KR20140066080A - 배열용 마스크 - Google Patents

배열용 마스크 Download PDF

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Publication number
KR20140066080A
KR20140066080A KR1020130096587A KR20130096587A KR20140066080A KR 20140066080 A KR20140066080 A KR 20140066080A KR 1020130096587 A KR1020130096587 A KR 1020130096587A KR 20130096587 A KR20130096587 A KR 20130096587A KR 20140066080 A KR20140066080 A KR 20140066080A
Authority
KR
South Korea
Prior art keywords
mask
opening
shape
work
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130096587A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 고바야시
히로히토 다마루
Original Assignee
히다치 막셀 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 막셀 가부시키가이샤 filed Critical 히다치 막셀 가부시키가이샤
Publication of KR20140066080A publication Critical patent/KR20140066080A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/285—Alignment aids, e.g. alignment marks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020130096587A 2012-11-22 2013-08-14 배열용 마스크 Ceased KR20140066080A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-256573 2012-11-22
JP2012256573A JP6150500B2 (ja) 2012-11-22 2012-11-22 配列用マスク

Publications (1)

Publication Number Publication Date
KR20140066080A true KR20140066080A (ko) 2014-05-30

Family

ID=50803223

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130096587A Ceased KR20140066080A (ko) 2012-11-22 2013-08-14 배열용 마스크

Country Status (3)

Country Link
JP (1) JP6150500B2 (https=)
KR (1) KR20140066080A (https=)
CN (1) CN103839843A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201602715A (zh) * 2014-07-07 2016-01-16 日立麥克賽爾股份有限公司 配列用遮罩及其製造方法
JP6381322B2 (ja) * 2014-07-07 2018-08-29 マクセルホールディングス株式会社 配列用マスク
TWI582873B (zh) * 2015-02-26 2017-05-11 Hitachi Maxell A masking method for manufacturing the same, and a method of manufacturing the solder bump
CN106981428B (zh) * 2016-01-19 2022-05-24 麦克赛尔株式会社 配列用掩膜及其制造方法、焊料凸块的形成方法
JP2018170529A (ja) * 2018-07-31 2018-11-01 マクセルホールディングス株式会社 配列用マスク
JP7256083B2 (ja) * 2019-07-02 2023-04-11 マクセル株式会社 配列用マスク
TWI910094B (zh) * 2018-08-09 2026-01-01 日商麥克賽爾股份有限公司 配列用遮罩
JP7170456B2 (ja) * 2018-08-09 2022-11-14 マクセル株式会社 配列用マスク

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3497550B2 (ja) * 1994-03-14 2004-02-16 株式会社東芝 バンプの形成方法
JPH08264932A (ja) * 1995-03-23 1996-10-11 Hitachi Techno Eng Co Ltd はんだバンプ形成法
JP2004253770A (ja) * 2003-01-31 2004-09-09 Hitachi Metals Ltd 導電性ボールの配列方法および配列装置
JP2009182068A (ja) * 2008-01-30 2009-08-13 Kyushu Hitachi Maxell Ltd 配列用マスク及びその製造方法
JP2012227466A (ja) * 2011-04-22 2012-11-15 Bonmaaku:Kk ボール搭載マスク

Also Published As

Publication number Publication date
CN103839843A (zh) 2014-06-04
JP6150500B2 (ja) 2017-06-21
JP2014107282A (ja) 2014-06-09

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