TW201507842A - Compression resin packaging method and compression resin packaging device for electronic components - Google Patents

Compression resin packaging method and compression resin packaging device for electronic components Download PDF

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Publication number
TW201507842A
TW201507842A TW103107135A TW103107135A TW201507842A TW 201507842 A TW201507842 A TW 201507842A TW 103107135 A TW103107135 A TW 103107135A TW 103107135 A TW103107135 A TW 103107135A TW 201507842 A TW201507842 A TW 201507842A
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Taiwan
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resin
lower mold
cavity
electronic component
substrate
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TW103107135A
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Chinese (zh)
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TWI592279B (en
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Shinji Takase
Yoshihisa Kawamoto
Mamoru Sunada
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

Abstract

The present invention relates to a compression resin packaging method and a compression resin packaging device for electronic components. The present invention simplifies the compression resin packaging device which integrally packages the electronic components on a large-scale substrate and resin in a package, and raises precision (deviation) of thickness of the package. Sheet-like resin having a shape-preserving property carried on a release liner is supplied into a lower mold cavity, mold assembling is performed for upper and lower molds, residual resin in the lower mold cavity is leaded into a residual resin containing part at the outside world through a gap between the upper mold and the lower mold, so that in a resin packaging step, a gap between a bottom surface of the lower mold cavity at a final position of the mold assembling of the upper and lower molds and an electronic component installing surface in the large-scale substrate is set to be equal to the gap of the package thickness for performing resin packaging for the electronic components of the large-scale substrate, by further compressing the fused resin material in the lower mold cavity under the conditions of low speed and low pressure, the electronic components on the large-scale substrate are packaged integrally with the resin.

Description

電子零件之壓縮樹脂密封方法及壓縮樹脂密封裝置 Compressed resin sealing method for electronic parts and compression resin sealing device

本發明係關於一種所謂採用壓縮成形方法並利用樹脂將大型基板上安裝的多個電子零件(半導體晶片)密封成形(樹脂成形)在一起的樹脂密封方法及樹脂密封裝置的改良。 The present invention relates to a resin sealing method and a resin sealing device for sealingly molding (resin molding) a plurality of electronic components (semiconductor wafers) mounted on a large substrate by a compression molding method.

作為將大型基板上的電子零件樹脂密封在一起的方法，已知有壓縮成形方法。如圖8中示意地圖示，用於進行該壓縮成形方法的裝置至少具備由上模1和下模2構成的壓縮成形模具，並配設成使上下兩模1、2經由適當的開合模機構(未圖示)相對地接合及背離。而且，為了使用這種樹脂密封裝置將大型基板3上的電子零件4樹脂密封在一起，以如下的方式進行。首先，如圖8的(1)所示，在大型基板3的安裝電子零件4的表面朝下的狀態下，向上模1供給並設置大型基板3，並且向下模2的模腔5內供給樹脂材料6並進行加熱。其次，如圖8的(2)所示，藉由經由開合模機構(省略圖示)將上下兩模1、2合模，從而將設置在上模1的大型基板3上的電子零件4浸漬在下模模腔5內的熔融樹脂材料6a中。在該合模時，下模2的上表面就會按壓大型基板3的周邊部。而且，在該狀態下，藉由使下模2的模腔底面構件5a向上移動以在既定的樹脂壓力下按壓(壓縮成形)下模模腔5內的熔融樹脂材料6a，從而能夠將電子零件4一起樹脂密封在對應於下模模腔5的形狀而成形的密封件內。 As a method of sealing together electronic components on a large substrate, a compression molding method is known. As schematically illustrated in Fig. 8, the apparatus for performing the compression molding method includes at least a compression molding die composed of an upper die 1 and a lower die 2, and is disposed such that the upper and lower molds 1, 2 are appropriately opened and closed. The mold mechanism (not shown) is relatively engaged and deviated. Further, in order to resin-separate the electronic component 4 on the large substrate 3 together using such a resin sealing device, it is carried out in the following manner. First, as shown in (1) of FIG. 8, in a state where the surface of the large-sized substrate 3 on which the electronic component 4 is mounted faces downward, the large-sized substrate 3 is supplied and disposed in the upper mold 1, and is supplied into the cavity 5 of the lower mold 2. The resin material 6 is heated and heated. Next, as shown in (2) of FIG. 8, the upper and lower molds 1 and 2 are clamped by means of an opening and closing mechanism (not shown) to electrically attach the electronic component 4 provided on the large substrate 3 of the upper mold 1. It is immersed in the molten resin material 6a in the lower mold cavity 5. At the time of the mold clamping, the upper surface of the lower mold 2 presses the peripheral portion of the large substrate 3. Further, in this state, by moving the cavity bottom surface member 5a of the lower mold 2 upward to press (compress-form) the molten resin material 6a in the lower mold cavity 5 under a predetermined resin pressure, the electronic component can be replaced. 4 The resin is sealed together in a seal formed corresponding to the shape of the lower mold cavity 5.

此外，在現狀中，使用直徑300mm的圓形基板或約95mm× 260mm左右的長方形狀基板等作為大型基板3，但希望能夠使用與上述基板相比為更大型的基板例如邊長500mm以上的方形的大型基板3，並利用樹脂將其電子零件4一併密封成形。另外，作為向下模模腔5內供給的樹脂材料6，公開有直接供給顆粒狀樹脂等。 In addition, in the current situation, a circular substrate having a diameter of 300 mm or about 95 mm × A rectangular substrate of about 260 mm or the like is used as the large substrate 3, but it is desirable to use a larger substrate such as a square substrate having a side length of 500 mm or more than the above substrate, and to seal the electronic component 4 together by resin. . Further, as the resin material 6 supplied into the downward cavity 5, a granular resin or the like is directly supplied.

但是，由於大型基板3中的樹脂密封範圍為大面積，因此具 有向下模模腔5內的樹脂供給量的設置操作等比較麻煩且需要費心的問題。例如，對於局部電子零件脫落的狀態的大型基板3，需要感知及檢測其脫落狀態，並且供給與此相應地增加分量的顆粒樹脂等，為此，必須設置感知及檢測機構和樹脂量調節機構等附加設備類。另外，對使用預先成形為既定形狀的片狀樹脂(片狀的樹脂材料)的情況來說，難以進行用於應對電子零件4的脫落而增加樹脂材料6的樹脂量調節操作。 However, since the resin sealing range in the large substrate 3 is a large area, The setting operation of the resin supply amount in the downward mold cavity 5 is troublesome and requires troublesome problems. For example, in the large-sized substrate 3 in a state where the local electronic component is detached, it is necessary to sense and detect the detached state, and to supply a granular resin or the like which increases the amount corresponding thereto. For this reason, it is necessary to provide a sensing and detecting mechanism, a resin amount adjusting mechanism, and the like. Additional device class. In the case of using a sheet-like resin (sheet-shaped resin material) that has been previously formed into a predetermined shape, it is difficult to perform a resin amount adjustment operation for increasing the resin material 6 in response to falling off of the electronic component 4.

另外，大型基板3中的樹脂密封面積為大面積，並且與其對應地壓縮成形模具的下模模腔5也為大面積。因此，需要藉由事先向下模模腔5的整個區域均勻地供給並填充樹脂材料6，從而在大型基板3的樹脂密封範圍中的各部位進行均勻的樹脂密封成形作用。在不能事先向下模模腔5內的整個區域均勻地供給並填充樹脂材料6的情況下，需要使模腔底面構件5a向上移動來按壓下模模腔5內的熔融樹脂材料6a的同時使該熔融樹脂材料6a在該下模模腔5內的整個區域流動並充填。然而，此時具有如下的樹脂成形方面的問題：容易發生藉由模腔底面構件5a的按壓力在下模模腔5內流動的熔融樹脂6a使電子零件4的導線變形，或使導線斷線等的導線偏移等。 Further, the resin sealing area in the large substrate 3 is a large area, and the lower mold cavity 5 which compresses the molding die corresponding thereto is also a large area. Therefore, it is necessary to uniformly supply and fill the resin material 6 in the entire region of the lower mold cavity 5 in advance, thereby performing uniform resin sealing forming action at each portion in the resin sealing range of the large substrate 3. In the case where the resin material 6 cannot be uniformly supplied and filled in the entire area in the lower mold cavity 5, it is necessary to move the cavity bottom surface member 5a upward to press the molten resin material 6a in the lower mold cavity 5 while making it The molten resin material 6a flows and fills the entire area in the lower mold cavity 5. However, at this time, there is a problem in resin molding in which the molten resin 6a flowing in the lower mold cavity 5 by the pressing force of the cavity bottom surface member 5a is liable to deform the wire of the electronic component 4, or to break the wire, etc. Wire offset, etc.

而且具有如下的樹脂成形方面的問題：在熔融樹脂材料6a中捲入空氣而形成空隙；發生樹脂中的填充劑的不均勻的分散以使作為樹脂材料6的功能低下等。 Further, there is a problem in resin molding in which air is entrained in the molten resin material 6a to form voids, and uneven dispersion of the filler in the resin occurs to lower the function as the resin material 6.

進一步，起因於向下模模腔5內供給的樹脂量的過分的不足，具有如下的樹脂成形方面的重大的問題：在對應於下模模腔5的形狀而成形的密封件上發生未充填狀態；在下模模腔5內得不到既定的樹脂壓力；不能將密封件的厚度成形為既定的均勻厚度。 Further, the excessive shortage of the amount of the resin supplied in the downward molding cavity 5 has a major problem in resin molding in which an unfilling occurs on the sealing member formed corresponding to the shape of the lower molding cavity 5. State; a predetermined resin pressure is not obtained in the lower mold cavity 5; the thickness of the seal cannot be formed into a predetermined uniform thickness.

專利文獻1：日本特開2006-120880號公報(參照第5頁的段落[0013]、圖1(1)等) Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-120880 (refer to paragraph [0013] on page 5, FIG. 1 (1), etc.)

本發明的目的在於提供一種電子零件之壓縮樹脂密封方法和用於實施該方法的壓縮樹脂密封裝置，該方法及裝置在使用壓縮成形方法並利用樹脂將安裝在大型基板上的多個電子零件一併密封成形的情況下，能夠省略向模腔內供給的樹脂量的計量和調節操作，另外，能夠有效地防止起因於模腔內的熔融樹脂材料的流動作用的導線偏移等的發生，另外，能夠在模腔內得到既定的樹脂壓力，進一步能夠將密封件的厚度成形為既定的厚度。 An object of the present invention is to provide a compression resin sealing method for an electronic component and a compression resin sealing device for carrying out the method, the method and the device using a compression molding method and using a resin to mount a plurality of electronic components mounted on a large substrate In the case of the sealing and molding, it is possible to omit the measurement and adjustment operation of the amount of the resin supplied into the cavity, and it is possible to effectively prevent the occurrence of a wire offset or the like which is caused by the flow of the molten resin material in the cavity, and The predetermined resin pressure can be obtained in the cavity, and the thickness of the seal can be further formed into a predetermined thickness.

為了達到上述的目的，本發明之電子零件之壓縮樹脂密封方法包括：熔化步驟，使用至少由上模和下模構成的壓縮成形用模具，將安裝有 電子零件之基板使所述基板的電子零件安裝面側朝下地向所述上模的型面供給並使所述基板固定，並且加熱供給到設置於所述下模的型面且被離型膜覆蓋的下模模腔內的樹脂材料以使所述樹脂材料熔化；其次，合模步驟，進行閉合所述上模和下模的合模以使所述上模側中的所述基板的所述電子零件浸漬在所述下模模腔內的熔融樹脂材料中；及其次，密封步驟，藉由對所述下模模腔內的熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將所述基板上的所述電子零件一併密封成形；其特徵在於：所述合模步驟包括：使所述下模模腔內的所述剩餘樹脂向所述下模模腔的外部流出的剩餘樹脂的外部流出步驟；及在經過所述剩餘樹脂的外部流出步驟之後，對所述下模模腔內的熔融樹脂材料施加既定的樹脂壓力以將所述基板上的電子零件一併樹脂密封成形的樹脂密封步驟；在所述剩餘樹脂的外部流出步驟中，通過設置在所述上模和下模之間的狹窄間隙，將所述剩餘樹脂引導到設置在所述下模模腔周圍的剩餘樹脂收容部內；在所述樹脂密封步驟中，將所述上模和下模的合模最終位置的所述下模模腔的底面與所述基板的電子零件安裝面之間的間隔設定為與用於對所述基板的電子零件進行樹脂密封的密封件厚度的間隔相等。 In order to achieve the above object, a compression resin sealing method for an electronic component of the present invention includes: a melting step in which a compression molding die composed of at least an upper mold and a lower mold is used, The substrate of the electronic component is supplied to the profile of the upper mold with the electronic component mounting surface side of the substrate facing downward and the substrate is fixed, and is heated and supplied to the profile provided on the lower mold and is released from the film. Covering the resin material in the lower mold cavity to melt the resin material; secondly, the mold clamping step, closing the mold of the upper mold and the lower mold to make the substrate in the upper mold side The electronic component is immersed in the molten resin material in the lower mold cavity; and secondly, a sealing step is performed by applying a predetermined resin pressure to the molten resin material in the lower mold cavity, thereby using the resin The electronic component on the substrate is integrally formed by sealing; characterized in that: the clamping step comprises: residing resin remaining in the lower mold cavity to the outside of the lower cavity An external outflow step; and a tree that applies a predetermined resin pressure to the molten resin material in the lower mold cavity after the external outflow step of the remaining resin to collectively seal the electronic components on the substrate a sealing step; in the external outflow step of the remaining resin, guiding the remaining resin to the remaining resin contained around the lower mold cavity by a narrow gap provided between the upper mold and the lower mold In the resin sealing step, an interval between a bottom surface of the lower mold cavity at a final position of the mold clamping of the upper and lower molds and an electronic component mounting surface of the substrate is set to be used for The thicknesses of the seals for resin sealing the electronic parts of the substrate are equal.

為了達到上述的目的，本發明之電子零件之壓縮樹脂密封方法包括： 熔化步驟，使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使所述基板的電子零件安裝面側朝下地向所述上模的型面供給並使所述基板固定，並且加熱供給到設置於所述下模的型面且被離型膜覆蓋的下模模腔內的樹脂材料以使所述樹脂材料熔化；其次，合模步驟，進行閉合所述上模和下模的合模以使所述上模側中的所述基板的所述電子零件浸漬在所述下模模腔內的熔融樹脂材料中；及其次，密封步驟，藉由對所述下模模腔內的熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將所述基板上的所述電子零件一併密封成形；其特徵在於：所述合模步驟包括：使所述下模模腔內的所述剩餘樹脂向所述下模模腔的外部流出的剩餘樹脂的外部流出步驟；及在經過所述剩餘樹脂的外部流出步驟之後，對所述下模模腔內的熔融樹脂材料施加既定的樹脂壓力以將所述基板上的電子零件一併樹脂密封成形的樹脂密封步驟；在所述剩餘樹脂的外部流出步驟中，通過設置在所述上模和下模之間的狹窄間隙，將所述剩餘樹脂引導到設置在所述下模模腔周圍的剩餘樹脂收容部內；在所述樹脂密封步驟中，將所述上模和下模的合模最終位置的所述下模模腔的底面與所述基板的電子零件安裝面之間的間隔設定為與用於對所述基板的電子零件進行樹脂密封的密封件厚度的間隔相等。 In order to achieve the above object, a compression resin sealing method for an electronic component of the present invention includes: In the melting step, the substrate on which the electronic component is mounted is supplied to the mold surface of the upper mold with the electronic component mounting surface side of the substrate facing downward using a mold for compression molding including at least an upper mold and a lower mold; The substrate is fixed, and a resin material supplied into a lower mold cavity provided on the profile of the lower mold and covered by the release film is heated to melt the resin material; secondly, a mold clamping step is performed to close the upper surface Forming the mold and the lower mold such that the electronic component of the substrate in the upper mold side is immersed in the molten resin material in the lower mold cavity; and secondly, a sealing step by The molten resin material in the cavity of the lower mold applies a predetermined resin pressure, thereby sealingly forming the electronic components on the substrate together by using a resin; wherein the step of clamping comprises: forming the lower mold An external outflow step of the remaining resin flowing out of the lower mold cavity in the chamber; and a molten resin material in the lower mold cavity after the external outflow step of the remaining resin Shi a predetermined resin pressure to seal the electronic components on the substrate together by a resin sealing step; in the external outflow step of the remaining resin, by a narrow gap provided between the upper mold and the lower mold, Leading the remaining resin into a remaining resin housing portion disposed around the lower mold cavity; in the resin sealing step, the lower mold cavity of the final position of the upper mold and the lower mold The interval between the bottom surface and the electronic component mounting surface of the substrate is set to be equal to the interval of the thickness of the sealing member for resin sealing the electronic component of the substrate.

另外，本發明之電子零件之壓縮樹脂密封方法的特徵在於， 在所述樹脂密封步驟中，進行在成形壓力為0.2942MPa以上的低壓下的壓縮樹脂密封成形。 Further, the compression resin sealing method of the electronic component of the present invention is characterized in that In the resin sealing step, compression resin sealing molding at a low pressure of a molding pressure of 0.2942 MPa or more is performed.

另外，本發明之電子零件之壓縮樹脂密封方法的特徵在於， 向所述下模模腔內供給的所述樹脂材料是片狀樹脂材料，所述片狀樹脂材料藉由將所需量的樹脂平坦化而具備所需的保形性，並且被成形為與俯視觀察下的所述下模模腔的形狀對應且能夠以嵌合在所述下模模腔內的狀態進行供給的形狀。 Further, the compression resin sealing method of the electronic component of the present invention is characterized in that The resin material supplied into the lower mold cavity is a sheet-like resin material having a desired shape retention property by flattening a desired amount of resin, and is formed into a shape The shape of the lower mold cavity in a plan view corresponds to and can be supplied in a state of being fitted in the lower mold cavity.

另外，本發明之電子零件之壓縮樹脂密封方法的特徵在於， 向所述下模模腔內供給的所述樹脂材料為將所需量的樹脂平坦化而供給的樹脂材料。 Further, the compression resin sealing method of the electronic component of the present invention is characterized in that The resin material supplied into the lower mold cavity is a resin material supplied by flattening a required amount of resin.

另外，本發明之電子零件之壓縮樹脂密封方法的特徵在於， 所述樹脂材料為選自顆粒狀的樹脂材料、粉末狀的樹脂材料、液狀的樹脂材料和糊狀的樹脂材料中的樹脂材料。 Further, the compression resin sealing method of the electronic component of the present invention is characterized in that The resin material is a resin material selected from the group consisting of a particulate resin material, a powdery resin material, a liquid resin material, and a paste resin material.

另外，本發明之電子零件之壓縮樹脂密封方法的特徵在於， 在使用所述離型膜覆蓋所述下模模腔之前，將所需量的樹脂平坦化而具備所需的保形性的片狀樹脂材料載置在所述離型膜上，並且藉由將該狀態下的所述片狀樹脂材料和所述離型膜供給到所述下模模腔內，從而進行使用所述離型膜的所述下模模腔的覆蓋和向所述下模模腔內的所述片狀樹脂材料的供給。 Further, the compression resin sealing method of the electronic component of the present invention is characterized in that Before the use of the release film to cover the lower mold cavity, a sheet-like resin material having a desired amount of resin flattened to have a desired conformal property is placed on the release film, and by The sheet-like resin material and the release film in this state are supplied into the lower mold cavity, thereby performing coverage of the lower mold cavity using the release film and toward the lower mold Supply of the sheet-like resin material in the cavity.

另外，本發明之電子零件之壓縮樹脂密封方法的特徵在於， 所述樹脂材料為將所需量的樹脂平坦化而具備所需的保形性的片狀樹脂材料，在包括所述下模模腔的所述下模的型面上張設所述離型膜，經由所述 離型膜向所述下模模腔供給所述片狀樹脂材料。 Further, the compression resin sealing method of the electronic component of the present invention is characterized in that The resin material is a sheet-like resin material having a desired shape retaining property by flattening a required amount of resin, and the release sheet is stretched on a profile of the lower mold including the lower mold cavity Membrane, via the The release film supplies the sheet-like resin material to the lower mold cavity.

另外，為了達到上述的目的，本發明之電子零件之壓縮樹脂密封裝置，使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使所述基板的電子零件安裝面側朝下地向所述上模的型面供給並使所述基板固定，並且加熱供給到設置於所述下模的型面且被離型膜覆蓋的下模模腔內的樹脂材料以使所述樹脂材料熔化，其次，進行將所述上模和下模閉合的合模以使所述上模側中的所述基板的電子零件浸漬在所述下模模腔內的熔融樹脂材料中，其次，藉由對所述下模模腔內的熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將安裝在基板上的電子零件一併密封成形，所述電子零件之壓縮樹脂密封裝置的特徵在於，在所述上模和下模之間，設置有在閉合所述上模和下模的合模時用於使成為所述下模模腔內的熔融樹脂材料的一部分的剩餘樹脂向所述下模模腔的外部流出的狹窄間隙；在所述下模模腔部周圍配置有通過所述狹窄間隙連通的剩餘樹脂收容部；所述上模和下模的合模最終位置的所述下模模腔的底面與所述基板的電子零件安裝面之間的間隔被設定為與用於對所述基板的電子零件進行樹脂密封的密封件厚度的間隔相等。 Further, in order to achieve the above object, the compression resin sealing device for an electronic component according to the present invention uses a mold for compression molding including at least an upper mold and a lower mold, and mounts the substrate on which the electronic component is mounted to the electronic component mounting surface of the substrate. Supplying the surface of the upper mold to the lower surface and fixing the substrate, and heating the resin material supplied into the lower mold cavity provided on the molding surface of the lower mold and covered by the release film to make The resin material is melted, and secondly, the mold clamping for closing the upper mold and the lower mold is performed such that the electronic component of the substrate in the upper mold side is immersed in the molten resin material in the lower mold cavity, Next, by applying a predetermined resin pressure to the molten resin material in the lower mold cavity, the electronic components mounted on the substrate are collectively sealed by a resin, and the compression resin sealing device of the electronic component is characterized in that Between the upper mold and the lower mold, there is provided a residual resin for making a part of the molten resin material in the lower mold cavity when closing the mold of the upper mold and the lower mold a narrow gap in which the outside of the cavity is flowed out; a remaining resin receiving portion communicating through the narrow gap is disposed around the lower cavity portion; the final position of the clamping of the upper and lower molds The interval between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate is set to be equal to the interval of the thickness of the seal for resin sealing the electronic component of the substrate.

另外，為了達到上述的目的，本發明之電子零件之壓縮樹脂密封裝置， 使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使所述基板的電子零件安裝面側朝下地向所述上模的型面供給並使所述基板固定，並且加熱供給到設置於所述下模的型面的下模模腔內的樹脂材料以使所述樹脂材料熔化，其次，進行閉合所述上模和下模的合模以使所述上模側中的所述基板的所述電子零件浸漬在所述下模模腔內的所述熔融樹脂材料中，其次，藉由對所述下模模腔內的所述熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將安裝在所述基板上的電子零件一併密封成形；其特徵在於：所述下模模腔的深度被設定為與用於對所述基板的所述電子零件進行樹脂密封的密封件厚度相等；在所述上模和下模之間，設置有在閉合所述上模和下模的合模時用於使成為所述下模模腔內的熔融樹脂材料的一部分的剩餘樹脂向所述下模模腔的外部流出的狹窄間隙；在所述下模模腔周圍配置有通過所述狹窄間隙連通的剩餘樹脂收容部；所述上模和下模的合模最終位置的所述下模模腔的底面與所述基板的電子零件安裝面之間的間隔被設定為與用於對所述基板的所述電子零件進行樹脂密封的密封件厚度的間隔相等。 In addition, in order to achieve the above object, the compression resin sealing device for an electronic component of the present invention, Using a mold for compression molding including at least an upper mold and a lower mold, the substrate on which the electronic component is mounted is supplied to the surface of the upper mold with the electronic component mounting surface side of the substrate facing downward, and the substrate is fixed. And heating a resin material supplied into a lower mold cavity provided in a profile of the lower mold to melt the resin material, and secondly, closing a mold of the upper mold and the lower mold to make the upper mold The electronic component of the substrate in the side is immersed in the molten resin material in the lower cavity, and secondly, a predetermined resin is applied to the molten resin material in the lower cavity Pressure, thereby sealingly forming the electronic components mounted on the substrate together with a resin; characterized in that the depth of the lower mold cavity is set to be resin-sealed with the electronic component for the substrate The seals are of equal thickness; between the upper and lower dies, a portion for melting the resin material in the lower mold cavity is provided when closing the mold of the upper and lower dies Remaining resin to the next a narrow gap flowing out of the outside of the cavity; a remaining resin receiving portion communicating through the narrow gap is disposed around the lower die cavity; and the lower die cavity of the upper die and the lower die is closed at a final position The interval between the bottom surface and the electronic component mounting surface of the substrate is set to be equal to the interval of the thickness of the seal for resin sealing the electronic component of the substrate.

另外，本發明之電子零件之壓縮樹脂密封裝置的特徵在於，用於使所述剩餘樹脂向所述下模模腔的外部流出的狹窄間隙為設置在所述下模的型面與所述基板的電子零件之安裝面之間並使所述下模模腔和剩餘樹脂收容部連通的樹脂通道， Further, the compression resin sealing device for an electronic component according to the present invention is characterized in that a narrow gap for discharging the remaining resin to the outside of the lower mold cavity is a profile provided on the lower mold and the substrate a resin passage between the mounting faces of the electronic components and connecting the lower die cavity and the remaining resin receiving portion,

所述樹脂通道具備從所述下模模腔朝向剩餘樹脂收容部變淺的傾斜面。 The resin passage has an inclined surface that becomes shallower from the lower mold cavity toward the remaining resin receiving portion.

另外，本發明之電子零件之壓縮樹脂密封裝置的特徵在於，用於使所述剩餘樹脂向所述下模模腔的外部流出的狹窄間隙設置在所述下模模腔與所述基板的所述電子零件安裝面之間；所述剩餘樹脂的收容部包括：所述狹窄間隙；及位在所述狹窄間隙與配置在所述下模模腔周圍的樹脂防漏用構件之間的空間部。 Further, the compression resin sealing device for an electronic component of the present invention is characterized in that a narrow gap for discharging the remaining resin to the outside of the lower die cavity is provided in the lower die cavity and the substrate The electronic component mounting surface; the remaining resin housing portion includes: the narrow gap; and a space portion between the narrow gap and a resin leakage preventing member disposed around the lower mold cavity .

另外，本發明之電子零件之壓縮樹脂密封裝置的特徵在於：所述樹脂防漏用構件兼作用於在所述上模和下模合模時限制所述上模和下模的型面之間的距離的定位構件。 Further, the compression resin sealing device for an electronic component of the present invention is characterized in that the resin leakage preventing member serves to restrict the between the upper and lower mold profiles when the upper and lower molds are closed. The distance of the positioning member.

另外，本發明之電子零件之壓縮樹脂密封裝置的特徵在於：所述下模具備分割為模腔底面構件和模腔側面構件的結構；將所述模腔底面構件和模腔側面構件能夠相對上下移動地嵌合而構成。 Further, the compression resin sealing device for an electronic component according to the present invention is characterized in that the lower die has a structure divided into a cavity bottom member and a cavity side member; the cavity bottom member and the cavity side member can be relatively up and down It is configured to be moved and fitted.

另外，本發明之電子零件之壓縮樹脂密封裝置的特徵在於：所述下模具備將模腔底面部和模腔側面部形成為一體的結構。 Further, the compression resin sealing device for an electronic component according to the present invention is characterized in that the lower mold has a structure in which a bottom surface portion of the cavity and a side surface portion of the cavity are integrally formed.

根據本發明之電子零件之壓縮樹脂密封方法及壓縮樹脂密封裝置，藉由使用將所需量的樹脂平坦化而具備所需的保形性，並且與下模模腔的形狀對應而成形的片狀樹脂，從而實際上能夠向下模模腔內的整個區域均勻地供給並填充片狀樹脂材料。因此，由於能夠在均勻的條件下， 在下模模腔的各部位進行下模模腔內的片狀樹脂的加熱熔化作用和對熔融樹脂材料的按壓(加壓)作用，因此能夠將各電子零件之樹脂密封成形品均勻化。 According to the compression resin sealing method and the compression resin sealing device for an electronic component of the present invention, a sheet formed by flattening a desired amount of resin to have a desired shape retaining property and corresponding to the shape of a lower mold cavity The resin is so as to be able to uniformly supply and fill the sheet-like resin material uniformly over the entire area in the cavity. Therefore, due to the ability to be in uniform conditions, The heat-melting action of the sheet-like resin in the lower mold cavity and the pressing (pressurizing) action on the molten resin material are performed in each part of the lower mold cavity, so that the resin-sealed molded article of each electronic component can be made uniform.

另外，由於能夠使用以定量定型化的片狀樹脂，因此能夠省 略所謂的向下模模腔內供給的樹脂量的計量和調節的樹脂計量及調節操作。 In addition, since it is possible to use a sheet-like resin which is quantitatively shaped, it is possible to save The so-called metering of the amount of resin supplied in the downward molding cavity and the adjustment of the resin metering and conditioning operation.

另外，由於能夠在低壓下進行下模模腔內的片狀樹脂的加熱 熔化作用和對於熔融樹脂材料的按壓作用，因此能夠防止或抑制下模模腔內的熔融樹脂材料的流動作用。即，藉由在低速且低壓下進行對於下模模腔內的熔融樹脂材料的按壓作用，從而能夠有效地防止起因於熔融樹脂材料的流動作用的導線偏移等的發生。例如，至少能夠在成形壓力0.2942MPa以上(3kgf/cm2以上)的低壓下，按壓下模模腔內的熔融樹脂材料。此外，換算成[MPa]單位是用1kg/cm2=0.0980665Mpa對括弧內表示的工程大氣壓(單位：kgf/cm2)進行計算，並將數字四捨五入為4位元。 In addition, since the heating and melting action of the sheet-like resin in the lower mold cavity and the pressing action on the molten resin material can be performed at a low pressure, the flow action of the molten resin material in the lower mold cavity can be prevented or suppressed. In other words, by performing the pressing action on the molten resin material in the lower mold cavity at a low speed and a low pressure, it is possible to effectively prevent the occurrence of a wire offset or the like due to the flow action of the molten resin material. For example, at least a molten resin material in the lower cavity can be pressed at a low pressure of a molding pressure of 0.2942 MPa or more (3 kgf/cm 2 or more). Further, the unit converted to [MPa] is calculated by using 1 kg/cm 2 = 0.0980665 Mpa for the engineering atmospheric pressure (unit: kgf/cm 2 ) expressed in parentheses, and the number is rounded to 4 bits.

另外，藉由使用以定量定型化的片狀樹脂，從而根據在下模 模腔內的整個區域的樹脂材料的供給作用、該片狀樹脂的加熱熔化作用和在低速且低壓下對熔融樹脂材料引起的按壓作用的相輔相成的作用，能夠進一步有效地防止起因於下模模腔內的熔融樹脂材料的流動作用的導線偏移等的發生。 In addition, by using a sheet-shaped resin that is quantitatively shaped, according to the lower mold The supply action of the resin material in the entire region in the cavity, the heating and melting action of the sheet-like resin, and the complementary action of the pressing action on the molten resin material at a low speed and a low pressure can further effectively prevent the lower mold from being caused. The occurrence of a wire offset or the like of the flow of the molten resin material in the cavity occurs.

另外，藉由進行包括使下模模腔內的剩餘樹脂向下模模腔的 外部流出的剩餘樹脂的外部流出步驟、和在進行該剩餘樹脂的外部流出步驟之後對下模模腔內的熔融樹脂材料施加既定的樹脂壓力以將基板上的電 子零件一併樹脂密封成形的樹脂密封步驟的上下兩模的合模步驟，從而能夠使所需量的熔融樹脂材料進一步有效地且切實地填充到下模模腔內。 In addition, by performing the process of including the remaining resin in the cavity of the lower mold cavity downwardly An external outflow step of the remaining resin flowing out externally, and applying a predetermined resin pressure to the molten resin material in the lower mold cavity after performing the external outflow step of the remaining resin to charge the substrate The sub-parts are further subjected to a mold clamping step of the upper and lower molds in the resin sealing step of the resin sealing molding, so that the required amount of the molten resin material can be further efficiently and reliably filled into the lower mold cavity.

另外，能夠在低速且低壓下進行對於下模模腔內的熔融樹脂 材料的按壓作用。因此，關於壓縮樹脂密封裝置而言，不需要作為整體力量的大的合模力，能夠應對基板的大型化，從而能夠簡單化或簡略化壓縮樹脂密封裝置的結構。因此，在該簡單化或簡略化的裝置中，使用以定量定型化(具備所需的保形性)的片狀樹脂，在低速且低壓下進行對於下模模腔內的熔融樹脂材料的按壓作用，從而將安裝在基板上的多個電子零件一併密封成形。 In addition, it is possible to carry out the molten resin in the cavity of the lower mold at a low speed and a low pressure. The pressing action of the material. Therefore, the compression resin sealing device does not require a large mold clamping force as a whole force, and can cope with an increase in the size of the substrate, so that the structure of the compression resin sealing device can be simplified or simplified. Therefore, in the simplification or simplification of the apparatus, the sheet-like resin which is quantitatively shaped (having the required shape retention property) is used, and the pressing of the molten resin material in the lower mold cavity is performed at a low speed and a low pressure. Acting to seal a plurality of electronic components mounted on the substrate together.

進一步，在合模步驟中的樹脂密封步驟中，藉由將上下兩模 的合模最終位置的下模模腔的底面與基板的電子零件安裝面之間的間隔設定為與用於對基板的電子零件進行樹脂密封的密封件厚度的間隔相等，從而能夠在模腔內得到既定的樹脂壓力，並且能夠將密封件的厚度成形為既定的厚度。因此，使用前述的簡單化或簡略化的壓縮樹脂密封裝置，能夠提高在下模模腔內成形的密封件的厚度的精度(偏差)。 Further, in the resin sealing step in the mold clamping step, by placing the upper and lower molds The interval between the bottom surface of the lower mold cavity at the final position of the mold clamping and the electronic component mounting surface of the substrate is set to be equal to the interval of the thickness of the seal for resin sealing the electronic components of the substrate, thereby being able to be in the cavity A predetermined resin pressure is obtained, and the thickness of the seal can be formed to a predetermined thickness. Therefore, the accuracy (deviation) of the thickness of the seal formed in the cavity of the lower mold can be improved by using the above-described simplified or simplified compression resin sealing device.

20‧‧‧壓制框架 20‧‧‧ suppression framework

30‧‧‧壓縮成形用模具 30‧‧‧Compression molding die

31‧‧‧上模 31‧‧‧上模

31a‧‧‧上模座 31a‧‧‧上模座

31b‧‧‧上模保持塊 31b‧‧‧Upper mold holding block

31c‧‧‧基板設置塊 31c‧‧‧Substrate setting block

31d‧‧‧上模加熱用加熱器 31d‧‧‧Upper heater heating heater

31e‧‧‧密封構件 31e‧‧‧ Sealing members

31f‧‧‧密封構件 31f‧‧‧ Sealing members

32‧‧‧下模 32‧‧‧Down

32a‧‧‧下模座 32a‧‧‧ lower mold base

32b‧‧‧下模保持塊 32b‧‧‧Down mold holding block

32c‧‧‧模腔底面構件 32c‧‧‧ cavity cavity bottom member

32d‧‧‧模腔側面構件 32d‧‧‧cavity side members

32e‧‧‧彈性構件 32e‧‧‧Flexible components

32f‧‧‧下模加熱用加熱器 32f‧‧‧heater for lower mold heating

32g‧‧‧密封構件 32g‧‧‧ Sealing member

33‧‧‧樹脂成形部 33‧‧‧Resin Forming Department

33a‧‧‧下模模腔 33a‧‧‧Down mold cavity

33b‧‧‧剩餘樹脂收容部 33b‧‧‧Remaining resin accommodating department

33c‧‧‧狹窄間隙 33c‧‧‧ narrow gap

33d‧‧‧密封件厚度 33d‧‧‧Seal thickness

34‧‧‧樹脂防漏用構件 34‧‧‧Resin leakage prevention components

34a‧‧‧下模模腔 34a‧‧‧Down mold cavity

34b‧‧‧剩餘樹脂收容部 34b‧‧‧Remaining resin accommodating department

34c‧‧‧狹窄間隙 34c‧‧‧ narrow gap

34d‧‧‧密封件厚度 34d‧‧‧Seal thickness

35‧‧‧動作訊號 35‧‧‧Action signal

36‧‧‧樹脂成形部 36‧‧‧Resin Forming Department

36a‧‧‧下模模腔 36a‧‧‧Down mold cavity

36b‧‧‧剩餘樹脂收容部 36b‧‧‧Remaining resin accommodating department

36c‧‧‧狹窄間隙 36c‧‧‧ narrow gap

36d‧‧‧密封件厚度 36d‧‧‧Seal thickness

40‧‧‧均勻加壓機構 40‧‧‧Uniform pressurizing mechanism

41‧‧‧上模均勻加壓機構 41‧‧‧Upper mold uniform pressurizing mechanism

41a‧‧‧上模水準空間部 41a‧‧‧Upper Level Space Division

41b‧‧‧彈性收容體 41b‧‧‧Flexible container

41c‧‧‧連通路徑 41c‧‧‧Connected path

42‧‧‧下模均勻加壓機構 42‧‧‧ Lower die uniform pressurizing mechanism

42a‧‧‧下模水準空間部 42a‧‧‧The Lower Level Space Division

42b‧‧‧彈性收容體 42b‧‧‧Flexible container

42c‧‧‧連通路徑 42c‧‧‧Connected path

43‧‧‧加壓力調節機構 43‧‧‧Adding pressure adjustment mechanism

44‧‧‧壓力介質 44‧‧‧Pressure medium

50‧‧‧開合模機構(肘節機構) 50‧‧‧Opening and clamping mechanism (toggle mechanism)

51‧‧‧底座 51‧‧‧Base

51a‧‧‧軸 51a‧‧‧Axis

52‧‧‧可動台板 52‧‧‧ movable platen

52a‧‧‧軸 52a‧‧‧Axis

53‧‧‧伺服馬達 53‧‧‧Servo motor

53a‧‧‧輸出軸 53a‧‧‧ Output shaft

53b‧‧‧帶輪 53b‧‧‧ Pulley

53c‧‧‧帶 53c‧‧‧带

54‧‧‧螺旋軸 54‧‧‧Spiral axis

55‧‧‧螺帽構件 55‧‧‧ Nut components

56a‧‧‧第一連桿 56a‧‧‧first link

56b‧‧‧第二連桿 56b‧‧‧second link

56c‧‧‧第三連桿 56c‧‧‧third link

60‧‧‧離型膜 60‧‧‧ release film

70‧‧‧大型基板 70‧‧‧ Large substrate

71‧‧‧電子零件 71‧‧‧Electronic parts

80‧‧‧片狀樹脂(片狀樹脂材料) 80‧‧‧Flake resin (sheet resin material)

80a‧‧‧熔融樹脂材料 80a‧‧‧ molten resin material

80b‧‧‧剩餘樹脂 80b‧‧‧ Remaining resin

圖1是表示本發明的第一實施方式之壓縮樹脂密封裝置的整體結構的局部剖面前視圖，示意地表示上下兩模的開模狀態。 1 is a partial cross-sectional front view showing the entire configuration of a compression resin sealing device according to a first embodiment of the present invention, and schematically shows a mold opening state of the upper and lower molds.

圖2是對應圖1的壓縮樹脂密封裝置的局部剖面前視圖，示意地表示上下兩模的合模狀態。 Fig. 2 is a partial cross-sectional front elevational view of the compression resin sealing device of Fig. 1, schematically showing the mold clamping state of the upper and lower molds.

圖3表示對應圖1的壓縮樹脂密封裝置的主要部分，圖3的(1)是其 下模中的均勻加壓機構的局部剖面放大前視圖，圖3的(2)是進一步放大表示其均勻加壓機構的局部剖面放大前視圖。 Figure 3 shows the main part of the compression resin sealing device corresponding to Figure 1, (1) of Figure 3 A partial cross-sectional enlarged front view of the uniform pressurizing mechanism in the lower mold, and (2) of Fig. 3 is a partially enlarged enlarged front view showing the uniform pressurizing mechanism.

圖4表示對應圖1的壓縮樹脂密封裝置的主要部分，圖4的(1)是其上下兩模開模時的樹脂成形部的放大縱剖面圖，圖4的(2)是其上下兩模合模時的樹脂成形部的放大縱剖面圖。 Fig. 4 shows a main portion of the compression resin sealing device corresponding to Fig. 1, and Fig. 4 (1) is an enlarged longitudinal sectional view of the resin molded portion when the upper and lower molds are opened, and Fig. 4 (2) is the upper and lower molds thereof. An enlarged longitudinal cross-sectional view of the resin molded portion at the time of mold clamping.

圖5表示對應圖4的樹脂成形部的主要部分，圖5的(1)是其主要部分的放大縱剖面圖，圖5的(2)是其主要部分的俯視圖。 Fig. 5 shows a main portion of the resin molded portion corresponding to Fig. 4, (1) of Fig. 5 is an enlarged longitudinal sectional view of a main portion thereof, and (2) of Fig. 5 is a plan view of a main portion thereof.

圖6表示本發明的第二實施方式之壓縮樹脂密封裝置的主要部分，圖6的(1)是其上下兩模開模時的樹脂成形部的縱剖面圖，圖6的(2)是其上下兩模合模時的樹脂成形部的縱剖面圖。 Fig. 6 is a view showing a main portion of a compression resin sealing device according to a second embodiment of the present invention, and Fig. 6 (1) is a longitudinal sectional view showing a resin molded portion when the upper and lower molds are opened, and Fig. 6 (2) is A longitudinal sectional view of a resin molded portion when the upper and lower molds are closed.

圖7表示本發明的第三實施方式之壓縮樹脂密封裝置的主要部分，圖7的(1)是其上下兩模開模時的樹脂成形部的縱剖面圖，圖7的(2)是其上下兩模合模時的樹脂成形部的縱剖面圖。 Fig. 7 is a view showing a main portion of a compression resin sealing device according to a third embodiment of the present invention, and Fig. 7 (1) is a longitudinal sectional view of a resin molded portion when the upper and lower molds are opened, and Fig. 7 (2) is A longitudinal sectional view of a resin molded portion when the upper and lower molds are closed.

圖8示意地表示現有壓縮樹脂密封裝置的主要部分，圖8的(1)是其上下兩模開模時的樹脂成形部的縱剖面圖，圖8的(2)是其上下兩模合模時的樹脂成形部的縱剖面圖。 Fig. 8 is a view schematically showing a main part of a conventional compression resin sealing device, and Fig. 8 (1) is a longitudinal sectional view of a resin molded portion when the upper and lower molds are opened, and (2) of Fig. 8 is a mold clamping portion thereof. A longitudinal sectional view of the resin molded portion at the time.

以下，對圖式所示的本發明的實施形態進行說明。 Hereinafter, embodiments of the present invention shown in the drawings will be described.

(第一實施形態) (First embodiment)

圖1至圖5是本發明的第一實施形態，圖1及圖2表示該壓縮樹脂密封裝置的整體結構，另外，圖3至圖5表示其主要部分。 1 to 5 show a first embodiment of the present invention, and Figs. 1 and 2 show the overall configuration of the compression resin sealing device, and Fig. 3 to Fig. 5 show the main portions thereof.

另外，表示該壓縮樹脂密封裝置藉由壓制框架(保持架)保 持各組成構件的結構。即，在框形的壓制框架20的上端部的下表面側配置有壓縮成形用的上模31，並且在該上模31的下方位置配置有藉由後述的開合模機構50能夠上下移動地設置的壓縮成形用的下模32。上模31及下模32構成壓縮成形用模具30。 In addition, it is indicated that the compression resin sealing device is protected by a pressing frame (cage) Hold the structure of each component. In other words, the upper mold 31 for compression molding is disposed on the lower surface side of the upper end portion of the frame-shaped press frame 20, and the lower mold portion 31 is disposed below the upper mold 31 so as to be vertically movable by the opening and closing mold mechanism 50 to be described later. A lower die 32 for compression molding is provided. The upper mold 31 and the lower mold 32 constitute a compression molding die 30.

另外，上模31具備：上模座31a，固定安裝在壓制框架20 的上端部的下表面側；上模保持塊31b，固定安裝在該上模座31a的下表面側；基板設置塊31c，支撐在該上模保持塊31b上；及上模加熱用加熱器31d，內置在該基板設置塊31c中。另外，在上模31的型面(下表面)具備配置在基板設置塊31c的外方周圍，並且用於與後述的下模32的型面(在圖例中為模腔側面構件32d的上表面)接合從而阻斷上下兩模31、32的型面之間與該上下兩模的外部之間的內外通氣的密封構件31e。進一步，在上模保持塊31b與基板設置塊31c之間具備用於阻斷兩塊31b、31c之間的通氣的密封構件31f。此外，在上模31設置有用於向其型面(下表面)供給安裝有電子零件71的大型基板70且使所述大型基板70的電子零件安裝面側朝下地固定的適當的固定機構(未圖示)。另外，在上模31配設有當後述的上下兩模31、32合模時(參照圖2)，經由適當的吸氣路徑使由密封構件31e密封(阻斷通氣)的該上下兩模31、32的型面與真空泵之間連通連接的抽真空機構(未圖示)。 In addition, the upper mold 31 is provided with an upper mold base 31a and fixedly mounted on the press frame 20 a lower surface side of the upper end portion; an upper mold holding block 31b fixedly mounted on a lower surface side of the upper mold base 31a; a substrate mounting block 31c supported on the upper mold holding block 31b; and an upper mold heating heater 31d It is built in the substrate setting block 31c. Further, the profile (lower surface) of the upper mold 31 is provided with a profile disposed around the outer periphery of the substrate installation block 31c and used for a lower mold 32 to be described later (in the illustrated example, the upper surface of the cavity side member 32d) The sealing member 31e is joined to block the internal and external ventilation between the profiles of the upper and lower molds 31, 32 and the outside of the upper and lower molds. Further, a sealing member 31f for blocking ventilation between the two pieces 31b and 31c is provided between the upper mold holding block 31b and the substrate setting block 31c. Further, the upper mold 31 is provided with an appropriate fixing mechanism for supplying the large-sized substrate 70 on which the electronic component 71 is mounted to the molding surface (lower surface) and fixing the electronic component mounting surface side of the large-sized substrate 70 downward (not Graphic). In the upper mold 31, when the upper and lower molds 31 and 32 to be described later are clamped (see FIG. 2), the upper and lower molds 31 are sealed (blocked and ventilated) by the sealing member 31e via an appropriate intake path. A vacuuming mechanism (not shown) that communicates between the profile of 32 and the vacuum pump.

另外，下模32配設在配置於壓制框架20的下端部的後述的 開合模機構50的可動台板52上。即，下模32具備：下模座32a，固定安裝在開合模機構50的可動台板52上；下模保持塊32b，固定安裝在該下模 座32a的上表面側上；模腔底面構件32c，支撐在該下模保持塊32b上；模腔側面構件32d，嵌合在該模腔底面構件32c的外方周圍；彈性構件32e，設置於下模座32a與模腔側面構件32d之間並設置成將該模腔側面構件32d向上方彈性推動；及下模加熱用加熱器32f，內置在模腔底面構件32c中。 因此，下模32具備被分割為模腔底面構件32c和模腔側面構件32d的結構，另外，模腔底面構件32c和模腔側面構件32d能夠相對上下移動地嵌合而構成。另外，在模腔底面構件32c與模腔側面構件32d之間具備用於阻斷該兩者間的通氣的密封構件32g。 Further, the lower mold 32 is disposed at a lower end portion of the press frame 20, which will be described later. The movable platen 52 of the mold clamping mechanism 50 is opened and closed. That is, the lower mold 32 is provided with a lower mold base 32a fixedly mounted on the movable platen 52 of the opening and closing mold mechanism 50, and a lower mold holding block 32b fixedly mounted to the lower mold. The upper surface side of the seat 32a; the cavity bottom surface member 32c is supported on the lower mold holding block 32b; the cavity side surface member 32d is fitted around the outer side of the cavity bottom surface member 32c; and the elastic member 32e is disposed on The cavity holder 32a and the cavity side member 32d are disposed to elastically push the cavity side member 32d upward; and the lower mold heating heater 32f is built in the cavity bottom member 32c. Therefore, the lower mold 32 is configured to be divided into the cavity bottom surface member 32c and the cavity side surface member 32d, and the cavity bottom surface member 32c and the cavity side surface member 32d can be fitted to each other so as to be movable up and down. Further, a seal member 32g for blocking the ventilation between the cavity bottom surface member 32c and the cavity side surface member 32d is provided.

另外，在具備大型基板用的模腔的壓縮成形模具中，上下兩 模31、32的合模壓力在該上下兩模31、32的周邊部大且在該上下兩模31、32的中央部小，其結果，在上下兩模31、32的中央部鼓起的狀態下，上下兩模31、32彎曲並產生變形。於是，壓縮成形用模具30具備兼作用於當後述的上下兩模31、32合模時防止該上下兩模31、32的彎曲變形的彎曲變形防止構件的均勻加壓機構40。另外，在圖例中，舉例說明該均勻加壓機構40具備對上模31的均勻加壓機構41和對下模32的均勻加壓機構42。 In addition, in a compression molding die having a cavity for a large substrate, two upper and lower The mold clamping pressure of the molds 31 and 32 is large at the peripheral portion of the upper and lower molds 31 and 32 and is small at the center portion of the upper and lower molds 31 and 32. As a result, the mold clamping pressure is raised in the center portions of the upper and lower molds 31 and 32. In the state, the upper and lower molds 31, 32 are bent and deformed. Then, the compression molding die 30 is provided with a uniform pressurizing mechanism 40 that acts as a bending deformation preventing member that prevents bending deformation of the upper and lower molds 31 and 32 when the upper and lower molds 31 and 32 to be described later are clamped. Further, in the illustrated example, the uniform pressurizing mechanism 40 is provided with a uniform pressurizing mechanism 41 for the upper mold 31 and a uniform pressurizing mechanism 42 for the lower mold 32.

即，上模均勻加壓機構41具備：上模水準空間部41a，設 置在上模保持塊31b與基板設置塊31c之間；彈性收容體41b，用於導入裝設在該上模水準空間部41a內的壓力介質44；加壓力調節機構43，用於調節由該壓力介質44引起的加壓力；及連通路徑41c，用於使該加壓力調節機構43和彈性收容體41b連通連接。另外，下模均勻加壓機構42具備下模水準空間部42a，設置在下模保持塊32b與模腔底面構件32c之間；彈性收容體42b，用於導入裝設在該下模水準空間部42a內的壓力介質44；加壓力 調節機構43，用於調節由該壓力介質44引起的加壓力；及連通路徑42c，用於使該加壓力調節機構43和彈性收容體42b連通連接。 In other words, the upper mold uniform pressurizing mechanism 41 includes an upper mold level space portion 41a and is provided. Between the upper mold holding block 31b and the substrate setting block 31c; the elastic receiving body 41b for introducing the pressure medium 44 installed in the upper mold level space portion 41a; and the pressure adjusting mechanism 43 for adjusting The pressing force by the pressure medium 44; and the communication path 41c for connecting the pressure adjusting mechanism 43 and the elastic receiving body 41b. Further, the lower mold uniform pressurizing mechanism 42 includes a lower mold level space portion 42a provided between the lower mold holding block 32b and the cavity bottom surface member 32c, and an elastic receiving body 42b for introduction and mounting in the lower mold level space portion 42a. Pressure medium 44 inside; pressure The adjusting mechanism 43 is for adjusting the pressing force caused by the pressure medium 44, and the communication path 42c is for connecting the pressure adjusting mechanism 43 and the elastic receiving body 42b.

作為上述的壓力介質，可使用流體(例如，空氣或惰性氣體 等氣體、或者水等惰性水溶液或油類等液體)。例如，可使用低熱傳導性的矽油作為壓力介質。此時，不僅具備作為壓力介質的功能，而且能夠藉由其絕熱功能降低消耗電力。 As the above pressure medium, a fluid (for example, air or inert gas) can be used. An inert aqueous solution such as a gas or water, or a liquid such as an oil). For example, low thermal conductivity eucalyptus oil can be used as the pressure medium. In this case, not only the function as a pressure medium but also the power consumption can be reduced by the heat insulating function.

此外，在圖例中，舉例說明了兼用上模均勻加壓機構41和 下模均勻加壓機構42的加壓力調節機構43的情況，但也可以配設分別對應上模均勻加壓機構41及下模均勻加壓機構42的專用的加壓力調節機構。 In addition, in the legend, the upper mold uniform pressurizing mechanism 41 is used as an example. Although the pressing force adjustment mechanism 43 of the lower die uniform pressurizing mechanism 42 is used, a dedicated pressurizing mechanism corresponding to the upper die uniform pressurizing mechanism 41 and the lower die uniform pressurizing mechanism 42 may be disposed.

另外，用於使下模32上下移動而將上模31和下模32開合 (合模或開模)的開合模機構50以如下方式構成。即，構成為：在作為壓縮成形用模具30的下方位置的壓制框架20的下部固定安裝有底座51，並且藉由連桿機構(肘節機構)連結底座51和設置在該底座51的上方位置的可動台板52，進一步，藉由由伺服馬達53驅動該連桿，從而進行上下兩模31、32的開合模。詳細說明如下：伺服馬達53和能夠旋轉地豎立設置在底座51的中心位置的螺旋軸54經由架設在伺服馬達53的輸出軸53a與螺旋軸54的下端帶輪53b之間的帶53c連結。另外，在螺旋軸54螺紋安裝有螺帽構件55，藉由使螺旋軸54旋轉，從而螺帽構件55向上下方向移動。而且，藉由使連結底座51和可動台板52的連桿與該螺帽構件55配合，從而伴隨螺帽構件55的上下移動可動台板52進行上下移動。此外，連結底座51與可動台板52之間的連桿由第一連桿板56a、第二連桿板56b及第三連桿板56c構成。而且，經由軸51a軸支撐底座51和第二連桿板56b的下端， 另外，經由軸52a軸支撐可動台板52和第三連桿台板56c的上端，另外，經由軸52b軸支撐第二連桿板56b的上端和第三連桿板56c的下端。另外，第一連桿板56a的一端軸支撐在螺帽構件55上，並且第一連桿板56a的另一端軸支撐在第二連桿板56b的中間位置(軸51a與軸52b之間的中間位置)。因此，第一連桿板56a就會作為用於將由螺帽構件55的上下移動引起的驅動力傳遞到第二連桿板56b和第三連桿板56c中的驅動連桿來起作用。 因此，藉由用伺服馬達53使螺旋軸54旋轉，從而能夠使可動台板52經由螺帽構件55及第一連桿板56a、第二連桿板56b和第三連桿板56c進行上下移動以進行上下兩模31、32的開合模。 In addition, the lower mold 32 is moved up and down to open and close the upper mold 31 and the lower mold 32. The opening and closing mechanism 50 (clamping or opening) is constructed as follows. In other words, the base 51 is fixedly attached to the lower portion of the press frame 20 at a position below the compression molding die 30, and the base 51 and the upper portion of the base 51 are coupled by a link mechanism (toggle mechanism). Further, the movable platen 52 is further driven by the servo motor 53 to open and close the upper and lower molds 31 and 32. Specifically, the servo motor 53 and the screw shaft 54 rotatably provided at the center position of the base 51 are coupled via a belt 53c that is placed between the output shaft 53a of the servo motor 53 and the lower end pulley 53b of the screw shaft 54. Further, the nut member 55 is screwed to the screw shaft 54, and the screw member 54 is rotated to move the nut member 55 in the vertical direction. Further, by engaging the link connecting the base 51 and the movable platen 52 with the nut member 55, the movable platen 52 is moved up and down in association with the vertical movement of the nut member 55. Further, the link between the joint base 51 and the movable platen 52 is constituted by the first link plate 56a, the second link plate 56b, and the third link plate 56c. Moreover, the lower ends of the base 51 and the second link plate 56b are supported via the shaft 51a, Further, the upper ends of the movable platen 52 and the third link platen 56c are axially supported via the shaft 52a, and the upper end of the second link plate 56b and the lower end of the third link plate 56c are axially supported via the shaft 52b. In addition, one end shaft of the first link plate 56a is supported on the nut member 55, and the other end shaft of the first link plate 56a is supported at an intermediate position of the second link plate 56b (between the shaft 51a and the shaft 52b) middle place). Therefore, the first link plate 56a functions as a drive link for transmitting the driving force caused by the up and down movement of the nut member 55 to the second link plate 56b and the third link plate 56c. Therefore, by rotating the screw shaft 54 by the servo motor 53, the movable platen 52 can be moved up and down via the nut member 55, the first link plate 56a, the second link plate 56b, and the third link plate 56c. The opening and closing molds of the upper and lower molds 31 and 32 are performed.

此外，在圖例中，舉例說明了上述的開合模機構50使用肘 節機構的情況，代替此，顯然可使用採用了電動機和螺旋千斤頂機構的開合模機構或採用了液壓機構的開合模機構等。 In addition, in the illustration, the above-described opening and closing mold mechanism 50 is used as an example. In the case of the joint mechanism, it is obvious that an opening and closing mold mechanism using an electric motor and a screw jack mechanism or an opening and closing mold mechanism using a hydraulic mechanism can be used.

另外，如圖4及圖5所放大圖示，在上下兩模31、32的型 面之間構成有樹脂成形部33。即，由模腔底面構件32c的上表面和模腔側面構件32d的上表面開口部構成的凹處成為樹脂成形用的下模模腔33a。另外，如圖4所示，在閉合上下兩模31、32的合模時(參照圖4的(2))，在該上下兩模31、32之間設置有用於使成為下模模腔33a內的熔融樹脂材料80a的一部分的剩餘樹脂80b向下模模腔33a的外部流出的狹窄間隙33c。 另外，在下模模腔33a周圍配置有通過狹窄間隙33c連通的剩餘樹脂收容部33b(參照圖5)。另外，上下兩模31、32的合模最終位置的下模模腔33a的底面與大型基板70中的電子零件71安裝面之間的間隔設定為與用於對大型基板70的電子零件71進行樹脂密封的密封件厚度33d的間隔相等。進一 步，用於使剩餘樹脂80b向下模模腔33a的外部流出的狹窄間隙33c設置在下模模腔33a與大型基板70中的電子零件安裝面這兩者之間，從而該狹窄間隙33c成為使下模模腔33a和剩餘樹脂80b的收容部33b連通的樹脂通道。另外，狹窄間隙33c設置為如從下模模腔33a朝向剩餘樹脂80b的收容部33b變淺的傾斜面。藉由設置這種由傾斜面構成的狹窄間隙33c，從而能夠使剩餘樹脂80b逐漸(在低速下)向剩餘樹脂收容部33b內流入。 In addition, as shown in FIG. 4 and FIG. 5, the type of the upper and lower molds 31 and 32 is shown. A resin molded portion 33 is formed between the faces. That is, the recess formed by the upper surface of the cavity bottom surface member 32c and the upper surface opening of the cavity side surface member 32d becomes the lower mold cavity 33a for resin molding. Further, as shown in Fig. 4, when the mold clamping of the upper and lower molds 31, 32 is closed (see (2) of Fig. 4), a lower mold cavity 33a is provided between the upper and lower molds 31, 32. The remaining resin 80b of a part of the molten resin material 80a is narrowed to the outside of the cavity 33a. Further, a remaining resin accommodating portion 33b (see FIG. 5) that communicates through the narrow gap 33c is disposed around the lower mold cavity 33a. Further, the interval between the bottom surface of the lower mold cavity 33a at the final position of the mold clamping of the upper and lower molds 31, 32 and the mounting surface of the electronic component 71 in the large substrate 70 is set to be used for the electronic component 71 for the large substrate 70. The resin-sealed seals have an equal thickness of 33d. Enter one The narrow gap 33c for allowing the remaining resin 80b to flow out of the outside of the lower mold cavity 33a is provided between the lower mold cavity 33a and the electronic component mounting surface of the large substrate 70, so that the narrow gap 33c becomes A resin passage that communicates with the accommodating portion 33b of the lower mold cavity 33a and the remaining resin 80b. Further, the narrow gap 33c is provided as an inclined surface that becomes shallow as it goes from the lower mold cavity 33a toward the accommodating portion 33b of the remaining resin 80b. By providing such a narrow gap 33c formed of an inclined surface, the remaining resin 80b can be gradually (in a low speed) flow into the remaining resin accommodating portion 33b.

此外，在上述的壓縮樹脂密封裝置中，同時設置有用於對設 置在下模32的包括下模模腔33a的下型面張設離型膜60的離型膜供給設置機構(未圖示)。進一步，同時設置有對藉由離型膜供給設置機構張設有離型膜60的下模模腔33a供給片狀樹脂80的樹脂供給設置機構(未圖示)。 另外，該片狀樹脂80形成為對應下模模腔33a的形狀的類似形狀，並且將所需量的樹脂平坦化而具備所需的保形性。在此，如後述，所謂的所需量意味著用於在下模模腔33a內將大型基板70上的電子零件71按既定厚度一併壓縮樹脂密封成形的樹脂量和在該樹脂量上加上用於向下模模腔33a的外部流出的剩餘樹脂量的量。更具體來講，例如，對於將大型基板70上的電子零件71一起壓縮樹脂密封成形在剖面厚度0.3mm的密封件內的情況來說，最好使用剖面厚度0.5mm的片狀樹脂材料80。 Further, in the above-described compression resin sealing device, the same is provided for the opposite design A release film supply setting mechanism (not shown) provided in the lower mold surface of the lower mold 32 including the lower mold cavity 33a. Further, a resin supply setting mechanism (not shown) for supplying the sheet-like resin 80 to the lower mold cavity 33a in which the release film 60 is placed by the release film supply setting means is provided. Further, the sheet-like resin 80 is formed into a similar shape corresponding to the shape of the lower mold cavity 33a, and planarizes a desired amount of resin to have a desired shape retaining property. Here, as will be described later, the required amount means the amount of resin for sealing the electronic component 71 on the large substrate 70 in a predetermined thickness and compressing the resin in the lower mold cavity 33a, and adding the amount of the resin. The amount of the remaining resin amount for the outside of the downward molding cavity 33a. More specifically, for example, in the case where the electronic component 71 on the large substrate 70 is compression-sealed together in a seal having a cross-sectional thickness of 0.3 mm, it is preferable to use a sheet-like resin material 80 having a cross-sectional thickness of 0.5 mm.

下面，對使用該壓縮樹脂密封裝置，並利用樹脂(以定量定 型化的片狀樹脂)將安裝在大型基板70上的電子零件71一併壓縮樹脂密封成形的情況進行說明。 Next, the use of the compression resin sealing device and the use of resin (by quantitative determination The case where the electronic component 71 mounted on the large substrate 70 is collectively molded by compression resin sealing will be described.

首先，經由開合模機構50，進行上下兩模31、32的開模(參 照圖1)。其次，在該開模時，經由適當的固定機構(未圖示)，向上模31 的型面(即，基板設置塊31c的下表面)供給安裝有電子零件71的大型基板70，並且使大型基板70以其電子零件安裝面側朝下的方式固定到上模31的型面上。另外，經由離型膜供給機構(未圖示)，在包括下模模腔33a的下模32的型面(即，模腔底面構件32c及模腔側面構件32d的上表面)張設離型膜60。進一步，經由樹脂供給設置機構(未圖示)，向張設有離型膜60的下模模腔33a供給片狀樹脂80(參照4)。另外，該片狀樹脂80藉由內置在模腔底面構件32c中的下模加熱用加熱器32f加熱熔化。此外，以定量定型化的片狀樹脂80，可在載置於將卷狀的離型膜事先切斷成所需的長度而構成的離型膜60(所謂，預製的離型膜)上的狀態下，向下模模腔33a內供給並設置。例如，首先在將片狀樹脂80載置在離型膜60上的狀態下，將該片狀樹脂80對準並載置在下模模腔33a的開口部(型面)，其次，將離型膜60引到下模模腔33a內並由離型膜60覆蓋下模模腔33a內。由此，能夠進行使用離型膜60的下模模腔33a內的覆蓋和向下模模腔33a的片狀樹脂80的供給。 First, the mold opening and closing of the upper and lower molds 31 and 32 is performed via the opening and closing mold mechanism 50 (see See Figure 1). Next, at the time of the mold opening, the upper mold 31 is passed through a suitable fixing mechanism (not shown). The profile (i.e., the lower surface of the substrate setting block 31c) is supplied to the large substrate 70 on which the electronic component 71 is mounted, and the large substrate 70 is fixed to the profile of the upper mold 31 with its electronic component mounting surface side facing downward. . Further, the release surface of the lower mold 32 including the lower mold cavity 33a (i.e., the upper surfaces of the cavity bottom surface member 32c and the cavity side member 32d) is detached via a release film supply mechanism (not shown). Membrane 60. Further, the sheet-like resin 80 is supplied to the lower mold cavity 33a in which the release film 60 is stretched via a resin supply setting means (not shown) (see 4). Further, the sheet-like resin 80 is heated and melted by the lower mold heating heater 32f built in the cavity bottom surface member 32c. Further, the sheet-like resin 80 which has been quantitatively shaped can be placed on a release film 60 (so-called prefabricated release film) which is formed by previously cutting a roll-shaped release film into a desired length. In the state, it is supplied and set in the downward molding cavity 33a. For example, in the state in which the sheet-like resin 80 is placed on the release film 60, the sheet-like resin 80 is aligned and placed on the opening (profile) of the lower mold cavity 33a, and secondly, the release is performed. The film 60 is introduced into the lower mold cavity 33a and covered by the release film 60 in the lower mold cavity 33a. Thereby, the supply of the sheet-like resin 80 in the lower mold cavity 33a of the release film 60 and the downward molding cavity 33a can be performed.

其次，藉由經由均勻加壓機構40，將由加壓力調節機構43 調節為既定的加壓力的壓力介質44分別導入到上模均勻加壓機構41的彈性收容部41b內及下模均勻加壓機構42的彈性收容部42b內，從而防止在上下兩模31、32合模時該上下兩模31、32因其合模壓力而彎曲變形(參照圖3)。另外，使用該均勻加壓機構40的上下兩模31、32的彎曲變形防止步驟，可以在成形步驟中常時進行，或者可以在後述的上下兩模31、32的合模步驟之前進行，或者可以與該合模步驟同時進行。總之，選擇能夠防止由上下兩模31、32的合模步驟中的合模壓力引起的該上下兩模31、32被彎曲變 形的時期即可。 Secondly, by the uniform pressurization mechanism 40, the pressure applying mechanism 43 is used. The pressure medium 44 adjusted to a predetermined pressing force is introduced into the elastic receiving portion 41b of the upper mold uniform pressing mechanism 41 and the elastic receiving portion 42b of the lower mold uniform pressing mechanism 42, respectively, thereby preventing the upper and lower molds 31, 32. When the mold is closed, the upper and lower molds 31 and 32 are bent and deformed by the mold clamping pressure (see Fig. 3). Further, the bending deformation preventing step using the upper and lower molds 31, 32 of the uniform pressurizing mechanism 40 may be performed at all times in the forming step, or may be performed before the mold clamping step of the upper and lower molds 31, 32 to be described later, or may be performed This is carried out simultaneously with the mold clamping step. In short, it is selected to prevent the upper and lower molds 31, 32 from being bent by the mold clamping pressure in the mold clamping step of the upper and lower molds 31, 32. The shape of the period can be.

其次，如圖2所示，藉由經由開合模機構50使下模32向上 移動，從而進行上下兩模31、32的合模。若進行上下兩模31、32的合模，則能夠使固定在上模31的型面上的大型基板70上的電子零件71浸漬在張設有離型膜60的下模模腔33a內的熔融樹脂材料80a中。其次，藉由對該下模模腔33a內的熔融樹脂材料80a施加既定的樹脂壓力，從而能夠利用樹脂將安裝在大型基板70上的電子零件71壓縮樹脂密封在一起。此外，由於在上述的上下兩模31、32合模時，能夠用密封構件31e密封該上下兩模31、32的型面之間，因此能夠進行操作抽真空機構(未圖示)的真空泵以對該型面之間(下模模腔33a內)進行減壓的所謂的真空成形(減壓成形)。 Next, as shown in FIG. 2, the lower mold 32 is moved upward by the opening and closing mechanism 50. The movement is performed to perform the mold clamping of the upper and lower molds 31 and 32. When the mold clamping of the upper and lower molds 31 and 32 is performed, the electronic component 71 on the large substrate 70 fixed to the molding surface of the upper mold 31 can be immersed in the lower mold cavity 33a in which the release film 60 is stretched. It is melted in the resin material 80a. Then, by applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a, the electronic component 71 mounted on the large substrate 70 can be compression-sealed by resin. Further, since the gap between the upper and lower molds 31 and 32 can be sealed by the sealing member 31e when the upper and lower molds 31 and 32 are closed, the vacuum pump that operates the vacuuming mechanism (not shown) can be used. So-called vacuum forming (decompression molding) for decompressing between the profiles (in the lower die cavity 33a) is performed.

另外，在上述的上下兩模31、32的合模步驟中，進行使下 模模腔33a內的多餘樹脂80b向下模模腔33a的外部流出的剩餘樹脂80b的外部流出步驟，而且，在經過該剩餘樹脂80b的外部流出步驟之後，藉由使模腔底面構件32c向上移動至既定的高度位置，從而進行對下模模腔33a內的熔融樹脂材料80a施加既定的樹脂壓力以將大型基板70上的電子零件71一併樹脂密封成形的樹脂密封步驟。在該剩餘樹脂80b的外部流出步驟中，通過在上下兩模31、32之間構成的狹窄間隙33c，將剩餘樹脂80b引導到設置在下模模腔33a周圍的剩餘樹脂收容部33b內(參照圖4及圖5)。 進一步，在該樹脂密封步驟中，由於上下兩模31、32的合模最終位置的下模模腔33a的底面與大型基板70中的電子零件安裝面之間的間隔被設定為與用於對大型基板70的電子零件71進行樹脂密封的密封件厚度33d的間隔相等，因此能夠在下模模腔33a內得到既定的樹脂壓力，並且能夠將密封件 厚度33d成形為既定的厚度。 Further, in the above-described mold clamping step of the upper and lower molds 31 and 32, the lowering is performed. The excess resin 80b in the cavity 33a is externally flowed out of the remaining resin 80b flowing out of the outside of the cavity 33a, and further, after passing through the external outflow step of the remaining resin 80b, the cavity bottom member 32c is upwardly Moving to a predetermined height position, a resin sealing step of applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 33a to collectively seal the electronic component 71 on the large substrate 70 is performed. In the external outflow step of the remaining resin 80b, the remaining resin 80b is guided to the remaining resin accommodating portion 33b provided around the lower mold cavity 33a by the narrow gap 33c formed between the upper and lower dies 31, 32 (refer to the figure). 4 and Figure 5). Further, in the resin sealing step, the interval between the bottom surface of the lower mold cavity 33a at the final position of the mold clamping of the upper and lower molds 31, 32 and the electronic component mounting surface in the large substrate 70 is set to be used for The interval of the seal thickness 33d in which the electronic component 71 of the large substrate 70 is resin-sealed is equal, so that a predetermined resin pressure can be obtained in the lower mold cavity 33a, and the seal can be obtained. The thickness 33d is shaped to a predetermined thickness.

即在此時，能夠進行由上下兩模31、32引起的合模作用和 由模腔底面構件32c引起的對下模模腔33a內的熔融樹脂材料80a的按壓作用。因此，藉由在低速且低壓下進行該上下兩模31、32的合模作用及對該熔融樹脂材料80a的按壓作用，從而能夠在低速且低壓下進行上述的剩餘樹脂80b的外部流出步驟和該外部流出步驟之後的樹脂密封步驟。進一步，在樹脂密封步驟中的上下兩模31、32的合模最終位置，大型基板70的電子零件71被關聯為能夠在既定厚度的密封件內進行樹脂密封。於是，在該上下兩模31、32的合模作用時及該熔融樹脂材料80a的按壓作用時，能夠防止或抑制下模模腔33a內的熔融樹脂材料80a的流動作用，因此能夠有效地防止起因於該熔融樹脂材料80a的流動作用的導線偏移等的發生。 That is, at this time, the mold clamping action caused by the upper and lower molds 31, 32 can be performed. The pressing action of the molten resin material 80a in the lower cavity 33a caused by the cavity bottom surface member 32c. Therefore, by performing the mold clamping action of the upper and lower molds 31 and 32 and the pressing action on the molten resin material 80a at a low speed and a low pressure, the external outflow step of the remaining resin 80b described above can be performed at a low speed and a low pressure. The resin sealing step after the external outflow step. Further, in the final position of the mold clamping of the upper and lower molds 31, 32 in the resin sealing step, the electronic component 71 of the large substrate 70 is associated with resin sealing in a seal of a predetermined thickness. Therefore, when the mold clamping action of the upper and lower molds 31 and 32 and the pressing action of the molten resin material 80a, the flow of the molten resin material 80a in the lower mold cavity 33a can be prevented or suppressed, so that it can be effectively prevented. The occurrence of a wire offset or the like due to the flow of the molten resin material 80a occurs.

此外，還可以使上述的樹脂密封步驟中的上下兩模31、32 的合模最終位置或在該合模最終位置的下模模腔33a的底面位置的設定與藉由開合模機構50使下模32向上移動的界限(上止點)的位置一致(參照圖2)。 In addition, the upper and lower molds 31 and 32 in the resin sealing step described above can also be made. The final position of the mold clamping or the position of the bottom surface of the lower mold cavity 33a at the final position of the mold clamping coincides with the position of the limit (top dead center) at which the lower mold 32 is moved upward by the opening and closing mold mechanism 50 (refer to the figure). 2).

另外，在上述的樹脂防止步驟中的上下兩模31、32的合模 最終位置或該合模最終位置的下模模腔33a的底面位置的設定，還可以採用高度位置控制機構(未圖示)，該高度位置控制機構能夠感測藉由開合模機構50向上移動的下模32或模腔底面構件32c的既定的高度位置，並使該下模32或模腔底面構件32c的向上移動作用停止。 Further, the clamping of the upper and lower molds 31, 32 in the resin preventing step described above The height position control mechanism (not shown) can also be used to set the bottom position of the lower mold cavity 33a at the final position or the final position of the mold clamping, and the height position control mechanism can sense the upward movement by the opening and closing mold mechanism 50. The lower mold 32 or the cavity bottom member 32c has a predetermined height position, and the upward movement of the lower mold 32 or the cavity bottom member 32c is stopped.

另外，藉由使用以定量定型化的片狀樹脂80，從而根據在下模模腔33a內的整個區域的樹脂材料的供給作用、該片狀樹脂的加熱熔化 作用和對熔融樹脂材料80a的低速且低壓下的按壓作用的相輔相成作用，能夠進一步有效地防止起因於該下模模腔33a內的熔融樹脂材料80a的流動作用的導線偏移等的發生。 Further, by using the sheet-like resin 80 which is quantitatively shaped, the heating of the sheet-like resin is performed according to the supply action of the resin material in the entire region in the lower mold cavity 33a. The action and the complementary action of the low-speed and low-pressure pressing action of the molten resin material 80a can further effectively prevent the occurrence of a wire offset or the like due to the flow action of the molten resin material 80a in the lower mold cavity 33a.

此外，在上述的樹脂密封步驟中，例如能夠在成形溫度 160~185℃下，進行在成形壓力0.2941MPa以上(3kgf/cm2以上)的低壓下的壓縮樹脂密封成形。另外，在樹脂密封步驟中，藉由同時使用均勻加壓機構40，從而能夠防止在上下兩模31、32合模時由合模壓力引起的該上下兩模31、32的彎曲變形。另外，藉由進行使下模模腔33a內的剩餘樹脂80b向下模模腔33a的外部流出的剩餘樹脂80b的外部流出步驟，並在經過該剩餘樹脂80b的外部流出步驟之後，使模腔底面構件32c向上移動至既定的高度位置，從而能夠對下模模腔33a內的熔融樹脂材料80a施加既定的樹脂壓力以將大型基板70上的電子零件71一併樹脂密封成形。此時，由於能夠對下模模腔33a內的熔融樹脂材料80a施加既定的樹脂壓力，且使模腔底面構件32c向上移動至既定的高度位置，因此能夠有效地提高成形在大型基板70上的密封件的厚度33d的精度(偏差)。 Further, in the resin sealing step described above, for example, a compression resin sealing molding at a low pressure of a molding pressure of 0.2941 MPa or more (3 kgf/cm 2 or more) at a molding temperature of 160 to 185 ° C can be performed. Further, in the resin sealing step, by simultaneously using the uniform pressurizing mechanism 40, it is possible to prevent the bending deformation of the upper and lower molds 31, 32 due to the mold clamping pressure when the upper and lower molds 31, 32 are clamped. Further, by performing an external outflow step of the remaining resin 80b flowing out of the remaining resin 80b in the lower mold cavity 33a to the outside of the lower mold cavity 33a, and after passing the external outflow step of the remaining resin 80b, the cavity is made The bottom member 32c is moved upward to a predetermined height position, so that a predetermined resin pressure can be applied to the molten resin material 80a in the lower mold cavity 33a to collectively seal the electronic component 71 on the large substrate 70. At this time, since the predetermined resin pressure can be applied to the molten resin material 80a in the lower mold cavity 33a, and the cavity bottom surface member 32c is moved upward to a predetermined height position, the molding on the large substrate 70 can be effectively improved. The accuracy (deviation) of the thickness 33d of the seal.

根據該實施形態的結構，對於利用樹脂將安裝在大型基板 70上的多個電子零件71一併密封成形的情況來說，能夠省略對下模模腔33a內供給的樹脂量的計量和調節作用。另外，能夠有效地防止起因於下模模腔33a內的熔融樹脂材料80a的流動作用的導線偏移等的發生。另外，能夠在下模模腔33a內得到既定的樹脂壓力。另外，能夠將樹脂密封電子零件71的密封件的厚度33d成形為既定的厚度。另外，由於藉由具備對上模31的均勻加壓機構41和對下模32的均勻加壓機構42，從而能夠防止上下兩 模31、32的彎曲變形，因此有利於利用樹脂將大型基板70上的電子零件71一併密封成形的情況。另外，在用開合模機構50將上下兩模31、32合模且對下模模腔33a內的熔融樹脂材料進行加壓時，藉由驅動下模32的均勻加壓機構42，在由設置在下模水準空間部42a的彈性收容體42b內的壓力介質44引起的均勻加壓作用下，能夠使附設在彈性收容體42b上的模腔底面構件32c在其模腔底面(前端面)保持水準狀態的狀態下進行向上移動。即，能夠在無傾斜的狀態下將模腔底面構件32c作為水準浮動板水準地抬起。進一步，藉由在上下兩模31、32之間的樹脂成形部(下模模腔33a)的附近位置配設上模加熱用加熱器31d及下模加熱用加熱器32f，從而能夠提高對熔融樹脂材料80a的熱效率。 According to the structure of this embodiment, the resin is mounted on a large substrate. In the case where the plurality of electronic components 71 on 70 are collectively sealed, the measurement and adjustment of the amount of resin supplied into the lower cavity 33a can be omitted. In addition, occurrence of a wire offset or the like due to the flow action of the molten resin material 80a in the lower mold cavity 33a can be effectively prevented. Further, a predetermined resin pressure can be obtained in the lower mold cavity 33a. Further, the thickness 33d of the seal of the resin-sealed electronic component 71 can be formed into a predetermined thickness. Further, since the uniform pressurizing mechanism 41 for the upper mold 31 and the uniform pressurizing mechanism 42 for the lower mold 32 are provided, it is possible to prevent the upper and lower two The bending deformation of the dies 31 and 32 is advantageous in that the electronic components 71 on the large substrate 70 are collectively sealed by a resin. Further, when the upper and lower molds 31, 32 are clamped by the opening and closing mold mechanism 50 and the molten resin material in the lower mold cavity 33a is pressurized, the uniform pressurizing mechanism 42 for driving the lower mold 32 is used. The cavity bottom surface member 32c attached to the elastic housing 42b can be held on the bottom surface (front end surface) of the cavity by the uniform pressurization by the pressure medium 44 provided in the elastic housing 42b of the lower mold level space portion 42a. Move up in the state of the level state. That is, the cavity bottom surface member 32c can be lifted up as a level floating plate without tilting. Further, by providing the upper mold heating heater 31d and the lower mold heating heater 32f in the vicinity of the resin molding portion (the lower mold cavity 33a) between the upper and lower molds 31 and 32, the melting can be improved. The thermal efficiency of the resin material 80a.

(第二實施形態) (Second embodiment)

下面，基於圖6說明本發明之第二實施形態。 Next, a second embodiment of the present invention will be described based on Fig. 6 .

圖6是表示本發明的第二實施形態的壓縮樹脂密封裝置，圖6的(1)表示其上下兩模開模時的樹脂成形部的主要部分，另外，圖6的(2)表示其上下兩模合模時的樹脂成形部的主要部分。第二實施形態在以下點上與第一實施形態不同。此外，至於其他點，實質上與第一實施形態相同。因此，關於不同的點進行說明，並且對與第一實施形態實質上相同的結構構件使用相同的附圖標記，並避免說明的重複。 Fig. 6 is a view showing a compression resin sealing device according to a second embodiment of the present invention, wherein (1) of Fig. 6 shows a main portion of a resin molded portion when the upper and lower molds are opened, and (2) of Fig. 6 shows the upper and lower sides thereof. The main part of the resin molded portion at the time of mold clamping. The second embodiment is different from the first embodiment in the following points. Further, as for the other points, it is substantially the same as the first embodiment. Therefore, the different points will be described, and the same reference numerals will be given to the structural members substantially the same as those in the first embodiment, and the repetition of the description will be avoided.

即，如圖6的(2)所示，用於使剩餘樹脂80b向下模模腔34a的外部流出的狹窄間隙34c設置在下模32的型面(在圖例中為模腔側面構件32d的上表面)與大型基板70中的電子零件安裝面這兩者之間。另外，剩餘樹脂的收容部34b被設置為狹窄間隙34c以及位在狹窄間隙34c和 配置在下模模腔34a周圍的樹脂防漏用構件34之間的空間部。另外，樹脂防漏用構件34兼作用於限制在上下兩模31、32合模時的該上下兩模31、32的型面之間的距離的定位構件。 That is, as shown in (2) of Fig. 6, a narrow gap 34c for allowing the remaining resin 80b to flow out of the outside of the lower mold cavity 34a is provided on the profile of the lower mold 32 (in the illustrated example, the cavity side member 32d) The surface is between the surface and the electronic component mounting surface in the large substrate 70. In addition, the accommodating portion 34b of the remaining resin is provided as a narrow gap 34c and in a narrow gap 34c and The space portion between the resin leakage preventing members 34 disposed around the lower mold cavity 34a. Further, the resin leakage preventing member 34 also serves as a positioning member that restricts the distance between the profiles of the upper and lower molds 31 and 32 when the upper and lower molds 31 and 32 are clamped.

樹脂防漏用構件34被設置為接收來自其驅動機構(未圖示) 的動作訊號35而上下移動。而且，藉由使該樹脂防漏用構件34的下端面與下模32的型面(即，張設有離型膜60的模腔側面構件32d的上表面)接合並固定，從而能夠將在上下兩模31、32合模時的該上下兩模31、32的型面之間限制為既定的距離。因此，藉由選擇該樹脂防漏用構件34中的下端面的高度位置，從而能夠適當地進行上述狹窄間隙34c的寬窄調節。 The resin leakage preventing member 34 is provided to receive from its driving mechanism (not shown) The motion signal 35 moves up and down. Further, by bonding and fixing the lower end surface of the resin leakage preventing member 34 to the profile of the lower mold 32 (that is, the upper surface of the cavity side surface member 32d on which the release film 60 is stretched), it is possible to The profile between the upper and lower molds 31, 32 when the upper and lower molds 31, 32 are clamped is limited to a predetermined distance. Therefore, by selecting the height position of the lower end surface of the resin leakage preventing member 34, it is possible to appropriately adjust the width and narrowness of the narrow gap 34c.

在第二實施形態的結構中，在圖6的(2)所示的上下兩模 31、32的合模步驟中，進行使下模模腔34a內的剩餘樹脂80b向下模模腔34a的外部流出的剩餘樹脂80b的外部流出步驟，而且在經過該剩餘樹脂80b的外部流出步驟之後，使模腔底面構件32c向上移動至既定的高度位置，從而進行對下模模腔34a內的熔融樹脂材料80a施加既定的樹脂壓力以將大型基板70上的電子零件71一併樹脂密封成形的樹脂密封步驟。另外，在剩餘樹脂80b的外部流出步驟中，設定為通過在上下兩模31、32之間構成的狹窄間隙34c，將剩餘樹脂80b引導到設置在下模模腔34a部周圍的剩餘樹脂收容部34b內。進一步，在樹脂密封步驟中，上下兩模31、32的合模最終位置的下模模腔34a的底面與大型基板70中的電子零件71安裝面之間的間隔設定為與用於對大型基板70的電子零件71進行樹脂密封的密封件厚度34d的間隔相等。因此，能夠在下模模腔34a內得到既定的樹脂壓力，並且能夠將密封件厚度34d成形為既定的厚度。 In the configuration of the second embodiment, the upper and lower modes shown in (2) of Fig. 6 In the mold clamping step of 31, 32, the external outflow step of the remaining resin 80b for allowing the remaining resin 80b in the lower mold cavity 34a to flow out to the outside of the lower mold cavity 34a is performed, and the external flow out step is passed through the remaining resin 80b. Thereafter, the cavity bottom surface member 32c is moved upward to a predetermined height position, thereby applying a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 34a to collectively seal the electronic component 71 on the large substrate 70. Resin sealing step. Further, in the external outflow step of the remaining resin 80b, the remaining resin 80b is guided to the remaining resin accommodating portion 34b provided around the lower mold cavity 34a by the narrow gap 34c formed between the upper and lower dies 31, 32. Inside. Further, in the resin sealing step, the interval between the bottom surface of the lower mold cavity 34a at the final position of the mold clamping of the upper and lower molds 31, 32 and the mounting surface of the electronic component 71 in the large substrate 70 is set to be used for the large substrate The interval of the seal thickness 34d of the electronic component 71 of 70 for resin sealing is equal. Therefore, a predetermined resin pressure can be obtained in the lower mold cavity 34a, and the seal thickness 34d can be formed into a predetermined thickness.

根據第二實施形態的結構，由於樹脂防漏構件34兼作用於 限制在上下兩模31、32合模時的該上下兩模31、32的型面之間的距離的定位構件，例如能夠同時進行設定所需的狹窄間隙34c的操作和構成剩餘樹脂80b的收容部34b的操作。另外，由於能夠在已合模的上下兩模31、32的型面之間設置剩餘樹脂收容部34b以及用於使該收容部34b和下模模腔34a連通連接的狹窄間隙34c，因此沒有必要切削設置具備第一實施形態中說明的傾斜面的狹窄間隙33c及凹槽狀的剩餘樹脂收容部33b來構成。 According to the structure of the second embodiment, since the resin leakage preventing member 34 serves as The positioning member that restricts the distance between the profiles of the upper and lower molds 31 and 32 when the upper and lower molds 31 and 32 are clamped can, for example, simultaneously perform the operation of setting the narrow gap 34c required and the accommodation of the remaining resin 80b. The operation of the portion 34b. Further, since the remaining resin accommodating portion 34b and the narrow gap 34c for connecting the accommodating portion 34b and the lower mold cavity 34a are provided between the molding faces of the upper and lower molds 31 and 32 that have been clamped, it is not necessary. The cutting is provided with a narrow gap 33c having an inclined surface described in the first embodiment and a recessed resin containing portion 33b.

其次，基於圖7說明本發明之第三實施形態。 Next, a third embodiment of the present invention will be described based on Fig. 7 .

(第三實施形態) (Third embodiment)

圖7是表示本發明的第三實施形態的壓縮樹脂密封裝置，圖7的(1)表示其上下兩模開模時的樹脂成形部的主要部分，另外，圖7的(2)表示其上下兩模合模時的樹脂成形部的主要部分。第三實施形態在以下點上與第一、第二實施形態不同。此外，至於其他點，實質上與第一、第二實施形態相同。因此，關於不同的點進行說明，並且對與第一、第二實施形態實質上相同的結構構件使用相同的附圖標記，並避免說明的重複。 Fig. 7 is a view showing a compression resin sealing device according to a third embodiment of the present invention, and Fig. 7 (1) shows a main portion of a resin molded portion when the upper and lower molds are opened, and (2) of Fig. 7 The main part of the resin molded portion at the time of mold clamping. The third embodiment is different from the first and second embodiments in the following points. Further, the other points are substantially the same as those of the first and second embodiments. Therefore, the different points will be described, and the same reference numerals will be given to the structural members that are substantially the same as the first and second embodiments, and the repetition of the description will be avoided.

即，如圖7所示，下模32具備將模腔底面部(第一、第二實施形態的模腔底面構件32c)和模腔側面部(第一、第二實施形態的模腔側面構件32d)形成為一體的結構。此外，在圖7所示的實施形態中，沒有必要必須使用離型膜60，但為了進一步優化密封件的脫模性，可以使用離型膜60。 That is, as shown in Fig. 7, the lower mold 32 includes a cavity bottom surface portion (the cavity bottom surface member 32c of the first and second embodiments) and a cavity side surface portion (the first and second embodiment cavity side members) 32d) is formed into a unitary structure. Further, in the embodiment shown in Fig. 7, it is not necessary to use the release film 60, but in order to further optimize the release property of the seal, the release film 60 may be used.

另外，在圖7的(2)所示的上下兩模31、32的合模最終位置，被設定為能夠藉由既定的樹脂壓力按壓下模模腔36a內的熔融樹脂材料 80a以成形既定的密封件厚度36d。例如，可將從下模32的型面(基板70中的電子零件71的安裝面)至模腔36a的底面為止的模腔36a的深度設定為既定的密封件的厚度(間隔)36d。 In addition, the final position of the mold clamping of the upper and lower molds 31 and 32 shown in (2) of FIG. 7 is set so that the molten resin material in the lower mold cavity 36a can be pressed by a predetermined resin pressure. 80a to form a predetermined seal thickness of 36d. For example, the depth of the cavity 36a from the profile of the lower mold 32 (the mounting surface of the electronic component 71 in the substrate 70) to the bottom surface of the cavity 36a can be set to a predetermined thickness (interval) 36d of the sealing member.

另外，與第一實施形態相同地，在上下兩模31、32的型面 之間構成有樹脂成形部36。即，在下模32的型面(上表面)設置有樹脂成形用的下模模腔36a。另外，在閉合上下兩模31、32的合模時(參照圖7的(2))，在該上下兩模31、32之間設置有用於使作為下模模腔36a內的部分熔融樹脂材料80a的剩餘樹脂80b向下模模腔36a的外部流出的狹窄間隙36c。另外，在下模模腔36a部周圍配置有通過狹窄間隙36c連通的剩餘樹脂收容部36b。另外，上下兩模31、32的合模最終位置的下模模腔36a的底面與大型基板70中的電子零件安裝面之間的間隔被設定為與用於對大型基板70的電子零件71進行樹脂密封的密封件厚度36d的間隔相等。進一步，用於使剩餘樹脂80b向下模模腔36a的外部流出的狹窄間隙36c設置在下模模腔36a與大型基板70中的電子零件71的安裝面這兩者之間，從而狹窄間隙36c成為使下模模腔36a和剩餘樹脂收容部36b連通的樹脂通道。另外，上述狹窄間隙36c設置為從下模模腔36a朝向剩餘樹脂80b的收容部36b變淺的傾斜面。 Further, in the same manner as in the first embodiment, the profiles of the upper and lower molds 31 and 32 are formed. A resin molded portion 36 is formed between them. That is, the lower mold cavity 36a for resin molding is provided on the profile (upper surface) of the lower mold 32. Further, when the mold clamping of the upper and lower molds 31, 32 is closed (refer to (2) of Fig. 7), a portion of the molten resin material for use in the lower mold cavity 36a is provided between the upper and lower molds 31, 32. The remaining resin 80b of 80a is narrowed into the narrow gap 36c of the outside of the cavity 36a. Further, a remaining resin accommodating portion 36b that communicates through the narrow gap 36c is disposed around the lower mold cavity 36a. Further, the interval between the bottom surface of the lower mold cavity 36a at the final position of the mold clamping of the upper and lower molds 31, 32 and the electronic component mounting surface in the large substrate 70 is set to be used for the electronic component 71 for the large substrate 70. The resin-sealed seals have an equal thickness of 36d. Further, a narrow gap 36c for allowing the remaining resin 80b to flow out of the outside of the lower mold cavity 36a is provided between the lower die cavity 36a and the mounting surface of the electronic component 71 in the large substrate 70, so that the narrow gap 36c becomes A resin passage that connects the lower mold cavity 36a and the remaining resin accommodation portion 36b. Further, the narrow gap 36c is provided as an inclined surface that is shallower from the lower mold cavity 36a toward the accommodating portion 36b of the remaining resin 80b.

在第三實施形態的結構中，在圖7的(2)所示的上下兩模 31、32的合模步驟中，進行使下模模腔36a內的剩餘樹脂80b向下模模腔36a的外部流出的剩餘樹脂80b的外部流出步驟，而且在經過該剩餘樹脂80b的外部流出步驟之後，進行對下模模腔36a內的熔融樹脂材料80a施加既定的樹脂壓力以將大型基板70上的電子零件71一併樹脂密封成形的樹脂密封 步驟。另外，在剩餘樹脂80b的外部流出步驟中，設定為通過設置在上下兩模31、32之間的狹窄間隙36c，將剩餘樹脂80b引導到設置在下模模腔36a部周圍的剩餘樹脂收容部36b內。進一步，在樹脂密封步驟中，上下兩模31、32的合模最終位置的下模模腔36a的底面與大型基板70中的電子零件安裝面之間的間隔被設定為與用於對大型基板70的電子零件71進行樹脂密封的密封件厚度36d的間隔相等。因此，能夠在下模模腔36a內得到既定的樹脂壓力，並且能夠將密封件厚度36d成形為既定的厚度。 In the configuration of the third embodiment, the upper and lower modes shown in (2) of Fig. 7 In the mold clamping step of 31, 32, the external outflow step of the remaining resin 80b for allowing the remaining resin 80b in the lower mold cavity 36a to flow out to the outside of the lower mold cavity 36a is performed, and the external flow out step is passed through the remaining resin 80b. Thereafter, a resin seal is applied to apply a predetermined resin pressure to the molten resin material 80a in the lower mold cavity 36a to collectively seal the electronic component 71 on the large substrate 70. step. Further, in the external outflow step of the remaining resin 80b, the remaining resin 80b is guided to the remaining resin accommodating portion 36b provided around the lower mold cavity 36a portion by the narrow gap 36c provided between the upper and lower dies 31, 32. Inside. Further, in the resin sealing step, the interval between the bottom surface of the lower mold cavity 36a at the final position of the mold clamping of the upper and lower molds 31, 32 and the electronic component mounting surface in the large substrate 70 is set to be used for the large substrate The electronic component 71 of 70 is equally sealed at a thickness of 36 d for resin sealing. Therefore, a predetermined resin pressure can be obtained in the lower mold cavity 36a, and the seal thickness 36d can be formed into a predetermined thickness.

在第三實施形態中，由於具備將模腔底面部和模腔側面部形 成為一體的下模32的結構，因此能夠同時進行由上下兩模31、32引起的合模作用和對下模模腔36a內的熔融樹脂材料80a的按壓作用。因此，藉由在低速且低壓下進行該上下兩模31、32的合模作用及對該熔融樹脂材料80a的按壓作用，從而能夠在低速且低壓下進行剩餘樹脂80b的外部流出步驟和在該外部流出步驟之後的樹脂密封步驟。進一步，在樹脂密封步驟中的上下兩模31、32的合模最終位置，大型基板70的電子零件71被關聯為能夠在既定厚度36d的密封件內進行樹脂密封。因此，在產生上下兩模31、32的合模作用時及該熔融樹脂材料80a的按壓作用時，能夠防止或抑制下模模腔36a內的熔融樹脂材料80a的流動作用，從而有效地防止起因於該熔融樹脂材料80a的流動作用的導線偏移等的發生。 In the third embodiment, the bottom surface portion of the cavity and the side surface of the cavity are formed. Since the structure of the lower mold 32 is integrated, the mold clamping action by the upper and lower molds 31 and 32 and the pressing action of the molten resin material 80a in the lower mold cavity 36a can be simultaneously performed. Therefore, by performing the mold clamping action of the upper and lower molds 31 and 32 and the pressing action on the molten resin material 80a at a low speed and a low pressure, the external outflow step of the remaining resin 80b can be performed at a low speed and a low pressure. The resin sealing step after the external outflow step. Further, in the final position where the upper and lower molds 31 and 32 are closed in the resin sealing step, the electronic component 71 of the large substrate 70 is associated with resin sealing in a sealing member having a predetermined thickness 36d. Therefore, when the mold clamping action of the upper and lower molds 31, 32 and the pressing action of the molten resin material 80a occur, the flow of the molten resin material 80a in the lower mold cavity 36a can be prevented or suppressed, thereby effectively preventing the cause. The occurrence of a wire shift or the like acting on the flow of the molten resin material 80a.

在第一至第三實施形態中，對使用電子零件之壓縮樹脂密封 裝置，並藉由所述的以定量定型化的片狀樹脂，將安裝在大型基板上的電子零件一併壓縮樹脂密封成形的情況進行了說明。然而在本發明中，例如可以將所需量的各種樹脂材料以平坦化的狀態(以均勻厚度的狀態)載置 到預剪切的離型膜上，並在該狀態下向下模模腔內供給該樹脂材料。另外在本發明中，例如可以將所需量的各種樹脂材料以平坦化的狀態(以均勻厚度的狀態)向覆蓋有離型膜的下模模腔內(或者沒有覆蓋離型膜的下模模腔內)供給。另外，可以使用顆粒狀的樹脂材料(顆粒樹脂)、粉末狀的樹脂材料(粉末樹脂)、液狀的樹脂材料(液狀樹脂)、糊狀的樹脂材料(糊狀樹脂)或片狀的樹脂材料(片狀樹脂)作為所述的各種樹脂材料。另外，可以使用具有透明性的樹脂材料、具有半透明性的樹脂材料或具有不透明性的樹脂材料作為所述的各種樹脂材料。 In the first to third embodiments, the compression resin seal using an electronic component In the apparatus, the electronic component mounted on the large substrate is collectively molded by compression resin sealing by the above-described sheet-shaped resin which is quantitatively shaped. However, in the present invention, for example, a desired amount of various resin materials may be placed in a flattened state (in a state of uniform thickness). The pre-cut release film is placed, and in this state, the resin material is supplied into the lower mold cavity. Further, in the present invention, for example, a desired amount of various resin materials may be in a flattened state (in a state of uniform thickness) in a lower mold cavity covered with a release film (or a lower mold not covered with a release film). Supply in the cavity. Further, a particulate resin material (particulate resin), a powdery resin material (powder resin), a liquid resin material (liquid resin), a paste-like resin material (paste resin) or a sheet-like resin can be used. A material (sheet resin) is used as the various resin materials described above. Further, as the various resin materials, a resin material having transparency, a resin material having translucency, or a resin material having opacity may be used.

另外，片狀的樹脂材料例如為，採用壓延輥等加熱所需量的 顆粒樹脂等樹脂材料並將其成形為片狀(平坦化狀態)並保形，並將所述樹脂材料冷卻而形成的材料。此外，可在藉由將顆粒樹脂的周面加熱以使其熔融，從而使顆粒的周面彼此接合並保持顆粒狀態的狀態下，將具有所需量的樹脂量的全部顆粒樹脂以平坦化的狀態進行保形(在顆粒之間具有間隙)。 Further, the sheet-like resin material is, for example, a heating amount required by a calender roll or the like. A resin material such as a pellet resin is formed into a sheet shape (flattened state) and conformed, and the resin material is cooled to form a material. Further, all of the particulate resin having a desired amount of resin can be planarized by heating the peripheral surface of the particulate resin to melt it so that the peripheral faces of the particles are joined to each other and maintained in a state of particles. The state is conformal (with a gap between the particles).

另外，在本發明中，可將所述的各種樹脂材料(顆粒樹脂、 粉末樹脂等)以所需量平坦化的狀態(設定為均勻厚度的狀態)，向預剪切的離型膜上、或者在覆蓋有離型膜的下模模腔內(無離型膜覆蓋的下模模腔內)供給。例如，可藉由樹脂材料的供給機構，連續地向下模模腔內撒布所需量的顆粒樹脂或粉末樹脂，並使得樹脂材料成為平坦化的狀態。 Further, in the present invention, the various resin materials (particle resin, Powder resin, etc.) in a state of being flattened in a desired amount (in a state of being set to a uniform thickness), onto a pre-shear release film, or in a lower mold cavity covered with a release film (without release film coverage) Supply in the lower mold cavity). For example, a desired amount of the particulate resin or the powder resin may be continuously sprayed into the cavity in the lower mold cavity by the supply mechanism of the resin material, and the resin material may be flattened.

另外，在本發明中，可將具有貫通孔的框架載置在預剪切的 離型膜上，並將所述的各種樹脂材料以平坦化的狀態向框架的凹部內(貫通孔)供給。在該狀態下，可以首先使框架的貫通孔與下模型面的模腔開 口部的位置對齊，其次藉由從模腔內強制地吸引排出空氣，從而將離型膜引入並覆蓋到模腔內，並藉由使樹脂材料降落而進行供給，從而將所需量的樹脂材料以平坦化的狀態向下模模腔內供給來形成。 In addition, in the present invention, the frame having the through hole can be placed on the pre-sheared On the release film, the various resin materials described above are supplied in a flat state to the inside of the recess (through hole) of the frame. In this state, the through hole of the frame and the cavity of the lower mold face can be opened first. The position of the mouth is aligned, and secondly, by forcibly sucking the exhaust air from the cavity, the release film is introduced and covered into the cavity, and is supplied by dropping the resin material, thereby supplying the required amount of resin. The material is formed in a flattened state by supplying it into the cavity.

本發明首先將樹脂材料(所述的各種樹脂材料)以平坦化的 狀態(以均勻的所需厚度)向壓縮成形用的下模內供給，其次，在進行壓縮成形時，將下模的模腔面與基板的電子安裝元件安裝面之間，即，將被壓縮成形的密封件的厚度設定為與樹脂材料的均勻的所需厚度相比更薄，並對下模模腔內的平坦化的樹脂材料進行加壓。因此，下模模腔內的熔融樹脂材料能夠通過狹路(狹窄間隙)向下模模腔的外部流出，並且能夠在低壓下對下模模腔內的樹脂進行加壓。此外，這被推測為是因為狹路被樹脂材料緩慢地堵塞，從而能夠在低壓下對下模模腔內施加所需的樹脂壓力。 The present invention first flattens a resin material (the various resin materials described) The state (with a uniform desired thickness) is supplied into the lower mold for compression molding, and secondly, when the compression molding is performed, the cavity surface of the lower mold and the electronic component mounting surface of the substrate are compressed, that is, will be compressed. The thickness of the formed seal is set to be thinner than the uniform desired thickness of the resin material, and pressurizes the flattened resin material in the lower mold cavity. Therefore, the molten resin material in the cavity of the lower mold can flow out through the narrow path (narrow gap) to the outside of the cavity, and the resin in the cavity of the lower cavity can be pressurized at a low pressure. Further, this is presumed to be because the narrow path is slowly clogged by the resin material, so that the required resin pressure can be applied to the lower cavity at a low pressure.

30‧‧‧壓縮成形用模具 30‧‧‧Compression molding die

31‧‧‧上模 31‧‧‧上模

31c‧‧‧基板設置塊 31c‧‧‧Substrate setting block

31d‧‧‧上模加熱用加熱器 31d‧‧‧Upper heater heating heater

32‧‧‧下模 32‧‧‧Down

32c‧‧‧模腔底面構件 32c‧‧‧ cavity cavity bottom member

32d‧‧‧模腔側面構件 32d‧‧‧cavity side members

32e‧‧‧彈性構件 32e‧‧‧Flexible components

32f‧‧‧下模加熱用加熱器 32f‧‧‧heater for lower mold heating

32g‧‧‧密封構件 32g‧‧‧ Sealing member

33‧‧‧樹脂成形部 33‧‧‧Resin Forming Department

33a‧‧‧下模模腔 33a‧‧‧Down mold cavity

33b‧‧‧剩餘樹脂收容部 33b‧‧‧Remaining resin accommodating department

33c‧‧‧狹窄間隙 33c‧‧‧ narrow gap

60‧‧‧離型膜 60‧‧‧ release film

70‧‧‧大型基板 70‧‧‧ Large substrate

71‧‧‧電子零件 71‧‧‧Electronic parts

80‧‧‧片狀樹脂(片狀樹脂材料) 80‧‧‧Flake resin (sheet resin material)

80a‧‧‧熔融樹脂材料 80a‧‧‧ molten resin material

80b‧‧‧剩餘樹脂 80b‧‧‧ Remaining resin

Claims (15)

一種電子零件之壓縮樹脂密封方法，包括：熔化步驟，使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使該基板的電子零件安裝面側朝下地向該上模的型面供給並使該基板固定，並且加熱供給到設置於該下模的型面且被離型膜覆蓋的下模模腔內的樹脂材料以使該樹脂材料熔化；其次，合模步驟，進行閉合該上模和下模的合模以使該上模側中的該基板的該電子零件浸漬在該下模模腔內的熔融樹脂材料中；及其次，密封步驟，藉由對該下模模腔內的熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將該基板上的該電子零件一併密封成形；其特徵在於：該合模步驟包括：使該下模模腔內的剩餘樹脂向該下模模腔的外部流出的剩餘樹脂的外部流出步驟；及在經過該剩餘樹脂的外部流出步驟之後，對該下模模腔內的熔融樹脂材料施加既定的樹脂壓力以將該基板上的電子零件一併樹脂密封成形的樹脂密封步驟；在該剩餘樹脂的外部流出步驟中，通過設置在該上模和下模之間的狹窄間隙，將該剩餘樹脂引導到設置在該下模模腔周圍的剩餘樹脂收容部內；在該樹脂密封步驟中，將該上模和下模的合模最終位置的該下模模腔的底面與該基板的電子零件安裝面之間的間隔設定為與用於對該基板的電子零件進行樹脂密封的密封件厚度的間隔相等。 A compression resin sealing method for an electronic component, comprising: a melting step of using a compression molding die composed of at least an upper mold and a lower mold, and mounting a substrate on which the electronic component is mounted with the electronic component mounting surface of the substrate facing downward The profile of the mold is supplied and fixed to the substrate, and the resin material supplied into the lower mold cavity provided on the profile of the lower mold and covered by the release film is heated to melt the resin material; secondly, the mold clamping step Closing the upper mold and the lower mold to close the electronic component of the substrate in the upper mold side in the molten resin material in the lower mold cavity; and secondly, sealing step by The molten resin material in the cavity of the lower mold is applied with a predetermined resin pressure, thereby sealingly molding the electronic component on the substrate together with the resin; characterized in that the clamping step comprises: remaining the cavity in the lower mold cavity An external outflow step of the remaining resin flowing out of the lower mold cavity; and applying the molten resin material in the lower mold cavity after the external outflow step of the remaining resin a predetermined resin pressure to seal the electronic parts on the substrate together by a resin sealing step; in the external outflow step of the remaining resin, the remaining gap is provided by the narrow gap between the upper mold and the lower mold The resin is guided into the remaining resin receiving portion disposed around the lower mold cavity; in the resin sealing step, the bottom surface of the lower mold cavity at the final position of the upper mold and the lower mold and the electronic component of the substrate The interval between the mounting faces is set to be equal to the interval of the thickness of the seal for resin sealing of the electronic components of the substrate. 一種電子零件之壓縮樹脂密封方法，包括：熔化步驟，使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使該基板的電子零件安裝面側朝下地向該上模的型面供給並使該基板固定，並且加熱供給到設置於該下模的型面的下模模腔內的樹脂材料以使該樹脂材料熔化；其次，合模步驟，進行閉合該上模和下模的合模以使該上模側中的該基板的電子零件浸漬在該下模模腔內的熔融樹脂材料中；及其次，密封步驟，藉由對該下模模腔內的該熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將該基板上的電子零件一併密封成形；其特徵在於：將該下模模腔的深度設定為與用於對該基板的電子零件進行樹脂密封的密封件厚度相等；該合模步驟包括：使該下模模腔內的剩餘樹脂向該下模模腔的外部流出的剩餘樹脂的外部流出步驟；及在經過該剩餘樹脂的外部流出步驟之後，對該下模模腔內的熔融樹脂材料施加既定的樹脂壓力以將該基板上的電子零件一併樹脂密封成形的樹脂密封步驟；在該剩餘樹脂的外部流出步驟中，通過設置在該上模和下模之間的狹窄間隙，將該剩餘樹脂引導到設置在該下模模腔周圍的剩餘樹脂收容部內；在該樹脂密封步驟中，將該上模和下模的合模最終位置的該下模模腔的底面與該基板的電子零件安裝面之間的間隔設定為與用於對該基板的電 子零件進行樹脂密封的密封件厚度的間隔相等。 A compression resin sealing method for an electronic component, comprising: a melting step of using a compression molding die composed of at least an upper mold and a lower mold, and mounting a substrate on which the electronic component is mounted with the electronic component mounting surface of the substrate facing downward The profile of the mold is supplied and fixed to the substrate, and the resin material supplied into the lower mold cavity provided in the profile of the lower mold is heated to melt the resin material; secondly, the mold clamping step is performed to close the upper mold And clamping the lower mold such that the electronic component of the substrate in the upper mold side is immersed in the molten resin material in the lower mold cavity; and secondly, the sealing step is performed by the lower mold cavity The molten resin material applies a predetermined resin pressure to seal the electronic components on the substrate together by using a resin; and the depth of the lower mold cavity is set to be resin-sealed with the electronic component for the substrate The sealing member has the same thickness; the clamping step includes: an external outflow step of the remaining resin flowing out of the lower mold cavity to the outside of the lower cavity; and After the external outflow step of the remaining resin, a resin sealing step of applying a predetermined resin pressure to the molten resin material in the lower mold cavity to collectively seal the electronic components on the substrate; an external outflow step of the remaining resin The remaining resin is guided into the remaining resin receiving portion disposed around the lower mold cavity by a narrow gap provided between the upper mold and the lower mold; in the resin sealing step, the upper mold and the lower portion are The interval between the bottom surface of the lower mold cavity and the electronic component mounting surface of the substrate at the final position of the mold clamping is set to be the same as the power for the substrate The thickness of the seals of the sub-parts for resin sealing is equal. 如申請專利範圍第1或2項之電子零件之壓縮樹脂密封方法，其中，在該樹脂密封步驟中，進行在成形壓力為0.2942MPa以上的低壓下的壓縮樹脂密封成形。 A method of compressing a resin sealing method for an electronic component according to claim 1 or 2, wherein in the resin sealing step, compression resin sealing molding at a low pressure of a molding pressure of 0.2942 MPa or more is performed. 如申請專利範圍第1或2項之電子零件之壓縮樹脂密封方法，其中，向該下模模腔內供給的該樹脂材料是片狀樹脂材料，該片狀樹脂材料藉由將所需量的樹脂平坦化而具備所需的保形性，並且被成形為與俯視觀察下的該下模模腔的形狀對應且能夠以嵌合在該下模模腔內的狀態進行供給的形狀。 A method of compressing a resin sealing method for an electronic component according to claim 1 or 2, wherein the resin material supplied into the lower mold cavity is a sheet-like resin material by using a desired amount The resin is flattened to have a desired shape retaining property, and is formed into a shape that can be supplied in a state of being fitted into the lower mold cavity in accordance with the shape of the lower cavity in a plan view. 如申請專利範圍第1或2項之電子零件之壓縮樹脂密封方法，其中，向該下模模腔內供給的該樹脂材料為將所需量的樹脂平坦化而供給的樹脂材料。 The method of sealing a resin according to claim 1 or 2, wherein the resin material supplied into the lower mold cavity is a resin material supplied by flattening a required amount of resin. 如申請專利範圍第5項之電子零件之壓縮樹脂密封方法，其中，該樹脂材料為選自顆粒狀的樹脂材料、粉末狀的樹脂材料、液狀的樹脂材料和糊狀的樹脂材料中的樹脂材料。 The method of compressing a resin sealing method for an electronic component according to the fifth aspect of the invention, wherein the resin material is a resin selected from the group consisting of a granular resin material, a powdery resin material, a liquid resin material, and a paste resin material. material. 如申請專利範圍第1項之電子零件之壓縮樹脂密封方法，其中，在使用該離型膜覆蓋該下模模腔之前，將所需量的樹脂平坦化而具備所需的保形性的片狀樹脂材料載置在該離型膜上，並且藉由將該狀態下的該片狀樹脂材料和該離型膜供給到該下模模腔內，從而進行使用該離型膜的該下模模腔的覆蓋和向該下模模腔內的該片狀樹脂材料的供給。 A method of compressing a resin sealing method for an electronic component according to the first aspect of the invention, wherein, before the lower mold cavity is covered with the release film, a sheet having a desired amount of resin is flattened to have a desired shape retention property. The resin material is placed on the release film, and the lower mold of the release film is used by supplying the sheet-like resin material and the release film in this state into the lower mold cavity. Covering of the cavity and supply of the sheet-like resin material into the lower cavity. 如申請專利範圍第1項之電子零件之壓縮樹脂密封方法，其中，該樹脂材料為將所需量的樹脂平坦化而具備所需的保形性的片狀樹脂材料； 在包括該下模模腔的該下模的型面上張設該離型膜，經由該離型膜向該下模模腔供給該片狀樹脂材料。 The method of sealing a resin sealing method for an electronic component according to the first aspect of the invention, wherein the resin material is a sheet-like resin material having a desired shape retaining property by flattening a required amount of the resin; The release film is stretched on a profile of the lower mold including the lower mold cavity, and the sheet-shaped resin material is supplied to the lower mold cavity through the release film. 一種電子零件之壓縮樹脂密封裝置，使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使該基板的電子零件安裝面側朝下地向該上模的型面供給並使該基板固定，並且加熱供給到設置於該下模的型面且被離型膜覆蓋的下模模腔內的樹脂材料以使該樹脂材料熔化，其次，進行將該上模和下模閉合的合模以使該上模側中的該基板的電子零件浸漬在該下模模腔內的熔融樹脂材料中，其次，藉由對該下模模腔內的熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將安裝在該基板上的電子零件一併密封成形；其特徵在於：在該上模和下模之間，設置有在將該上模和下模閉合的合模時用於使成為該下模模腔內的熔融樹脂材料的一部分的剩餘樹脂向該下模模腔的外部流出的狹窄間隙；在該下模模腔部周圍配置有通過該狹窄間隙連通的剩餘樹脂收容部；該上模和下模的合模最終位置的該下模模腔的底面與該基板的電子零件安裝面之間的間隔被設定為與用於對該基板的電子零件進行樹脂密封的密封件厚度的間隔相等。 A compression resin sealing device for an electronic component, which uses a mold for compression molding including at least an upper mold and a lower mold, and supplies a substrate on which an electronic component is mounted such that an electronic component mounting surface of the substrate faces downward to a profile of the upper mold And fixing the substrate, and heating the resin material supplied into the lower mold cavity provided on the profile of the lower mold and covered by the release film to melt the resin material, and secondly, performing the upper and lower molds Closing the mold so that the electronic component of the substrate in the upper mold side is immersed in the molten resin material in the lower mold cavity, and secondly, by applying a predetermined resin to the molten resin material in the lower mold cavity Pressure to seal the electronic components mounted on the substrate together by using a resin; characterized in that between the upper mold and the lower mold, a mold clamping for closing the upper mold and the lower mold is provided a narrow gap in which the remaining resin which is a part of the molten resin material in the lower mold cavity flows out to the outside of the lower mold cavity; and a remaining tree connected through the narrow gap is disposed around the lower cavity portion a receiving portion; an interval between a bottom surface of the lower mold cavity at a final position where the upper mold and the lower mold is closed and an electronic component mounting surface of the substrate are set to be resin-sealed with the electronic component for the substrate The seals are equally spaced apart in thickness. 一種電子零件之壓縮樹脂密封裝置，使用至少由上模和下模構成的壓縮成形用模具，將安裝有電子零件之基板使該基板的電子零件安裝面側朝下地向該上模的型面供給並使該基板固定，並且加熱供給到設置於該下模的型面的下模模腔內的樹脂材料以使該樹脂材料熔化，其次，進行閉合該上模和下模的合模以使該上模側中的該基板的該電子零件浸漬在該下 模模腔內的熔融樹脂材料中，其次，藉由對該下模模腔內的該熔融樹脂材料施加既定的樹脂壓力，從而利用樹脂將安裝在該基板上的電子零件一併密封成形；其特徵在於：該下模模腔的深度被設定為與用於對該基板的該電子零件進行樹脂密封的密封件厚度相等；在該上模和下模之間，設置有在閉合該上模和下模的合模時用於使成為該下模模腔內的熔融樹脂材料的一部分的剩餘樹脂向該下模模腔的外部流出的狹窄間隙；在該下模模腔周圍配置有通過該狹窄間隙連通的剩餘樹脂收容部；該上模和下模的合模最終位置的該下模模腔的底面與該基板的電子零件安裝面之間的間隔被設定為與用於對該基板的該電子零件進行樹脂密封的密封件厚度的間隔相等。 A compression resin sealing device for an electronic component, which uses a mold for compression molding including at least an upper mold and a lower mold, and supplies a substrate on which an electronic component is mounted such that an electronic component mounting surface of the substrate faces downward to a profile of the upper mold And fixing the substrate, and heating the resin material supplied into the lower mold cavity provided in the profile of the lower mold to melt the resin material, and secondly, closing the mold of the upper mold and the lower mold to make the mold The electronic component of the substrate in the upper mold side is immersed under the In the molten resin material in the cavity, secondly, by applying a predetermined resin pressure to the molten resin material in the cavity of the lower mold, the electronic components mounted on the substrate are collectively sealed by the resin; Characterizing that the depth of the lower mold cavity is set to be equal to the thickness of the seal for resin sealing the electronic component of the substrate; between the upper mold and the lower mold, the upper mold is closed a narrow gap for discharging the remaining resin which is a part of the molten resin material in the lower mold cavity to the outside of the lower mold cavity during mold clamping; a narrow passage is arranged around the lower mold cavity a remaining resin receiving portion communicating with the gap; an interval between a bottom surface of the lower mold cavity at a final position of the mold clamping of the upper and lower molds and an electronic component mounting surface of the substrate is set to be used for the substrate The thickness of the seals for resin sealing of electronic parts is equal. 如申請專利範圍第9或10項之電子零件之壓縮樹脂密封裝置，其中，用於使該剩餘樹脂向該下模模腔的外部流出的狹窄間隙為設置在該下模的型面與該基板的該電子零件安裝面之間並使該下模模腔和該剩餘樹脂收容部連通的樹脂通道；該樹脂通道具備從該下模模腔朝向該剩餘樹脂收容部變淺的傾斜面。 A compression resin sealing device for an electronic component according to claim 9 or 10, wherein a narrow gap for discharging the remaining resin to the outside of the lower mold cavity is a profile provided on the lower mold and the substrate A resin passage between the mounting faces of the electronic components and the lower die cavity and the remaining resin receiving portion; the resin passage having an inclined surface that becomes shallower from the lower die cavity toward the remaining resin receiving portion. 如申請專利範圍第9或10項之電子零件之壓縮樹脂密封裝置，其中，用於使該剩餘樹脂向該下模模腔的外部流出的狹窄間隙設置在該下模模腔與該基板的該電子零件安裝面之間；該剩餘樹脂收容部包括：該狹窄間隙；及 位在該狹窄間隙與配置在該下模模腔周圍的樹脂防漏用構件之間的空間部。 A compression resin sealing device for an electronic component according to claim 9 or 10, wherein a narrow gap for discharging the remaining resin to the outside of the lower cavity is provided in the lower cavity and the substrate Between the mounting faces of the electronic components; the remaining resin receiving portion includes: the narrow gap; The space portion between the narrow gap and the resin leakage preventing member disposed around the lower mold cavity. 如申請專利範圍第10項之電子零件之壓縮樹脂密封裝置，其中，該樹脂防漏用構件兼作用於在該上模和下模合模時限制該上模和下模的型面之間的距離的定位構件。 The compression resin sealing device for an electronic component according to claim 10, wherein the resin leakage preventing member acts to limit the profile between the upper die and the lower die when the upper die and the lower die are closed. The positioning member of the distance. 如申請專利範圍第7項之電子零件之壓縮樹脂密封裝置，其中，該下模具備分割為模腔底面構件和模腔側面構件的結構；將該模腔底面構件和該模腔側面構件能夠相對上下移動地嵌合而構成。 The compression resin sealing device for an electronic component according to claim 7, wherein the lower mold has a structure divided into a cavity bottom member and a cavity side member; the cavity bottom member and the cavity side member are opposite to each other; It is configured by fitting up and down. 如申請專利範圍第8項之電子零件之壓縮樹脂密封裝置，其中，該下模具備將模腔底面部和模腔側面部形成為一體的結構。 The compression resin sealing device for an electronic component according to the eighth aspect of the invention, wherein the lower mold has a structure in which a bottom surface portion of the cavity and a side surface portion of the cavity are integrally formed.
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