KR20130090827A - 기판 반송 방법 및 기판 반송 장치 - Google Patents

기판 반송 방법 및 기판 반송 장치 Download PDF

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Publication number
KR20130090827A
KR20130090827A KR1020130012729A KR20130012729A KR20130090827A KR 20130090827 A KR20130090827 A KR 20130090827A KR 1020130012729 A KR1020130012729 A KR 1020130012729A KR 20130012729 A KR20130012729 A KR 20130012729A KR 20130090827 A KR20130090827 A KR 20130090827A
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KR
South Korea
Prior art keywords
substrate
wafer
board
temperature
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020130012729A
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English (en)
Korean (ko)
Inventor
마사유키 야마모토
유키토시 하세
Original Assignee
닛토덴코 가부시키가이샤
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Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20130090827A publication Critical patent/KR20130090827A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130012729A 2012-02-06 2013-02-05 기판 반송 방법 및 기판 반송 장치 Ceased KR20130090827A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012023009A JP5959216B2 (ja) 2012-02-06 2012-02-06 基板搬送方法および基板搬送装置
JPJP-P-2012-023009 2012-02-06

Publications (1)

Publication Number Publication Date
KR20130090827A true KR20130090827A (ko) 2013-08-14

Family

ID=47721908

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130012729A Ceased KR20130090827A (ko) 2012-02-06 2013-02-05 기판 반송 방법 및 기판 반송 장치

Country Status (5)

Country Link
EP (1) EP2624292B1 (https=)
JP (1) JP5959216B2 (https=)
KR (1) KR20130090827A (https=)
PT (1) PT2624292E (https=)
TW (1) TWI584404B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180124732A (ko) * 2017-05-12 2018-11-21 캐논 가부시끼가이샤 임프린트 방법, 임프린트 장치, 임프린트 시스템 및 물품 제조 방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101940580B1 (ko) * 2012-05-24 2019-01-22 에이씨엠 리서치 (상하이) 인코포레이티드 로드록 챔버와, 그를 이용하여 기판을 처리하는 방법
KR101455205B1 (ko) * 2014-04-29 2014-10-27 주식회사 다이나테크 교정장치
JP6322083B2 (ja) * 2014-08-08 2018-05-09 日東電工株式会社 半導体ウエハの冷却方法および半導体ウエハの冷却装置
JP6811951B2 (ja) * 2017-02-03 2021-01-13 株式会社ディスコ 搬送機構
JP7061012B2 (ja) * 2018-05-01 2022-04-27 株式会社ディスコ 加工装置
JP7282467B2 (ja) * 2019-08-14 2023-05-29 株式会社ディスコ 加工装置
KR102235146B1 (ko) * 2019-10-08 2021-04-02 리얼룩앤컴퍼니 주식회사 냉각 성능이 개선된 3d 포밍필름 제조 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6378546A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd ウエハハンドリング装置
JP2941505B2 (ja) * 1991-08-08 1999-08-25 株式会社東芝 基板位置決め方法
JP3442253B2 (ja) * 1997-03-13 2003-09-02 東京エレクトロン株式会社 基板処理装置
JPH11168131A (ja) * 1997-12-04 1999-06-22 Nec Kyushu Ltd ウエハ搬送チャック
JP4403631B2 (ja) * 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP4592270B2 (ja) 2003-10-06 2010-12-01 日東電工株式会社 半導体ウエハの支持材からの剥離方法およびこれを用いた装置
JP2007317822A (ja) * 2006-05-25 2007-12-06 Sony Corp 基板処理方法及び半導体装置の製造方法
JP2008053432A (ja) * 2006-08-24 2008-03-06 Disco Abrasive Syst Ltd ウエーハ加工装置
DE102008041250A1 (de) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
CN102217055B (zh) * 2008-11-21 2013-09-18 芝浦机械电子株式会社 衬底处理方法及衬底处理装置
JP5549185B2 (ja) * 2009-11-06 2014-07-16 株式会社ニコン 半導体デバイスの製造方法および基板貼り合せ装置
JP2011151149A (ja) 2010-01-20 2011-08-04 Tdk Corp 積層型電子部品の製造方法
JP5543813B2 (ja) * 2010-03-23 2014-07-09 日東電工株式会社 ワーク搬送方法およびワーク搬送装置
JP2012186245A (ja) * 2011-03-04 2012-09-27 Tokyo Electron Ltd 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2011223014A (ja) * 2011-06-02 2011-11-04 Furukawa Electric Co Ltd:The チップ保護用フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180124732A (ko) * 2017-05-12 2018-11-21 캐논 가부시끼가이샤 임프린트 방법, 임프린트 장치, 임프린트 시스템 및 물품 제조 방법

Also Published As

Publication number Publication date
JP2013161958A (ja) 2013-08-19
TWI584404B (zh) 2017-05-21
JP5959216B2 (ja) 2016-08-02
TW201351558A (zh) 2013-12-16
EP2624292A1 (en) 2013-08-07
PT2624292E (pt) 2015-05-20
EP2624292B1 (en) 2015-04-22

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