KR20030044282A - Semiconductor package manufacturing equipment having tray auto sending apparatus and the tray auto sending method - Google Patents

Abstract

PURPOSE: Semiconductor package fabricating equipment having an apparatus for automatically transferring a tray is provided to prevent the whole equipment from being stopped by automatically supplying and ejecting the tray. CONSTITUTION: A trimming/forming unit separates a lead frame material into pieces. A plurality of vacant trays having each separated semiconductor package are stacked in a supply unit(5). A plurality of trays, which include each separate semiconductor package transferred from the supply, are stacked in an ejection unit(7). A tray transfer unit(20) automatically supplies the plurality of vacant trays to the supply unit and automatically ejects the plurality of trays stacked in the ejection unit.

Description

Semi-conductor package manufacturing equipment with tray automatic transfer device and tray automatic transfer method {SEMICONDUCTOR PACKAGE MANUFACTURING EQUIPMENT HAVING TRAY AUTO SENDING APPARATUS AND THE TRAY AUTO SENDING METHOD}

The present invention relates to a manufacturing apparatus for a semiconductor package having a tray automatic transfer device and an automatic transfer method of the tray, and more particularly, to a semiconductor package which is automatically supplied with a plurality of empty trays and separately separated from a lead frame material. The present invention relates to a manufacturing apparatus for a semiconductor package having a tray automatic transfer device for automatically withdrawing a plurality of trays into which a plurality of trays are inserted, and to an automatic transfer method of the tray.

In general, semiconductor package manufacturing process goes through sawing process, wire bonding process, molding process, and trim / forming process.Semi-conductor package, which has gone through trim / forming process, is separated from lead frame material. The separated semiconductor packages are inserted or seated and transferred to the next process.

In the tray loading device for seating the semiconductor package as described above, one tray located at the lower part of the supply unit in which a plurality of empty trays on which the semiconductor package is not seated is stacked is transferred by a conveying means, and the one tray conveyed is trimmed. After completion of the forming process, the semiconductor package is transported by the adsorption means and sequentially placed in the tray.

As such, when all the semiconductor packages are seated in the empty trays, the semiconductor packages are again transferred by the transfer means and stacked on the discharge unit.

Such a configuration has been disclosed in Korean Patent Publication (Publication No .: 1998-026359, Publication Date: July 15, 1998, the title of the invention: the tray loading device of the semiconductor package manufacturing equipment).

However, in the conventional semiconductor package manufacturing equipment configured as described above, a person directly places a plurality of empty trays stacked on the supply unit and is supplied through the supply unit to mount a semiconductor package after the trimming / forming process is completed inside the tray. When the trays are stacked on the discharge unit, when the tray is supplied and discharged by a person, the entire facility must be stopped.

In addition, in order to check the processing status of the processed semiconductor package, the entire equipment is stopped and the tray stacked on the discharge part is lifted to check the semiconductor package, which also acts as a loss of the entire equipment. There is a problem.

Accordingly, the present invention has been made to solve the above-described problems, the first object of the present invention is to implement the automatic supply and discharge operation of the tray tray automatic transport apparatus to eliminate the stop of the entire facility It is to provide a semiconductor package manufacturing equipment having.

It is a second object of the present invention to provide a semiconductor package manufacturing apparatus having a tray automatic transfer device which eliminates the suspension of the entire installation when checking the quality state of the processed semiconductor package.

In order to achieve the above object, the present invention comprises a trim / forming operation for separating the molded lead frame material supplied by the trim / forming operation individually; A supply unit in which a plurality of empty trays on which the individual semiconductor packages processed through the trim / forming operation unit are seated are stacked; A discharge part configured to stack a plurality of trays which are transported from the supply part and seated individual semiconductor packages processed through the trim / forming work part; a plurality of empty trays are automatically supplied to the supply part, and a plurality of stacked parts are stacked on the discharge part It includes a tray conveying means for automatically withdrawing the tray of the.

The tray conveying means includes first and second conveying means installed to communicate with the atmospheric portion and the discharge portion; And first and second sliders connected to the first and second transfer means and installed to enable linear reciprocating motion, and the first and second sliders are formed of “c”.

On both sides of the tray conveying means is installed a sensing sensor for detecting the approach state of the abnormal object to stop the operation of the tray conveying means in the sensing state, the sensing sensor is an optical sensor, and secures the sensing area Take the form of a bar.

A first step of supplying a plurality of empty trays stacked in predetermined stages by the above-mentioned tray conveying means to the upper side of the first slider waiting at a predetermined position; A second step of returning the first slider supplied with a plurality of empty trays to the supply part by a conveying means and then returning to the initial state again; A third step of transferring the tray on which the empty trays supplied to the supply unit are transferred to a predetermined position and seating the semiconductor packages individually separated through the trim / forming operation unit to the discharge unit; The second slider is transferred to the discharge unit, and the tray is transported by repeating the fourth step of seating the plurality of trays stacked on the discharge unit and withdrawing the discharge unit.

1 is a partial perspective view showing the configuration of a semiconductor package manufacturing equipment is configured tray automatic transfer apparatus according to an embodiment of the present invention,

FIG. 2 is an enlarged perspective view of the configuration of the tray automatic transfer device of FIG. 1.

<Explanation of symbols for the main parts of the drawings>

1: Body 1a: Opening

1b: Support plate 3: trim / forming work part

5 supply part 7 discharge part

9: waiting part 11: withdrawing part

13a, 13b: 1st, 2nd lift pin 20: Tray conveyance means

21,23: 1st, 2nd transfer means 25,27: 1st, 2nd slider

29: Sensor T: Tray

Hereinafter, with reference to the accompanying drawings, Figures 1 and 2 will be described in detail the configuration and operation according to an embodiment of the present invention.

1 is an overall configuration diagram showing the configuration of a semiconductor package manufacturing apparatus equipped with a tray automatic transport apparatus according to an embodiment of the present invention, Figure 2 is a perspective view showing an enlarged configuration of the tray automatic transport apparatus of FIG.

As shown in the figure there is a main body (1) for working the appearance of the equipment, the upper side of the main body (1) is supplied with a lead frame material (not shown) to trim / forming the trim / forming to separate The work part 3 is provided, and a plurality of trays T on which the individual semiconductor packages processed through the trim / forming work part 3 are stacked are stacked below the trim forming work part 3. And a discharge part 7 in which a plurality of trays T on which the plurality of trays, which are transported from the supply part 5 and the semiconductor part processed through the trim / forming work part 5, are stacked, are stacked. Prepared.

The opening 1a is operated in the main body 1 at the position where the supply part 5 and the discharge part 7 are provided, and the supply part 5 and the discharge part 7 are aligned with the supply part 5 and the discharge part 7 below the opening part 1a. And a plurality of trays T to be supplied to the supply unit 5 in a standby state, and a standby unit 9 and an extraction unit 11 which draw out a plurality of trays T stacked on the discharge unit 7. ) Supporting plate (1b) is extended to protrude to the outside of the main body (1).

The supply part 5 and the discharge part 7 are provided with a plurality of lift pins 13a and 13b which are operated up and down by lifting and lowering driving means, not shown, to lift and lower the tray T stacked thereon. The empty portion T is automatically supplied to the supply portion 5 to the supply portion 5 and the standby portion 9, the discharge portion 7, and the extraction portion 11, and the discharge portion 7. The tray conveying means 20 which automatically draws out the tray T on which the semiconductor package is mounted is installed in it.

The tray conveying means 20 includes a plurality of first and second conveying means 21 and 23 provided over the supply part 5 and the waiting part 9, and the discharge part 7 and the withdrawal part 11. ) And first and second sliders 25 and 27 connected to the first and second transfer means and installed to enable linear reciprocating motion.

The first and second transfer means 21 and 23 are linearly moved by hydraulic pressure supplied to the air cylinders 21a and 23a and the first and second air cylinders 21a and 23a, as shown in FIG. It is preferable to comprise the 1, 2 cylinder moving bodies 21b and 23b.

In addition, the first and second transfer means (21, 23) is a motor for generating power as well known, a ball screw shaft connected to the shaft of the motor to perform a forward and reverse rotation in a predetermined direction, and the ball screw shaft The first and second sliders 25 and 27 may be configured to be linearly reciprocated by connecting the first and second sliders 25 and 27 to the transfer nut by using a transfer nut that is reciprocated in a linear manner. will be.

The first and second sliders 25 and 27 may be formed as “c” so as not to interfere with the first and second lift pins 13a and 13b provided in the supply unit 5 and the discharge unit 7.

In addition, by detecting the approach state of the abnormal object (for example, the operator's arm, etc.) on the outside of the main body 1 in the sensed state by stopping the operation of the tray transport means 20, the sensor to eliminate the risk of safety accidents (29) is preferably further configured, and the detection sensor 29 is preferably an optical sensor and preferably provided in the form of a bar to secure the detection area.

In the drawing, reference numeral 16 denotes a bracket for fixing the detection sensor 29 to a predetermined position.

Next, a description will be given of a state in which the tray is conveyed by the tray conveying means 20 configured as described above.

First, when an operator places the empty trays T stacked in predetermined stages on the first slider 25 waiting on the waiting section 9 (first step), the air of the first air cylinder 21a In operation, the first cylinder moving body 21a is advanced to the position of the supply part 5 in the direction of the arrow ↑.

At this time, the first lift pin 13a may be in a lower position than the bottom of the lowermost side of the empty tray T on the first slider 25 while maintaining the lowered state.

As such, when the first slider 25 moves to the supply part 5, the first lift pin 13a is lifted by the lifting driving means (not shown) and the empty tea tray T stacked at a predetermined position. The first slider 25 moves backward to the waiting unit 9 to achieve a standby state by raising the position of the first slider 25 at a predetermined position by raising the position of the first tray.

Next, the semiconductor packages individually separated by the trim / forming work part 3 by the suction means not shown in the empty tea tray T supplied from the supply part 5 are continuously seated and completely stored. When it is achieved, it is transferred to the discharge part 7 by a transfer means (not shown), and the second lift pin 13b is lifted up to push up the transferred tray T to be stacked.

Next, when a predetermined amount of tray T is stacked in the discharge part 7, the second transfer means 23 is operated to advance the second slider 27 to the discharge part 7, The second lift pin 13b is operated to lower the tray T stacked on the discharge part 7 and rest on the upper surface of the second slider 27.

In such a state, the second slider 27 is moved in the opposite direction in the above-described direction by the second transfer means 23 to be transferred to the lead-out portion 11, thereby stacking the tray T stacked on the discharge portion 7. Will be automatically withdrawn (step 4).

According to the method as described above, simply placing the empty tray to be supplied to the standby section 9 is automatically supplied to the supply section 5, and when the tray stacked in the discharge section 7 has a predetermined amount, the drawing section As it is automatically drawn out to (11), the operator simply checks the state of the waiting section 9 and the drawing section 11, supplies the empty tray T appropriately, and pulls out the tray T in which the semiconductor package is stored. do.

Therefore, it is possible to solve the problem of having to stop the equipment while supplying and removing the tray T as in the prior art.

In addition, when the quality of the semiconductor package is to be checked during the manufacturing and transport of the semiconductor package by the above-described work process, when the monitor button provided on the operation unit (not shown) is pressed, the waiting unit for the drawing unit 11 is waited. Two sliders 27 are conveyed to the discharge part 7.

In such a state, the lift pin 13b operates to lower the lowermost tray T stacked on the discharge part 7 and rest on the upper surface of the second slider 27 to transfer the transfer means 23. By the operation of the second slider 27 is moved back to the lead-out portion 11, the operator checks the state of the processed semiconductor package.

By this operation, it is possible to effectively reduce the loss of equipment operation that had to be withdrawn the tray by stopping the entire equipment as in the prior art,

On the other hand, during the operation as described above, the sensor 29 detects the proximity of an abnormal object, such as the worker's arm, and in the detection state to stop the operation of the tray transport means 20 to eliminate the risk of accidents Let's go.

As described above, according to the semiconductor package manufacturing apparatus having the tray automatic recoil device according to the present invention and the tray automatic conveying method thereof, an operation of supplying an empty tray and drawing out a tray containing a processed semiconductor package which has undergone a trimming / forming process As it is automatically handled automatically there is an advantage that can solve the problem that caused the loss of the equipment by stopping the equipment for its storage and withdrawal operation.

In addition, even when checking the quality of the semiconductor package, it becomes possible without stopping the equipment, thereby reducing the loss of the equipment.

As described above, in the detailed description of the present invention has been described with respect to specific embodiments, various modifications are of course possible without departing from the scope of the invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be defined by the claims below and equivalents thereof.

Claims (7)

A trim / forming work unit which separates the molded leadframe material supplied by the trim / forming work into pieces; A supply unit in which a plurality of empty trays on which the individual semiconductor packages processed through the trim / forming operation unit are seated are stacked; A discharge part in which a plurality of trays, which are transported from the supply part and seated individual semiconductor packages processed through the trim / forming work part, are stacked; And a tray conveying means for automatically supplying a plurality of empty trays to the supply part and automatically drawing out a plurality of trays stacked on the discharge part. The method of claim 1, The tray conveying means includes first and second conveying means installed to communicate with the supply part and the discharge part; And a first and second sliders connected to the first and second transfer means and installed to enable linear reciprocating motion. The method of claim 1, The first and the second slider is a semiconductor package manufacturing equipment having a tray automatic transfer device, characterized in that formed by the letter "c". The method of claim 1, On both sides of the tray transport means is installed, the semiconductor package manufacturing equipment having an automatic tray transport device, characterized in that additional sensing sensor for detecting the approach state of the abnormal object to stop the operation of the tray transport means in the sensing state . The method of claim 4, wherein The sensing sensor is a semiconductor package manufacturing equipment having an automatic transport device, characterized in that consisting of an optical sensor. The method of claim 5, The sensing sensor is a semiconductor package manufacturing equipment having an automatic transfer device, characterized in that provided in the form of a bar. A first step of supplying a plurality of empty trays stacked in predetermined stages to an upper side of the first slider waiting at a predetermined position; A second step of transferring the first slider, which has received a plurality of empty trays on the upper surface thereof, to a supply part by a conveying means, and then returning to the initial state again; A third step of transferring the tray on which the empty trays supplied to the supply unit are transferred to a predetermined position and seating the semiconductor packages individually separated through the trim / forming operation unit to the discharge unit; The second slider is transported to the discharge unit to seat the plurality of trays stacked on the discharge unit and repeating the fourth step to be taken out to the withdrawal unit repeating the tray automatic transfer method of the manufacturing equipment.