction of the inclined surface,
Wherein the adhesive sheet attached to the sheet member is cut into a predetermined shape.