JP2001156151A - Wafer-attracting conveyor with fall preventing function - Google Patents

Wafer-attracting conveyor with fall preventing function

Info

Publication number
JP2001156151A
JP2001156151A JP33447399A JP33447399A JP2001156151A JP 2001156151 A JP2001156151 A JP 2001156151A JP 33447399 A JP33447399 A JP 33447399A JP 33447399 A JP33447399 A JP 33447399A JP 2001156151 A JP2001156151 A JP 2001156151A
Authority
JP
Japan
Prior art keywords
wafer
suction
fall prevention
transfer
fall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33447399A
Other languages
Japanese (ja)
Inventor
Takashi Ishimoto
Yoshinobu Kudo
義信 工藤
隆 石本
Original Assignee
Tokyo Seimitsu Co Ltd
株式会社東京精密
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd, 株式会社東京精密 filed Critical Tokyo Seimitsu Co Ltd
Priority to JP33447399A priority Critical patent/JP2001156151A/en
Publication of JP2001156151A publication Critical patent/JP2001156151A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To prevent destruction due to the fall of a wafer, based on disappearance of an attraction force when the wafer is attached and held from an upper face to convey it. SOLUTION: A wafer-attracting conveyor having a fall preventing function comprises a fall-preventing means, so that even if an attracting force of an attracting pad 6 for attracting and holding a wafer disappears during an attracting conveyance of a wafer W, the wafer does not fall from the device. The fall-preventing means has a cylinder mechanism 5 for providing a linear movement to a rack 11, and a rack and pinion mechanism for transforming the liner movement of the rack to a rotary movement of a fall-preventing receiver 16 for receiving the wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor manufacturing apparatus and a wafer suction and transfer apparatus used in an inspection apparatus in the manufacturing process.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing apparatus and an inspection apparatus for a manufacturing process thereof, a wafer is held in one side by vacuum suction and transferred in various steps. At that time, in order to transfer the wafer, vacuum suction is performed on the pattern surface of the wafer from above. In this case, if the vacuum line is cut for some reason during the vacuum suction transfer of the wafer, there is a problem that the suction force of the wafer is lost and the wafer is dropped and destroyed.

[0003]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for vacuum-sucking a wafer from the upper surface, in which the wafer is dropped from the transfer device and destroyed even if the vacuum line is cut and the suction force of the wafer is lost. It is an object of the present invention to provide a wafer suction transfer device with a fall prevention function which does not need to be performed.

[0004]

According to the present invention, as a means for solving the above-mentioned problems, there is provided a wafer suction / transport device with a fall prevention function as described in each of the claims. The wafer suction transfer device with a drop prevention function according to claim 1, wherein the wafer suction transfer device is provided with a drop prevention means so that the wafer does not drop even if the suction force is lost during the transfer of the wafer. Which gives
Due to cutting of the vacuum line or vibration during operation of the rotating arm, etc.
Even when the wafer comes off from the suction pad, the wafer does not fall, and the destruction of the wafer can be prevented.

A wafer suction transfer device with a drop prevention function according to a second aspect of the present invention is provided with a drop prevention receiver for receiving a wafer and a rack and pinion mechanism for rotating the drop prevention receiver as drop prevention means. This has substantially the same effect as the transport device of the first aspect. The wafer suction transfer device with a fall prevention function according to claim 3 further includes an opening / closing sensor for detecting opening / closing of the wafer fall prevention receiver, thereby confirming that the wafer fall prevention receiver is open. After that, the wafer suction operation is performed, and after the wafer is sucked, the fall prevention receiver can be closed, thereby ensuring the reliability of the operation.

[0006]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 1 is a side view of a right half showing a cross section of a part of the wafer suction and transfer apparatus 1 with a fall prevention function of the present invention, and FIG. 2 is a plan view of the apparatus 1. The wafer suction transfer device 1 with a fall prevention function includes a rotating arm 2,
The rotating arm 2 has a disk-shaped upper plate 3 and a lower plate 4 which are attached to the rotating arm 2 with a space therebetween.

At the center of the lower plate 4, a cylinder mechanism 5 is attached, and suction pads 6 for holding the wafer W by suction are provided at several places around an intermediate portion of the lower plate 4.
For example, in FIG. 2, eight locations are attached by appropriate fixing means. The suction pad 6 is connected to an intake hose 7 and is connected to an exhaust pump (not shown).
A drive shaft 8 that moves up and down protruding from the cylinder mechanism 5 includes:
A substantially cross-shaped plate-like connecting member 9 is fixed, and four racks 11 are connected to four ends of the cross member of the connecting member 9 via an L-shaped mounting member 10 by bolts or the like. Have been. Accordingly, the rack 11 moves up and down with the vertical movement of the drive shaft 8 of the cylinder mechanism 5 due to hydraulic pressure or pneumatic pressure. A spring 12 is provided between the lower plate 4 and the connecting member 9 to urge the connecting member 9 downward. Further, two guide members 19 for guiding the vertical movement of the connecting member 9 are provided on the lower plate 4.

A substantially cross-shaped opening 13 is formed in the upper plate 3 so that the cross-shaped connecting member 9 and the four racks 11 can be moved up and down through the opening 13. It has become. The upper plate 3 has two gears A and B.
Are respectively fixed to each other, and are provided at four locations. Gear A,
B is rotatably supported on a shaft, and the gear A is a rack 11
And the gear B. On the gear B side, four drop prevention receivers 16 each having an inwardly protruding claw 15 for receiving the wafer W are supported by the gear B together with the gear B. 16 is also configured to rotate. The rack and pinion mechanism is constituted by the rack 11 and the gears A and B. In this case, two gears are provided, but this is to increase the movement, and one gear is sufficiently possible.

Below the gear A, a fall prevention receiver 1 is provided.
An open / close sensor 17 is provided for detecting a closed position in which the device 6 is suspended and an open position in which the device 6 is pivoted upward from the closed position. Furthermore, a size sensor 18 is provided at an appropriate location below the upper plate 3 to check the size of the wafer W. The present invention is also applicable to holding a wafer by another suction method other than vacuum suction.

Next, the operation of the wafer suction and transfer apparatus 1 with the fall prevention function of the present invention configured as described above will be described. First, the open / close sensor 17 checks the open / close state of the fall prevention receiver 16 having the claw portion 15. When it is closed, a solenoid valve (not shown) is energized to drive the cylinder mechanism 5 and raise the drive shaft 8. As the drive shaft 8 rises, the connecting member 9 and the four racks 11 rise, and the gears A and B rotate. At the same time, the four fall prevention receivers 16 attached to the gear B rotate upward in the counterclockwise direction, respectively, and are brought to the open positions where the transfer of the wafer W is not hindered. In this state, the exhaust pump is driven, and the wafer W is vacuum-sucked and held by the suction pad 6.

When the vacuum sensor (not shown) confirms that the wafer W has been completely vacuum-sucked, the solenoid valve is energized to drive the cylinder mechanism 5 and lower the drive shaft 8. As the drive shaft 8 descends, the connecting member 9 and the four racks 11 descend to rotate the gears A and B in opposite directions. At the same time, 4 attached to gear B
The fall prevention receivers 16 rotate clockwise, respectively.
It is brought to the closed position in the hanging state, and the claw portion 15 enters under the wafer W.

In this state, the rotating arm 2 is rotated to transfer the wafer W to a predetermined place. During this transfer, if the wafer W comes off from the suction pad 6 due to a vacuum cut or vibration during the operation of the rotating arm, the wafer W is placed on the claw 15 of the fall prevention receiver 16. In addition, it is possible to prevent the destruction of the wafer W by falling.

[0013]

As described above, in the wafer suction transfer apparatus with the drop prevention function of the present invention, when the wafer is held by suction from above the pattern surface for transferring the wafer, the vacuum line is cut or transferred. Even if the suction force is lost due to the vibration of the wafer and the wafer comes off the suction pad, the wafer is received by the claw portion of the fall prevention receiver and does not fall to the floor or the like and is not broken. The transfer device of the present invention is used in a device for positioning a wafer and a contact board in a burn-in process at a wafer level.
It is particularly suitable for a rotating arm that sucks the pattern surface of a wafer during transfer, but is not limited to this, and is used for a general semiconductor manufacturing device and a wafer transfer device used for an inspection device in the manufacturing process. Is also applicable.

[Brief description of the drawings]

FIG. 1 is a right half side view showing a cross section of a part of a wafer suction and transfer apparatus with a fall prevention function according to an embodiment of the present invention.

FIG. 2 is a plan view of a wafer suction transfer device with a fall prevention function according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 2 ... Rotating arm 3 ... Upper plate 4 ... Lower plate 5 ... Cylinder mechanism 6 ... Intake pad 8 ... Drive shaft 9 ... Connecting material 11 ... Rack 13 ... Opening 14 ... Shaft support member 15 ... Claw portion 16 ... Fall prevention receiver 17 … Open / close sensor A, B… Gear W… Wafer

Claims (3)

[Claims]
1. A wafer suction transfer device for transferring a wafer by sucking the wafer from above, even if the suction force of a suction pad holding the wafer is lost during the suction transfer of the wafer, the wafer falls from the suction transfer device. A wafer suction transfer device with a fall prevention function, comprising a fall prevention means for preventing the wafer from falling.
2. The fall prevention means, wherein the fall prevention means has a claw for receiving a wafer, a drive cylinder for imparting a linear motion to a rack, and a linear movement of the rack for rotating the fall prevention receiver. 2. The wafer suction and transfer apparatus with a fall prevention function according to claim 1, further comprising a rack and pinion mechanism for converting the wafer into a wafer.
3. The wafer suction and transfer apparatus with a fall prevention function according to claim 2, wherein said fall prevention means further comprises an open / close sensor for detecting opening / closing by rotation of said fall prevention receiver.
JP33447399A 1999-11-25 1999-11-25 Wafer-attracting conveyor with fall preventing function Pending JP2001156151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33447399A JP2001156151A (en) 1999-11-25 1999-11-25 Wafer-attracting conveyor with fall preventing function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33447399A JP2001156151A (en) 1999-11-25 1999-11-25 Wafer-attracting conveyor with fall preventing function

Publications (1)

Publication Number Publication Date
JP2001156151A true JP2001156151A (en) 2001-06-08

Family

ID=18277792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33447399A Pending JP2001156151A (en) 1999-11-25 1999-11-25 Wafer-attracting conveyor with fall preventing function

Country Status (1)

Country Link
JP (1) JP2001156151A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7295287B2 (en) 2003-10-31 2007-11-13 Canon Kabushiki Kaisha Substrate holder and exposure apparatus having the same
JP2013157517A (en) * 2012-01-31 2013-08-15 Lintec Corp Sheet adhering device and adhering method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7295287B2 (en) 2003-10-31 2007-11-13 Canon Kabushiki Kaisha Substrate holder and exposure apparatus having the same
US7834982B2 (en) 2003-10-31 2010-11-16 Canon Kabushiki Kaisha Substrate holder and exposure apparatus having the same
JP2013157517A (en) * 2012-01-31 2013-08-15 Lintec Corp Sheet adhering device and adhering method

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