CN103081084A - 基板加热装置 - Google Patents

基板加热装置 Download PDF

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Publication number
CN103081084A
CN103081084A CN2011800426244A CN201180042624A CN103081084A CN 103081084 A CN103081084 A CN 103081084A CN 2011800426244 A CN2011800426244 A CN 2011800426244A CN 201180042624 A CN201180042624 A CN 201180042624A CN 103081084 A CN103081084 A CN 103081084A
Authority
CN
China
Prior art keywords
region
substrate
zone
susceptor
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800426244A
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English (en)
Chinese (zh)
Inventor
洛朗·德蓬
马库斯·波佩尔勒
拉尔夫·施莫尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TEL Solar AG
Original Assignee
Oerlikon Solar AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Solar AG filed Critical Oerlikon Solar AG
Publication of CN103081084A publication Critical patent/CN103081084A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2011800426244A 2010-09-03 2011-09-02 基板加热装置 Pending CN103081084A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37987610P 2010-09-03 2010-09-03
US61/379,876 2010-09-03
PCT/EP2011/065168 WO2012028704A1 (en) 2010-09-03 2011-09-02 Substrate heating device

Publications (1)

Publication Number Publication Date
CN103081084A true CN103081084A (zh) 2013-05-01

Family

ID=44735886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800426244A Pending CN103081084A (zh) 2010-09-03 2011-09-02 基板加热装置

Country Status (5)

Country Link
EP (1) EP2612351A1 (https=)
JP (1) JP2013538455A (https=)
KR (1) KR20130102577A (https=)
CN (1) CN103081084A (https=)
WO (1) WO2012028704A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109314073A (zh) * 2016-06-20 2019-02-05 贺利氏特种光源有限公司 用于支承架的基板支承元件
CN110396680A (zh) * 2019-07-19 2019-11-01 西安奕斯伟硅片技术有限公司 一种外延反应设备
CN111694181A (zh) * 2020-07-07 2020-09-22 中航华东光电有限公司 低温均匀加热的液晶屏组件方法
CN112071773A (zh) * 2019-06-10 2020-12-11 细美事有限公司 用于处理基板的装置和用于处理装置的方法
CN117737692A (zh) * 2022-09-14 2024-03-22 中微半导体设备(上海)股份有限公司 一种温度控制系统、化学气相沉积设备及方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103614709B (zh) * 2013-12-12 2015-10-07 济南大学 用于mocvd反应室的组合基座式电磁加热装置
US10655226B2 (en) * 2017-05-26 2020-05-19 Applied Materials, Inc. Apparatus and methods to improve ALD uniformity

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000058048A1 (en) * 1999-03-29 2000-10-05 Brooks Automation, Inc. Hybrid heater with ceramic foil serrated plate and gas assist
JP2006137650A (ja) * 2004-11-15 2006-06-01 Taiheiyo Cement Corp 軽量高剛性セラミック部材
US20060191639A1 (en) * 2003-08-18 2006-08-31 Sumi Tanaka Substrate holding structure and substrate processing device
CN101390444A (zh) * 2006-02-20 2009-03-18 科发伦材料株式会社 面状加热器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399926B2 (en) * 2000-04-03 2002-06-04 Sigmameltec Ltd. Heat-treating apparatus capable of high temperature uniformity
JP2002151412A (ja) * 2000-10-30 2002-05-24 Applied Materials Inc 半導体製造装置
US6962732B2 (en) 2001-08-23 2005-11-08 Applied Materials, Inc. Process for controlling thin film uniformity and products produced thereby

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000058048A1 (en) * 1999-03-29 2000-10-05 Brooks Automation, Inc. Hybrid heater with ceramic foil serrated plate and gas assist
US20060191639A1 (en) * 2003-08-18 2006-08-31 Sumi Tanaka Substrate holding structure and substrate processing device
JP2006137650A (ja) * 2004-11-15 2006-06-01 Taiheiyo Cement Corp 軽量高剛性セラミック部材
CN101390444A (zh) * 2006-02-20 2009-03-18 科发伦材料株式会社 面状加热器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109314073A (zh) * 2016-06-20 2019-02-05 贺利氏特种光源有限公司 用于支承架的基板支承元件
CN112071773A (zh) * 2019-06-10 2020-12-11 细美事有限公司 用于处理基板的装置和用于处理装置的方法
CN110396680A (zh) * 2019-07-19 2019-11-01 西安奕斯伟硅片技术有限公司 一种外延反应设备
CN111694181A (zh) * 2020-07-07 2020-09-22 中航华东光电有限公司 低温均匀加热的液晶屏组件方法
CN117737692A (zh) * 2022-09-14 2024-03-22 中微半导体设备(上海)股份有限公司 一种温度控制系统、化学气相沉积设备及方法

Also Published As

Publication number Publication date
WO2012028704A1 (en) 2012-03-08
JP2013538455A (ja) 2013-10-10
KR20130102577A (ko) 2013-09-17
EP2612351A1 (en) 2013-07-10

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Application publication date: 20130501