KR20140123407A - Method and apparatus for compressive resin sealing electronic component - Google Patents

Method and apparatus for compressive resin sealing electronic component Download PDF

Info

Publication number
KR20140123407A
KR20140123407A KR1020140008955A KR20140008955A KR20140123407A KR 20140123407 A KR20140123407 A KR 20140123407A KR 1020140008955 A KR1020140008955 A KR 1020140008955A KR 20140008955 A KR20140008955 A KR 20140008955A KR 20140123407 A KR20140123407 A KR 20140123407A
Authority
KR
South Korea
Prior art keywords
resin
cavity
mold
electronic component
resin material
Prior art date
Application number
KR1020140008955A
Other languages
Korean (ko)
Other versions
KR101610456B1 (en
Inventor
신지 다카세
요시히사 가와모토
마모루 스나다
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20140123407A publication Critical patent/KR20140123407A/en
Application granted granted Critical
Publication of KR101610456B1 publication Critical patent/KR101610456B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Engineering (AREA)

Abstract

An object of the present invention is to simplify a compression resin sealing apparatus which collectively encapsulates electronic components on a large-sized substrate in a package, and improve the precision (variation) of package thickness.
According to the present invention, a sheet-like resin having a bevelling disposed on a release film is fed into a lower mold cavity, and the upper and lower molds are closed to form a surplus resin in the lower mold cavity through a narrow gap between the upper and lower molds, In the resin sealing step, the gap between the bottom surface of the lower mold cavity and the electronic component mounting surface of the large substrate at the mold closing end position of the upper and lower positions is the same as the interval of the package thickness for resin- And the compression of the molten resin material in the lower cavity is performed at a low speed and at a low pressure so that the electronic components on the large-sized substrate are integrally molded by resin sealing.

Description

TECHNICAL FIELD [0001] The present invention relates to a compression resin sealing method and an apparatus for sealing a compression resin,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulation method and a resin encapsulation method in which a plurality of electronic components (semiconductor chips) mounted on a large substrate by a so-called compression molding method are integrally encapsulated .

A compression molding method is known as a method of collectively sealing a resin on an electronic component on a large substrate. As schematically shown in Fig. 8, the apparatus for performing the compression molding method is provided with a compression molding die comprising at least a top mold 1 and a bottom mold 2, and the upper and the lower molds 1 and 2 (Not shown) of an appropriate mold opening / closing mechanism. In order to seal the electronic components 4 on the large-size substrate 3 collectively using the resin-sealing apparatus, the following procedure is performed. First, as shown in Fig. 8 (1), the large-size substrate 3 is supplied and set in the upper mold 1 in a state where the mounting surface of the electronic component 4 is downward, The resin material 6 is supplied into the mold 5 and heated. Next, as shown in Fig. 8 (2), the upper and the lower molds 1 and 2 are closed by a mold opening / closing mechanism (not shown) The component 4 is immersed in the molten resin material 6a in the lower mold cavity 5. [ The upper surface of the lower mold 2 presses against the peripheral edge of the large-sized substrate 3 at the time of closing the mold. In this state, the cavity bottom face member 5a of the lower mold 2 is moved upward to press the molten resin material 6a in the lower cavity 5 with a predetermined resin pressure to form the lower cavity 5 The electronic part 4 can be collectively sealed in the package to be molded in accordance with the shape of the package.

On the other hand, as the large substrate 3, a circular substrate having a diameter of 300 mm or a rectangular substrate having a size of about 95 mm x 260 mm or the like is used in the present situation. However, a larger substrate, for example, It is required that the electronic part 4 can be sealed and formed by the resin in a lump. In addition, as the resin material 6 to be supplied into the lower mold cavity 5, granular resin is supplied as it is.

However, since the resin encapsulation range on the large-sized substrate 3 is large, there is a problem that the work of setting the resin supply amount into the lower cavity 5 is troublesome and troublesome. For example, it is necessary to detect and detect the missing state of the large-size substrate 3 in which a part of the electronic parts is missing, and to supply the increased amount of granular resin or the like corresponding thereto, It is necessary to install an attached device such as a resin amount adjusting mechanism or the like. Further, in the case of using a sheet-like resin (sheet-like resin material) previously molded into a predetermined shape, it is difficult to perform the resin amount adjustment work for adding the resin material 6 in response to the loss of the electronic part 4 .

In addition, the resin encapsulation range in the large substrate 3 is wide, and correspondingly, the lower mold cavity 5 for compression molding also has a large area. Therefore, even when the resin material 6 is uniformly supplied and filled in the whole area of the lower mold cavity 5, the resin sealing material can be uniformly injected into the large- It is necessary to perform the operation. When the resin material 6 can not be uniformly supplied and filled all over the lower cavity 5, the cavity bottom face member 5a is moved upward to press the molten resin material 6a in the lower cavity 5 It is necessary to flow the molten resin material 6a into the entire lower cavity 5 to fill it. However, in this case,

A wire sweep such as a molten resin material 6a flowing in the lower mold cavity 5 deforms the wire of the electronic part 4 or disconnects the wire by the pressing force of the cavity bottom face member 5a Easy-to-occur

And the like,

Air is drawn into the molten resin material 6a to form voids,

Uneven dispersion of the filler in the resin occurs to deteriorate the function as the resin material (6)

And the like.

Also, due to the excess or shortage of the resin supplied into the lower mold cavity 5,

An unfilled state occurs in the package to be formed corresponding to the shape of the lower mold cavity 5,

A predetermined resin pressure is not obtained in the lower mold cavity 5,

· The thickness of the package can not be formed with a uniform thickness

There is also a serious problem of resin molding.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2006-120880 [see paragraphs [0013] and [1] of FIG. 5 on page 5)

The present invention is capable of omitting the measurement and adjustment of the amount of resin to be fed into the cavity when a plurality of electronic parts mounted on a large substrate are compression-molded together by resin using a compression molding method, In addition, it is possible to effectively prevent the occurrence of wire sweeps and the like due to the flow action of the molten resin material in the cavity, to obtain a predetermined resin pressure in the cavity, And a compression resin sealing device for carrying out the method.

According to an aspect of the present invention, there is provided a method of sealing a compression resin of an electronic component using at least a mold for compression molding comprising an upper mold and a lower mold, A melting step of heating and melting the resin material supplied into the lower mold cavity formed on the mold surface of the lower mold and covered with the release film;

Closing the upper and lower molds to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower cavity;

Next, by applying a predetermined resin pressure to the molten resin material in the lower cavity, a sealing step of collectively molding the electronic parts on the substrate by resin

The method comprising the steps of:

In the mold closing process,

An outer resin outflow step of allowing the surplus resin in the lower cavity to flow out of the lower cavity,

A resin sealing step of subjecting the molten resin material in the lower mold cavity to a predetermined resin pressure after collecting the excess resin through an outflow step to collectively mold the electronic parts on the substrate by resin sealing

Lt; / RTI >

The surplus resin is guided in the surplus resin accommodating portion provided around the lower mold cavity through a narrow gap provided between the upper and lower molds,

The gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is set to a distance between the package thickness for resin- To be equal to each other.

According to another aspect of the present invention, there is provided a method of sealing a compression resin of an electronic component, the method comprising: a compression mold having at least a top mold and a bottom mold; A lower mold provided on the lower mold and heating and melting the resin material supplied to the lower mold cavity;

Closing the upper and lower molds to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower cavity;

Next, a predetermined resin pressure is applied to the molten resin material in the lower mold cavity to seal the electronic components on the substrate together with the resin to form a seal

The method comprising the steps of:

The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,

In the mold closing process,

A step of externally discharging surplus resin in the lower cavity to allow the surplus resin to flow out of the lower cavity;

A resin sealing step of subjecting the molten resin material in the lower cavity to a predetermined resin pressure so as to collectively mold the electronic parts on the substrate by resin sealing after passing through the surplus resin outflow step

/ RTI >

The surplus resin is guided in the surplus resin accommodating portion provided around the lower cavity through a narrow gap provided between the upper and lower molds,

The gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is made equal to the package thickness for resin sealing the electronic component of the substrate .

In the method for sealing a compression resin of an electronic component according to the present invention, the compression sealing step is performed at a low pressure in which the molding pressure is 0.2942 MPa or more in the resin sealing step.

In the method for sealing a compression resin of an electronic component according to the present invention, the resin material to be fed into the lower cavity is preferably formed by planarizing a required amount of resin to have a desired shape-retaining property, Shaped resin material corresponding to the shape of the lower mold cavity and formed into a shape capable of being fitted and supplied in the lower cavity.

The method for sealing a compression resin of an electronic component according to the present invention is characterized in that the resin material to be fed into the lower cavity is a resin material supplied by planarizing a required amount of resin.

The method for sealing a compression resin of an electronic component according to the present invention is characterized in that the resin material is a resin material selected from a granular resin material, a powdered resin material, a liquid resin material, and a paste resin material .

A method for sealing a compression resin of an electronic part according to the present invention is characterized in that before the lower mold cavity is covered with the release film, a resin material in a sheet form, And the sheet-shaped resin material and the release film are fed into the lower cavity, whereby the lower cavity is covered with the release film and the sheet-like resin material is supplied to the lower cavity .

A method of sealing a compression resin of an electronic part according to the present invention is characterized in that the resin material is a sheet-like resin material having a required amount of flattened resin to form a desired shape, Wherein the release film is provided in an expanded state and the sheet-like resin material is supplied to the lower cavity via the release film.

According to another aspect of the present invention, there is provided a compression resin sealing apparatus for an electronic part,

A mold for compression molding comprising at least an upper mold and a lower mold is used and the substrate on which the electronic component is mounted is supplied to the mold surface of the upper mold with the mounting surface side thereof facing downward, Heating and melting the resin material supplied in the lower mold cavity covered with the film and then closing the upper mold and the lower mold to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower mold cavity, Next, by applying a predetermined resin pressure to the molten resin material in the lower cavity, the electronic parts mounted on the substrate are collectively molded by resin to form a compression resin sealing apparatus for an electronic part,

Wherein a narrow gap is provided between the upper and lower molds to allow the surplus resin, which becomes a part of the molten resin material in the lower cavity, to flow out of the lower cavity when closing the upper and lower molds,

A surplus resin receiving portion communicating with the lower cavity around the lower cavity is disposed,

The interval between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower molds is set to be equal to the interval of the package thickness for resin sealing the electronic component of the substrate .

According to another aspect of the present invention, there is provided a compression resin sealing apparatus for an electronic part,

Wherein the electronic component mounting surface of the electronic component mounting face is downwardly directed to supply the electronic component mounting face to at least one of the upper mold face and the lower mold cavity using a mold for compression molding comprising at least upper and lower molds, And then the upper and lower molds are closed to close the electronic component of the substrate on the upper mold side so as to be immersed in the molten resin material in the lower mold cavity, Wherein a predetermined resin pressure is applied to the molten resin material so that the electronic parts mounted on the substrate are collectively molded by resin,

The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,

A narrow gap is provided between the upper and lower molds to allow an excess resin, which is a part of the molten resin material in the lower cavity, to flow out of the lower cavity when the upper and lower molds are closed,

A surplus resin receiving portion communicating with the lower gap around the lower cavity is disposed,

Wherein a gap between the bottom surface of the lower cavity at the mold closing end position of the upper and lower molds and the electronic component mounting surface of the substrate is set to be the same as the package thickness for resin sealing the electronic component of the substrate .

The narrow gap for allowing the surplus resin to flow out of the lower cavity may be provided between the mold surface of the lower mold and the mounting surface of the electronic component in the substrate, The resin passage communicating the lower mold cavity with the accommodating portion of the excess resin,

And the resin passage has an inclined surface that becomes shallow toward the receiving portion of the excess resin from the lower mold cavity.

Further, in the compression resin sealing apparatus for an electronic part according to the present invention,

A narrow gap for allowing the surplus resin to flow out of the lower cavity is provided between the lower cavity and the electronic component mounting surface of the substrate,

The accommodating portion of the surplus resin,

The narrow gap,

And a space portion between the narrow gap and a resin leakage preventing member disposed around the lower cavity.

Further, in the compression resin sealing apparatus for an electronic part according to the present invention,

And the resin leakage preventing member also serves as a positioning member for regulating a distance between the upper and lower mold surfaces when the upper and lower molds are closed.

Further, in the compression resin sealing apparatus for an electronic part according to the present invention,

Wherein the lower mold has a structure in which the cavity bottom face member and the cavity side face member are divided,

And the cavity bottom face member and the cavity side face member are fitted to each other so as to be relatively movable up and down.

Further, in the compression resin sealing apparatus for an electronic part according to the present invention,

The lower mold is characterized in that the cavity bottom face portion and the cavity side face portion are integrally formed.

According to the compression resin sealing method and the compression resin sealing apparatus of the electronic component according to the present invention, by using a sheet-like resin molded in conformity with the shape of the lower mold cavity, The resin material can be uniformly supplied and filled in the whole area of the lower mold cavity. Therefore, it is possible to perform the heating and melting action of the sheet-like resin in the lower cavity and the pressing (pressing) action on the molten resin material under the same conditions at the respective portions of the lower cavity, It is possible to equalize the quality of the molded sealing article.

In addition, since a sheet-shaped resin which is formulated in a fixed amount can be used, it is possible to omit the resin metering and adjustment work such as metering and adjustment of the amount of resin to be fed into the lower mold cavity.

In addition, since the heating molten action of the sheet-like resin in the lower mold cavity and the pressing action against the molten resin material can be performed at a low pressure, the flow action of the molten resin material in the lower cavity can be prevented or suppressed . That is, by performing the pressing action against the molten resin material in the lower cavity at a low speed and a low pressure, occurrence of wire sweep or the like caused by the flow action of the molten resin material can be effectively prevented. For example, it is possible to press the molten resin material in the lower mold cavity at a low pressure of at least 0.2942 MPa (at least 3 kgf / cm2). In terms of [MPa], the numerical values of the engineering pressures (unit: kgf / cm 2) indicated in parentheses were calculated as 1 kgf / cm 2 = 0.0980665 MPa, and the numbers were rounded to 4 digits.

Further, by using the sheet-like resin which is shaped in a fixed amount, the supply action of the resin material throughout the lower cavity, the heating and melting action of the sheet-like resin, the lowering of the speed of the molten resin material, The occurrence of a wire sweep or the like due to the flow action of the molten resin material in the lower cavity can be more effectively prevented.

In addition, it is also possible to carry out the step of externally discharging the surplus resin in the lower mold cavity to the outside of the lower mold cavity, and the step of applying the predetermined resin pressure to the molten resin material in the lower mold cavity, By performing a mold closing step of upper and lower defects including a resin sealing step of collectively molding the molten resin material in the lower mold cavity, the required amount of molten resin material can be filled more efficiently and reliably in the lower mold cavity.

Further, the pressing action against the molten resin material in the lower mold cavity can be performed at low speed and at low pressure. Therefore, with respect to the compression resin sealing apparatus, it is possible to cope with the enlargement of the substrate without requiring a large mold closing force as the total force, and the configuration of the compression resin sealing apparatus can be simplified or simplified. Therefore, a plurality of electronic components mounted on the substrate can be pressed against the molten resin material in the lower cavity by using the sheet-like resin (with required bending) shaped in a constant amount by this simplified or simplified apparatus It is possible to perform sealing molding at a low speed and at a low pressure in a lump.

Further, in the resin sealing step in the mold closing step, the gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing end position of the upper and lower positions is smaller than the interval The predetermined resin pressure can be obtained in the cavity, and the thickness of the package can be formed to a predetermined thickness. Therefore, the precision (variation) of the thickness of the package molded in the lower cavity can be improved by using the above-mentioned simplified or simplified compression resin sealing apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially cut-away front view showing the entire configuration of a compression-sealed apparatus according to a first embodiment of the present invention, schematically showing a state of being opened up and down. Fig.
Fig. 2 is a partially cut-away front view of the compression resin sealing apparatus corresponding to Fig. 1, schematically showing a closed state of the upper and lower directions.
Fig. 3 shows a main part of the compression resin sealing apparatus corresponding to Fig. 1, and Fig. 3 (1) is a partially cutaway enlarged front view of the uniform pressurizing means in its lower mold, and Fig. 3 (2) And FIG. 6 is a partially enlarged front view showing the enlarged view of the means.
Fig. 4 shows a main part of the compression resin sealing apparatus corresponding to Fig. 1, and Fig. 4 (1) is an enlarged longitudinal sectional view of the resin molded part at the time of opening the upper and lower guards, Fig. 5 is an enlarged longitudinal sectional view of the resin molding portion at the time of closing the upper and lower molds. Fig.
Fig. 5 shows a main part of the resin molding part corresponding to Fig. 4, and Fig. 5 (1) is an enlarged longitudinal sectional view of the main part, and Fig. 5 (2) is a plan view of the main part.
6 (A) is a longitudinal sectional view of the resin molding section when the upper and lower molds are opened, and FIG. 6 (A) is a longitudinal sectional view of the resin molding section 2 is a vertical cross-sectional view of the resin molding portion at the time of mold closing of the upper and lower molds.
7 (A) is a longitudinal sectional view of the resin molding section at the time of mold release of the upper and lower molds, and FIG. 7 (A) is a longitudinal sectional view of the resin molding section of the compression resin sealing apparatus according to the third embodiment of the present invention. 2 is a vertical cross-sectional view of the resin molding portion at the time of mold closing of the upper and lower molds.
Fig. 8 schematically shows a main part of a conventional compressive-resin-sealing apparatus. Fig. 8 (1) is a vertical cross-sectional view of the resin molding section at the time of opening the upper and lower molds. Fig. 8 (2) Fig. 7 is a longitudinal sectional view of the resin molding portion at the time of mold closing of the staple. Fig.

The embodiments of the present invention shown in the drawings have been described above.

(First Embodiment)

Figs. 1 to 5 show a first embodiment of the present invention. Fig. 1 and Fig. 2 show the entire configuration of the compression resin sealing apparatus, and Figs. 3 to 5 show the main parts thereof.

Further, this compression resin sealing apparatus has a constitution in which the constituent members thereof are held by a press frame (hold frame). That is, the upper mold 31 for compression molding is disposed on the lower surface side of the upper end of the frame-shaped press frame 20 and the upper mold 31 is moved up and down by a mold opening / So that the lower mold 32 for compression molding is provided. The upper mold 31 and the lower mold 32 constitute a mold 30 for compression molding.

The upper mold 31 includes an upper mold base 31a fixed to the lower face side of the upper end of the press frame 20, a upper mold holding block 31b fixed to the lower face side of the upper mold base 31a, A substrate set block 31c supported by the upper mold hold block 31b and a top mold heating heater 31d built in the substrate set block 31c. The upper surface of the upper mold 31 is placed on the outer periphery of the substrate set block 31c and the upper surface of the lower mold 32 to be described later (upper surface of the cavity side member 32d in the example of the figure) And a seal member 31e for interrupting the inside and outside ventilation between the mold surfaces of the upper and lower molds 31 and 32 and the outside of the upper and lower molds. Between the upper mold-holding block 31b and the substrate set block 31c, there is provided a seal member 31f for interrupting the ventilation between the blocks 31b and 31c. The upper die 31 is provided with a large substrate 70 on which an electronic component 71 is mounted and a suitable fastening for fastening the electronic component mounting face downward, Means (not shown) are provided. The upper mold 31 is provided with the upper mold 31 and the lower mold 31 · 32 which are sealed (ventilated) by the seal member 31e at the time of mold closing of the upper and lower molds 31 · 32 And a vacuum suction mechanism (not shown) in which a vacuum pump and a vacuum pump are communicatively connected through an appropriate intake path.

The lower mold 32 is provided on the movable platen 52 in the mold opening / closing mechanism 50, which will be described later, which is disposed at the lower end of the press frame 20. The lower mold 32 includes a lower mold base 32a fixed on the movable platen 52 of the mold opening and closing mechanism 50 and a lower mold holding block 32b fixed to the upper face side of the lower mold base 32a A cavity bottom face member 32c supported by the lower mold holding block 32b, a cavity side face member 32d fitted around the outer periphery of the cavity bottom face member 32c, a lower side mold base member 32a, An elastic member 32e interposed between the cavity bottom face member 32c and the cavity bottom face member 32d so as to elastically press the cavity side face member 32d upward and a heater 32f for heating the bottom mold embedded in the cavity bottom face member 32c do. The lower mold 32 has a configuration in which the cavity bottom face member 32c and the cavity side face member 32d are divided and the cavity bottom face member 32c and the cavity side face member 32d are relatively movable up and down Respectively. Between the cavity bottom face member 32c and the cavity side face member 32d, there is provided a seal member 32g for interrupting the ventilation between the two.

In the compression molding die provided with the cavity for a large substrate, the mold closing pressure of the upper and lower molds 31 and 32 is large at the periphery of the upper and lower molds 31 and 32 and becomes smaller at the center thereof, The upper and lower leaves 31 · 32 are bent and deformed in a state in which the central portion of the upper and lower leaves 31 · 32 is expanded. Therefore, the compression molding die 30 is provided with an equalizing pressurizing means (not shown) also serving as a curved deformation preventing member for preventing the upper and lower guards 31 and 32 from being bent during the closing of the upper and lower guards 31 and 32 (40). The uniform pressurizing means 40 exemplifies a case in which the equal pressing means 41 for the upper die 31 and the equal pressing means 42 for the lower die 32 are provided have.

That is, the phase-type equalizing pressurizing means 41 includes an upper horizontal space portion 41a provided between the upper mold holding block 31b and the substrate set block 31c, A pressing force adjusting mechanism 43 for adjusting the pressing force by the pressure medium 44 and a pressing force adjusting mechanism 43 for connecting the pressing force adjusting mechanism 43 and the elastic receiving body 41b to each other, And a communicating path 41c for supplying a fluid. The lower mold uniform pressing means 42 includes a lower mold horizontal space portion 42a provided between the lower mold holding block 32b and the cavity bottom surface member 32c and a pressure medium A pressing force adjusting mechanism 43 for adjusting the pressing force by the pressure medium 44 and a pressing force adjusting mechanism 43 for connecting the pressing force adjusting mechanism 43 and the elastic receiving body 42b to each other, And a communicating path 42c for allowing the fluid to pass therethrough.

As the above-mentioned pressure medium, it is possible to use a fluid (for example, a gas such as air or an inert gas, or a liquid such as an inert aqueous solution or oil such as water). For example, a silicone oil of low thermal conductivity may be used as the pressure medium. In this case, not only the function as the pressure medium is provided, but also the power consumption can be reduced by the heat insulating function.

On the other hand, in the example of the drawings, the case is shown in which the pressing force adjustment mechanism 43 of the upper and lower equal pressurizing means 41 and 42 is also used. However, the upper and lower pressurizing pressurizing means 41, A dedicated pressing force adjusting mechanism corresponding to each of the pressing means 42 may be provided.

The mold opening / closing mechanism 50 for opening and closing the upper mold 31 and the lower mold 32 by moving the lower mold 32 up and down is constructed as follows. That is, the base 51 is fixed to the lower portion of the press frame 20 which is positioned below the compression molding die 30 and the movable platen 52 provided at the upper position of the base 51 and the base 51, (Toggle mechanism), and the link is driven by the servomotor 53 so that the upper and lower guards 31 and 32 are opened and closed. The output shaft 53a of the servo motor 53 and the lower pulley 54a of the screw shaft 54 are connected to the screw shaft 54 rotatably set at the center position of the servo motor 53 and the base 51. [ 53b of a belt 53c. The nut member 55 is screwed to the screw shaft 54 and the nut member 55 is moved in the vertical direction by rotating the screw shaft 54. [ The movable platen 52 moves vertically as the nut member 55 moves up and down by engaging a link connecting the base 51 and the movable platen 52 to the nut member 55. [ On the other hand, the link connecting between the base 51 and the movable platen 52 is constituted by a first link plate 56a, a second link plate 56b and a third link plate 56c. The lower ends of the base 51 and the second link plate 56b are pivotally supported via the shaft 51a and the upper ends of the movable platen 52 and the third link plate 56c are pivotally supported via the shaft 52a. And the upper end of the second link plate 56b and the lower end of the third link plate 56c are pivotally supported via the shaft 52b. One end of the first link plate 56a is pivotally supported by the nut member 55 and the other end of the first link plate 56a is positioned at an intermediate position between the shaft 51a and the shaft 52b in the second link plate 56b. At an intermediate position of the center of gravity. Therefore, the first link plate 56a acts as a drive link for transmitting the driving force by the up-and-down movement of the nut member 55 to the second link plate 56b and the third link plate 56c. The movable platen 52 is rotated through the nut member 55 and the first link plate 56a, the second link plate 56b, and the third link plate 56c by rotating the screw shaft 54 with the servo motor 53, The upper and lower guards 31 and 32 can be opened and closed.

Although the above-described mold opening and closing mechanism 50 is exemplified by the case of using the toggle mechanism in the example of the drawings, a mold opening / closing mechanism employing an electric motor and a screw jack means, It is obvious that an opening and closing mechanism can be used.

Between the mold surfaces of the upper and lower molds 31 and 32, a resin molding portion 33 is formed as shown in enlarged view in Figs. That is, the concave portion formed by the upper surface of the cavity bottom surface member 32c and the upper surface opening of the cavity side surface member 32d is a lower mold cavity 33a for resin molding. 4, a lower cavity 33a is formed between the upper and lower molds 31 and 32 when the upper and lower molds 31 and 32 are closed (see (2) in FIG. 4) A narrow gap 33c for allowing the surplus resin 80b, which is a part of the molten resin material 80a in the lower cavity 33a, to flow out of the lower cavity 33a is provided. Further, a surplus resin accommodating portion 33b communicating with the lower mold cavity 33a through a narrow gap 33c is disposed (see Fig. 5). The distance between the bottom surface of the lower mold cavity 33a and the mounting surface of the electronic component 71 of the large substrate 70 at the mold closing end position of the upper and lower molds 31, Is set to be equal to the interval of the package thickness (33d) for sealing the resin (71). The narrow gap 33c for allowing the surplus resin 80b to flow out of the lower cavity 33a is provided between the lower cavity 33a and the electronic component mounting surface of the large substrate 70, The narrow gap 33c serves as a resin passage communicating the lower mold cavity 33a with the accommodating portion 33b of the excess resin 80b. The narrow gap 33c is provided as an inclined surface that becomes shallower from the lower mold cavity 33a toward the accommodating portion 33b of the excess resin 80b. By providing the narrow gap 33c made of such an inclined surface, the excess resin 80b can be slowly (slowly) introduced into the excess resin accommodating portion 33b.

On the other hand, the above-mentioned compression resin sealing apparatus is provided with a release film supply setting mechanism (not shown) for tightly mounting the release film 60 on the lower surface including the lower cavity 33a provided in the lower mold 32 have. A resin supply and setting mechanism (not shown) for supplying the sheet-like resin 80 to the lower mold cavity 33a, which is provided with the release film 60 tightly by the release film supply set mechanism, is provided in parallel. The sheet-like resin 80 is formed in a similar shape corresponding to the shape of the lower mold cavity 33a, and the required amount of resin is flattened to provide required formability. Here, the required amount is the amount of resin for molding the electronic components 71 on the large-sized substrate 70 in a predetermined thickness in the lower mold cavity 33a by compression-sealing resin molding, The amount of surplus resin to be discharged to the outside of the outer cylinder 33a. More specifically, for example, in the case where the electronic components 71 on the large-size substrate 70 are integrally packaged in a package having a 0.3 mm thickness in cross-section, the sheet-shaped resin material 80 having a 0.5 mm thickness desirable.

A description will now be given of a case where the electronic components 71 mounted on the large substrate 70 are integrally molded by compression resin molding using a resin (a sheet-shaped resin that is shaped in a fixed amount) using the compression resin sealing apparatus do.

First, the upper and lower molds 31 and 32 are opened by a mold opening / closing mechanism 50 (see Fig. 1). Next, at the time of this die opening, a large-sized substrate (not shown) on which the electronic parts 71 are mounted is mounted on the mold surface of the upper mold 31 (i.e., the lower surface of the substrate set block 31c) And the large-size substrate 70 is attached to the mold surface of the upper mold 31 with its electronic component mounting surface facing downward. The mold releasing film 32 is provided on the mold surface of the lower mold 32 including the lower mold cavity 33a (that is, the upper surface of the cavity bottom surface member 32c and the cavity side surface member 32d) (60). In addition, the sheet-like resin 80 is supplied to the lower mold cavity 33a provided with the releasing film 60 in an expanded state through a resin supply set mechanism (not shown) (see Fig. 4). The sheet-like resin 80 is heated and melted by a heater 32f for heating the lower mold embedded in the cavity bottom surface member 32c. On the other hand, the sheet-like resin 80 shaped in a fixed amount is placed on the release film 60 (so-called pre-cut release film) formed by cutting the roll-shaped release film in advance to a predetermined length, 33a. For example, first, the sheet-like resin 80 is aligned with the opening (mold surface) of the lower mold cavity 33a with the sheet-like resin 80 disposed on the release film 60, 60 are drawn into the lower mold cavity 33a to cover the inside of the lower mold cavity 33a by the release film 60. [ As a result, it is possible to coat the lower mold cavity 33a with the release film 60 and supply the sheet-like resin 80 to the lower cavity 33a.

Next, the pressure medium 44 adjusted by the pressing force adjusting mechanism 43 to a predetermined pressing force is uniformly pressurized in the elastic receptor 41b of the upper-portion equal pressing means 41 through the equal pressing means 40, Is introduced into each of the elastic receivers 42b of the means 42 to prevent the upper and lower molds 31 and 32 from being curvedly deformed by the mold closing pressure when the upper and lower molds 31 and 32 are closed (See FIG. 3). The curved deformation preventing step of the upper and lower molds 31 and 32 by the uniform pressurizing means 40 may be carried out all the time during the molding step or may be carried out during the mold closing step of the upper and lower molds 31 and 32 Or may be performed simultaneously with the mold closing process. In short, the timing at which the upper and lower molds 31 and 32 are prevented from being curved and deformed by the mold closing pressure in the mold closing process of the upper and lower molds 31 and 32 can be selected.

Next, as shown in Fig. 2, the lower mold 32 is moved upward through the mold opening / closing mechanism 50 so that the upper and lower molds 31 and 32 are closed. The electronic component 71 on the large substrate 70 attached to the mold surface of the upper mold 31 is attached to the lower mold cavity 33a in which the release film 60 is tightly installed In the molten resin material 80a. Next, by applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a, the electronic parts 71 mounted on the large-size substrate 70 are collectively molded by compression resin and molded by resin . On the other hand, since the seal member 31e can seal between the mold surfaces of the upper and lower molds 31 and 32 when the upper and lower molds 31 and 32 are closed, the vacuum pump (not shown) Called vacuum molding (reduced-pressure molding) in which the pressure between the mold surfaces (in the lower mold cavity 33a) is reduced by operating the molds.

In the mold closing process of the upper and lower molds 31 and 32 described above, the step of externally discharging the excess resin 80b for discharging the excess resin 80b in the lower cavity 33a to the outside of the lower cavity 33a And the molten resin material 80a in the lower cavity 33a is moved upward by the upward movement of the cavity bottom face member 32c after the outflow of the excess resin 80b through the outflow step, The resin sealing step for collectively molding the electronic components 71 on the large-size substrate 70 by resin sealing is performed. The surplus resin 80b is supplied to the surplus resin accommodating portion 33a provided around the lower cavity 33a through the narrow gap 33c formed between the upper and lower types 31 and 32, (See Figs. 4 and 5). In the resin sealing step, the gap between the bottom surface of the lower mold cavity 33a and the electronic component mounting surface of the large-size substrate 70 at the mold closing end position of the upper and lower molds 31, A predetermined resin pressure can be obtained in the lower cavity 33a and the package thickness 33d is set to be smaller than the predetermined thickness of the package 33d. As shown in Fig.

That is, at this time, the mold closing action by the upper and lower molds 31 and 32 and the pressing action against the molten resin material 80a in the lower cavity 33a by the cavity bottom surface member 32c can be performed. Therefore, by performing the mold closing action of the upper and lower molds 31 and 32 and the pressing action against the molten resin material 80a at a low speed and a low pressure, it is possible to carry out the above- The resin sealing step can be performed at a low speed and at a low pressure. The electronic component 71 of the large-size substrate 70 at the final position of mold closing of the upper and lower molds 31 and 32 in the resin sealing step is related to resin sealing in a package having a predetermined thickness. Therefore, it is possible to prevent or prevent the flow action of the molten resin material 80a in the lower mold cavity 33a during the mold closing action of the upper and lower molds 31 and 32 and the pressing action of the molten resin material 80a It is possible to effectively prevent occurrence of wire sweep or the like due to the flow action of the molten resin material 80a.

On the other hand, setting of the mold closing end position of the upper and lower molds 31 and 32 or the bottom position of the lower mold cavity 33a at the mold closing end position in the resin sealing step is performed by the mold opening / (Top dead center) in which the lower die 32 is moved upward (see Fig. 2).

The setting of the mold closing end position of the upper and lower molds 31 and 32 or the bottom position of the lower mold cavity 33a at the mold closing end position in the resin sealing step is performed by the mold opening / A height position control mechanism (not shown) for detecting the predetermined height position of the lower mold 32 or the cavity bottom surface member 32c moving upward and stopping the upward movement of the lower mold 32 or the cavity bottom surface member 32c It may be adopted.

Further, by using the sheet-like resin 80 shaped into a predetermined amount, the supply action of the resin material over the whole area in the lower cavity 33a, the heating and melting action of the sheet-like resin, The occurrence of a wire sweep or the like due to the flow action of the molten resin material 80a in the lower cavity 33a can be more effectively prevented by the synergistic action of the low speed and the low pressure.

On the other hand, in the above-described resin sealing step, it is possible to perform compression sealing molding at a molding temperature of 160 ° C to 185 ° C under a molding pressure of 0.2941 MPa or more (3 kgf / cm 2 or more). In addition, in the resin sealing step, by using the uniform pressurizing means 40 in combination, it is possible to prevent the upper and lower guards 31 and 32 from being curvedly deformed by the mold closing pressure at the time of mold closing of the upper and lower guards 31 · 32 . After the surplus resin 80b in the lower cavity 33a is discharged to the outside of the lower cavity 33a and the surplus resin 80b flows out of the lower cavity, A prescribed resin pressure is applied to the molten resin material 80a in the lower cavity 33a to move the cavity bottom face member 32c upward to a predetermined height position so that the electronic components 71 on the large- Sealing molding can be performed. Since the predetermined resin pressure can be applied to the molten resin material 80a in the lower mold cavity 33a and the cavity bottom member 32c can be moved upward to the predetermined height position, It is possible to efficiently improve the precision (variation) of the thickness 33d of the package.

According to the configuration of this embodiment, when a plurality of electronic parts 71 mounted on the large-size substrate 70 are integrally molded by the resin, the amount of resin to be supplied into the lower cavity 33a The adjustment operation can be omitted. Further, it is possible to effectively prevent occurrence of wire sweep or the like caused by the flow action of the molten resin material 80a in the lower mold cavity 33a. In addition, a predetermined hydraulic pressure can be obtained in the lower mold cavity 33a. In addition, the thickness 33d of the package for resin-sealing the electronic component 71 can be formed to a predetermined thickness. By providing the equal pressing means 41 for the upper die 31 and the equal pressing means 42 for the lower die 32, it is possible to prevent the upper and lower leaves 31, It is advantageous when the electronic components 71 on the large substrate 70 are integrally molded by resin to be sealed. When the upper and lower molds 31 and 32 are closed by the mold opening and closing mechanism 50 and the molten resin material 80a in the lower mold cavity 33a is pressed, The cavity bottom face member 32c provided on the elastic receptacle 42b by the equalizing action of the pressure medium 44 in the elastic receptacle 42b provided in the lower horizontal space portion 42a , The cavity bottom face (front end face) can be moved upward while being held in a horizontal state. That is, the cavity bottom surface member 32c can be horizontally lifted without being inclined as a horizontal floating plate. The upper mold heating heater 31d and the lower mold heating heater 32f are provided in the vicinity of the resin molding portion 33 (lower mold cavity 33a) between the upper and lower molds 31 and 32, The thermal efficiency for the molten resin material 80a can be improved.

(Second Embodiment)

Next, a second embodiment according to the present invention will be described with reference to Fig.

Fig. 6 shows a second embodiment of the present invention. Fig. 6 (1) shows a main part of a resin molding section at the time of opening the upper and lower molds, and Fig. 6 (2) And shows the main parts of the resin molding portion at the time of closing the upper and lower molds. The second embodiment is different from the first embodiment in the following points. And the other points are substantially the same as those of the first embodiment. Therefore, different points will be described, and constituent members which are substantially the same as those of the first embodiment will be denoted by the same reference numerals, and redundant description will be avoided.

6 (2), a narrow gap 34c for allowing the surplus resin 80b to flow out of the lower cavity 34a is formed in the mold surface of the lower mold 32 (in the example of the figure, The upper surface of the cavity side surface member 32d) and the electronic component mounting surface of the large substrate 70. [ The surplus resin receiving portion 34b is provided as a space between the narrow gap 34c and the resin leakage preventing member 34 disposed around the lower cavity 34a and the narrow gap 34c. The resin leakage preventing member 34 also serves as a positioning member for regulating the distance between the mold surfaces of the upper and lower molds 31 and 32 when the upper and lower molds 31 and 32 are closed.

The resin leakage preventing member 34 is provided to move up and down by receiving an operation signal 35 from its driving mechanism (not shown). The lower end surface of the resin leakage preventing member 34 is fixed to the mold surface of the lower mold 32 (that is, the upper surface of the cavity side member 32d provided with the release film 60 in an uptight state) (31 · 32) at the time of mold closing of the upper and lower molds 31 · 32 can be regulated to a predetermined distance. Therefore, by selecting the height position of the lower end face of the resin leakage preventing member 34, the narrow gap 34c can be appropriately adjusted.

In the configuration of the second embodiment, the surplus resin 80b in the lower cavity 34a is held in the lower cavity 34a during the mold closing process of the upper and lower molds 31 and 32 shown in Fig. 6 (2) The cavity bottom face member 32c is moved upward to a predetermined height position after performing the outflowing step of the excess resin 80b to be discharged to the outside and the outflowing step of the excess resin 80b, A predetermined resin pressure is applied to the molten resin material 80a in the large-size substrate 34a to perform the resin sealing step of collectively molding the electronic parts 71 on the large-size substrate 70 by resin sealing. The surplus resin 80b is discharged to the outside through the narrow gap 34c formed between the upper and lower types 31 and 32 by the surplus resin 80b provided around the lower cavity 34a, So as to be guided in the portion 34b. In the resin sealing step, the gap between the bottom surface of the lower cavity 34a and the mounting surface of the electronic component 71 of the large substrate 70 at the mold closing end position of the upper and lower molds 31, 70 is set to be equal to the interval of the package thickness 34d for resin sealing. Therefore, a predetermined resin pressure can be obtained in the lower mold cavity 34a, and the package thickness 34d can be molded to a predetermined thickness.

According to the configuration of the second embodiment, the resin leakage preventing member 34 is positioned and fixed for regulating the distance between the mold surfaces of the upper and lower molds 31 and 32 when the molds of the upper and lower molds 31 and 32 are closed. It is possible to simultaneously perform the operation of setting the required narrow gap 34c and the operation of configuring the accommodating portion 34b of the surplus resin 80b at the same time. A surplus resin accommodating portion 34b and a narrow gap 34c for communicating the accommodating portion 34b and the lower mold cavity 34a are provided between the mold surfaces of the upper and lower molds 31, It is not necessary to cut off the narrow gap 33c having the inclined surface described in the first embodiment and the concave groove-shaped surplus resin accommodating portion 33b.

Next, a third embodiment according to the present invention will be described with reference to Fig.

(Third Embodiment)

Fig. 7 (1) shows a main portion of the resin molding portion at the time of mold release of the upper and lower molds, and Fig. 7 (2) And shows the main parts of the resin molding portion at the time of closing the upper and lower molds. The third embodiment is different from the first and second embodiments in the following points. The other points are substantially the same as those of the first and second embodiments. Therefore, different points will be described, and constituent members which are substantially the same as those of the first and second embodiments will be denoted by the same reference numerals and duplicate description will be avoided.

7, the lower mold 32 includes the cavity bottom face portion (the cavity bottom face member 32c of the first and second embodiments) and the cavity side face portion (the cavity side face member of the first and second embodiments) (32d) are integrally formed. On the other hand, in the embodiment shown in Fig. 7, the release film 60 is not necessarily used, but a release film 60 may be used in order to improve the releasability of the package.

7 (2), the molten resin material 80a in the lower cavity 36a is pressed by a predetermined resin pressure to form a predetermined package (not shown) in the mold closing final position of the upper and lower molds 31, So that the thickness 36d can be formed. The depth of the cavity 36a from the mold surface of the lower mold 32 (the mounting surface of the electronic component 71 on the substrate 70) to the bottom surface of the cavity 36a is set to be equal to the thickness (interval) 36d ).

Further, similarly to the first embodiment, a resin molding portion 36 is formed between the mold surfaces of the upper and lower molds 31 and 32. [ That is, the lower mold cavity 36a for resin molding is provided on the mold surface (upper surface) of the lower mold 32. [ The molten resin material 80a in the lower cavity 36a is filled between the upper and lower molds 31 and 32 at the time of closing the upper and lower molds 31 and 32 (see Fig. 7 (2) A narrow gap 36c for allowing the excess resin 80b, which becomes a part of the lower mold cavity 36a, to flow out of the lower cavity 36a is provided. In addition, a surplus resin accommodating portion 36b communicating with the lower mold cavity 36a through a narrow gap 36c is disposed around the lower mold cavity 36a. The distance between the bottom surface of the lower mold cavity 36a at the mold closing end position of the upper and lower molds 31 and 32 and the mounting surface of the electronic component in the large substrate 70 is larger than the distance between the bottom surface of the electronic component 71 Is equal to the interval of the package thickness 36d for resin sealing. The narrow gap 36c for allowing the surplus resin 80b to flow out of the lower mold cavity 36a is a gap between the lower mold cavity 36a and the mounting surface of the electronic component 71 in the large- And the narrow gap 36c is a resin passage communicating the lower cavity 36a and the surplus resin accommodating portion 36b. The narrow gap 36c is formed as an inclined surface that becomes shallow from the lower mold cavity 36a toward the accommodating portion 36b of the excess resin 80b.

In the configuration of the third embodiment, the surplus resin 80b in the lower cavity 36a is held in the lower cavity 36a during the mold closing process of the upper and lower molds 31 and 32 shown in Fig. 7 (2) A predetermined resin pressure is applied to the molten resin material 80a in the lower mold cavity 36a after the step of externally discharging the excess resin 80b out of the lower mold cavity 36a is performed, The resin sealing step for collectively molding the electronic components 71 on the large-size substrate 70 by resin sealing is performed. The surplus resin 80b is discharged to the outside of the lower mold cavity 36a through the narrow gap 36c formed between the upper and lower molds 31 and 32 in the outflow of the excess resin 80b. And is guided in the resin accommodating portion 36b. In the resin sealing step, the gap between the bottom surface of the lower mold cavity 36a and the electronic component mounting surface of the large-size substrate 70 at the mold closing final position of the upper and lower molds 31, Is set to be equal to the interval of the package thickness (36d) for resin-sealing the electronic component (71). Therefore, a predetermined resin pressure can be obtained in the lower mold cavity 36a, and the package thickness 36d can be molded to a predetermined thickness.

The mold closing action by the upper and lower molds 31 and 32 and the mold closing action by the upper and lower molds 31 and 32 and the molten resin in the lower mold cavity 36a can be suppressed by using the lower mold 32 having the cavity bottom face portion and the cavity side face portion integrally formed. The pressing action against the material 80a can be performed simultaneously. Therefore, by performing the mold closing action of the upper and lower molds 31 and 32 and the pressing action against the molten resin material 80a at a low speed and a low pressure, it is possible to prevent the residual resin 80b from flowing out, Step can be performed at low speed and at low pressure. The electronic component 71 of the large substrate 70 at the final position of the mold closing of the upper and lower molds 31 and 32 in the resin sealing step is related to resin sealing in the package of the predetermined thickness 36d have. Therefore, the flow action of the molten resin material 80a in the lower mold cavity 36a can be prevented or suppressed during mold clamping action of the upper and lower molds 31 and 32 and pressing action of the molten resin material 80a It is possible to effectively prevent the occurrence of wire sweeps or the like caused by the flow action of the molten resin material 80a.

In the first to third embodiments, when a compression resin sealing device is used for integrally mounting electronic parts mounted on a large-sized substrate with a sheet-like resin that is shaped in the above-described manner, Explained. However, in the present invention, for example, various kinds of resin materials in a required amount are flattened (in an even thickness state) on a pre-cut release film, and the resin material can be supplied into the lower cavity in this state . Further, in the present invention, various kinds of resin materials in a required amount can be supplied (in an even thickness state) in a lower cavity coated with a release film (or in a lower cavity not covered with a release film). As the various resin materials described above, a granular resin material (granular resin), a powdery resin material (powder resin), a liquid resin material (liquid resin), a paste resin material or a sheet resin material . As the various resin materials described above, a resin material having transparency, a resin material having translucency, and a resin material having opacity can be used.

The sheet-like resin material is formed by cooling, for example, a resin material such as a granular resin in a required amount by molding with a calendar roll or the like to form a sheet (flattened state) and embossing it. On the other hand, by granulating the granular resin by heating its peripheral surface, the peripheral surfaces of the granules are adhered to each other, and the granular resin having a required amount of resin can be shaped in a state of being flattened while maintaining the granular state ( There is a gap between the granules).

Further, in the present invention, the above-mentioned various resin materials (granular resin, powder resin, etc.) are placed on a release film that has been pre-cut or in a lower cavity covered with a release film (in a lower cavity not covered with a release film) It can be supplied in a required amount and in a planarized state (with an even thickness set). For example, the required amount of the granular resin or the powdered resin can be sprayed in a state in which the resin material is flattened in the lower cavity in a state in which the granular resin or the powdered resin can be supplied at once by the supply mechanism of the resin material.

Further, in the present invention, a frame frame having through holes may be arranged on a pre-cut release film, and the various resin materials described above may be supplied in a planarized state in a recess (through hole) of the frame frame. In this state, first, the through-holes of the frame mold are matched with the positions of the cavity openings of the lower mold surface, and then the air is forcibly sucked and discharged from the inside of the cavities, So that the resin material can be supplied in a planarized state in a lower mold cavity.

In the present invention, first, the resin material (the various resin materials described above) is fed into the lower mold cavity for compression molding in a planarized state (with an equivalent required thickness), and then, at the time of compression molding, The thickness of the package to be compression molded is set to be thinner than the uniform thickness of the resin material so as to pressurize the planarized resin material in the lower cavity. Therefore, the molten resin material in the lower mold cavity flows out through the narrow path (narrow gap) to the outside of the lower mold cavity, and the resin in the lower mold cavity can be pressed at a low pressure. On the other hand, this is presumed to be because the grooves are gently closed by the resin material, and the required resin pressure can be applied to the lower cavity at a low pressure.

20: Press frame 30: Mold for compression molding
31: upper die 31a: upper die
31b: upper mold hold block 31c: substrate set block
31d: heater for heating the upper mold 31e:
31f: seal member 32: lower mold
32a: Lower mold base 32b: Lower mold holding block
32c: cavity bottom member 32d: cavity side member
32e: elastic member 32f: heater for heating the lower mold
32g: seal member 33: resin molding part
33a: Lower mold cavity 33b: Surplus resin accommodating portion
33c: narrow gap 33d: package thickness
34: Resin leakage preventing member 34a: Lower mold cavity
34b: surplus resin receiving portion 34c: narrow clearance
34d: package thickness 35: operation signal
36: resin molding part 36a: lower mold cavity
36b: Surplus resin accommodating portion 36c: Narrow clearance
36d: package thickness 40: uniform pressing means
41: phase-type equalizing pressurizing means 41a:
41b: Elastic receiver 41c:
42: Lower mold uniform pressing means 42a: Lower mold horizontal space section
42b: Elastic receiver 42c:
43: pressing force adjusting mechanism 44: pressure medium
50: mold opening / closing mechanism (toggle mechanism) 51: base
51a: axis 52: movable platen
52a: Axis 53: Servo motor
53a: Output shaft 53b: Pulley
53c: Belt 54: Screw shaft
55: nut member 56a: first link
56b: second link 56c: third link
60: release film 70: large substrate
71: electronic part 80: sheet-like resin (sheet-like resin material)
80a: molten resin material 80b: excess resin

Claims (15)

A method of manufacturing an electronic part, comprising the steps of: using a mold for compression molding comprising at least an upper mold and a lower mold, supplying a substrate on which an electronic component is mounted to a mold surface of the upper mold with its electronic component mounting surface facing downward, A melting step of heating and melting the resin material supplied in the lower cavity covered with the film;
Closing the upper and lower molds to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower cavity;
Next, a sealing process for collectively molding the electronic components on the substrate by resin by applying a predetermined resin pressure to the molten resin material in the lower cavity
The method comprising the steps of:
In the mold closing process,
A step of externally discharging surplus resin in the lower cavity to allow the surplus resin to flow out of the lower cavity;
A resin sealing step of subjecting the molten resin material in the lower cavity to a predetermined resin pressure so as to collectively mold the electronic parts on the substrate by resin sealing molding after passing through the surplus resin step
Lt; / RTI >
The surplus resin is guided in the surplus resin accommodating portion provided around the lower cavity through a narrow gap provided between the upper and lower molds,
In the resin sealing step, an interval between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is the same as the interval of the package thickness for resin- Wherein the sealing member is made of a resin material. Wherein the electronic component mounting surface of the electronic component mounting face is downwardly directed to supply the electronic component mounting face to at least one of the upper mold face and the lower mold cavity using a mold for compression molding comprising at least upper and lower molds, A melting step of heating and melting the resin material supplied in the melting step,
A mold closing step of closing the upper and lower molds so as to dope the electronic component of the substrate on the upper mold side into the molten resin material in the lower mold cavity;
Next, a sealing process for collectively molding the electronic components on the substrate by resin is performed by applying a predetermined resin pressure to the molten resin material in the lower cavity
The method comprising the steps of:
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,
In the mold closing process,
A step of externally discharging surplus resin in the lower cavity to allow the surplus resin to flow out of the lower cavity;
A resin sealing step of subjecting the molten resin material in the lower cavity to a predetermined resin pressure so as to collectively mold the electronic parts on the substrate by resin sealing molding after passing through the surplus resin step
/ RTI >
The surplus resin is guided in the surplus resin accommodating portion provided around the lower cavity through a narrow gap provided between the upper and lower molds,
The gap between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower positions is made equal to the package thickness for resin sealing the electronic component of the substrate Wherein the sealing member is formed of a resin. The method for sealing a compression resin of an electronic part according to claim 1 or 2, wherein in the resin sealing step, compression molding with a low pressure is performed so that a molding pressure is 0.2942 MPa or more. The method according to claim 1 or 2, wherein the resin material to be supplied into the lower mold cavity has a desired shape (flatness) by flattening a required amount of resin and corresponds to the shape of the lower cavity Wherein the sheet-shaped resin material is a sheet-like resin material molded in a shape capable of being fitted into the lower cavity to supply the compressed resin. The compression resin sealing method of an electronic part according to claim 1 or 2, wherein the resin material to be supplied into the lower cavity is a resin material which is supplied by planarizing a required amount of resin. The method according to claim 5, wherein the resin material is a resin material selected from a granular resin material, a powder resin material, a liquid resin material, and a paste resin material . The method for manufacturing a resin sheet according to claim 1, wherein a sheet-shaped resin material having desired formability is formed on the release film by planarizing a required amount of resin before coating the lower cavity with the release film, Wherein the material and the release film are fed into the lower cavity to cover the lower cavity with the release film and to supply the sheet-like resin material to the lower cavity. The resin material according to claim 1, wherein the resin material is a sheet-like resin material having a required amount of resin to be planarized to provide a desired shape,
Wherein the releasing film is provided on the mold surface of the lower mold including the lower mold in an expanded state and the sheet-like resin material is supplied to the lower mold cavity via the release film. A method of manufacturing an electronic part, comprising the steps of: using a mold for compression molding comprising at least an upper mold and a lower mold, supplying a substrate on which an electronic component is mounted to a mold surface of the upper mold with its electronic component mounting surface facing downward, Heating and melting the resin material supplied in the lower cavity covered with the film and then closing the upper and lower molds to dope the electronic component of the substrate on the upper mold side into the molten resin material in the lower cavity And then applying a predetermined resin pressure to the molten resin material in the lower mold cavity to seally mold the electronic parts mounted on the substrate together with the resin,
Wherein a narrow gap is provided between the upper and lower molds to allow the surplus resin, which becomes a part of the molten resin material in the lower cavity, to flow out of the lower cavity when closing the upper and lower molds,
A surplus resin receiving portion communicating with the lower cavity around the lower cavity is disposed,
The interval between the bottom surface of the lower cavity and the electronic component mounting surface of the substrate at the mold closing final position of the upper and lower molds is set to be equal to the interval of the package thickness for resin sealing the electronic component of the substrate Wherein the sealing member is a sealing member. Wherein the electronic component mounting surface of the electronic component mounting face is downwardly directed to supply the electronic component mounting face to at least one of the upper mold face and the lower mold cavity using a mold for compression molding comprising at least upper and lower molds, And then the upper and lower molds are closed to close the upper and lower molds to immerse the electronic component of the substrate on the upper mold side in the molten resin material in the lower mold cavity, A compression resin sealing apparatus for an electronic part for sealingly molding an electronic part mounted on a substrate by applying resin pressure to the molten resin material in a cavity,
The depth of the lower mold cavity is set to be equal to the package thickness for resin-sealing the electronic component of the substrate,
A narrow gap is provided between the upper and lower molds to allow an excess resin, which is a part of the molten resin material in the lower cavity, to flow out of the lower cavity when the upper and lower molds are closed,
A surplus resin receiving portion communicating with the lower gap around the lower cavity is disposed,
Wherein a gap between the bottom surface of the lower cavity at the mold closing end position of the upper and lower molds and the electronic component mounting surface of the substrate is set to be the same as the package thickness for resin sealing the electronic component of the substrate Wherein the sealing member is a resin sealing member. The electronic component mounting structure according to claim 9 or 10, wherein a narrow gap for allowing the surplus resin to flow out of the lower cavity is formed between the mold surface of the lower mold and the electronic component mounting surface of the substrate, A resin passage communicating the resin accommodating portion,
Wherein the resin passage has an inclined surface that becomes shallow toward the surplus resin receiving portion from the lower cavity. The electronic component mounting apparatus according to claim 9 or 10, wherein a narrow gap for allowing the surplus resin to flow out of the lower cavity is provided between the lower cavity and the electronic component mounting surface of the substrate,
The surplus resin accommodating portion
The narrow gap,
The space between the narrow gap and the resin leakage preventing member disposed around the lower cavity
And a sealing member for sealing the electronic component. 13. The electronic component according to claim 12, characterized in that the resin leakage preventing member also serves as a positioning member for regulating the distance between the upper and lower mold faces when the upper and lower molds are closed. Device. 10. The apparatus according to claim 9, wherein the lower mold has a configuration divided into a cavity bottom surface member and a cavity side surface member,
Wherein the cavity bottom face member and the cavity side face member are fitted to each other so as to be relatively movable up and down. The compression resin-sealing apparatus for electronic parts according to claim 10, wherein the lower mold has a configuration in which a cavity bottom face portion and a cavity side face portion are integrally formed.
KR1020140008955A 2013-04-12 2014-01-24 Method and apparatus for compressive resin sealing electronic component KR101610456B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013083493A JP5934138B2 (en) 2013-04-12 2013-04-12 Compressed resin sealing method and compressed resin sealing device for electronic parts
JPJP-P-2013-083493 2013-04-12

Publications (2)

Publication Number Publication Date
KR20140123407A true KR20140123407A (en) 2014-10-22
KR101610456B1 KR101610456B1 (en) 2016-04-07

Family

ID=51671563

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140008955A KR101610456B1 (en) 2013-04-12 2014-01-24 Method and apparatus for compressive resin sealing electronic component

Country Status (4)

Country Link
JP (1) JP5934138B2 (en)
KR (1) KR101610456B1 (en)
CN (1) CN104103530B (en)
TW (1) TWI592279B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114801003A (en) * 2022-04-25 2022-07-29 浙江瑞然生态科技有限公司 Full-biodegradable environment-friendly tableware mould pressing device and preparation method thereof

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6491508B2 (en) 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 Resin sealing device and method of manufacturing resin molded product
JP6654861B2 (en) * 2015-11-09 2020-02-26 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
NL2016011B1 (en) 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
JP6580519B2 (en) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 Compression molding apparatus, resin-encapsulated product manufacturing apparatus, compression molding method, and resin-encapsulated product manufacturing method
JP6861506B2 (en) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 Compression molding equipment, compression molding method, and manufacturing method of compression molded products
JP6861507B2 (en) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 Compression molding equipment, compression molding method, and manufacturing method of compression molded products
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
KR102446861B1 (en) 2017-09-21 2022-09-23 삼성전자주식회사 Stacked package and method of manufacturing the same
JP7149238B2 (en) * 2019-08-09 2022-10-06 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
CN112976666B (en) * 2019-12-12 2022-07-26 东莞市天贺电子科技有限公司 Dynamic balance buffer mechanism applied to compression forming die
CN111391219B (en) * 2020-03-20 2021-12-24 东莞市艾尔玛塑件科技有限公司 In-mold transfer printing system
JP7475215B2 (en) * 2020-06-29 2024-04-26 Nok株式会社 Manufacturing method of gasket

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1189271A3 (en) * 1996-07-12 2003-07-16 Fujitsu Limited Wiring boards and mounting of semiconductor devices thereon
JP4326786B2 (en) * 2002-11-26 2009-09-09 Ｔｏｗａ株式会社 Resin sealing device
JP4336502B2 (en) * 2003-01-30 2009-09-30 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
US7189601B2 (en) * 2004-03-02 2007-03-13 Texas Instruments Incorporated System and method for forming mold caps over integrated circuit devices
JP2005324341A (en) * 2004-05-12 2005-11-24 Apic Yamada Corp Resin molding method and resin molding machine
JP2006245151A (en) * 2005-03-02 2006-09-14 Matsushita Electric Ind Co Ltd Sealing molding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114801003A (en) * 2022-04-25 2022-07-29 浙江瑞然生态科技有限公司 Full-biodegradable environment-friendly tableware mould pressing device and preparation method thereof
CN114801003B (en) * 2022-04-25 2024-04-05 浙江瑞然生态科技有限公司 Full-biodegradation type environment-friendly tableware mould pressing device and preparation method thereof

Also Published As

Publication number Publication date
TWI592279B (en) 2017-07-21
JP5934138B2 (en) 2016-06-15
JP2014207302A (en) 2014-10-30
CN104103530B (en) 2017-06-20
KR101610456B1 (en) 2016-04-07
TW201507842A (en) 2015-03-01
CN104103530A (en) 2014-10-15

Similar Documents

Publication Publication Date Title
KR101610456B1 (en) Method and apparatus for compressive resin sealing electronic component
EP2474401A2 (en) Method of resin molding and resin molding apparatus
KR101610474B1 (en) Compression resin sealing method and compression resin sealing apparatus for electronic component
KR101832597B1 (en) Resin Sealing Apparatus and Resin Sealing Method
JP6057824B2 (en) Compressed resin sealing method and compressed resin sealing device for electronic parts
KR20160013202A (en) Resin molding device and resin molding method
JP4336499B2 (en) Resin sealing molding method and apparatus for electronic parts
JP6654861B2 (en) Resin sealing device and resin sealing method
KR102522168B1 (en) Resin molding device and manufacturing method of resin molding
KR102184809B1 (en) Resin molding apparatus and method for manufacturing resin-molded component
JP6861609B2 (en) Resin molding equipment and manufacturing method of resin molded products
JP2013010216A (en) Molding die and resin molding device with the same
JP5419070B2 (en) Resin sealing device
WO2018139631A1 (en) Resin sealing device and resin sealing method
JP6057822B2 (en) Compressed resin sealing method and compressed resin sealing device for electronic parts
KR102527948B1 (en) Resin molding device and manufacturing method of resin molding
JP2014039065A (en) Resin sealing apparatus
WO2024203997A1 (en) Compression molding apparatus and compression molding method
JP2018183959A (en) Mold die and resin mold device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant