KR20140123407A - Method and apparatus for compressive resin sealing electronic component - Google Patents
Method and apparatus for compressive resin sealing electronic component Download PDFInfo
- Publication number
- KR20140123407A KR20140123407A KR1020140008955A KR20140008955A KR20140123407A KR 20140123407 A KR20140123407 A KR 20140123407A KR 1020140008955 A KR1020140008955 A KR 1020140008955A KR 20140008955 A KR20140008955 A KR 20140008955A KR 20140123407 A KR20140123407 A KR 20140123407A
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- Prior art keywords
- resin
- cavity
- mold
- electronic component
- resin material
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- 239000011347 resin Substances 0.000 title claims abstract description 458
- 229920005989 resin Polymers 0.000 title claims abstract description 458
- 238000007789 sealing Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims description 41
- 239000000463 material Substances 0.000 claims abstract description 149
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 230000006835 compression Effects 0.000 claims abstract description 44
- 238000007906 compression Methods 0.000 claims abstract description 44
- 238000000465 moulding Methods 0.000 claims description 46
- 238000000748 compression moulding Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 description 35
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mechanical Engineering (AREA)
Abstract
An object of the present invention is to simplify a compression resin sealing apparatus which collectively encapsulates electronic components on a large-sized substrate in a package, and improve the precision (variation) of package thickness.
According to the present invention, a sheet-like resin having a bevelling disposed on a release film is fed into a lower mold cavity, and the upper and lower molds are closed to form a surplus resin in the lower mold cavity through a narrow gap between the upper and lower molds, In the resin sealing step, the gap between the bottom surface of the lower mold cavity and the electronic component mounting surface of the large substrate at the mold closing end position of the upper and lower positions is the same as the interval of the package thickness for resin- And the compression of the molten resin material in the lower cavity is performed at a low speed and at a low pressure so that the electronic components on the large-sized substrate are integrally molded by resin sealing.
Description
BACKGROUND OF THE
A compression molding method is known as a method of collectively sealing a resin on an electronic component on a large substrate. As schematically shown in Fig. 8, the apparatus for performing the compression molding method is provided with a compression molding die comprising at least a
On the other hand, as the
However, since the resin encapsulation range on the large-
In addition, the resin encapsulation range in the
A wire sweep such as a molten resin material 6a flowing in the
And the like,
Air is drawn into the molten resin material 6a to form voids,
Uneven dispersion of the filler in the resin occurs to deteriorate the function as the resin material (6)
And the like.
Also, due to the excess or shortage of the resin supplied into the
An unfilled state occurs in the package to be formed corresponding to the shape of the
A predetermined resin pressure is not obtained in the
· The thickness of the package can not be formed with a uniform thickness
There is also a serious problem of resin molding.
The present invention is capable of omitting the measurement and adjustment of the amount of resin to be fed into the cavity when a plurality of electronic parts mounted on a large substrate are compression-molded together by resin using a compression molding method, In addition, it is possible to effectively prevent the occurrence of wire sweeps and the like due to the flow action of the molten resin material in the cavity, to obtain a predetermined resin pressure in the cavity, And a compression resin sealing device for carrying out the method.
According to an aspect of the present invention, there is provided a method of sealing a compression resin of an electronic component using at least a mold for compression molding comprising an upper mold and a lower mold, A melting step of heating and melting the resin material supplied into the lower mold cavity formed on the mold surface of the lower mold and covered with the release film;
Closing the upper and lower molds to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower cavity;
Next, by applying a predetermined resin pressure to the molten resin material in the lower cavity, a sealing step of collectively molding the electronic parts on the substrate by resin
The method comprising the steps of:
In the mold closing process,
An outer resin outflow step of allowing the surplus resin in the lower cavity to flow out of the lower cavity,
A resin sealing step of subjecting the molten resin material in the lower mold cavity to a predetermined resin pressure after collecting the excess resin through an outflow step to collectively mold the electronic parts on the substrate by resin sealing
Lt; / RTI >
The surplus resin is guided in the surplus resin accommodating portion provided around the lower mold cavity through a narrow gap provided between the upper and lower molds,
The gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is set to a distance between the package thickness for resin- To be equal to each other.
According to another aspect of the present invention, there is provided a method of sealing a compression resin of an electronic component, the method comprising: a compression mold having at least a top mold and a bottom mold; A lower mold provided on the lower mold and heating and melting the resin material supplied to the lower mold cavity;
Closing the upper and lower molds to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower cavity;
Next, a predetermined resin pressure is applied to the molten resin material in the lower mold cavity to seal the electronic components on the substrate together with the resin to form a seal
The method comprising the steps of:
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,
In the mold closing process,
A step of externally discharging surplus resin in the lower cavity to allow the surplus resin to flow out of the lower cavity;
A resin sealing step of subjecting the molten resin material in the lower cavity to a predetermined resin pressure so as to collectively mold the electronic parts on the substrate by resin sealing after passing through the surplus resin outflow step
/ RTI >
The surplus resin is guided in the surplus resin accommodating portion provided around the lower cavity through a narrow gap provided between the upper and lower molds,
The gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is made equal to the package thickness for resin sealing the electronic component of the substrate .
In the method for sealing a compression resin of an electronic component according to the present invention, the compression sealing step is performed at a low pressure in which the molding pressure is 0.2942 MPa or more in the resin sealing step.
In the method for sealing a compression resin of an electronic component according to the present invention, the resin material to be fed into the lower cavity is preferably formed by planarizing a required amount of resin to have a desired shape-retaining property, Shaped resin material corresponding to the shape of the lower mold cavity and formed into a shape capable of being fitted and supplied in the lower cavity.
The method for sealing a compression resin of an electronic component according to the present invention is characterized in that the resin material to be fed into the lower cavity is a resin material supplied by planarizing a required amount of resin.
The method for sealing a compression resin of an electronic component according to the present invention is characterized in that the resin material is a resin material selected from a granular resin material, a powdered resin material, a liquid resin material, and a paste resin material .
A method for sealing a compression resin of an electronic part according to the present invention is characterized in that before the lower mold cavity is covered with the release film, a resin material in a sheet form, And the sheet-shaped resin material and the release film are fed into the lower cavity, whereby the lower cavity is covered with the release film and the sheet-like resin material is supplied to the lower cavity .
A method of sealing a compression resin of an electronic part according to the present invention is characterized in that the resin material is a sheet-like resin material having a required amount of flattened resin to form a desired shape, Wherein the release film is provided in an expanded state and the sheet-like resin material is supplied to the lower cavity via the release film.
According to another aspect of the present invention, there is provided a compression resin sealing apparatus for an electronic part,
A mold for compression molding comprising at least an upper mold and a lower mold is used and the substrate on which the electronic component is mounted is supplied to the mold surface of the upper mold with the mounting surface side thereof facing downward, Heating and melting the resin material supplied in the lower mold cavity covered with the film and then closing the upper mold and the lower mold to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower mold cavity, Next, by applying a predetermined resin pressure to the molten resin material in the lower cavity, the electronic parts mounted on the substrate are collectively molded by resin to form a compression resin sealing apparatus for an electronic part,
Wherein a narrow gap is provided between the upper and lower molds to allow the surplus resin, which becomes a part of the molten resin material in the lower cavity, to flow out of the lower cavity when closing the upper and lower molds,
A surplus resin receiving portion communicating with the lower cavity around the lower cavity is disposed,
The interval between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower molds is set to be equal to the interval of the package thickness for resin sealing the electronic component of the substrate .
According to another aspect of the present invention, there is provided a compression resin sealing apparatus for an electronic part,
Wherein the electronic component mounting surface of the electronic component mounting face is downwardly directed to supply the electronic component mounting face to at least one of the upper mold face and the lower mold cavity using a mold for compression molding comprising at least upper and lower molds, And then the upper and lower molds are closed to close the electronic component of the substrate on the upper mold side so as to be immersed in the molten resin material in the lower mold cavity, Wherein a predetermined resin pressure is applied to the molten resin material so that the electronic parts mounted on the substrate are collectively molded by resin,
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,
A narrow gap is provided between the upper and lower molds to allow an excess resin, which is a part of the molten resin material in the lower cavity, to flow out of the lower cavity when the upper and lower molds are closed,
A surplus resin receiving portion communicating with the lower gap around the lower cavity is disposed,
Wherein a gap between the bottom surface of the lower cavity at the mold closing end position of the upper and lower molds and the electronic component mounting surface of the substrate is set to be the same as the package thickness for resin sealing the electronic component of the substrate .
The narrow gap for allowing the surplus resin to flow out of the lower cavity may be provided between the mold surface of the lower mold and the mounting surface of the electronic component in the substrate, The resin passage communicating the lower mold cavity with the accommodating portion of the excess resin,
And the resin passage has an inclined surface that becomes shallow toward the receiving portion of the excess resin from the lower mold cavity.
Further, in the compression resin sealing apparatus for an electronic part according to the present invention,
A narrow gap for allowing the surplus resin to flow out of the lower cavity is provided between the lower cavity and the electronic component mounting surface of the substrate,
The accommodating portion of the surplus resin,
The narrow gap,
And a space portion between the narrow gap and a resin leakage preventing member disposed around the lower cavity.
Further, in the compression resin sealing apparatus for an electronic part according to the present invention,
And the resin leakage preventing member also serves as a positioning member for regulating a distance between the upper and lower mold surfaces when the upper and lower molds are closed.
Further, in the compression resin sealing apparatus for an electronic part according to the present invention,
Wherein the lower mold has a structure in which the cavity bottom face member and the cavity side face member are divided,
And the cavity bottom face member and the cavity side face member are fitted to each other so as to be relatively movable up and down.
Further, in the compression resin sealing apparatus for an electronic part according to the present invention,
The lower mold is characterized in that the cavity bottom face portion and the cavity side face portion are integrally formed.
According to the compression resin sealing method and the compression resin sealing apparatus of the electronic component according to the present invention, by using a sheet-like resin molded in conformity with the shape of the lower mold cavity, The resin material can be uniformly supplied and filled in the whole area of the lower mold cavity. Therefore, it is possible to perform the heating and melting action of the sheet-like resin in the lower cavity and the pressing (pressing) action on the molten resin material under the same conditions at the respective portions of the lower cavity, It is possible to equalize the quality of the molded sealing article.
In addition, since a sheet-shaped resin which is formulated in a fixed amount can be used, it is possible to omit the resin metering and adjustment work such as metering and adjustment of the amount of resin to be fed into the lower mold cavity.
In addition, since the heating molten action of the sheet-like resin in the lower mold cavity and the pressing action against the molten resin material can be performed at a low pressure, the flow action of the molten resin material in the lower cavity can be prevented or suppressed . That is, by performing the pressing action against the molten resin material in the lower cavity at a low speed and a low pressure, occurrence of wire sweep or the like caused by the flow action of the molten resin material can be effectively prevented. For example, it is possible to press the molten resin material in the lower mold cavity at a low pressure of at least 0.2942 MPa (at least 3 kgf / cm2). In terms of [MPa], the numerical values of the engineering pressures (unit: kgf / cm 2) indicated in parentheses were calculated as 1 kgf /
Further, by using the sheet-like resin which is shaped in a fixed amount, the supply action of the resin material throughout the lower cavity, the heating and melting action of the sheet-like resin, the lowering of the speed of the molten resin material, The occurrence of a wire sweep or the like due to the flow action of the molten resin material in the lower cavity can be more effectively prevented.
In addition, it is also possible to carry out the step of externally discharging the surplus resin in the lower mold cavity to the outside of the lower mold cavity, and the step of applying the predetermined resin pressure to the molten resin material in the lower mold cavity, By performing a mold closing step of upper and lower defects including a resin sealing step of collectively molding the molten resin material in the lower mold cavity, the required amount of molten resin material can be filled more efficiently and reliably in the lower mold cavity.
Further, the pressing action against the molten resin material in the lower mold cavity can be performed at low speed and at low pressure. Therefore, with respect to the compression resin sealing apparatus, it is possible to cope with the enlargement of the substrate without requiring a large mold closing force as the total force, and the configuration of the compression resin sealing apparatus can be simplified or simplified. Therefore, a plurality of electronic components mounted on the substrate can be pressed against the molten resin material in the lower cavity by using the sheet-like resin (with required bending) shaped in a constant amount by this simplified or simplified apparatus It is possible to perform sealing molding at a low speed and at a low pressure in a lump.
Further, in the resin sealing step in the mold closing step, the gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing end position of the upper and lower positions is smaller than the interval The predetermined resin pressure can be obtained in the cavity, and the thickness of the package can be formed to a predetermined thickness. Therefore, the precision (variation) of the thickness of the package molded in the lower cavity can be improved by using the above-mentioned simplified or simplified compression resin sealing apparatus.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially cut-away front view showing the entire configuration of a compression-sealed apparatus according to a first embodiment of the present invention, schematically showing a state of being opened up and down. Fig.
Fig. 2 is a partially cut-away front view of the compression resin sealing apparatus corresponding to Fig. 1, schematically showing a closed state of the upper and lower directions.
Fig. 3 shows a main part of the compression resin sealing apparatus corresponding to Fig. 1, and Fig. 3 (1) is a partially cutaway enlarged front view of the uniform pressurizing means in its lower mold, and Fig. 3 (2) And FIG. 6 is a partially enlarged front view showing the enlarged view of the means.
Fig. 4 shows a main part of the compression resin sealing apparatus corresponding to Fig. 1, and Fig. 4 (1) is an enlarged longitudinal sectional view of the resin molded part at the time of opening the upper and lower guards, Fig. 5 is an enlarged longitudinal sectional view of the resin molding portion at the time of closing the upper and lower molds. Fig.
Fig. 5 shows a main part of the resin molding part corresponding to Fig. 4, and Fig. 5 (1) is an enlarged longitudinal sectional view of the main part, and Fig. 5 (2) is a plan view of the main part.
6 (A) is a longitudinal sectional view of the resin molding section when the upper and lower molds are opened, and FIG. 6 (A) is a longitudinal sectional view of the
7 (A) is a longitudinal sectional view of the resin molding section at the time of mold release of the upper and lower molds, and FIG. 7 (A) is a longitudinal sectional view of the resin molding section of the compression resin sealing apparatus according to the third embodiment of the present invention. 2 is a vertical cross-sectional view of the resin molding portion at the time of mold closing of the upper and lower molds.
Fig. 8 schematically shows a main part of a conventional compressive-resin-sealing apparatus. Fig. 8 (1) is a vertical cross-sectional view of the resin molding section at the time of opening the upper and lower molds. Fig. 8 (2) Fig. 7 is a longitudinal sectional view of the resin molding portion at the time of mold closing of the staple. Fig.
The embodiments of the present invention shown in the drawings have been described above.
(First Embodiment)
Figs. 1 to 5 show a first embodiment of the present invention. Fig. 1 and Fig. 2 show the entire configuration of the compression resin sealing apparatus, and Figs. 3 to 5 show the main parts thereof.
Further, this compression resin sealing apparatus has a constitution in which the constituent members thereof are held by a press frame (hold frame). That is, the
The
The
In the compression molding die provided with the cavity for a large substrate, the mold closing pressure of the upper and
That is, the phase-type equalizing pressurizing means 41 includes an upper horizontal space portion 41a provided between the upper
As the above-mentioned pressure medium, it is possible to use a fluid (for example, a gas such as air or an inert gas, or a liquid such as an inert aqueous solution or oil such as water). For example, a silicone oil of low thermal conductivity may be used as the pressure medium. In this case, not only the function as the pressure medium is provided, but also the power consumption can be reduced by the heat insulating function.
On the other hand, in the example of the drawings, the case is shown in which the pressing
The mold opening /
Although the above-described mold opening and
Between the mold surfaces of the upper and
On the other hand, the above-mentioned compression resin sealing apparatus is provided with a release film supply setting mechanism (not shown) for tightly mounting the
A description will now be given of a case where the
First, the upper and
Next, the
Next, as shown in Fig. 2, the
In the mold closing process of the upper and
That is, at this time, the mold closing action by the upper and
On the other hand, setting of the mold closing end position of the upper and
The setting of the mold closing end position of the upper and
Further, by using the sheet-
On the other hand, in the above-described resin sealing step, it is possible to perform compression sealing molding at a molding temperature of 160 ° C to 185 ° C under a molding pressure of 0.2941 MPa or more (3 kgf /
According to the configuration of this embodiment, when a plurality of
(Second Embodiment)
Next, a second embodiment according to the present invention will be described with reference to Fig.
Fig. 6 shows a second embodiment of the present invention. Fig. 6 (1) shows a main part of a resin molding section at the time of opening the upper and lower molds, and Fig. 6 (2) And shows the main parts of the resin molding portion at the time of closing the upper and lower molds. The second embodiment is different from the first embodiment in the following points. And the other points are substantially the same as those of the first embodiment. Therefore, different points will be described, and constituent members which are substantially the same as those of the first embodiment will be denoted by the same reference numerals, and redundant description will be avoided.
6 (2), a narrow gap 34c for allowing the
The resin
In the configuration of the second embodiment, the
According to the configuration of the second embodiment, the resin
Next, a third embodiment according to the present invention will be described with reference to Fig.
(Third Embodiment)
Fig. 7 (1) shows a main portion of the resin molding portion at the time of mold release of the upper and lower molds, and Fig. 7 (2) And shows the main parts of the resin molding portion at the time of closing the upper and lower molds. The third embodiment is different from the first and second embodiments in the following points. The other points are substantially the same as those of the first and second embodiments. Therefore, different points will be described, and constituent members which are substantially the same as those of the first and second embodiments will be denoted by the same reference numerals and duplicate description will be avoided.
7, the
7 (2), the
Further, similarly to the first embodiment, a
In the configuration of the third embodiment, the
The mold closing action by the upper and
In the first to third embodiments, when a compression resin sealing device is used for integrally mounting electronic parts mounted on a large-sized substrate with a sheet-like resin that is shaped in the above-described manner, Explained. However, in the present invention, for example, various kinds of resin materials in a required amount are flattened (in an even thickness state) on a pre-cut release film, and the resin material can be supplied into the lower cavity in this state . Further, in the present invention, various kinds of resin materials in a required amount can be supplied (in an even thickness state) in a lower cavity coated with a release film (or in a lower cavity not covered with a release film). As the various resin materials described above, a granular resin material (granular resin), a powdery resin material (powder resin), a liquid resin material (liquid resin), a paste resin material or a sheet resin material . As the various resin materials described above, a resin material having transparency, a resin material having translucency, and a resin material having opacity can be used.
The sheet-like resin material is formed by cooling, for example, a resin material such as a granular resin in a required amount by molding with a calendar roll or the like to form a sheet (flattened state) and embossing it. On the other hand, by granulating the granular resin by heating its peripheral surface, the peripheral surfaces of the granules are adhered to each other, and the granular resin having a required amount of resin can be shaped in a state of being flattened while maintaining the granular state ( There is a gap between the granules).
Further, in the present invention, the above-mentioned various resin materials (granular resin, powder resin, etc.) are placed on a release film that has been pre-cut or in a lower cavity covered with a release film (in a lower cavity not covered with a release film) It can be supplied in a required amount and in a planarized state (with an even thickness set). For example, the required amount of the granular resin or the powdered resin can be sprayed in a state in which the resin material is flattened in the lower cavity in a state in which the granular resin or the powdered resin can be supplied at once by the supply mechanism of the resin material.
Further, in the present invention, a frame frame having through holes may be arranged on a pre-cut release film, and the various resin materials described above may be supplied in a planarized state in a recess (through hole) of the frame frame. In this state, first, the through-holes of the frame mold are matched with the positions of the cavity openings of the lower mold surface, and then the air is forcibly sucked and discharged from the inside of the cavities, So that the resin material can be supplied in a planarized state in a lower mold cavity.
In the present invention, first, the resin material (the various resin materials described above) is fed into the lower mold cavity for compression molding in a planarized state (with an equivalent required thickness), and then, at the time of compression molding, The thickness of the package to be compression molded is set to be thinner than the uniform thickness of the resin material so as to pressurize the planarized resin material in the lower cavity. Therefore, the molten resin material in the lower mold cavity flows out through the narrow path (narrow gap) to the outside of the lower mold cavity, and the resin in the lower mold cavity can be pressed at a low pressure. On the other hand, this is presumed to be because the grooves are gently closed by the resin material, and the required resin pressure can be applied to the lower cavity at a low pressure.
20: Press frame 30: Mold for compression molding
31:
31b: upper
31d: heater for heating the
31f: seal member 32: lower mold
32a:
32c:
32e:
32g: seal member 33: resin molding part
33a:
33c:
34: Resin leakage preventing member 34a: Lower mold cavity
34b: surplus resin receiving portion 34c: narrow clearance
34d: package thickness 35: operation signal
36: resin molding part 36a: lower mold cavity
36b: Surplus resin accommodating portion 36c: Narrow clearance
36d: package thickness 40: uniform pressing means
41: phase-type equalizing pressurizing means 41a:
41b: Elastic receiver 41c:
42: Lower mold uniform pressing means 42a: Lower mold horizontal space section
42b:
43: pressing force adjusting mechanism 44: pressure medium
50: mold opening / closing mechanism (toggle mechanism) 51: base
51a: axis 52: movable platen
52a: Axis 53: Servo motor
53a: Output shaft 53b: Pulley
53c: Belt 54: Screw shaft
55: nut member 56a: first link
56b: second link 56c: third link
60: release film 70: large substrate
71: electronic part 80: sheet-like resin (sheet-like resin material)
80a:
Claims (15)
Closing the upper and lower molds to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower cavity;
Next, a sealing process for collectively molding the electronic components on the substrate by resin by applying a predetermined resin pressure to the molten resin material in the lower cavity
The method comprising the steps of:
In the mold closing process,
A step of externally discharging surplus resin in the lower cavity to allow the surplus resin to flow out of the lower cavity;
A resin sealing step of subjecting the molten resin material in the lower cavity to a predetermined resin pressure so as to collectively mold the electronic parts on the substrate by resin sealing molding after passing through the surplus resin step
Lt; / RTI >
The surplus resin is guided in the surplus resin accommodating portion provided around the lower cavity through a narrow gap provided between the upper and lower molds,
In the resin sealing step, an interval between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is the same as the interval of the package thickness for resin- Wherein the sealing member is made of a resin material.
A mold closing step of closing the upper and lower molds so as to dope the electronic component of the substrate on the upper mold side into the molten resin material in the lower mold cavity;
Next, a sealing process for collectively molding the electronic components on the substrate by resin is performed by applying a predetermined resin pressure to the molten resin material in the lower cavity
The method comprising the steps of:
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,
In the mold closing process,
A step of externally discharging surplus resin in the lower cavity to allow the surplus resin to flow out of the lower cavity;
A resin sealing step of subjecting the molten resin material in the lower cavity to a predetermined resin pressure so as to collectively mold the electronic parts on the substrate by resin sealing molding after passing through the surplus resin step
/ RTI >
The surplus resin is guided in the surplus resin accommodating portion provided around the lower cavity through a narrow gap provided between the upper and lower molds,
The gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is made equal to the package thickness for resin sealing the electronic component of the substrate Wherein the sealing member is formed of a resin.
Wherein the releasing film is provided on the mold surface of the lower mold including the lower mold in an expanded state and the sheet-like resin material is supplied to the lower mold cavity via the release film.
Wherein a narrow gap is provided between the upper and lower molds to allow the surplus resin, which becomes a part of the molten resin material in the lower cavity, to flow out of the lower cavity when closing the upper and lower molds,
A surplus resin receiving portion communicating with the lower cavity around the lower cavity is disposed,
The interval between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower molds is set to be equal to the interval of the package thickness for resin sealing the electronic component of the substrate Wherein the sealing member is a sealing member.
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,
A narrow gap is provided between the upper and lower molds to allow an excess resin, which is a part of the molten resin material in the lower cavity, to flow out of the lower cavity when the upper and lower molds are closed,
A surplus resin receiving portion communicating with the lower gap around the lower cavity is disposed,
Wherein a gap between the bottom surface of the lower cavity at the mold closing end position of the upper and lower molds and the electronic component mounting surface of the substrate is set to be the same as the package thickness for resin sealing the electronic component of the substrate Wherein the sealing member is a resin sealing member.
Wherein the resin passage has an inclined surface that becomes shallow toward the surplus resin receiving portion from the lower cavity.
The surplus resin accommodating portion
The narrow gap,
The space between the narrow gap and the resin leakage preventing member disposed around the lower cavity
And a sealing member for sealing the electronic component.
Wherein the cavity bottom face member and the cavity side face member are fitted to each other so as to be relatively movable up and down.
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JP2013083493A JP5934138B2 (en) | 2013-04-12 | 2013-04-12 | Compressed resin sealing method and compressed resin sealing device for electronic parts |
JPJP-P-2013-083493 | 2013-04-12 |
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KR20140123407A true KR20140123407A (en) | 2014-10-22 |
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JP (1) | JP5934138B2 (en) |
KR (1) | KR101610456B1 (en) |
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CN114801003A (en) * | 2022-04-25 | 2022-07-29 | 浙江瑞然生态科技有限公司 | Full-biodegradable environment-friendly tableware mould pressing device and preparation method thereof |
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JP6491508B2 (en) | 2015-03-23 | 2019-03-27 | Towa株式会社 | Resin sealing device and method of manufacturing resin molded product |
JP6654861B2 (en) * | 2015-11-09 | 2020-02-26 | Towa株式会社 | Resin sealing device and resin sealing method |
NL2016011B1 (en) | 2015-12-23 | 2017-07-03 | Besi Netherlands Bv | Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators. |
JP6580519B2 (en) * | 2016-05-24 | 2019-09-25 | Towa株式会社 | Compression molding apparatus, resin-encapsulated product manufacturing apparatus, compression molding method, and resin-encapsulated product manufacturing method |
JP6861506B2 (en) * | 2016-11-29 | 2021-04-21 | Towa株式会社 | Compression molding equipment, compression molding method, and manufacturing method of compression molded products |
JP6861507B2 (en) * | 2016-11-29 | 2021-04-21 | Towa株式会社 | Compression molding equipment, compression molding method, and manufacturing method of compression molded products |
US10199299B1 (en) | 2017-08-07 | 2019-02-05 | Micron Technology, Inc. | Semiconductor mold compound transfer system and associated methods |
KR102446861B1 (en) | 2017-09-21 | 2022-09-23 | 삼성전자주식회사 | Stacked package and method of manufacturing the same |
JP7149238B2 (en) * | 2019-08-09 | 2022-10-06 | Towa株式会社 | RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD |
CN112976666B (en) * | 2019-12-12 | 2022-07-26 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
CN111391219B (en) * | 2020-03-20 | 2021-12-24 | 东莞市艾尔玛塑件科技有限公司 | In-mold transfer printing system |
JP7475215B2 (en) * | 2020-06-29 | 2024-04-26 | Nok株式会社 | Manufacturing method of gasket |
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EP1189271A3 (en) * | 1996-07-12 | 2003-07-16 | Fujitsu Limited | Wiring boards and mounting of semiconductor devices thereon |
JP4326786B2 (en) * | 2002-11-26 | 2009-09-09 | Towa株式会社 | Resin sealing device |
JP4336502B2 (en) * | 2003-01-30 | 2009-09-30 | Towa株式会社 | Resin sealing molding method and apparatus for electronic parts |
US7189601B2 (en) * | 2004-03-02 | 2007-03-13 | Texas Instruments Incorporated | System and method for forming mold caps over integrated circuit devices |
JP2005324341A (en) * | 2004-05-12 | 2005-11-24 | Apic Yamada Corp | Resin molding method and resin molding machine |
JP2006245151A (en) * | 2005-03-02 | 2006-09-14 | Matsushita Electric Ind Co Ltd | Sealing molding method |
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CN114801003A (en) * | 2022-04-25 | 2022-07-29 | 浙江瑞然生态科技有限公司 | Full-biodegradable environment-friendly tableware mould pressing device and preparation method thereof |
CN114801003B (en) * | 2022-04-25 | 2024-04-05 | 浙江瑞然生态科技有限公司 | Full-biodegradation type environment-friendly tableware mould pressing device and preparation method thereof |
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TWI592279B (en) | 2017-07-21 |
JP5934138B2 (en) | 2016-06-15 |
JP2014207302A (en) | 2014-10-30 |
CN104103530B (en) | 2017-06-20 |
KR101610456B1 (en) | 2016-04-07 |
TW201507842A (en) | 2015-03-01 |
CN104103530A (en) | 2014-10-15 |
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