KR20130102423A - Semiconductor material sawing device - Google Patents

Abstract

PURPOSE: A semiconductor material sawing device is provided to easily perform a cutting process by adding a simple conversion unit even if a semiconductor material supply device is changed. CONSTITUTION: A pickup part (200) includes at least one pickup part. A transfer part (300) transfers the pickup part in a predetermined direction. A material supply part includes at least one material accommodating groove. The material supply part includes at least one feeder. A sawing part (500) includes at least one chuck table and at least one sawing unit.

Description

Semiconductor Material Sawing Device

The present invention relates to a semiconductor material cutting device. The present invention relates to a semiconductor material cutting device that can be applied respectively when the cutting target semiconductor materials are supplied in a tray method or a cassette magazine method.

In general, a semiconductor package is manufactured by bonding a circuit portion or lead frame including a transistor, a capacitor, and the like to a substrate made of silicon, and molding the molding with a molding material or the like so that the semiconductor material is protected from the external environment.

The semiconductor material (or semiconductor package) manufactured as described above is aligned with a vision inspection device while seated on a chuck table, and then transferred to a semiconductor material sawing device to be singulated or cut separately. Cutting or sawing).

When a plurality of circuits are provided on one substrate, the semiconductor package may be configured as one semiconductor package through a singulation process after molding.

Recently, when the semiconductor material to be singulated is small in size or the edge portion of the semiconductor material is not sufficiently secured, it is difficult to perform the singulation operation directly from the molded semiconductor material to each semiconductor package. Can be. In other words, semiconductor singulation may be performed in multiple stages.

For example, the edge portion of the semiconductor material may be first removed, or the size of the singulation target semiconductor material may be minute, so that the singulation or cutting process may be required in stages.

Therefore, if the semiconductor material to be cut has already been subjected to a preliminary cutting process, the method of supplying the semiconductor material to be cut may include a tray having a seating area in which each semiconductor material is seated, rather than a conventional magazine or the like. It may be easy to receive the semiconductor material through.

However, in the case where the semiconductor material to be cut is supplied through a cassette magazine or a tray, separately providing the semiconductor material cutting device according to the supply means of the semiconductor material is wasteful and increases the cost of the semiconductor manufacturing process. It can be a factor.

The present invention is configured to perform a cutting process by adding a simple conversion unit to the semiconductor material cutting device even when the supply means of the cutting target semiconductor material is changed, solving the problem of providing a semiconductor material cutting device with improved utilization and efficiency Let's do the task.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention provides the pick-up part provided with the at least 1 pick-up unit for picking up a semiconductor material, the pick-up part mounted, the conveying part which conveys a said pick-up part to a predetermined direction, and the pick-up part semiconductor In order to supply the material, at least one having at least one material receiving groove in which the semiconductor material is accommodated and transferring at least one tray of a plurality of trays stacked or to be stacked in a direction perpendicular to the transfer direction of the pickup portion. Provided is a semiconductor material cutting device including a material supply unit including at least one feeder, at least one chuck table on which the semiconductor material supplied from the material supply unit is seated, and a cutting unit having at least one cutting unit.

The material supply unit may include a tray supply unit in which trays containing semiconductor materials are stacked, and a tray transport unit in which trays in which semiconductor materials are picked up by the pickup unit are stacked. And a first feeder for transferring the tray from the tray supply unit to a pick-up position, and a second feeder for transferring the tray, to which the semiconductor material is picked up by the pickup unit, to the tray transporting unit.

The material supply unit supports the trays so that the trays are discharged from the tray supply unit to the supply or tray transport unit by the first and second feeders, respectively, and the first guide is disposed in a direction perpendicular to the transport direction of the pickup unit. A rail and a second guide rail can be provided.

Here, the material supply unit may further include a tray pickup unit for picking up the tray, the pickup of the semiconductor material by the pickup unit from the first guide rail to be seated on the second guide rail.

In this case, a seating block having a material loading groove is formed between the material supply part and the chuck table of the cutting part, and the pickup part may transfer the semiconductor material picked up from the material supply part to the chuck table via the seating block. have.

In addition, the seating block may include a driving means to be driven in a direction perpendicular to the transfer direction of the pickup by the transfer unit.

The number of material seating portions and the material loading grooves of the seating block formed to seat the semiconductor material provided on the chuck table may be a divisor of the number of material receiving grooves of the tray.

Here, the pick-up unit may include a unit pick-up unit for picking up each semiconductor material and a multi pick-up unit for picking up a plurality of semiconductor packages together.

In this case, the pickup unit may include a vision unit for photographing the semiconductor material accommodated in the material receiving groove of the tray or the semiconductor material loaded in the material loading groove of the seating block to obtain position information thereof.

In addition, a cassette magazine in which semiconductor materials are stacked and supplied to one side of the semiconductor material supply unit may be detachably added in a module form.

Here, the feeder of any one of the first and second feeders of the material supply unit may be mounted to guide the semiconductor material supplied in a direction parallel to the transport direction of the pickup unit from a cassette magazine in which semiconductor materials are stacked and supplied. The conversion unit may be fastened by a fastening member.

In this case, fastening holes are provided in the feeder and the conversion unit, respectively, and the fastening member may be fastened together to the fastening hole of the feeder and the conversion unit.

The conversion unit may include a pair of guide rails, a support plate on which the guide rails are mounted, and a driving means for adjusting a distance between the guide rails.

Here, the pair of guide rails may be independently driven from each other to provide individual driving means on each guide rail so as to adjust the width of the pair of guide rails and the position of each guide rail.

In this case, the driving means approaches or is spaced apart by displacing the pair of guide rails by the same distance, and the position of the pair of guide rails can be changed by moving the feeder to which the conversion unit is fastened.

The pick-up unit may further include a gripper for drawing a tip of the semiconductor material of the cassette magazine to draw the material to the guide rail unit.

Here, a vision unit provided below the transfer path of the semiconductor material transferred from the material supply unit to the chuck table of the cutting unit through the pickup or the guide rail to obtain the position information of the semiconductor material on the pickup unit or the guide rail. can do.

According to the semiconductor material cutting device according to the present invention, even when the supply means of the semiconductor material is changed, a simple conversion unit can be added to the semiconductor material cutting device to perform the cutting process.

In addition, according to the semiconductor material cutting device according to the present invention, even if the supply means of the semiconductor material is switched according to the tray method or the cassette magazine method, it is possible to maximize the utility of the equipment by mounting the conversion unit.

In addition, according to the semiconductor material cutting device according to the present invention, the cutting process is possible even if the supply means of the semiconductor material is switched according to the tray method or the cassette magazine method can prevent the overlapping investment and improve the price competitiveness of the semiconductor manufacturing process. .

1 shows a plan view of a semiconductor material cutting device according to the present invention.
2 shows a conversion unit mounted to a feeder of a semiconductor material cutting device according to the present invention.
3 is a plan view showing a state in which a conversion unit is mounted in the semiconductor material cutting device according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

1 shows a plan view of a semiconductor material cutting device 1000 according to the present invention.

In the semiconductor material cutting apparatus 1000 according to the present invention, a pickup unit 200 having at least one pickup unit for picking up a semiconductor material, the pickup unit 200 is mounted, and the pickup unit 200 is mounted. In order to supply the semiconductor material to the transfer part 300 and the pick-up part 200 to be transferred in a predetermined direction, at least one material receiving groove (sp) for accommodating the semiconductor material is provided and stacked or stacked The material supply unit 100 and at least one feeder for transporting any one tray (t) of the two trays in the direction perpendicular to the transfer direction of the pickup unit 200, supplied from the material supply unit 100 It may include at least one chuck table 510 is provided with at least one mounting portion (not shown) on which the semiconductor material is seated and a cut portion 500 provided with at least one cutting unit 520. have.

Unlike the conventional cutting device, the semiconductor material cutting device 1000 according to the present invention may receive a cutting target semiconductor material ss through a tray t for mounting a plurality of semiconductor materials.

The semiconductor material cutting device 1000 includes a pickup part 200. The pickup unit 200 serves to transfer the semiconductor material to the cutting unit side described later by the transfer unit 300 while picking up the semiconductor material from the material supply unit 100 to which the semiconductor material is supplied.

The pickup unit 200 may include a unit pickup unit 220 for picking up each semiconductor package and a multi pickup unit 230 for picking up a plurality of semiconductor packages together.

The unit pickup unit 220 may be provided to individually pick up the semiconductor material mounted on the tray t. The multi pickup unit 230 provided in the pickup unit 200 together with the unit pickup unit 220 may be provided to pick up a plurality of semiconductor materials together. The multi pickup unit 230 will be described later.

In addition, the pickup unit 200 may be provided with a vision unit 240 for checking the alignment of the semiconductor material to be cut. Specifically, the pickup unit 200 is a material receiving groove (sp) provided for accommodating the semiconductor material of the tray (t) or a material loading groove provided for loading the semiconductor material of the seating block 400 ( And a vision unit 240 for photographing the semiconductor material accommodated or loaded in the 410 to obtain location information thereof.

Therefore, the vision unit 240 collects information on the misalignment of the semiconductor material in the pick-up process or the seating process, and may correct this in the seating process or the cutting process.

The semiconductor material cutting device 1000 according to the present invention feeds a tray (t) containing at least one semiconductor material to a pickup position of the pickup unit 200 or a tray on which pickup is completed by the pickup unit 200. It may include a pair of parallel feeders for conveying to the unloading position.

In detail, the material supply unit 100 includes a tray supply unit 180 in which a tray containing semiconductor material is stacked, and a tray transport unit 190 in which a tray in which semiconductor materials are picked up by the pickup unit 200 is stacked. The feeder may include a first feeder 120 for transferring the tray from the tray supply unit 180 to a pickup position of the pickup unit, and a tray in which semiconductor material is picked up by the pickup unit 200. The second feeder 140 may be transferred to 190.

The pair of feeders 120 and 140 tray a tray in which the pickup of the semiconductor material is completed by the first feeder 120 and the pickup unit 200 for drawing out or towing a tray containing the semiconductor material from the tray supply unit. It may include a second feeder 140 for transporting or towing the tray to carry out the tray to the carrying unit.

The material supply unit 100 supplies the tray t such that the tray t is supplied from the tray supply unit 180 or taken out from the tray transport unit 190 by the first and second feeders 120 and 140, respectively. Support rails 110 and 130 may be provided. Each of the guide rails 110 and 130 may be provided in parallel to support the trays transported by the respective feeders 120 and 140.

The guide rails 110 and 130 may be disposed in a direction perpendicular to the transfer part 300. When the transfer part 300 reciprocally transfers the pickup part 200 in a predetermined direction (x-axis direction), the guide rails are disposed in a direction parallel to each of the trays in a predetermined direction (y-axis direction). Each tray may be supplied or taken out in a predetermined direction (y-axis direction).

The tray supply unit 180 and the tray carrying unit 190 may be provided at the same direction end of each of the guide rails 110 and 130.

The tray supply unit 180 may be provided in a state in which a tray t in which a cutting target semiconductor material ss is placed in a plurality of material receiving grooves sp is stacked.

Therefore, the tray t stacked in the tray supply unit 180 may be transferred to a pickup position where pickup by the pickup unit 200 is possible by the first feeder 120.

The first feeder 120 picks up a position along the first guide rail 110 in a state in which a tray mounted on a lowermost or uppermost portion of the trays stacked on the tray supply unit is gripped by grippers 121 and 123 provided at both ends thereof. Can be moved. The pick-up position means a position at which the pick-up unit 200 can pick up the semiconductor material mounted on the tray, so that the pick-up position is on the transfer path where the pick-up unit 200 is transferred by the transfer unit 300. It means location.

Each tray t may have a plurality of material receiving grooves sp in which semiconductor materials are accommodated.

Tray (t) supplied from the tray supply unit 180 may be provided with a material receiving groove (sp) in a plurality of rows and columns.

The pickup unit 200 may be transferred only in a predetermined direction (x-axis direction) by the transfer unit 300. Accordingly, the first feeder 120 may move the tray in a predetermined direction (y-axis direction) in units of rows so that each semiconductor material may be picked up by the pick-up unit 200 mounted to the transfer unit 300. ) Can be transferred.

That is, when all of the semiconductor material placed in a specific row is picked up by the pickup unit, the trays can be sequentially transferred (by row) so that the semiconductor material placed in the next row can be picked up.

When all of the semiconductor material mounted on the specific tray supplied from the tray supply unit 180 is picked up and transferred to the cutting unit, the first feeder 120 advances the tray along the first guide rail 110.

The rear end of the first guide rail 110 may be provided with a tray pickup unit 150 for picking up and transferring the tray in a direction perpendicular to the conveying direction of the first feeder 120.

The tray pick-up unit 150 serves to transport the trays in which all the semiconductor materials are picked up by the pickup unit 200 to the second guide rail 130 provided with the tray carrying unit 190.

The second guide rail 130 serves to guide the transfer of the tray transferred by the tray pickup unit 150. The second feeder 140 is also provided at the side of the second guide rail 130. The second feeder 140 holds the tray to be transported and transports the tray to the tray carrying unit 190 along the second guide rail 130.

The tray carrying unit 190 is also mounted in a state in which the target trays are stacked, and the empty trays may be stacked and taken out by stacking the trays carried out by the second feeder 140 at the top or bottom thereof.

In addition, below the transfer path of the semiconductor material transferred from the material supply unit 100 to the chuck table of the cutting unit 500 through the guide rail of the pickup unit 200 or the conversion unit 1500 (see FIG. 2) described later. It may include a vision unit 160 provided to obtain the position information of the semiconductor material on the pickup unit or the guide rail.

The vision unit 160 may also perform image pickup for checking the alignment of the semiconductor material or the flipping of the semiconductor material, in addition to the imaging for the location information of the semiconductor material.

This is to check the flipping or alignment information of the semiconductor material through the image of the lower surface of the semiconductor material in the pickup and transfer state by the pickup unit 200.

As described above, the pickup unit 200 may reciprocally transfer the pickup unit 200 in a direction (x-axis direction) perpendicular to the transfer direction of each feeder of the material supply unit 100.

As described above, the pickup unit 200 may include a unit pickup unit 220 for picking up each semiconductor package and a multi pickup unit 230 for picking up a plurality of semiconductor packages together. The pickup unit 220 may be provided to individually pick up a semiconductor material mounted on a tray or the like, and the multi pickup unit 230 provided in the pickup unit 200 together with the unit pickup unit 220 may include a plurality of units. It may be provided to pick up the semiconductor material together.

The semiconductor material cutting device 1000 according to the present invention is a front of the chuck table 510 which provides a place for singulation of the semiconductor material, specifically, of the chuck table 510 on the transport path of the pickup unit 200. The seating block 400 may be provided at the front side.

The cutting unit may perform the operation of singulating the semiconductor material mounted on the chuck tables 510a and 510b into individual semiconductor packages. When the number of semiconductor packages is small because the size of the semiconductor package included in one semiconductor material is large, the time required for cutting the semiconductor material may be mainly used in singulation by the cutting unit.

Therefore, when the seating block 400 is not provided, the pickup unit 200 waits for the cutting process until the singulation operation of the semiconductor package by the cutting unit 520 of the cutting unit 500 is completed, and then again. The transfer process of the semiconductor material by the pickup may be performed.

In addition, although each cutting unit 520 constituting the cutting part 500 may perform the cutting operation in consideration of the alignment state of each semiconductor material, the alignment of each chip is modified in advance for the efficiency of the cutting process. Can be.

Therefore, the pickup unit 200 according to the present invention loads the semiconductor material picked up by the unit pickup unit 220 in each material loading groove 410 of the seating block 400, and in the material loading groove 410. In the process of being loaded, the alignment of the semiconductor material to be loaded can be corrected (for example, correction in the z-axis twist or the like).

If the semiconductor material is loaded in the material loading groove 410 of the seating block 400 after the alignment and the like are corrected, and the semiconductor package cut after the cutting process of the chuck table 510 is finished, The multi pickup unit 230 of the pickup unit 200 seats the semiconductor material loaded in the material loading groove 410 of the seating block 400 at a time on the material seating portion on the chuck table 510.

That is, each semiconductor package is transferred to the seating block 400 by the unit pickup unit 220 of the pickup unit 200, and the alignment and the like are modified, and the alignment and the like are loaded into the respective material stacking units in the modified state. The prepared semiconductor materials may be transferred to the chuck table at once to prepare for the cutting process.

Therefore, even if the work is not finished in the cutting unit, the alignment of each semiconductor material may be modified and the semiconductor material may be loaded in the seating block 400 first, and the pick-up unit 200 may have a new chuck table 510 of the cutting unit. When the cutting target semiconductor materials can be seated, the multi-pickup unit 230 may pick up the chuck table 510 at a time and transfer the semiconductor materials.

That is, the unit pickup unit 220 of the pickup unit 200 transfers the semiconductor material on the material loading groove 410 of the seating block 400 and corrects the alignment at the same time regardless of the cutting process performed in the cutting unit. The new semiconductor material may be picked up and supplied at once as soon as the export of the cut semiconductor material is completed by the unit picker unit 800, which will be described later, from the chuck table 510. It is possible to minimize the gap of the process that can be generated by the transfer process.

In addition, since the alignment state may be determined on the seating block 400 by the unit pickup unit 220, a cutting process reflecting the alignment state of each semiconductor material by the cutting unit 520 of the cutting unit 500. Alignment can be minimized, resulting in maximum singulation efficiency.

The seating block 400 may be configured to be driven in a predetermined direction (y-axis direction). Specifically, the seating block 400 may include a driving means (not shown) to enable driving in a direction perpendicular to the transfer direction of the pickup by the transfer part 300.

As described above, the pick-up unit 200 may be transferred only in a predetermined direction (x-axis direction) by the transfer unit 300, and thus, material loading grooves disposed in all rows of the seating block 400 may be used. This is because the seating block needs to be driven in the y-axis direction in order to load the semiconductor material at 410.

In the embodiment shown in Figure 1, the tray (t) is shown is provided with a material receiving groove (sp) of nine rows and three columns.

The number and positions of the material loading grooves of the seating block 400 and the material seating portions of the chuck table 510 may be configured to correspond to each other. In the embodiment shown in Figure 1, the tray is provided with a total of 27 material receiving grooves, nine rows, three columns, the material loading groove 410 of the seating block 400 and the material seating of the chuck table 510 The number of parts is provided with nine pieces each.

The material loading groove 410 of the seating block 400 and the material seating portion of the chuck table 510 may be arranged ten, but only nine reasons are as follows.

The number of material loading grooves 410 of the seating block 400 and the material seating portions of the chuck table 510 is preferably a divisor of the number of material receiving grooves sp of the tray t.

Specifically, in the embodiment shown in Figure 1, the material loading groove 410 of the seating block 400 and the number of material seating portion of the chuck table 510 is 27 of the tray material receiving groove (sp) 9 of the divisors 1, 3, 9, and 27 were selected.

The number of material loading grooves 410 of the seating block 400 and the material seating portions of the chuck table 510 is a divisor of the number of material receiving grooves (sp) of the tray and the number of material receiving grooves of the tray except 1 ( It is preferable to consist of the large number 9 in 3 or 9). This is to improve the efficiency of management and operation of semiconductor materials picked up and cut from each tray.

Of course, the material receiving grooves sp of the tray t, the material loading grooves 410 of the seating block 400, or the number of seating portions of the chuck table 510 may be configured in the same manner.

When the number of material loading grooves 410 of the seating block is one of the divisors of the number of tray seating portions, all the semiconductor materials on one tray may be transferred by several pick-up and transfer operations by the multi pickup unit. This is because it is easy to manage the product process.

In addition, the number of seating portions of the tray on which the semiconductor material is seated may be expressed as K times (K = 1,2,3..N, N is a natural number) of the number of seating portions of the chuck table and the seating block.

The cutting unit 500 may include at least one chuck table 510a and 510b and at least one cutting unit 520a and 520b.

As shown in FIG. 1, since the cutting units 520a and 520b are provided on the opposite side of the transfer part 300, the chuck tables 510a and 510b also have a predetermined direction y as in the seating block 400. Axial direction) and can be rotated to change the cutting direction.

The chuck tables 510a and 510b are shown provided with a pair to minimize the gap of the cutting process, the number may be added or subtracted as necessary.

In addition to the pickup unit 200 described above, the transfer unit 300 may be provided with a unit picker unit 800. The unit picker unit 800 may pick-up the semiconductor packages cut from the chuck tables 510a and 510b of the cutting unit at one time and perform a sorting step for sorting the semiconductor packages (not shown). Can serve as an export.

The unit picker unit 800 mounted to the transfer unit 300 may transfer the semiconductor package sorting unit to the semiconductor package sorting unit via the cleaning unit 700 that picks up the semiconductor packages and washes them through a compressor or a cleaning liquid.

The semiconductor material cutting device 1000 according to the present invention shown in FIG. 1 is supplied through a state in which cutting target semiconductor material is accommodated in a tray.

However, if the semiconductor material cutting device 1000 shown in FIG. 1 can be used even when the semiconductor material is supplied through a cassette magazine (cm), which is conventionally used in addition to the case where the semiconductor material is accommodated and supplied to a tray, Utilization, efficiency and competitiveness can be improved.

2 shows a conversion unit 1500 mounted to the feeder of the material supply unit 100 of the semiconductor material cutting device 1000 according to the present invention.

The conversion unit 1500 may include a guide rail 1100 for guiding a semiconductor material supplied from a cassette magazine cm, a support shaft 1200 for varying a distance between the guide rail 1100, and the guide rail ( A driving plate 1400 for adjusting a distance between the support plate 1300 and the guide rail 1100 on which the 1100 is mounted may be provided.

The conversion unit 1500 may be mounted on any one of a pair of feeders of the material supply unit 100.

In detail, as illustrated in FIGS. 1 and 2, the first feeder 120 of the first and second feeders 120 and 140 of the material supply unit 100 may have a cassette magazine in which semiconductor materials are stacked and supplied. It can be fastened by the fastening member and the conversion unit 1500 that can be mounted in order to guide the semiconductor material supplied in a direction parallel to the transfer direction of the pick-up unit 200 in cm).

A cassette magazine (cm), in which semiconductor materials are stacked and supplied on one side of the semiconductor material supply unit 100, may be detachably mounted in a module form. The cassette magazine cm may be disposed to supply the semiconductor material to a position adjacent to the transfer part 300 and parallel to the transfer direction of the pickup part.

The fastening member may be a fastening bolt or the like. Therefore, fastening holes are provided in the feeder 120 and the conversion unit 1500, respectively, and the fastening member may be fastened together in the fastening holes 125 and 1305 of the feeder 120 and the conversion unit 1500. have.

In the embodiment shown in FIG. 2, the conversion unit 1500 is shown to be mounted to the first feeder 120, but may be mounted to the second feeder 140. For convenience of description, the illustration of the second feeder is omitted in FIG. 2.

Since the fastening hole formed in the feeder 120 and the conversion unit 1500 and the aforementioned fastening member are means for mounting the conversion unit to the feeder, a fastening means of another method may be used.

The guide rail 1100 is configured to guide the transfer of the semiconductor material supplied through the cassette magazine, and the support shaft 1200 supports the guide rail 1100 so as to adjust the gap of the guide rail 1100. The support plate 1300 may serve as a mounting place where the support shaft or the guide rail is mounted, and the guide rail 1100 may support the support plate 1300 via the support shaft 1200. It can be mounted on.

The conversion unit 1500 may include at least one or more driving means 1400 for adjusting the gap of the guide rail.

In the embodiment shown in FIG. 2, the driving means 1400 includes a screw 1430 axially coupled with at least one of the guide rails of the guide rail and a motor 1410 for rotating the screw 1430. can do. A screw nut (not shown) may be provided at the side of the guide rail 1100. In addition, a closing member 1450 for closing and supporting the screw 1430 and the like may be provided.

The screw may be a ball screw or a TEM screw, or the like, and if necessary, a screw nut may be provided on the guide rail to increase or narrow the interval of the guide rail to enable cutting of semiconductor materials having various widths.

In the embodiment illustrated in FIG. 2, the driving means 1400 is provided only in one guide rail, but driving means may be provided in each of the guide rails.

Specifically, the driving means 1400 is approached or spaced apart by displacing the pair of guide rails 1100 by the same distance, the position of the pair of guide rails is a feeder to which the conversion unit 1500 is fastened You can change it by moving it.

The drive unit may be provided on each guide rail. In this case, the pair of guide rails 1100 are driven independently of each other to individually drive each guide rail 1100 to adjust the width between the pair of guide rails and the position of each guide rail 1100. Means may also be provided. In this case, the position of each guide rail can be changed by each driving means, and it is not necessary to drive the feeder.

Since the conversion unit shown in FIG. 2 is mounted on the semiconductor material cutting device 1000 shown in FIG. 1, the semiconductor material can be cut even when the semiconductor material is supplied through the cassette magazine (cm). Applicability of 1000 can be improved.

3 is a plan view showing a state in which a conversion unit is mounted in the semiconductor material cutting device 1000 according to the present invention.

As described above, the semiconductor material to be cut may be supplied mounted to the material receiving groove of each tray while preliminary cutting is performed, and may be supplied through the cassette magazine (cm) as in the conventionally used method. It may be.

As shown in FIG. 3, the conversion unit 1500 shown in FIG. 2 is mounted on the feeder 120 of the material supply unit 100.

By mounting the conversion unit 1500 to the feeder 120, the material supply unit 100 may be provided with a guide rail for transferring the cutting target semiconductor material in a direction parallel to the transfer unit 300.

That is, in the semiconductor material cutting device 1000 according to the present invention in the description with reference to FIG. 1, the tray in which the cutting target semiconductor material is accommodated is transferred to the pickup part 200 by the transfer part 300 by the feeder. The semiconductor material may be picked up by the pick-up unit 200 in a direction perpendicular to the direction of the pick-up.

However, when the semiconductor material ss' is supplied through the cassette magazine (cm) illustrated in FIG. 3, the semiconductor material is pulled by the gripper 210 or the like to be picked up by the pickup unit 200. Can be transferred to a position.

In the embodiment shown in FIG. 3, it is assumed that the semiconductor material ss' is a semiconductor material having a suitable type and size to be supplied through a cassette magazine, unlike the semiconductor material shown in FIG. 1.

In this case, the cutting target semiconductor material ss 'in the cassette magazine cm may be pushed to a predetermined area by a pusher 1600 that may be provided in the material supply unit, and the pushed semiconductor material ss' is pushed. The tow may be towed by the gripper described below and transferred to the pick-up position through the guide rail of the conversion unit.

Therefore, the semiconductor material cutting device 1000 according to the present invention includes a gripper for drawing and pulling the semiconductor material from the cassette magazine (cm), and specifically, the gripper 210 is provided at one end of the pick-up part 200. It is provided.

Since the pick-up unit 200 may be transported along the transfer direction of the transfer unit 300, the gripper provided at the pick-up unit 200 may be cut from a cassette magazine (cm) provided at one end of the transfer unit 300. The target semiconductor material may be taken out to transfer the cutting target semiconductor material along the guide rail 1100 of the conversion unit 1500.

When the cutting target semiconductor material withdrawn from the cassette magazine (cm) is configured in the form of a single substrate, the pickup unit 200 is transferred to the pickup position through the guide rail by a gripper of the pickup unit 200. The stacking process of the seating block 400 is omitted by the multi pick-up unit 230, and is transferred to the chuck table 510 to perform a cutting process.

When the semiconductor material to be cut out from the cassette magazine (cm) is provided in a state of being mounted on a separate boat or the like, the semiconductor material is picked up by the tray of FIG. Likewise, the semiconductor material may be transferred to the chuck table 510 by the unit pickup unit 220, the seating block 400, and the multi pickup unit 230 of the pickup unit 200.

In the latter case, since the conversion unit 1500 is mounted on the feeder 120 capable of conveying in a predetermined direction (y-axis direction), the pick-up part 200 is determined by the conveying part 300 in a predetermined direction (x). Even if transfer is possible only in the axial direction, the unit semiconductor material can be arranged at the pickup position of the unit pickup unit 220 of the pickup unit 200.

3, the transfer unit 300 may include a unit picker unit 800 in addition to the pickup unit 200, and the unit picker unit 800 may include the chuck table 510a of the cutting unit. In operation 510b, the semiconductor packages that have been cut may be picked up and taken out.

In addition, it is the same as in the embodiment with reference to FIG. 1 that the unit picker 800 may be routed through the washing unit 700 which is washed through the compressor body or the cleaning liquid.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1000: semiconductor material cutting device
1500: conversion unit
100: material supply unit
200: pickup section
300: transfer unit
400: seating block
500: cutting part

Claims (17)

A pickup unit including at least one pickup unit for picking up a semiconductor material;
A transfer part mounted with the pickup part and configured to transfer the pickup part in a predetermined direction;
In order to supply the semiconductor material to the pickup unit, at least one material receiving groove for accommodating the semiconductor material, and any one of a plurality of trays stacked or to be stacked in the direction perpendicular to the transfer direction of the pickup portion A material supply unit including at least one feeder to be transferred to the apparatus; And
And a cutting unit including at least one or more chuck tables and at least one cutting unit on which the semiconductor material supplied from the material supply unit is seated. The method of claim 1,
The material supply unit includes a tray supply unit in which trays containing semiconductor materials are stacked and a tray carrying unit in which trays in which semiconductor materials are picked up by the pickup unit are stacked, and the feeder is located at a pickup position of the pickup unit in the tray supply unit. And a second feeder for transferring the tray to which the semiconductor material is picked up by the pick-up unit to the tray transporting unit. The method of claim 2,
The material supply unit supports the trays so that the trays are discharged from the tray supply unit to the supply or the tray transport unit by the first and second feeders, respectively, and the first guide rail is disposed in a direction perpendicular to the transport direction of the pickup unit; And a second guide rail. The method of claim 3,
And the material supply unit further comprises a tray pickup unit configured to pick up the tray on which the semiconductor material has been picked up by the pickup unit from the first guide rail and seat the tray on the second guide rail. The method of claim 1,
A seating block having a material loading groove is provided between the material supply unit and the chuck table of the cutting unit, and the pickup unit transfers the semiconductor material picked up by the material supply unit to the chuck table via the seating block. Semiconductor material cutting device. The method of claim 5,
And the seating block includes driving means to be driven in a direction perpendicular to the conveying direction of the pick-up part by the conveying part. The method of claim 5,
And the number of material seating portions formed to seat the semiconductor material provided on the chuck table and the material loading grooves of the seating block is a divisor of the number of material receiving grooves of the tray. The method of claim 1,
And said pick-up unit comprises a unit pick-up unit for picking up each semiconductor material and a multi pick-up unit for picking up a plurality of semiconductor packages together. 9. The method of claim 8,
And the pickup unit comprises a vision unit for photographing the semiconductor material accommodated in the material receiving groove of the tray or the semiconductor material loaded in the material loading groove of the seating block to obtain position information thereof. The method of claim 1,
The semiconductor material cutting device, characterized in that the cassette magazine to which the semiconductor material is stacked and supplied to one side of the semiconductor material supply unit may be detachably added in a module form. The method of claim 10,
The feeder of any one of the first and second feeders of the material supply part may be mounted to guide the semiconductor material supplied in a direction parallel to the transport direction of the pickup part from a cassette magazine in which semiconductor materials are stacked and supplied. A semiconductor material cutting device, characterized in that is fastened by the fastening member. 12. The method of claim 11,
Fastening holes are provided in the feeder and the conversion unit, respectively, wherein the fastening member is fastened to the fastening hole of the feeder and the conversion unit. 12. The method of claim 11,
And the conversion unit includes a pair of guide rails, a support plate on which the guide rails are mounted, and a driving means for adjusting a distance between the guide rails. The method of claim 13,
And a pair of guide rails are driven independently of each other and provided with individual driving means on each guide rail to adjust the width between the pair of guide rails and the position of each guide rail. The method of claim 13,
The driving means displaces the pair of guide rails by the same distance to approach or spaced apart, the position of the pair of guide rails can be changed by moving the feeder to which the conversion unit is fastened, the semiconductor material cutting Device. 12. The method of claim 11,
And the pick-up portion further comprises a gripper for gripping the tip of the semiconductor material of the cassette magazine to draw the material out to the guide rail portion. 12. The method of claim 11,
And a vision unit provided below the transfer path of the semiconductor material transferred from the material supply part to the chuck table of the cutting part through the pickup part or the guide rail to obtain position information of the semiconductor material on the pickup unit or the guide rail. Semiconductor material cutting device characterized in that.

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