CN113394148B - Solar cell's distributing device - Google Patents
Solar cell's distributing device Download PDFInfo
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- CN113394148B CN113394148B CN202110662608.0A CN202110662608A CN113394148B CN 113394148 B CN113394148 B CN 113394148B CN 202110662608 A CN202110662608 A CN 202110662608A CN 113394148 B CN113394148 B CN 113394148B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a material distribution device of a solar cell, which comprises a support plate transmission device, feeding devices, material taking devices and deviation correction devices, wherein by arranging a plurality of groups of feeding devices, each group of feeding devices comprises a plurality of rows of feeding rails, each group of feeding devices corresponds to one group of material taking devices and one group of deviation correction devices, and the material taking devices can sequentially grab silicon wafers on different feeding rails in the same group of feeding devices, namely: a plurality of feeding rails of the same group of feeding devices can share one group of taking devices, and the plurality of feeding rails feed materials in sequence, so that the feeding speed of the feeding rails can be slower than the taking speed of the taking devices; therefore, the feeding rail has a low transmission speed and is not easy to cause damage to the silicon wafers when the material taking device is high in speed to meet high material distribution efficiency.
Description
Technical Field
The invention belongs to the technical field of solar cell manufacturing, and particularly relates to a material distribution device of a solar cell.
Background
In the production process of the solar cell, the silicon wafer is used as a carrier and needs to be transmitted among all parts of a production system, so that the detection, surface etching, screen printing and the like of the silicon wafer are realized, and the solar cell with a preset circuit printed on the surface of the silicon wafer is finally obtained.
In the partial technological process of the transmission and processing of the silicon chip, a carrier plate is needed to bear the silicon chip, and the size of the carrier plate is far larger than that of the silicon chip. The process of arranging the silicon wafers on the carrier plate can be called a material distribution process, in the material distribution process, the carrier plate is conveyed along a certain direction, in the conveying process, the material taking device obtains the silicon wafers conveyed by the conveying belt and places the silicon wafers on the carrier plate until a preset number of silicon wafers are arranged on the carrier plate in rows and columns, and then the carrier plate bears the silicon wafers and enters the next process flow for processing.
In order to improve the productivity of the solar cell, the related manufacturing device of the solar cell improves the arrangement efficiency of the silicon wafer by improving the speed of sucking and transferring the silicon wafer, but the damage rate of the silicon wafer is high when the silicon wafer is sucked and transferred at a higher speed.
Disclosure of Invention
In view of this, the present invention provides a material distribution device for a solar cell, so as to solve the technical problem of how to reduce the damage rate of a silicon wafer while improving the material distribution efficiency of the silicon wafer.
The technical scheme of the invention is realized as follows:
the embodiment of the invention provides a material distribution device of a solar cell, which comprises: the carrier plate conveying device is used for conveying the carrier plate along a first direction; the feeding device is used for conveying the silicon wafers; the feeding devices are provided with a plurality of groups and are arranged at intervals in the first direction, and each group of feeding devices comprises a plurality of rows of feeding rails; the material taking devices correspond to one group of material taking devices, and are used for sequentially grabbing the silicon wafers on each row of the feeding rails of the corresponding group of material feeding devices and distributing the silicon wafers to the carrier plate; and each group of feeding devices corresponds to one group of the deviation correcting devices, and the deviation correcting devices are used for adjusting the positions of the silicon wafers transmitted by the corresponding group of feeding devices on the support plate.
Furthermore, the deviation correcting device is arranged below the carrier plate conveying device.
Furthermore, in the first direction, the two sides of each group of the deviation correcting devices are provided with the corresponding group of the feeding rails of the feeding devices.
Further, the conveying direction of the feeding device is perpendicular to the first direction.
Further, the transport path of the feeder device is at least partially located above the transport path of the carrier board transport device.
Furthermore, each group of material taking devices is provided with a material taking part, and the material taking part sequentially grabs the silicon wafers on each feeding rail of the corresponding group of feeding devices.
Further, the carrier is configured to carry N × M silicon wafers, where N is the number of columns of the silicon wafers arranged in the first direction, and M is the number of rows of the silicon wafers arranged in a direction perpendicular to the first direction; the material taking part sequentially grabs silicon wafers from the plurality of feeding rails, and the material taking part grabs M silicon wafers from one feeding rail at a time and places the M silicon wafers in the same row on the support plate.
Furthermore, each group of material taking devices is provided with a plurality of material taking parts, and each material taking part correspondingly grabs the silicon wafer on one feeding rail.
Further, the carrier plate is used for carrying N × M silicon wafers, where N is the number of rows of silicon wafers arranged in the first direction, and M is the number of rows of silicon wafers arranged in the direction perpendicular to the first direction; the plurality of taking parts sequentially and respectively grab the silicon wafers from the corresponding feeding rails, and the plurality of taking parts grab the M silicon wafers from the corresponding feeding rails at each time and place the M silicon wafers in the same row on the support plate.
Furthermore, a plurality of material taking devices corresponding to the plurality of groups of feeding devices move synchronously.
The embodiment of the invention provides a material distribution device of a solar cell, which comprises a support plate transmission device, feeding devices, material taking devices and deviation correction devices, wherein the support plate transmission device is used for transmitting a support plate along a first direction, a plurality of groups of feeding devices are arranged in the first direction at intervals, each group of feeding devices comprises a plurality of rows of feeding rails, each group of feeding devices is provided with one group of material taking devices, the material taking devices are used for sequentially grabbing silicon wafers of each row of feeding rails in each group of feeding devices and distributing the silicon wafers to the support plate, and each group of feeding devices is also provided with one group of deviation correction devices used for adjusting the silicon wafers on the support plate. In the embodiment of the invention, a plurality of groups of feeding devices are arranged, each group of feeding devices comprises a plurality of rows of feeding rails, each group of feeding devices corresponds to one group of taking devices and one group of deviation correcting devices, and the taking devices can sequentially grab silicon wafers on different feeding rails in the same group of feeding devices, namely: a plurality of feeding rails of the same group of feeding devices can share one group of taking devices, and the plurality of feeding rails feed materials in sequence, so that the feeding speed of the feeding rails can be slower than the taking speed of the taking devices; therefore, the feeding track has a low transmission speed and is not easy to damage silicon wafers while the material taking device is high in speed to meet high material distribution efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a carrier plate according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a material distribution device in an embodiment of the present invention;
FIG. 3 is a top view of a dispensing device in accordance with an embodiment of the present invention;
FIG. 4 is a schematic diagram of the positions of a feeding device and a deviation rectifying device according to an embodiment of the present invention;
FIG. 5 is a schematic side view of a dispensing device according to an embodiment of the present invention;
FIG. 6 is a schematic side view of a dispensing device according to another embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a feeding device according to an embodiment of the present invention.
Description of the reference numerals:
1. a carrier plate; 11. a through hole; 12. a silicon wafer; 2. a carrier plate transmission device; 3. a feeding device; 31. a feed rail; 31a, a first supply rail; 31b, a second supply rail; 311. a conveyor belt; 312. a support frame; 313. a first driving member; 4. a material taking device; 41. taking a material part; 41a, a first material taking part; 41b, a second material taking part; 5. a deviation rectifying device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The individual features described in the embodiments can be combined in any suitable manner without departing from the scope, for example different embodiments and aspects can be formed by combining different features. Various possible combinations of the various specific features of the invention are not described in detail to avoid unnecessary repetition.
In the following description, the term "first/second/so" is used merely to distinguish different objects and does not mean that there is a common or relationship between the objects. It should be understood that the references to the orientation descriptions "above", "below", "outside" and "inside" are all the orientations in the normal use state, and the "left" and "right" directions indicate the left and right directions indicated in the specific corresponding schematic diagrams, and may or may not be the left and right directions in the normal use state.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The invention provides a material distribution device of a solar cell, which is used for the process of placing a silicon wafer on a support plate in the production process of the solar cell. It should be noted that the material distribution device may be applied to a plurality of process flows in the production process of the solar cell, and the type of application scenario of the present invention does not limit the material distribution device of the present invention.
The purpose of the support plate and the material distribution process are roughly described below by taking as an example that a related material distribution device is applied to a silicon wafer loading and unloading stage before and after a PVD (Physical Vapor Deposition) process is performed on a silicon wafer, during the PVD process of the silicon wafer, the silicon wafer to be processed needs to be transported to the support plate, the support plate transmission device transmits the support plate carrying the silicon wafer to related process equipment, after the silicon wafer on the support plate completes the related process flow, the support plate transmission device transmits the support plate, and the related grabbing equipment takes out the processed silicon wafer.
Referring to fig. 1, roughly describing the structure of the carrier plate 1, a plurality of through holes 11 are formed at intervals on the carrier plate 1, wherein a silicon wafer is disposed above the through holes 11, the size of the silicon wafer is not smaller than that of the through holes 11, and the edge of the silicon wafer overlaps the carrier plate 1, so that the position where the through holes 11 are disposed can be approximately regarded as the position of the silicon wafer. The silicon chips are distributed on the support plate by the distributing device to form a silicon chip matrix which is distributed in rows and columns. Through the form that sets up the through-hole on the support plate, can alleviate the weight of support plate, practice thrift driven power, place the silicon chip in the depressed area simultaneously, can play the effect of restriction to the silicon chip, be favorable to the unified clamp of unloading on the silicon chip to get. It should be noted that the carrier board structure in the embodiment of the present invention does not limit the carrier board transmission device of the present invention, and the carrier board related in the embodiment of the present invention may also be in other forms, for example, the carrier board is a flat board without an opening.
As shown in fig. 2, an embodiment of the present invention provides a material distribution device for solar cells, including a carrier plate transmission device 2, a feeding device 3, a material taking device 4, and a deviation rectification device 5. The following describes each apparatus.
The carrier plate transfer device 2 is used for transferring the carrier plate 1 along a first direction (x direction shown in fig. 2), the carrier plate transfer device 2 in the embodiment of the present invention includes, but is not limited to, a belt drive and a gear drive, the carrier plate 1 is placed on the carrier plate transfer device 2 (y direction shown in fig. 2), and the carrier plate transfer device 2 carries and drives the carrier plate 1 to move in the x direction. Optionally, the carrier plate conveying device 2 may drive the carrier plate 1 to move continuously in the first direction, and may also perform stepping control on the carrier plate 1 according to specific loading and unloading requirements, for example, when the carrier plate 1 reaches a loading and unloading position, the carrier plate conveying device 2 may stop conveying the carrier plate 1; under the condition that the carrier plate 1 finishes the loading and unloading operation, the carrier plate transmission device 2 can start the transmission of the carrier plate 1, and the embodiment of the invention can adjust the start-stop time of the carrier plate transmission device 2 according to the actual carrier plate distributing mode.
The supply device 3 is used for conveying the silicon wafer 12. Specifically, the feeding device 3 is used for supplying silicon wafers 12 to be distributed, and the silicon wafers 12 are arranged in the carrier plate 1 on the carrier plate conveying device 2. The supply means 3 has a plurality of sets, each set of supply means 3 includes a plurality of rows of supply rails 31, and a plurality of wafers 12 are transferred on each row of supply rails 31. Alternatively, the transfer speeds of the feed tracks 31 of the groups of feed devices 3 may be the same, and the feed tracks 31 of the groups of feed devices 3 may be fed synchronously. The group of feeding devices 3 in the embodiment of the present invention may include 2 rows, 3 rows, and other rows of feeding tracks 31, the multiple rows of feeding tracks 31 may be disposed adjacently in the first direction (x direction shown in fig. 2) or disposed at intervals in the first direction, and the positional relationship of the multiple rows of feeding tracks 31 in the embodiment of the present invention does not limit the feeding manner of the present invention. A group of material taking devices 4 are correspondingly arranged on the group of feeding devices 3, and the same group of material taking devices 4 are used for sequentially clamping the silicon wafers 12 on the plurality of feeding rails 31 in the same group of feeding devices 3 and sequentially arranging the clamped silicon wafers 12 on the support plate 1. Alternatively, the transfer speeds of the feed tracks 31 of the groups of feed devices 3 may be the same, and the feed tracks 31 of the groups of feed devices 3 may be fed synchronously. For example, as shown in fig. 1, there are two rows of feeding tracks 31 in the same group of feeding devices 3, and the conveying speeds of the two rows of feeding tracks 31 are the same but can be started at intervals, so that when the first row of feeding tracks 31 has conveyed M silicon wafers to the position to be taken for being picked by the picking device 4, the conveyed silicon wafers on the other row of feeding tracks 31 do not reach the position to be taken; then, the material taking device 4 grabs the M silicon wafers on the first row of feeding rails 31 and places the M silicon wafers on the carrier plate, and simultaneously with the process, the second row of feeding rails 31 finish the transportation of the M silicon wafers to the position to be taken; then, the taking device 4 grabs the M silicon wafers on the second row of feeding rails 31 and places the M silicon wafers on the carrier plate, and simultaneously with the process, the first row of feeding rails 31 finish transporting the M silicon wafers to the position to be taken; and by analogy, the same group of material taking devices 4 can take materials from multiple rows of material feeding tracks in the same group of material feeding devices 3 in sequence. Therefore, the material taking mode can meet the requirement of high material distribution efficiency at a high speed of the material taking device, and meanwhile, the feeding rail has a low transmission speed and is not easy to cause damage to silicon wafers.
The deviation rectifying device 5 is used for adjusting the position of the silicon wafer 12 so that the position of the silicon wafer 12 placed on the carrier plate 1 meets the requirement of a preset position. Each group of feeding devices 3 corresponds to one group of deviation rectifying devices 5, and one group of deviation rectifying devices 5 is responsible for rectifying the deviation of the silicon wafers from the corresponding group of feeding devices 3. Specifically, referring to fig. 1, the position of the same deviation rectifying device 5 in the world coordinate system can be regarded as unchanged, that is, the deviation rectifying device 5 does not move with the carrier plate 1 during the movement of the carrier plate 1, but is always in the same position pair in the world coordinate systemAnd adjusting the position of the silicon wafer passing through the carrier plate 1. E.g. at t 0 At that time, the distance to the front end of the carrier (the front-back direction is the moving direction of the carrier) is A 0 Location of the zone (referred to as A on the carrier plate) 0 Position) coincides with the position of the deviation correcting device 5, at which moment the taking device 4 grabs a silicon wafer a placed on the carrier plate 0 Position, A on the carrier plate following the deviation-correcting device 5 0 Performing position rectification on the positioned silicon wafer; the carrier board then continues to be transported forward, at t 1 At that time, the distance to the front end of the carrier (the front-back direction is the moving direction of the carrier) is A 1 Location of the zone (referred to as A on the carrier plate) 1 Position) coincides with the position of the deviation correcting device 5, at which moment the taking device 4 grabs a silicon wafer a placed on the carrier plate 1 Position, A on the carrier plate following the deviation-correcting device 5 1 And (5) carrying out position correction on the silicon wafer at the position. It can be seen that the absolute position of the same deviation correcting device 5 is unchanged, and the position of the deviation correcting device relative to the carrier plate 1 is changed, so that the deviation of a plurality of silicon wafers arranged on the carrier plate can be continuously and sequentially corrected.
In the embodiment of the present invention, each group of feeding devices 3 corresponds to a group of material taking devices 4 and a group of deviation rectifying devices 5. The absolute position of the feeding device 3 under the world coordinate system is unchanged, the absolute position of the silicon wafer placed after the silicon wafer is grabbed by the material fetching device 4 from the feeding device 3 is basically unchanged, and the deviation rectifying device 5 continuously rectifies the silicon wafer placed at the same absolute position. The following description will exemplify the arrangement process of silicon wafers on a carrier plate by providing two sets of feeding devices 3, each set of feeding devices 3 having two feeding rails 31, and the two sets of feeding devices 3 moving synchronously.
As shown in fig. 2, the material distribution device is provided with two sets of feeding devices 3, each set of feeding devices 3 is provided with two rows of feeding rails 31, the feeding rails 31 can be marked as a first feeding rail 31a and a second feeding rail 31b, and each set of feeding devices 3 corresponds to one material taking device 4 and one deviation rectifying device 5. At t 0 At the moment, the first feeding rail 31a of the two feeding devices 3 has M silicon wafers 12 entering the region to be taken, which is the region where the taking device can move to take the silicon wafers, and referring to fig. 1,each group of material taking devices 4 respectively and correspondingly clamps the M silicon wafers 12 on the first feeding rail 31a to the first position A on the carrier plate 1 0 First position A 0 At this moment, the deviation correcting device 5 is located above the corresponding deviation correcting device 5, and the deviation correcting device 5 is rapidly aligned to the corresponding position A 0 The position of the silicon chip on the silicon chip is subjected to deviation rectification adjustment; then, the carrier plate conveying device 2 drives the carrier plate 1 to move rightwards along the x direction, and meanwhile, the silicon wafers on the first feeding rail 31a of the feeding device move to be supplemented at t 1 At the moment, the second feeding rail 31b of the two groups of feeding devices 3 has M silicon wafers 12 entering the region to be taken, and each group of material taking devices 4 correspondingly clamps the M silicon wafers 12 on the second feeding rail 31b to the second position a on the carrier plate 1 1 A second position A 1 At this moment, the deviation correcting device 5 is located above the corresponding deviation correcting device 5, and the deviation correcting device 5 is rapidly aligned to the corresponding position A 1 The position of the silicon chip on the silicon chip is subjected to deviation rectification adjustment; and so on. The material taking devices of each group take materials from the material feeding rails of the corresponding group of material feeding devices in sequence, and the deviation rectifying devices of each group rectify the silicon wafers of the corresponding group of material feeding devices, so that the silicon wafer arrangement of the whole carrier plate is completed.
In the embodiment of the invention, a plurality of groups of feeding devices are arranged, each group of feeding devices comprises a plurality of rows of feeding rails, each group of feeding devices corresponds to one group of taking devices and one group of deviation correcting devices, and the taking devices can sequentially grab silicon wafers on different feeding rails in the same group of feeding devices, namely: a plurality of feeding rails of the same group of feeding devices can share one group of taking devices, and the plurality of feeding rails feed materials in sequence, so that the feeding speed of the feeding rails can be slower than the taking speed of the taking devices; therefore, the feeding rail has a low transmission speed and is not easy to damage silicon wafers while the material taking device has a high speed so as to meet the requirement of high material distribution efficiency; the same feeding device corresponds to a group of deviation correcting devices, so that the grabbing speed of the material taking device is increased, and the deviation correcting times of the deviation correcting devices in unit time can be increased.
In some embodiments, as shown in fig. 2, the deviation correcting device 5 is disposed below the carrier plate conveying device 2 (below the z direction shown in fig. 2), the material taking device 4 clamps the silicon wafer 12 onto the carrier plate 1, the silicon wafer 12 is correspondingly disposed at the position of the through hole 11 on the carrier plate 1, and the deviation correcting device 5 disposed below the carrier plate 1 can pass through the through hole 11 to contact the silicon wafer 12.
In some embodiments, as shown in fig. 3, on both sides of each set of deviation rectifying devices 5 in the first direction (x direction shown in fig. 3), there are provided feeding rails 31 of feeding devices of the corresponding set. In the embodiment of the present invention, the same group of feeding devices may be configured as multiple rows of feeding rails 31, for example, the same feeding device may be configured with two rows of feeding rails 31, the two rows of feeding rails 31 may be spaced in a first direction (in the x direction shown in fig. 3), and the two rows of feeding rails 31 may be configured to be centrosymmetric by the deviation rectifying device 5; for another example, the same feeding device may be provided with three rows of feeding tracks, wherein one row of feeding tracks may be disposed on the left side of the deviation rectifying device in the first direction, and two rows of feeding tracks may be disposed on the right side of the deviation rectifying device in the first direction; alternatively, the feed rails 31 of each row may be equally spaced to facilitate control of the speed of travel of the reclaimer assemblies 4. The embodiment of the invention can set the number of the feeding tracks according to the model size of the carrier plate and set the specific position relation according to the actual number of the feeding tracks. According to the embodiment of the invention, the plurality of feeding rails are arranged on two sides of the deviation correcting device in the first direction, and the material taking device is used for conveying the silicon wafers on the feeding rails to the position corresponding to the deviation correcting device, so that the material taking stroke of the material taking device is favorably reduced, the time for taking materials at one time is shortened, and the material taking efficiency of the material taking device is improved.
In some embodiments, as shown in fig. 3 and 4, the transport direction of the feeding means is perpendicular to the first direction (the y-direction in fig. 3 is the transport direction of the feeding means). That is, the conveying direction of the plurality of supply rails 31 is perpendicular to the first direction, wherein a plurality of silicon wafers 12 are arranged in each row of supply rails 31, each row of supply rails 31 can be divided into two regions, referring to fig. 4, one region is a material distribution region (the region surrounded by the carrier plate 1 shown in fig. 4), the other region is a material supply region (the region within the dashed line frame shown in fig. 4), in the material supply region, a device for storing silicon wafers (such as a flower basket) arranges the silicon wafers 12 one by one on each supply rail 31 through a conveying member, the supply rails move to convey the silicon wafers 12 to the material distribution region, so that the material taking device grips the silicon wafers 12, and after the silicon wafers 12 in the material distribution region are gripped by the material taking device 4, the silicon wafers 12 in the subsequent material supply region continuously move to the material distribution region. The direction of the silicon wafers 12 moving from the feeding area to the distributing area can be used to indicate the conveying direction (y direction shown in fig. 3) of the feeding device, the conveying direction is perpendicular to the first direction (x direction shown in fig. 3), and the carrier plates 1 are arranged in a row perpendicular to the first direction, so that the arrangement of the carrier plates can be realized by directly conveying the entire row of silicon wafers 12 gripped by the material-taking device 4 onto the carrier plates 1. The silicon wafer clamped by the material taking device in the embodiment of the invention can be directly placed on the support plate along the first direction, and the position of the support plate in the first direction can be adjusted, so that the stroke of clamping the silicon wafer by the material taking device each time is greatly reduced, and the clamping efficiency of the material taking device is improved.
In some embodiments, as shown in fig. 4, the transport path of the magazine 3 is at least partially located above the transport path of the carrier board transport device. Specifically, the transport path of the supply device 3 can be described with reference to the above-mentioned embodiment, each row of the supply track 31 can be divided into a material distribution area (the area surrounded by the carrier plate 1 shown in fig. 4) and a material supply area (the area within the dashed line shown in fig. 4), and the path of the silicon wafer 12 moving from the material supply area to the material distribution area is the transport path of the supply device (the path upward in the y direction shown in fig. 4). The transport path of the carrier board transport apparatus is a path for transporting the carrier board 1 in the x direction as shown in fig. 4. The transmission path of the feeding device 3 in the embodiment of the invention can be partially arranged above the transmission path of the carrier plate transmission device, the material distribution area in the feeding track 31 can be completely arranged above the transmission path of the carrier plate transmission device, and the material taking device can directly clamp the M silicon wafers in the material distribution area onto the carrier plate under the condition that the number of the silicon wafers distributed in the material distribution area is more than or equal to M; the feeding area may be partly or completely arranged outside the transport path of the carrier plate conveyor. According to the embodiment of the invention, at least part of the feeding device is arranged above the transmission path of the carrier plate transmission device, so that the taking device can clamp and take the silicon wafers on the feeding rail only by moving in the first direction, and the taking path of the taking device is shortened.
In some embodiments, referring to the schematic side view of the material taking device shown in fig. 5, two material taking devices are provided in the embodiment of fig. 5, each material taking device has a material taking member 41, and the material taking member 41 can simultaneously grip a plurality of silicon wafers on the same feeding rail 31. The take-out member 41 sequentially picks up the silicon wafer 12 on each of the supply rails 31 of the corresponding set of supply devices 3. The distributing device is provided with two groups of feeding devices 3, each group of feeding devices 3 is provided with two rows of feeding rails 31, the feeding rails 31 can be marked as a first feeding rail a and a second feeding rail b, and each group of feeding devices 3 corresponds to one material taking part 41. At t 0 At the moment, silicon wafers 12 are arranged on each row of the feeding rails 31 of the two groups of feeding devices 3, and the taking part 41 clamps the silicon wafers on the first feeding rail 31a onto the carrier plate 1; the carrier plate conveying device drives the carrier plate 1 to move rightwards along the x direction, and simultaneously, the silicon wafers on the first feeding rail 31a of the feeding device 3 move and distribute at t 1 At this moment, the silicon wafers 12 are located on the second feeding rails 31b of the feeding devices 3 in the same group, and each group of the material taking members 41 correspondingly takes the silicon wafers 12 on the second feeding rails 31b to the carrier plate 1. According to the embodiment of the invention, the material taking parts are adopted to sequentially clamp the silicon wafers on different feeding rails in the same feeding device, so that the quantity of the silicon wafers clamped by a single material taking part in unit time is increased under the condition that the speed of conveying the silicon wafers by the feeding rails is not changed, and the efficiency of arranging the silicon wafers on the carrier plate by the printing device is increased.
Specifically, referring to fig. 1 and fig. 3, the carrier in fig. 1 is used to carry N × M silicon wafers, where N is the number of rows of silicon wafers arranged in a first direction (x direction shown in fig. 1), and M is the number of rows of silicon wafers arranged in a direction perpendicular to the first direction; in fig. 1, M is 8, N is 10, and a total of 10 × 8 silicon wafers may be supported. Referring to fig. 3, the material taking device 4 sequentially grabs the silicon wafers 12 from different feeding rails 31 of the same feeding device 3, and the material taking device 4 grabs 8 silicon wafers from one feeding rail 31 at a time and places the silicon wafers on the carrier plate. Under the condition that the two material taking devices 4 move synchronously, the two material taking devices 4 grab 16 silicon wafers to the support plate 1, and the specification of the current support plate is 8 x 10, so the support plate needs to move forward 4 times in the x direction to complete the distribution of the whole support plate.
In some embodiments, as shown in fig. 6, each set of extracting devices 4 has a plurality of extracting members 41, and the embodiment shown in fig. 6 has two sets of extracting devices 4, and each set of extracting devices 4 has two extracting members 41. Each of the pick-up members 41 picks up a silicon wafer 12 on one of the supply rails 31. Specifically, referring to fig. 6, the material taking device 4 in the same group includes a first material taking member 41a and a second material taking member 41b, and at t 0 At the moment, silicon wafers 12 are arranged on each row of the feeding rails 31 of the two groups of feeding devices 3, and the first material taking part 41 clamps the silicon wafers 12 on the first feeding rails 31a onto the carrier plate 1; the carrier plate conveying device drives the carrier plate 1 to move rightwards along the x direction, and meanwhile, the silicon wafers on the first feeding rail 31a of the feeding device 3 move for distribution at t 1 At this moment, the silicon wafers 12 are located on the second feeding rails 31b of the feeding devices 3 in the same group, and the second material taking members 41b of the material taking devices 4 in the same group respectively and correspondingly clamp the silicon wafers 12 on the second feeding rails 31b onto the carrier plate 1. According to the embodiment of the invention, the plurality of material taking parts are adopted to respectively clamp the silicon wafers on different feeding tracks in the same feeding device, and different material taking parts in the same material taking device take materials in sequence, so that the track of single movement of the material taking parts is reduced, and the material taking speed is improved.
Specifically, under the condition that the carrier plate is used for bearing N × M silicon wafers, wherein N is the number of rows of silicon wafers arranged in the first direction, and M is the number of rows of silicon wafers arranged in the direction perpendicular to the first direction; the plurality of taking parts sequentially and respectively grab the silicon wafers from the corresponding feeding rails, and the plurality of taking parts grab the M silicon wafers from the corresponding feeding rails at each time and place the M silicon wafers on the same row on the support plate. For example, when M is 8, N is 10; the carrier plate can carry 10 × 8 silicon wafers in total. A plurality of material taking members in the same material taking device sequentially and respectively grab the silicon wafers from the corresponding feeding rails, namely the feeding rails grabbed by each material taking member are different, the material taking members grab 8 silicon wafers from the corresponding feeding rails at each time and place the silicon wafers in the same row on the support plate, and the two material taking devices shown in fig. 6 can grab 16 silicon wafers at a time. Through set up the form that a plurality of material pieces were got in same extracting device, save the stroke of getting the material piece and moving every time to improve silicon chip and get speed of getting.
In some embodiments, as shown in fig. 3, multiple reclaimer assemblies 4 of multiple feeder assemblies 3 are moved in unison. For example, the material distributing device shown in fig. 3 is provided with two sets of feeding devices 3, and the left material taking device 4 and the right material taking device 4 can move synchronously to respectively clamp the silicon wafers in the left feeding device and the right feeding device 3. The silicon wafer distributing efficiency can be improved by adopting a synchronous motion mode.
In some embodiments, as shown in FIG. 7, the feed track 31 includes a conveyor 311, a support frame 312, and a first drive member 313. The conveyor belt 311 extends along a direction (y direction shown in fig. 5) perpendicular to the first direction, and the conveyor belt 311 is partially disposed above the carrier board conveying device; the support frame 312 is used for supporting the conveyor belt 311; the first driving member 313 is used for driving the conveyor belt 311 to transport the silicon wafer 12 along a direction perpendicular to the first direction. The embodiment of the invention adopts the form of the conveyor belt to convey the silicon wafer, the conveying mode is stable, and the breakage rate of the silicon wafer can be reduced.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (10)
1. A solar cell's distributing device, characterized by includes:
the carrier plate conveying device is used for conveying the carrier plate along a first direction;
the feeding device is used for conveying the silicon wafer to be distributed; the feeding devices are provided with a plurality of groups and are arranged at intervals in the first direction, each group of feeding devices comprises a plurality of rows of feeding rails, and a plurality of silicon wafers can be conveyed on each row of feeding rails;
the silicon wafers on each row of the feeding rails of the feeding devices of the corresponding group are sequentially grabbed by the material fetching devices and are distributed to the carrier plate; the silicon wafers on the same feeding track are clamped by the same group of material taking devices at the same time and are arranged on the carrier plate at the same time, and the silicon wafers on different feeding tracks in the same group of material taking devices are clamped by the same group of material taking devices at different times and are arranged on the carrier plate at different times;
the correcting devices are used for adjusting the positions of the silicon wafers transmitted by the corresponding groups of feeding devices on the carrier plate; the absolute position of the same deviation correcting device is unchanged, and the position of the carrier plate can be changed relative to the deviation correcting device along with the movement of the carrier plate transmission device along the first direction, so that the deviation correcting device can sequentially correct the deviation of the plurality of silicon wafers arranged on the carrier plate.
2. The material distribution device according to claim 1, wherein the deviation rectification device is disposed below the carrier plate transmission device.
3. The material distribution device according to claim 1 or 2, wherein in the first direction, two sides of each group of the deviation rectifying devices are provided with a corresponding group of the feeding tracks of the feeding devices.
4. Distributing device according to claim 1, characterized in that the feeding device is transported in a direction perpendicular to the first direction.
5. Distributing device according to claim 4, characterized in that the transport path of the magazine is at least partly located above the transport path of the carrier plate transport device.
6. The distributing device according to claim 1, wherein each group of the taking devices has a taking member, and the taking member sequentially grabs the silicon wafers on each of the feeding rails of the feeding devices of the corresponding group.
7. The material distribution device according to claim 6, wherein the carrier is configured to carry N x M silicon wafers, where N is the number of rows of silicon wafers arranged in the first direction, and M is the number of rows of silicon wafers arranged in a direction perpendicular to the first direction; the material taking part sequentially grabs silicon wafers from the plurality of feeding rails, and the material taking part grabs M silicon wafers from one feeding rail at a time and places the M silicon wafers in the same row on the support plate.
8. The distributing device according to claim 1, wherein each group of the taking devices has a plurality of taking members, and each taking member correspondingly grabs the silicon wafer on one of the feeding rails.
9. The material distribution device according to claim 8, wherein the carrier is configured to carry N × M silicon wafers, where N is the number of rows of silicon wafers arranged in the first direction, and M is the number of rows of silicon wafers arranged in a direction perpendicular to the first direction; the plurality of taking parts sequentially and respectively grab the silicon wafers from the corresponding feeding rails, and the plurality of taking parts grab the M silicon wafers from the corresponding feeding rails at each time and place the M silicon wafers in the same row on the support plate.
10. The dispensing device of claim 1, wherein the plurality of material extracting devices of the plurality of feeding devices move synchronously.
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| CN202110662608.0A CN113394148B (en) | 2021-06-15 | 2021-06-15 | Solar cell's distributing device |
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| EP2678461A1 (en) * | 2011-02-21 | 2014-01-01 | CTF Solar GmbH | Method and device for coating substrates |
| KR20140102595A (en) * | 2013-02-14 | 2014-08-22 | 가부시키가이샤 도쿄 웰드 | Work measuring apparatus and work measuring method |
| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
| CN209993612U (en) * | 2019-06-03 | 2020-01-24 | 创富东日(深圳)科技有限公司 | Accurate positioning device that rectifies of solar energy crystal silicon chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5439141B2 (en) * | 2009-11-30 | 2014-03-12 | 芝浦メカトロニクス株式会社 | Semiconductor chip mounting apparatus and mounting method |
| DE102010045098A1 (en) * | 2010-09-13 | 2012-03-15 | Rena Gmbh | Device and method for separating and transporting substrates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2678461A1 (en) * | 2011-02-21 | 2014-01-01 | CTF Solar GmbH | Method and device for coating substrates |
| KR20140102595A (en) * | 2013-02-14 | 2014-08-22 | 가부시키가이샤 도쿄 웰드 | Work measuring apparatus and work measuring method |
| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
| CN209993612U (en) * | 2019-06-03 | 2020-01-24 | 创富东日(深圳)科技有限公司 | Accurate positioning device that rectifies of solar energy crystal silicon chip |
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