KR20130102577A - 기판 가열 장치 - Google Patents

기판 가열 장치 Download PDF

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Publication number
KR20130102577A
KR20130102577A KR1020137008445A KR20137008445A KR20130102577A KR 20130102577 A KR20130102577 A KR 20130102577A KR 1020137008445 A KR1020137008445 A KR 1020137008445A KR 20137008445 A KR20137008445 A KR 20137008445A KR 20130102577 A KR20130102577 A KR 20130102577A
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KR
South Korea
Prior art keywords
zone
susceptor
substrate
thickness
central
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137008445A
Other languages
English (en)
Korean (ko)
Inventor
로랑 데스폰트
마르쿠스 포펠러
랄프 슈몰
Original Assignee
텔 쏠라 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 텔 쏠라 아게 filed Critical 텔 쏠라 아게
Publication of KR20130102577A publication Critical patent/KR20130102577A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020137008445A 2010-09-03 2011-09-02 기판 가열 장치 Withdrawn KR20130102577A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37987610P 2010-09-03 2010-09-03
US61/379,876 2010-09-03
PCT/EP2011/065168 WO2012028704A1 (en) 2010-09-03 2011-09-02 Substrate heating device

Publications (1)

Publication Number Publication Date
KR20130102577A true KR20130102577A (ko) 2013-09-17

Family

ID=44735886

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137008445A Withdrawn KR20130102577A (ko) 2010-09-03 2011-09-02 기판 가열 장치

Country Status (5)

Country Link
EP (1) EP2612351A1 (https=)
JP (1) JP2013538455A (https=)
KR (1) KR20130102577A (https=)
CN (1) CN103081084A (https=)
WO (1) WO2012028704A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103614709B (zh) * 2013-12-12 2015-10-07 济南大学 用于mocvd反应室的组合基座式电磁加热装置
DE102016111236A1 (de) * 2016-06-20 2017-12-21 Heraeus Noblelight Gmbh Substrat-Trägerelement für eine Trägerhorde, sowie Trägerhorde und Vorrichtung mit dem Substrat-Trägerelement
US10655226B2 (en) * 2017-05-26 2020-05-19 Applied Materials, Inc. Apparatus and methods to improve ALD uniformity
KR102263718B1 (ko) * 2019-06-10 2021-06-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN110396680A (zh) * 2019-07-19 2019-11-01 西安奕斯伟硅片技术有限公司 一种外延反应设备
CN111694181B (zh) * 2020-07-07 2022-06-21 中航华东光电有限公司 低温均匀加热的液晶屏组件方法
CN117737692A (zh) * 2022-09-14 2024-03-22 中微半导体设备(上海)股份有限公司 一种温度控制系统、化学气相沉积设备及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054688A (en) * 1997-06-25 2000-04-25 Brooks Automation, Inc. Hybrid heater with ceramic foil serrated plate and gas assist
US6399926B2 (en) * 2000-04-03 2002-06-04 Sigmameltec Ltd. Heat-treating apparatus capable of high temperature uniformity
JP2002151412A (ja) * 2000-10-30 2002-05-24 Applied Materials Inc 半導体製造装置
US6962732B2 (en) 2001-08-23 2005-11-08 Applied Materials, Inc. Process for controlling thin film uniformity and products produced thereby
US7618494B2 (en) * 2003-08-18 2009-11-17 Tokyo Electron Limited Substrate holding structure and substrate processing device
JP2006137650A (ja) * 2004-11-15 2006-06-01 Taiheiyo Cement Corp 軽量高剛性セラミック部材
JP4756695B2 (ja) * 2006-02-20 2011-08-24 コバレントマテリアル株式会社 面状ヒータ

Also Published As

Publication number Publication date
CN103081084A (zh) 2013-05-01
WO2012028704A1 (en) 2012-03-08
JP2013538455A (ja) 2013-10-10
EP2612351A1 (en) 2013-07-10

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000